attaching head

Abstract

This application relates to a bonding head, including a housing, a power component, a sensor, and a suction nozzle. The power component is disposed on the housing; one side of the sensor faces the power component; one end of the suction nozzle is connected to the side of the sensor away from the power component, and the other end is used to adsorb material; the bonding head includes a first state and a second state; in the first state, the suction nozzle does not adsorb material, the power component and the sensor are in contact, and a first contact force is generated between the power component and the sensor; in the second state, the suction nozzle adsorbs material, the power component and the sensor are in contact, and a second contact force is generated between the power component and the sensor. The bonding head of this application can achieve precise control of the bonding head on the chip from an initial value of 0-5g, and can control the bonding distance in real time.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to bonding heads. Background Technology

[0002] A die bonder, also known as a die attacher or wafer bonding machine, is a type of packaging machinery. The bonding head of the die bonder is driven by other modules of the die bonder to perform its work. Driven by linear motors and other drive structures in the die bonder's drive module, it performs the functions of adsorption and pressing bonding. When adsorbing and bonding chips, high precision and control of the force are required.

[0003] In related technologies, the bonding head mainly consists of a motor, linear guide rail, suction nozzle rod, grating ruler, encoder, and various connecting parts, using linear guide rail or crossed roller guide rail as a guide. Specifically, after the suction nozzle rod contacts the chip, the chip moves relative to the linear guide rail during the bonding process with other structures, causing the encoder to move relative to the grating ruler. The displacement of the encoder is then used to determine the force of chip adsorption and bonding.

[0004] However, when the surface of the chip or the material of the chip itself is relatively soft, the chip itself will undergo plastic deformation during the process of adsorbing the chip and bonding the chip with other structures. This will affect the displacement of the encoder, making it impossible to accurately judge the force when adsorbing and bonding the chip, and the bonding head will not be able to precisely control the force on the chip. Summary of the Invention

[0005] Therefore, it is necessary to provide a bonding head that can solve the problem of the bonding head being unable to accurately control the force on the chip during the process of adsorbing and bonding the chip.

[0006] A fitting head, comprising:

[0007] case;

[0008] The power unit is located on the housing;

[0009] The sensor, with one side facing the power unit;

[0010] The suction rod has one end connected to the sensor on the side away from the power component, and the other end used to adsorb material.

[0011] The bonding head includes a first state and a second state;

[0012] In the first state, the nozzle rod is not adsorbing material, the power component and the sensor are in contact, and a first contact force is generated between the power component and the sensor;

[0013] In the second state, the nozzle rod adsorbs material, the power component and the sensor come into contact, and a second contact force is generated between the power component and the sensor.

[0014] In some embodiments, the power assembly includes a first motor and a transmission member, one end of which is connected to the power output end of the first motor, and the side of the sensor away from the nozzle rod faces the end of the transmission member away from the first motor.

[0015] The bonding head also includes a spring force control assembly, which is rotatably mounted on the housing and connected to the nozzle rod. The nozzle rod can move relative to the spring force control assembly in a first direction to drive the transmission component to move in the first direction.

[0016] The first direction is parallel to the axial direction of the nozzle rod.

[0017] In some embodiments, the spring force control assembly includes at least two diaphragm springs, which are spaced apart along a first direction, each of which has a through hole, the axes of which are collinear, and the suction rod passes through the through hole.

[0018] In some embodiments, the fitting head further includes:

[0019] A detection component, at least a portion of which is connected to a transmission component, is used to detect the amount of displacement of the transmission component along a first direction.

[0020] In some embodiments, the detection component includes:

[0021] The grating ruler is mounted on the housing.

[0022] An encoder is connected to a transmission component.

[0023] In some embodiments, the fitting head further includes:

[0024] The second motor is mounted on the housing;

[0025] The transmission component is connected between the power output end of the second motor and the suction rod.

[0026] In some embodiments, the transmission assembly includes:

[0027] The first transmission wheel is connected to the power output end of the second motor;

[0028] The second drive wheel is connected to the suction nozzle rod;

[0029] A drive belt connects the first drive pulley and the second drive pulley.

[0030] In some embodiments, the nozzle rod includes a hollow cavity;

[0031] The bonding head also includes a vacuum connector that connects to the cavity of the nozzle rod.

[0032] In some embodiments, the sensor is a pressure sensor.

[0033] In some embodiments, the first motor is a voice coil motor.

[0034] The aforementioned bonding head includes a housing, a power component, a sensor, and a suction nozzle. The power component is mounted on the housing; one side of the sensor faces the power component; one end of the suction nozzle is connected to the side of the sensor away from the power component, and the other end is used to adsorb material. The bonding head includes a first state and a second state; in the first state, the suction nozzle is not adsorbing material, the power component and the sensor are in contact, and a first contact force is generated between the power component and the sensor; in the second state, the suction nozzle adsorbs material, the power component and the sensor are in contact, and a second contact force is generated between the power component and the sensor. In this application, the bonding head, because the power component and the sensor switch between the first and second states, generates different contact forces when the suction nozzle is not adsorbing material and when it is adsorbing material, respectively. Therefore, the force exerted on the material during adsorption can be accurately determined by the second contact force relative to the first contact force. Furthermore, when the material is bonded to other structures, the power component and the sensor further contact, thereby accurately determining the force exerted during material bonding by the force exerted at this time relative to the first contact force, ultimately achieving precise force control of the material by the bonding head. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the bonding head in one embodiment of this application.

[0036] Figure 2 for Figure 1 Side view of the fitting head.

[0037] Figure 3 for Figure 2 A cross-sectional view of the bonding head along the AA direction.

[0038] Figure 4 This is a schematic diagram of the structure of a diaphragm spring in one embodiment of this application.

[0039] Figure 5 for Figure 3 A magnified view of a portion of point A in the middle.

[0040] Explanation of reference numerals in the attached figures:

[0041] 1. Fitting head;

[0042] 11. Housing; 12. Power assembly; 13. Sensor; 14. Nozzle rod; 15. Spring force control assembly; 16. Detection assembly; 17. Second motor; 18. Transmission assembly; 19. Vacuum connector;

[0043] 121. First motor; 122. Transmission component;

[0044] 151. Diaphragm spring;

[0045] 161. Linear scale; 162. Encoder;

[0046] 181. First drive wheel; 182. Second drive wheel; 183. Drive belt. Detailed Implementation

[0047] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] It should be noted that the suction nozzle rod of this application is used to adsorb materials. Simultaneously, driven by the power component, the suction nozzle rod can further bond the materials to other structures. For example, the chips mentioned in this application are all types of materials. This application uses chips as an example to illustrate the material, and for ease of explanation, the bonding process between the materials and other structures is illustrated by the bonding of a chip and a wafer. The bonding process between a chip and a wafer is the same as the bonding process between the chip and the wafer. Of course, it is understood that the materials in this application are not restrictive, and the categories of materials will not be elaborated upon here.

[0054] Additionally, it should be noted that the suction rod in this application is used to adsorb materials. For example, the suction rod, by attaching a suction nozzle, further adsorbs materials through the nozzle. Of course, the suction rod can also adsorb materials in other ways; the method by which the suction rod adsorbs materials is not limited here, and will not be described in detail further.

[0055] See Figure 1 , Figure 2 and Figure 3As shown. An embodiment of this application provides a bonding head 1 including a housing 11, a power assembly 12, a sensor 13, and a suction nozzle 14. The power assembly 12 is disposed on the housing 11; one side of the sensor 13 faces the power assembly 12; one end of the suction nozzle 14 is connected to the side of the sensor 13 away from the power assembly 12, and the other end is used to adsorb material; the bonding head 1 includes a first state and a second state; in the first state, the suction nozzle 14 does not adsorb material, the power assembly 12 and the sensor 13 abut against each other, and a first abutting force is generated between the power assembly 12 and the sensor 13; in the second state, the suction nozzle 14 adsorbs material, the power assembly 12 and the sensor 13 abut against each other, and a second abutting force is generated between the power assembly 12 and the sensor 13.

[0056] Specifically, the housing 11 serves as the frame structure of the bonding head 1, supporting and fixing other components of the bonding head 1. The power assembly 12 serves as the power structure of the bonding head 1, driving the sensor 13 and the suction rod 14 to move relative to each other, thereby achieving precise force control over the chip. The sensor 13 serves as the detection structure of the bonding head 1, sensing the force exerted by the suction rod 14 on the chip during its movement and during the chip bonding process.

[0057] It should be noted that the bonding head 1 includes a first state and a second state, in which the power component 12 and the sensor 13 are both in contact. The bonding head 1 also includes a preset state, in which the power component 12 and the sensor 13 are not in contact, and the suction rod 14 does not adsorb the chip.

[0058] Furthermore, in the preset state, the nozzle rod 14 does not adhere to the chip, and the power component 12 and the sensor 13 are not in contact. At this time, the power component 12 is not working. By controlling the power component 12 to work, the power component 12 moves towards the sensor 13 until the first state, where the nozzle rod 14 does not adhere to the chip, and the power component 12 and the sensor 13 are in contact. Thus, the initial contact force of the sensor 13 at that point can be determined, i.e., the first contact force.

[0059] It should be further explained that the bonding head 1 is a part of the die bonder, which is a type of packaging machinery. The bonding head 1 operates under the drive of other drive mechanisms within the die bonder. Specifically, the nozzle rod 14 in the bonding head 1 can move via the power assembly 12 and simultaneously via the drive mechanism. Understandably, when the nozzle rod 14 moves via the power assembly 12, the nozzle rod 14 and the power assembly 12 are in relative motion. However, when the nozzle rod 14 moves via an external drive mechanism, the nozzle rod 14 and the power assembly 12 are in a relatively stationary state until the nozzle rod 14 contacts the chip. The chip then exerts a reverse force on the nozzle rod 14, causing the nozzle rod 14 to exert a reverse force on the power assembly 12 and move relative to it.

[0060] In the first state, the nozzle rod 14 does not adsorb the chip, and the power component 12 and sensor 13 are in contact. At this time, the external drive mechanism does not apply force to the bonding head 1. When the external drive mechanism applies force to the bonding head 1, the power component 12 and sensor 13 switch to the second state, that is, the nozzle rod 14 adsorbs the chip, and the power component 12 and sensor 13 are in contact.

[0061] Since the nozzle rod 14 does not adhere to the chip in the preset state and the first state, as the power component 12 is driven, the power component 12 and the sensor 13 switch from a non-contact state to a contact state. That is, in the first state, the first contact force generated when the power component 12 and the sensor 13 come into contact can be accurately determined. Furthermore, since the first contact force between the power component 12 and the sensor 13 remains unchanged under the drive of the external drive mechanism, until the nozzle rod 14 contacts the chip, the chip applies a reverse force to the nozzle rod 14, thereby generating a second contact force between the sensor 13 and the power component 12. The sensor 13 can quickly sense this second contact force, and by the change of the second contact force relative to the first contact force, the contact state between the nozzle rod 14 and the chip can be accurately determined, and the bonding head 1 can achieve precise control of the chip.

[0062] Furthermore, after the suction rod 14 adsorbs the chip, when it is necessary to bond the chip and the wafer, the control power component 12 drives the suction rod 14 to move the chip further. At this time, the suction rod 14 will apply a further abutting force to the chip, and the force applied by the bonding head 1 to the chip can be accurately determined by the difference between the abutting force and the first abutting force, thereby achieving precise force control of the bonding head 1 on the chip.

[0063] Understandably, in order to make it easier to precisely control the force of the bonding head 1 on the chip, in the first state, when the first contact force is generated between the power component 12 and the sensor 13, the first contact force can be set to 0, thereby making it easier to precisely control the force of the bonding head 1 on the chip.

[0064] Meanwhile, it should be noted that in the process of precisely controlling the chip, this application only needs to change the second contact force relative to the first contact force to achieve precise control of the chip. That is, this application can achieve precise control of the chip by changing the relative force between the second contact force and the first contact force. In other words, compared with the first contact force, the process of controlling the chip by the bonding head 1 can be understood as controlling the chip from a state of zero force, thereby further improving the accuracy of the bonding head 1 in controlling the chip.

[0065] On the other hand, since the surface of the chip is covered with film or other soft materials, the surface material of the film is relatively soft. When the nozzle rod 14 comes into contact with the chip, even if the surface of the chip undergoes plastic deformation, the sensor 13 will still accurately determine the force generated when the nozzle rod 14 comes into contact with the chip. Thus, the bonding head 1 can achieve precise control of the chip by the force of the second contact force relative to the first contact force.

[0066] Furthermore, during the bonding process of the chip and wafer, the bonding head 1 controls the bonding of the chip and wafer by driving the sensor 13 through the power component 12 to move the suction rod 14. The contact force between the power component 12 and the sensor 13 is related to the current applied by the power component 12. During the multiple bonding processes of the chip and wafer, a curve of the current applied by the power component 12 and the generated second contact force can be generated. Therefore, in the subsequent control process of the bonding head 1 on the chip, it is only necessary to control the current applied to the power component 12 to achieve precise control of the bonding head 1 on the chip, which can facilitate the operation of the operator.

[0067] It should be noted that in the first state, the suction rod 14 is not adsorbed to the chip, and the power component 12 and the sensor 13 are in contact. At this time, the external drive mechanism does not apply force to the bonding head 1. Until the suction rod 14 contacts the chip, the chip applies a reverse force to the suction rod 14, thereby generating a second contact force between the sensor 13 and the power component 12. The sensor 13 can quickly sense this second contact force, and can accurately determine the contact state between the suction rod 14 and the chip by the change of the second contact force relative to the first contact force. Thus, when the second contact force is 0-5g, the sensor 13 can accurately sense the directional force applied by the chip to the suction rod 14, thereby enabling the bonding head 1 to accurately control the force on the chip from an initial value of 0-5g.

[0068] Optionally, the first contact force is less than the second contact force. It's important to note that the first contact force is the force exerted by the power assembly 12 on the sensor 13, while the second contact force is the force exerted by the chip on the nozzle rod 14, i.e., the force exerted by the sensor 13 on the power assembly 12. In other words, the first and second contact forces are in opposite directions. Because the first contact force is less than the second contact force, it is easier to calculate the relative force between the second and first contact forces, thus facilitating more precise control of the contact head 1 on the chip.

[0069] In some embodiments, see Figure 3As shown, the power assembly 12 includes a first motor 121 and a transmission member 122. One end of the transmission member 122 is connected to the power output end of the first motor 121. The side of the sensor 13 away from the nozzle rod 14 faces the end of the transmission member 122 away from the first motor 121. The bonding head 1 also includes a spring force control assembly 15, which is rotatably mounted on the housing 11 and connected to the nozzle rod 14. The nozzle rod 14 can move relative to the spring force control assembly 15 in a first direction to drive the transmission member 122 to move in the first direction.

[0070] It should be noted that the first direction is parallel to the axial direction of the nozzle rod 14, that is... Figure 3 The X direction in the equation.

[0071] In this configuration, one end of the transmission component 122 is connected to the power output end of the first motor 121, and the side of the sensor 13 away from the nozzle rod 14 faces the end of the transmission component 122 away from the first motor 121. That is, in the first state, the nozzle rod 14 does not hold the chip, the transmission component 122 and the sensor 13 are in contact, and a first contact force is generated between them; in the second state, the nozzle rod 14 holds the chip, the transmission component 122 and the sensor 13 are in contact, and a second contact force is generated between them.

[0072] Because the spring-loaded force control assembly 15 is rotatably mounted on the housing 11 and connected to the nozzle rod 14, it can rotate relative to the housing 11 under external power, thereby causing the nozzle rod 14 to rotate relative to the housing 11. This allows for adjustment of the position and angle of the nozzle rod 14 relative to the chip, as well as the position and angle of the chip relative to the wafer. This facilitates the adsorption of the chip by the bonding head 1 and the bonding between the chip and the wafer, thus simplifying the operator's work. Furthermore, because the nozzle rod 14 can move relative to the spring-loaded force control assembly 15 along a first direction, driving the transmission component 122 to move along the first direction, the spring-loaded force control assembly 15 provides guidance and eliminates the frictional influence on the nozzle rod 14. This eliminates the impact of friction on the force control accuracy of the bonding head 1, improving the accuracy and reliability of the bonding head 1's force control on the chip.

[0073] In some embodiments, see Figure 3 and Figure 4 As shown, the spring force control assembly 15 includes at least two diaphragm springs 151, which are spaced apart along a first direction. Each of the at least two diaphragm springs 151 has a through hole, and the axes of the at least two diaphragm springs 151 are collinear. The suction rod 14 passes through the through hole.

[0074] In this way, at least two diaphragm springs 151 spaced apart can guide different parts of the suction rod 14. By applying force to different parts of the suction rod 14, it can be ensured that the suction rod 14 always extends in the first direction, thereby preventing the suction rod 14 from becoming skewed. On the one hand, this ensures that the suction rod 14 always moves normally during its movement. On the other hand, it ensures that there is no friction between the suction rod 14 and the diaphragm spring 151 in the first direction, thereby eliminating the influence of friction on the control force accuracy of the bonding head 1 and improving the accuracy and reliability of the bonding head 1 in controlling the chip force.

[0075] In some embodiments, see Figure 3 As shown, the bonding head 1 also includes a detection component 16. At least a portion of the detection component 16 is connected to the transmission member 122 and is used to detect the amount of displacement of the transmission member 122 along a first direction.

[0076] Thus, while the current of the power component 12 and the force sensed by the sensor 13 can precisely control the chip force, this application can also use the detection component 16 in conjunction with the spring force control component 15 to precisely control the chip force, thereby further improving the accuracy of the bonding head 1 in precisely controlling the chip force.

[0077] Specifically, as the suction nozzle 14 moves relative to the spring-loaded force control assembly 15 along the first direction, it drives the sensor 13 to move, which in turn drives the transmission component 122 to move. Since at least a portion of the detection component 16 is connected to the transmission component 122, the detection component 16 can move synchronously with the suction nozzle 14. Because the spring-loaded force control assembly 15 has a stable stiffness K, the chip can be precisely controlled by F=KX. Here, F is the force exerted by the bonding head 1 to adsorb the chip or the bonding force between the chip and the wafer, K is the stiffness of the spring-loaded force control assembly 15, and X is the displacement of the detection component 16 along the first direction.

[0078] Since the spring force control component 15 has a stable stiffness K through F=KX, and the detection component 16 can accurately detect the displacement of the transmission component 122 along the first direction, it can provide high-precision force control with a force control accuracy of ±2g, while not being affected by the friction of the linear guide / cross ball guide.

[0079] In some embodiments, see Figure 3 As shown, the detection component 16 includes a grating ruler 161 and an encoder 162. The grating ruler 161 is mounted on the housing 11; the encoder 162 is connected to the transmission component 122.

[0080] In this way, the displacement of the transmission component 122 along the first direction can be detected more accurately by the movement of the encoder 162 relative to the grating ruler 161, thereby further improving the accuracy of the bonding head 1 in controlling the chip.

[0081] Furthermore, when the suction nozzle 14 contacts the chip, the chip applies a reverse force to the suction nozzle 14, thereby generating a second contact force between the sensor 13 and the power assembly 12. The bonding head 1 switches from the first state to the second state. At this time, the suction nozzle 14 contacts the chip, and the encoder 162 moves relative to the grating ruler 161. Thus, the displacement between the suction nozzle 14 and the chip can be precisely controlled by the displacement of the encoder 162 relative to the grating ruler 161, thereby achieving precise control of the chip's displacement by the bonding head 1. Based on this, it can be understood that the bonding head 1 of this application can achieve both precise force control and precise displacement control of the chip.

[0082] In some embodiments, see Figure 3 As shown, the bonding head 1 also includes a second motor 17 and a transmission assembly 18. The second motor 17 is mounted on the housing 11; the transmission assembly 18 is connected between the power output end of the second motor 17 and the suction rod 14.

[0083] Thus, driven by the second motor 17, the transmission assembly 18 can be driven to rotate the nozzle rod 14 relative to the housing 11. This allows for adjustment of the position and angle of the nozzle rod 14 relative to the chip, as well as the position and angle of the chip relative to the wafer. This facilitates the adsorption of the chip by the bonding head 1 and the bonding between the chip and the wafer, thus simplifying the operator's work. Furthermore, since the second motor 17 is independent of the first motor 121 and the external drive mechanism, interference with the movement and rotation of the nozzle rod 14 is avoided, ensuring its normal operation.

[0084] In some embodiments, see Figure 3 As shown, the transmission assembly 18 includes a first transmission wheel 181, a second transmission wheel 182, and a transmission belt 183. The first transmission wheel 181 is connected to the power output end of the second motor 17; the second transmission wheel 182 is connected to the suction nozzle rod 14; and the transmission belt 183 is connected to the first transmission wheel 181 and the second transmission wheel 182.

[0085] In this way, the position of the second motor 17 relative to the suction rod 14 can be changed through the connection between the first transmission wheel 181, the second transmission wheel 182 and the transmission belt 183. This allows for a reasonable design and planning of the internal space of the bonding head 1 according to design requirements, thereby improving the utilization rate of the internal space of the bonding head 1.

[0086] In some embodiments, see Figure 5 As shown, the suction rod 14 includes a hollow cavity; the bonding head 1 also includes a vacuum connector 19, which is connected to the cavity of the suction rod 14.

[0087] Thus, when the suction rod 14 contacts the chip, an external vacuum device can be connected through the vacuum connector 19 to evacuate the cavity of the suction rod 14, thereby enabling the suction rod 14 to adsorb the chip, which facilitates the operation of the operator.

[0088] In some embodiments, sensor 13 is a pressure sensor 13.

[0089] Thus, the pressure sensor 13 is a device or apparatus that can sense pressure signals and convert them into usable output electrical signals according to a certain rule. The pressure sensor 13 typically consists of a pressure-sensitive element and a signal processing unit. On the one hand, due to the high accuracy of the pressure sensor 13, precise force control of the bonding head 1 on the chip can be achieved; on the other hand, the pressure sensor 13 has a large measurement range, good durability, and long lifespan, thereby improving the reliability of the bonding head 1's precise force control on the chip. Furthermore, the pressure sensor 13 has good stability, ensuring that the bonding head 1 can still maintain stable and precise force control on the chip during long-term use.

[0090] In some embodiments, the first motor 121 is a voice coil motor.

[0091] Thus, the voice coil motor is a special type of direct drive motor. It features simple structure, small size, high speed, and fast acceleration response. Its working principle is that a current-carrying coil (conductor) placed in a magnetic field generates a force, the magnitude of which is proportional to the current applied to the coil. Based on this principle, the motion of a voice coil motor can be linear or circular. On one hand, voice coil motors can achieve precision up to several micrometers, thereby further improving the precise control of the bonding head on the chip; on the other hand, voice coil motors have extremely fast response speeds, completing movement within milliseconds, thus improving the efficiency of the bonding head's chip control process. Furthermore, voice coil motors operate without noise, improving the user experience.

[0092] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A fitting head, characterized in that, include: case; The power unit is mounted on the housing; A sensor, one side of which faces the power assembly; A suction rod, one end of which is connected to the side of the sensor away from the power component, and the other end is used to adsorb material; The bonding head includes a first state and a second state; In the first state, the suction nozzle rod does not adsorb the material, the power component and the sensor are in contact, and a first contact force is generated between the power component and the sensor; In the second state, the suction nozzle stick adsorbs the material, the power component and the sensor come into contact, and a second contact force is generated between the power component and the sensor; The power assembly includes a first motor and a transmission component. One end of the transmission component is connected to the power output end of the first motor, and the side of the sensor away from the nozzle rod faces the end of the transmission component away from the first motor. The bonding head also includes a spring force control assembly, which is rotatably mounted on the housing and connected to the suction rod. The suction rod can move relative to the spring force control assembly in a first direction to drive the transmission component to move in the first direction. Wherein, the first direction is parallel to the axial direction of the suction rod; The spring force control assembly includes at least two diaphragm springs, which are spaced apart along the first direction. Each of the at least two diaphragm springs has a through hole, and the axes of the at least two diaphragm springs are collinear. The suction rod passes through the through hole. The bonding head also includes: A detection component, at least a portion of which is connected to the transmission member, is used to detect the amount of displacement of the transmission member along the first direction.

2. The bonding head according to claim 1, characterized in that, The detection component includes: A grating ruler is mounted on the housing. An encoder is connected to the transmission component.

3. The bonding head according to claim 1, characterized in that, The bonding head also includes: A second motor is mounted on the housing; The transmission assembly is connected between the power output end of the second motor and the suction rod.

4. The bonding head according to claim 3, characterized in that, The transmission assembly includes: The first transmission wheel is connected to the power output end of the second motor; The second drive wheel is connected to the suction rod; A drive belt connects the first drive wheel and the second drive wheel.

5. The bonding head according to claim 1, characterized in that, The suction rod includes a hollow cavity; The bonding head also includes a vacuum connector that communicates with the cavity of the suction rod.

6. The bonding head according to any one of claims 1-5, characterized in that, The sensor is a pressure sensor.

7. The bonding head according to any one of claims 1-2, characterized in that, The first motor is a voice coil motor.

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