Radio frequency test probe device

Abstract

The invention discloses a radio frequency test probe device, which comprises a substrate, a plurality of probes, a plurality of transmission lines and a cable protection seat, and is characterized in that the substrate is provided with a first welding part and a second welding part; the plurality of probes are arranged in parallel and are connected to the first welding part; the plurality of transmission lines are connected to the second welding part, and the plurality of transmission lines are electrically connected with at least part of the plurality of probes; the cable protection seat is connected with the substrate, and a space for a transmission line to pass through is arranged between the cable protection seat and the substrate. The plurality of probes provided by the invention are arranged in parallel and do not interfere with one another, so that the electrical characteristic measurement of an integrated circuit or other microelectronic devices with small contact distance and a large number of contacts can be realized.

Description

Technical Field

[0001] The invention relates to a radio frequency testing probe device, belonging to the technical field of chip testing equipment. Background Art

[0002] The probe card is a necessary test device for testing the electrical characteristics of microwave integrated circuits or other microelectronic devices. In microwave testing, the probe acts as a "bridge" to connect the chip under test with the test instrument (vector network analyzer, etc.).

[0003] Since the contact pitch of an integrated circuit or other microelectronic devices is small and the number of contacts is large, a coaxial high-frequency probe includes an inner conductor and an outer conductor. For impedance matching, the inner diameter of the outer conductor needs to be of a certain size while satisfying the strength and stiffness of the inner conductor. However, the inner diameter of the outer conductor will exceed the contact pitch of the microelectronic device, causing interference between the two outer conductors. The probe cannot be used when the contact pitch of the microelectronic device is small. Therefore, providing a probe card for measuring the electrical characteristics of integrated circuits or other microelectronic devices at millimeter wave frequencies is an urgent problem to be solved in the art. Summary of the invention

[0004] The object of the present invention is to provide a radio frequency test probe device, which can realize the electrical characteristic measurement of an integrated circuit or other microelectronic device with a small contact spacing and a large number of contacts.

[0005] To achieve the above object, the present invention adopts the following technical solution:

[0006] A radio frequency test probe device, comprising:

[0007] a substrate, the substrate having a first welding portion and a second welding portion; and

[0008] A plurality of probes, wherein the plurality of probes are arranged in parallel and connected to the first welding portion;

[0009] a plurality of transmission lines, wherein the plurality of transmission lines are connected to the second soldering portion, and the plurality of transmission lines are electrically connected to at least part of the plurality of probes;

[0010] A cable protection seat is connected to the base plate, and a space is provided between the cable protection seat and the base plate for the transmission line to pass through.

[0011] As a further improved technical solution of the present invention, the probe includes a main body, a probe head connected to one end of the main body, and a connecting part connected to the other end of the main body, the connecting part is welded and fixed to the first welding part, the probe head is configured to dock with the gold fingers of the device under test, along the parallel direction of the multiple probes, at least part of the multiple main bodies are bent relative to their respective connecting parts, and the distance between at least part of two adjacent probe heads in the multiple probes is smaller than the distance between the center lines of two adjacent main bodies.

[0012] As a further improved technical solution of the present invention, the plurality of probes include signal probes and ground probes, the transmission line is electrically connected to the signal probes,

[0013] The signal probe includes a first probe head and a first connecting portion, and the grounding probe includes a second probe head and a second connecting portion. A first distance exists between a center line of the first connecting portion and a center line of an adjacent second connecting portion. Along a parallel direction of the plurality of probes, a second distance exists between the first probe head and an adjacent second probe head, and the second distance is smaller than the first distance.

[0014] As a further improved technical solution of the present invention, the signal probes are arranged in pairs between the two ground probes. In the paired signal probes, there is a third distance between the center lines of two adjacent first connecting parts, and there is a fourth distance between two adjacent first probe heads, and the fourth distance is smaller than the third distance.

[0015] As a further improved technical solution of the present invention, the second connecting portion of at least one of the grounding probes is connected to the two main bodies, and the two main bodies are correspondingly connected to two second probe heads, and along the parallel direction of the multiple probes, the distance between the two main bodies gradually increases from the second connecting portion to the outside.

[0016] As a further improved technical solution of the present invention, the width of the probe head is smaller than the width of the gold finger, and the probe head is inclined relative to the device under test so that the tip of the probe head is butted against the gold finger.

[0017] As a further improved technical solution of the present invention, the transmission line includes a cable and a coaxial connector, one end of the cable is connected to the substrate, and the coaxial connector is connected to the other end of the cable. The probe device also includes a fixed seat, which has a plurality of holes, and each of the coaxial connectors is at least partially disposed in the corresponding hole.

[0018] As a further improved technical solution of the present invention, the substrate is inclined relative to a plane perpendicular to the channel axis.

[0019] As a further improved technical solution of the present invention, the fixed seat includes a seat body and a cover plate connected to the seat body, the seat body is provided with a first through hole, the cover plate is provided with a second through hole, the first through hole is connected to the second through hole, the channel includes the first through hole and the second through hole, the cover plate and the seat body form a step in the channel, and the coaxial connector abuts against the step.

[0020] As a further improved technical solution of the present invention, the probe device also includes a support member, which includes a supporting part and a connecting part connected to the supporting part, the connecting part is connected to the fixing seat, and the supporting part and the cable protection seat are respectively detachably connected to different sides of the substrate in the thickness direction.

[0021] Compared with the prior art, the beneficial effect of the present invention is that the multiple probes provided by the present invention are arranged in parallel, and the multiple probes do not interfere with each other, which can realize the electrical characteristic measurement of integrated circuits or other microelectronic devices with a small contact spacing and a large number of contacts. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 is a three-dimensional schematic diagram of a radio frequency test probe device of the present invention;

[0023] Figure 2 yes Figure 1 A side view of the RF test probe device shown;

[0024] Figure 3 yes Figure 1 An exploded schematic diagram of the RF test probe device shown;

[0025] Figure 4 yes Figure 3 A magnified schematic diagram of the middle A area;

[0026] Figure 5 yes Figure 1 The exploded schematic diagram of the radio frequency test probe device shown in another angle;

[0027] Figure 6 yes Figure 5 Exploded diagram of some components in the figure;

[0028] Figure 7 yes Figure 6 A magnified schematic diagram of the middle B area;

[0029] Figure 8 yes Figure 7 A top view of multiple probes;

[0030] Fig. 9 yes Figure 3 Exploded diagram of some components in the figure;

[0031] Fig.10 yes Fig. 9 Schematic diagram of another angle;

[0032] Fig.11 yes Figure 5 A three-dimensional cross-sectional view of the middle fixing seat;

[0033] Fig.12 is the insertion loss curve of the probe device of the present invention;

[0034] Fig.13 is the terminal TDR curve of the probe device of the present invention;

[0035] Fig.14 It is a schematic diagram of the structure of the gold finger of the device under test. DETAILED DESCRIPTION

[0036] The exemplary embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. If there are several embodiments, the features of these embodiments can be combined with each other without conflict. When the description refers to the drawings, unless otherwise specified, the same numbers in different drawings represent the same or similar elements. The contents described in the following exemplary embodiments do not represent all embodiments consistent with the present invention; on the contrary, they are only examples of devices, products and / or methods consistent with some aspects of the present invention as recorded in the claims of the present invention.

[0037] The terms used in the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the scope of protection of the present invention. The singular forms "a", "said" or "the" used in the specification and claims of the present invention are also intended to include plural forms, unless the context clearly indicates other meanings.

[0038] It should be understood that the words used in the specification and claims of the present invention, such as "first", "second" and similar words, do not indicate any order, quantity or importance, but are only used to distinguish the names of features. Similarly, words such as "one" or "an" do not indicate a quantitative limitation, but indicate the existence of at least one. Unless otherwise specified, words such as "front", "rear", "upper", "lower" and similar words appearing in the present invention are only for the convenience of explanation and are not limited to a specific position or a spatial orientation. Words such as "include" or "comprise" are an open-ended expression, meaning that the elements appearing before "include" or "comprise" include the elements appearing after "include" or "comprise" and their equivalents, which does not exclude that the elements appearing before "include" or "comprise" may also include other elements. If "several" appears in the present invention, it means two or more.

[0039] Please refer to Figures 1 to 11 As shown, the present invention discloses a radio frequency test probe device, including a substrate 1, a plurality of probes 2, a plurality of transmission lines 3 and a cable protection seat 4, wherein the plurality of probes 2 and the plurality of transmission lines 3 are respectively connected to different positions of the substrate 1, so as to realize electrical connection between the transmission lines 3 and the probes 2; the cable protection seat 4 is connected to the substrate 1, and there is a space between the cable protection seat 4 and the substrate 1 for the transmission lines 3 to pass through, that is, one end of the transmission line 3 passes through the space and is connected to the substrate 1.

[0040] The substrate 1 is a ceramic board or a high-density PCB board. In particular, the ceramic board has high thermal conductivity and low thermal expansion coefficient and is suitable for a probe card with high precision requirements.

[0041] See also Figure 3 The base plate 1 includes a first portion 1a and a second portion 1b connected to the first portion 1a. The first portion 1a is detachably connected to the cable protection seat 4 via a first fastener 71. Figure 6 and Figure 7 The second portion 1 b is provided with a plurality of first welding portions 11 and a plurality of second welding portions 12 , wherein the first welding portions 11 are used for welding and connection of the probe 2 , and the second welding portions 12 are used for welding and connection of the transmission line 3 .

[0042] See also Figure 6 and Figure 7 The width of the second part 1b gradually decreases from the first part 1a outwards. A plurality of first ports 13 are provided at one end of the second part 1b away from the first part 1a. The first welding portion 11 is at least partially exposed to the first port 13. The probe 2 is welded and connected to the first welding portion 11 at the first port 13. The second part 1b is also provided with a plurality of second ports 14. The second welding portion 12 is at least partially exposed to the second port 14. The conductor of the transmission line 3 is welded to the second welding portion 12 at the second port 14. A portion of the second port 14 is a through hole, which is used to receive the outer layer of the transmission line 3, so that the conductor of the transmission line 3 is in a position that is easy to weld with the second welding portion 12.

[0043] A plurality of probes 2 are arranged in parallel, so that the probe device can dock with a plurality of contacts of the device under test to meet the transmission of high-frequency signals, wherein the device under test is an integrated circuit or other microelectronic device.

[0044] Specifically, the probe 2 includes a main body 21, a probe head 22 connected to one end of the main body 21, and a connecting portion 23 connected to the other end of the main body 21. The probe 2 is fixed to the first welding portion 11 by welding through the connecting portion 23, and the probe head 22 is configured to dock with the gold finger 100 of the device under test. Along the parallel direction of the multiple probes 2, at least part of the multiple main bodies 21 are bent relative to their respective connecting portions 23, so that the distance between at least part of two adjacent probe heads 22 is less than the distance between the center lines of the two adjacent main bodies 21. In other words, by bending at least part of the main body 21 relative to their respective connecting portions 23 to different degrees, the spacing between the multiple probe heads 22 can be reduced, which meets the electrical characteristics measurement of integrated circuits or other microelectronic devices with a small contact spacing and a large number of contacts, and at the same time, the multiple probes 2 do not interfere with each other.

[0045] In the present invention, a plurality of probes 2 are arranged in parallel, so that the distance between the tip of the probe head 22 and the gold finger 100 can be kept consistent, which is beneficial to reducing measurement errors.

[0046] For further information, see Figure 4 The width of the probe head 22 is smaller than the width of the gold finger 100, and the probe head 22 is tilted relative to the device under test, especially relative to the gold finger 100, so that the tip of the probe head 22 is butted against the gold finger 100. By setting the probe head 22 smaller than the contact of the device under test, the tip of the probe head 22 is stably in contact with the contact of the device under test during the test, meeting the high-frequency characteristics required by the millimeter-wave device under test.

[0047] See also Figure 4 The plurality of probes 2 include a signal probe 2a and a ground probe 2b, and the transmission line 3 is electrically connected to the signal probe 2a. Figure 7 The signal probe 2a includes a first probe head 22a and a first connecting portion 23a, and the grounding probe 2b includes a second probe head 22b and a second connecting portion 23b. Figure 8 There is a first distance S1 between the center line of the first connecting portion 23a and the center line of the adjacent second connecting portion 23b. Along the parallel direction of the plurality of probes 2, there is a second distance S2 between the first probe head 22a and the adjacent second probe head 22b. The second distance S2 is smaller than the first distance S1.

[0048] The probe device of the present invention is explained by taking the GSSGSSG GSSG gold finger contact adapted to the device under test as an example, where G represents the ground contact, S represents the signal contact, and the gold finger contacts include seven first gold finger contacts and four second gold finger contacts. The spacing between two adjacent first gold finger contacts and the spacing between two adjacent second gold finger contacts are both smaller than the spacing between adjacent first gold finger contacts and second gold finger contacts.

[0049] The spacing between two adjacent first gold finger contacts and the spacing between two adjacent second gold finger contacts are both H1, the width of the gold finger contact is H2, the spacing between adjacent first gold finger contacts and second gold finger contacts is H3, and the overall width of all gold finger contacts is H4, H1 is 0.08mm, H2 is 0.1mm, H3 is 0.36mm, and H4 is 2.08mm.

[0050] Accordingly, see Figure 8 The signal probes 2a are arranged in pairs between two ground probes 2b. In the paired signal probes 2a, there is a third distance S3 between the center lines of two adjacent first connecting parts 23a, and there is a fourth distance S4 between two adjacent first probe heads 22a. The fourth distance S4 is smaller than the third distance S3, and the fourth distance S4 is equal to the second distance S2.

[0051] Accordingly, see Figure 8 The signal probe 2a includes a first signal probe 2a1, a second signal probe 2a2, a third signal probe 2a3, a fourth signal probe 2a4, a fifth signal probe 2a5 and a sixth signal probe 2a6, and the ground probe 2b includes a first ground probe 2b1, a second ground probe 2b2, a third ground probe 2b3 and a fourth ground probe 2b4, and these probes are arranged in the order of the first ground probe 2b1, the first signal probe 2a1, the second signal probe 2a2, the second ground probe 2b2, the third signal probe 2a3, the fourth signal probe 2a4, the third ground probe 2b3, the fifth signal probe 2a5, the sixth signal probe 2a6 and the fourth ground probe 2b4. Among them, the second connection part 23b of the third grounding probe 2b3 is connected to two main bodies 21, and the two main bodies 21 are correspondingly connected to two second probe heads 22b. Along the parallel direction of multiple probes 2, the distance between the two main bodies 21 gradually increases from the second connection part 23b to the outside, so that the distance between the two second probe heads 22b increases, so that it can be adapted to the GSGSSG GSSG gold finger contact. At the same time, the two second probe heads 22b share a second connection part 23b, which can save space, facilitate the arrangement of other probes 2, and better meet the needs of micro spacing.

[0052] The center line of the main body 21 of the second ground probe 2b2 is almost coincident with the center line of the second connecting portion 23b, that is, the main body 21 of the second ground probe 2b2 is not bent relative to the second connecting portion 23b, but the main body 21 of the first ground probe 2b1, the main body 21 of the first signal probe 2a1, the main body 21 of the second signal probe 2a2, the main body 21 of the third signal probe 2a3, the main body 21 of the fourth signal probe 2a4 and one main body 21 of the third ground probe 2b3 are bent to varying degrees toward the main body 21 of the second ground probe 2b2, so that the probe heads 22 docking with the seven first gold finger contacts are close to each other and maintain a small and equal spacing, and in addition, the probe heads 22 docking with the four second gold finger contacts are also close to each other and maintain a small and equal spacing.

[0053] Continue to see Figure 8 The main body 21 of the second grounding probe 2b2 includes a first gradient zone 211 and a second gradient zone 212. The width of the first gradient zone 211 gradually increases from the second connection portion 23b of the second grounding probe 2b2 to the outside, and the width of the second gradient zone 212 gradually decreases from the first gradient zone 211 to the outside. The second probe head 22b is connected to the second gradient zone 212. The structure of the main body 21 of the second grounding probe 2b2 can fully utilize the space.

[0054] In the present invention, the material of the probe 2 is tungsten, molybdenum or beryllium copper alloy. Tungsten and molybdenum probes are used in situations where high hardness and high elasticity are required, while beryllium copper alloy is used in situations where higher conductivity is required, thereby meeting the needs of different situations. The probe 2 provided by the present invention uses a material with low transmission loss. At the millimeter wave frequency, the signal transmission loss of the probe 2 needs to be as low as possible to ensure the integrity and accuracy of the signal.

[0055] To enhance the conductivity and corrosion resistance of the probe 2, the probe 2 is surface treated, for example, the probe 2 is gold plated or nickel plated. Since the thickness and uniformity of the coating are critical, a scanning electron microscope (SEM) inspection is usually performed after electroplating to ensure the integrity and consistency of the coating.

[0056] Due to the small size of the probe 2, the positioning of the probe 2 is usually performed on a high-precision micromanipulator, which needs to have micron-level movement accuracy. A precise positioning diagram of the probe is generated through computer-aided design (CAD) software, and then the probe 2 is installed at a predetermined position on the substrate 1 through a microscope and a microprobe station.

[0057] The probe 2 and the substrate 1 can be welded by hot pressing, laser welding, and conductive adhesive bonding. During the hot pressing welding process, the bottom of the probe 2 is hot pressed and welded to the first welding part 11 of the substrate 1. Pulse heating and pressure control technology are usually used. The temperature and pressure need to be strictly controlled during the welding process to avoid deformation of the probe 1 or damage to the substrate 1. Laser welding can apply high energy in a very small area and is suitable for precision welding of the probe 1. Tensile testing is required after welding to ensure the fixing strength of the probe 2. Conductive adhesive is applied between the probe 2 and the first welding part 11 of the substrate 1, and cured after precise alignment. The curing conditions (temperature, time) of the conductive adhesive need to be strictly controlled, and the conductivity and bonding strength tests are performed after curing.

[0058] Further, the probe 2 needs to be height-calibrated, and precision mechanical equipment is used to measure and adjust the height of each probe 2. The height calibration usually uses a non-contact laser measurement system to ensure that the height consistency of the probe 2 is within the micron level. After the height calibration, a pressure contact test is required to simulate the contact condition of the probe 2 during actual use.

[0059] See also Figure 3 The transmission line 3 includes a cable 31 and a coaxial connector 32. One end of the cable 31 is connected to the substrate 1, and the coaxial connector 32 is connected to the other end of the cable 31. Figure 5 The probe device further includes a fixing seat 5, which has a plurality of channels 50. Each coaxial connector 32 is at least partially disposed in a corresponding channel 50. By providing the fixing seat 5, the coaxial connector 32 is fixed, which is beneficial to the stability of the detection signal. A plane is defined, which is perpendicular to the axis of the channel 50. The substrate 1 is inclined at a certain angle relative to the plane, that is, the substrate 1 is inclined relative to the fixing seat 5, and the coaxial connector 32 is vertically fixed to the fixing seat 5.

[0060] See also Figure 3 The cable protection seat 4 is provided with a guide groove 43, which is used to cooperate with the substrate 1 to enclose a space for storing the cable 31. The depth of the guide groove 43 on one side close to the probe 1 is less than the depth on the other side, so that the outlet height of the space for storing the cable 31 is less than the inlet height. This arrangement facilitates the cable 31 to pass through the space from the inlet, and allows the cable 31 to gradually transition from a vertical state to an inclined state, and can also limit the end of the cable 31 close to the substrate 1.

[0061] For details, see Figure 3 The groove wall of the guide groove 43 includes a flat surface 431 and a curved surface 432 connected to the flat surface 431. The curved surface 432 gradually changes the depth of the guide groove 43. The curved surface 432 guides the cable 31, so that the cable 31 gradually transitions from a vertical state to an inclined state, thereby protecting the cable 31.

[0062] See also Figure 3 The cable protection seat 4 includes a base 41 and a gradient portion 42 connected to the base 41. The height of the gradient portion 42 gradually decreases from the base 41 to the outside, and the gradient portion 42 is generally a trapezoidal structure. The straight surface 431 is located at the gradient portion 42, and the arc surface 432 is at least partially located at the base 41. Compared with the structure of the cable protection seat 4 with a constant height, the cable protection seat 4 provided by the present invention not only reduces the occupied space, but also helps to reduce the overall weight.

[0063] See also Figures 9 to 11 The fixing seat 5 includes a seat body 51 and a cover plate 52 connected to the seat body 51. The seat body 51 is provided with a first through hole 511, and the cover plate 52 is provided with a second through hole 521. The first through hole 511 is connected with the second through hole 521. The channel 50 includes the first through hole 511 and the second through hole 521, and the inner diameter of the first through hole 511 is larger than the inner diameter of the second through hole 521. After the seat body 51 and the cover plate 52 are assembled, the cover plate 52 and the seat body 51 form a step 53 in the channel 50, and the coaxial connector 32 abuts against the step 53. Compared with the fixed seat 5 being an integrally formed structure, the split setting of the fixing seat 5 provided by the present invention, the seat body 51 and the cover plate 52 are detachably connected, which is convenient for the installation of the coaxial connector 32.

[0064] See also Fig. 9 The seat body 51 is provided with a first mounting groove 512, and the first mounting groove 512 is used to receive the cover plate 52. After the seat body 51 and the cover plate 52 are assembled, the cover plate 52 does not extend out of the first mounting groove 512, so that the overall height of the fixing seat 5 will not be increased.

[0065] See also Fig. 9 The cover plate 52 is provided with a plurality of side grooves 522, and the side grooves 522 penetrate through the side surfaces of the cover plate 52, and the side grooves 522 are connected with the corresponding second through holes 521. By providing the side grooves 522, it is convenient for tools to be inserted into the channel 50 to replace individual coaxial connectors 32 without disassembling the seat body 51 and the cover plate 52.

[0066] Continue to see Fig. 9 The cover plate 52 is connected to the base body 51 via a second fastener 72 , which may be a bolt. The second fastener 72 is provided in two rows, and the two rows of second fasteners 72 are staggered, which is beneficial to improving the connection stability between the cover plate 52 and the base body 51 .

[0067] See also Fig. 9 The fixed seat 5 includes a back plate 54 , and the back plate 54 and the cover plate 52 are respectively fixed on different sides of the seat body 51 in the thickness direction. The side surface of the back plate 54 abuts against the outer shell of the coaxial connector 32 , and the back plate 54 plays an alignment role for multiple coaxial connectors 32 .

[0068] See also Figures 1 to 3The probe device further includes a support member 6, which is an integral member and connects the substrate 1 and the fixing seat 5, so that the positional relationship between the substrate 1 and the cable protection seat 4 and the fixing seat 5 does not change, and the shape of the cable 31 does not change. Figure 5 The support member 6 includes a support portion 61 and a connection portion 62 connected to the support portion 61, the connection portion 62 is connected to the fixing seat 5, the support portion 61 and the cable protection seat 4 are respectively detachably connected to different sides of the thickness direction of the substrate 1, and the support portion 61, the cable protection seat 4 and the substrate 1 are fixedly connected by a first fastener 71. Specifically, the cable protection seat 4 is provided with a first hole 44, the first hole 44 is a countersunk hole, the substrate 1 is provided with a second hole 15, the support portion 61 is provided with a third hole 611, and the first fastener 71 is a bolt, which passes through the first hole 44, the second hole 15 and the third hole 611 in sequence and is connected with the internal thread of the third hole 611 to achieve the fixing of the support portion 61, the cable protection seat 4 and the substrate 1.

[0069] In the present invention, since the support part 61, the cable protection seat 4 and the base plate 1 are detachably connected, and the connecting part 62 and the fixing seat 5 are detachably connected, when any one of the RF test probe device becomes abnormal or damaged during use, it can be removed and repaired.

[0070] In order to match the tilted state of the substrate 1, the support portion 61 is bent at a certain angle relative to the connecting portion 62, and the mounting surface of the support portion 61 is tilted at a certain angle relative to the connecting portion 62. Fig. 9 The support portion 61 has an inclined top surface 612, and the third hole 611 passes through the top surface 612. By setting the inclined top surface 612, the thickness of the support portion 61 in the top surface 612 area is reduced, which is convenient for opening the hole.

[0071] See also Fig.10 The connecting portion 62 is a T-shaped structure. The connecting portion 62 is disposed in the second mounting groove 513 of the seat body 51. The connecting portion 62 and the seat body 51 can be locked by a bolt. The length of the connecting portion 62 can be appropriately adjusted according to the length of the cable 31. A partition 514 is formed between the first mounting groove 512 and the second mounting groove 513 of the seat body 51. The end of the connecting portion 62 abuts against the partition 514, and the partition 514 plays a positioning role for the connecting portion 62.

[0072] According to the above structure, a simulation model of 0.5-70GHz waveguide probe was established. The insertion loss curve obtained by simulation is shown in Fig.12 As shown in the figure, it can be seen that the insertion loss is less than 55dB in the entire frequency band. This performance indicator can achieve good microwave detection function.

[0073] According to the above structure, a time domain reflectometry (TDR) simulation model was established. The terminal TDR curve is shown in Fig.13 As shown in the figure, it can be seen that the probe device provided by the present invention meets the high-frequency characteristics required by the millimeter-wave device under test.

[0074] The probe device provided by the present invention includes a plurality of probes 2, and the probe heads 22 of the plurality of probes 2 are arranged in parallel with a small spacing therebetween, which can realize accurate electrical characteristic measurement, and is particularly suitable for testing situations in a high-frequency environment where the spacing between contact points is extremely small and the number of contacts is large; by optimizing the arrangement and material selection of the probes 2, the influence of parasitic effects (such as parasitic capacitance and parasitic inductance) on signal transmission is reduced, thereby ensuring that stable and low-loss signal transmission can still be maintained under high-frequency conditions, so that the probe device can meet the high-frequency testing of integrated circuits or other microelectronic devices.

[0075] The above implementation modes are only used to illustrate the present invention and are not intended to limit the technical solutions described in the present invention. The understanding of the present invention should be based on the technical personnel in the relevant technical field. Although the present invention has been described in detail in this specification with reference to the above implementation modes, the ordinary technical personnel in the field should understand that the technical personnel in the relevant technical field can still modify or replace the present invention with equivalents, and all technical solutions and improvements thereof that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A radio frequency test probe device, characterized in that: include: A substrate (1), wherein the substrate (1) is provided with a first welding portion (11) and a second welding portion (12); A plurality of probes (2), wherein the plurality of probes (2) are arranged in parallel and connected to the first welding portion (11); A plurality of transmission lines (3), wherein the plurality of transmission lines (3) are connected to the second soldering portion (12), and the plurality of transmission lines (3) are electrically connected to at least part of the plurality of probes (2); as well as A cable protection seat (4), the cable protection seat (4) is connected to the substrate (1), and there is a space between the cable protection seat (4) and the substrate (1) for the transmission line (3) to pass through.

2. The radio frequency test probe device according to claim 1, characterized in that: The probe (2) comprises a main body (21), a probe head (22) connected to one end of the main body (21), and a connecting portion (23) connected to the other end of the main body (21); the connecting portion (23) is fixed to the first welding portion (11) by welding; the probe head (22) is configured to dock with a gold finger (100) of a device under test; along a direction in which the plurality of probes (2) are arranged in parallel, at least a portion of the plurality of main bodies (21) is bent relative to the respective connecting portions (23); and the distance between at least a portion of two adjacent probe heads (22) in the plurality of probes (2) is smaller than the distance between the center lines of two adjacent main bodies (21).

3. The radio frequency test probe device according to claim 2, characterized in that: The plurality of probes (2) include a signal probe (2a) and a ground probe (2b), the transmission line (3) is electrically connected to the signal probe (2a), The signal probe (2a) comprises a first probe head (22a) and a first connecting portion (23a); the grounding probe (2b) comprises a second probe head (22b) and a second connecting portion (23b); a first distance (S1) is provided between a center line of the first connecting portion (23a) and a center line of an adjacent second connecting portion (23b); and a second distance (S2) is provided between the first probe head (22a) and an adjacent second probe head (22b) along a direction in which the plurality of probes (2) are arranged in parallel; the second distance (S2) is smaller than the first distance (S1).

4. The radio frequency test probe device according to claim 3, characterized in that: The signal probes (2a) are arranged in pairs between the two grounding probes (2b); in the pair of signal probes (2a), there is a third distance (S3) between the center lines of two adjacent first connecting parts (23a), and there is a fourth distance (S4) between two adjacent first probe heads (22a); the fourth distance (S4) is smaller than the third distance (S3).

5. The radio frequency test probe device according to claim 3, characterized in that: The second connecting portion (23b) of at least one of the grounding probes (2b) is connected to two of the main bodies (21), and the two main bodies (21) are correspondingly connected to two of the second probe heads (22b), and along the parallel direction of the plurality of probes (2), the distance between the two main bodies (21) gradually increases from the second connecting portion (23b) outwards.

6. The radio frequency test probe device according to claim 2, characterized in that: The width of the probe head (22) is smaller than the width of the gold finger (100), and the probe head (22) is in an inclined state relative to the device under test so that the tip of the probe head (22) is butted against the gold finger (100).

7. The radio frequency test probe device according to claim 1, characterized in that: The transmission line (3) comprises a cable (31) and a coaxial connector (32), one end of the cable (31) is connected to the substrate (1), and the coaxial connector (32) is connected to the other end of the cable (31). The probe device also comprises a fixing seat (5), the fixing seat (5) has a plurality of channels (50), and each of the coaxial connectors (32) is at least partially disposed in a corresponding channel (50).

8. The radio frequency test probe device according to claim 7, characterized in that: The substrate (1) is inclined relative to a plane perpendicular to the axis of the channel (50).

9. The radio frequency test probe device according to claim 7, characterized in that: The fixing seat (5) comprises a seat body (51) and a cover plate (52) connected to the seat body (51); the seat body (51) is provided with a first through hole (511); the cover plate (52) is provided with a second through hole (521); the first through hole (511) is communicated with the second through hole (521); the channel (50) comprises the first through hole (511) and the second through hole (521); the cover plate (52) and the seat body (51) form a step (53) in the channel (50); the coaxial connector (32) abuts against the step (53).

10. The radio frequency test probe device according to claim 7, characterized in that: The probe device further comprises a support member (6), wherein the support member (6) comprises a support portion (61) and a connection portion (62) connected to the support portion (61), wherein the connection portion (62) is connected to the fixing seat (5), and the support portion (61) and the cable protection seat (4) are respectively detachably connected to different sides of the substrate (1) in the thickness direction.

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