Color film substrate, display panel and display device

Abstract

The application provides a color film substrate, a display panel and a display device, and belongs to the technical field of display. The color film substrate comprises a substrate, a filter layer arranged on one side of the substrate, and a heat dissipation assembly. The substrate has a display area and a non-display area arranged around the display area. The filter layer comprises color resistance layers of multiple different colors. The heat dissipation assembly comprises a liquid cooling pipe, the liquid cooling pipe is located on the same side of the substrate as the filter layer, and the liquid cooling pipe is provided with cooling liquid. The liquid cooling pipe comprises heat conduction pipes and cooling pipes which are in communication with each other. The heat conduction pipes are arranged in the display area and are located between adjacent color resistance layers and are arranged in a staggered manner with the color resistance layers. The cooling pipes are arranged in the non-display area and are in communication with the heat conduction pipes. The color film substrate can improve the heat resistance of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a color filter substrate, a display panel, and a display device. Background Technology

[0002] In recent years, with the continuous development of thin-film transistor liquid crystal display (TFT-LCD) technology, TFT-LCD display panels have been widely used in daily life and production due to their advantages such as low cost, high reliability, low power consumption, low radiation, and wide color gamut.

[0003] TFT-LCD display panels typically consist of an array substrate, a color filter substrate, and a liquid crystal layer. The array substrate and the color filter substrate are stacked together to form a liquid crystal cell, into which liquid crystal is injected. When the display panel operates in high-temperature environments, its operating temperature rises, which can easily affect the panel's reliability and lifespan. Moreover, because the liquid crystal cell is a sealed space, the temperature of the liquid crystal inside the panel also rises, and the heat is not easily dissipated. This causes the liquid crystal to become more liquid-like, increasing its fluidity. Under the influence of gravity, this can easily lead to gravity mutagenesis in the display panel. Summary of the Invention

[0004] This application provides a color filter substrate, a display panel, and a display device, aiming to solve the problem in the prior art where the internal temperature of the display panel rises and the liquid crystal flow increases, resulting in uneven display.

[0005] To address the aforementioned technical problems, the first technical solution provided in this application is: to provide a color filter substrate. The color filter substrate includes:

[0006] A substrate having a display area and a non-display area surrounding the display area;

[0007] A filter layer, disposed on one side of the substrate, includes color resist layers of various colors;

[0008] The color filter substrate also includes a heat dissipation assembly, which includes a liquid cooling pipe disposed on one side of the substrate and on the same side of the substrate as the filter layer. Cooling liquid is disposed in the liquid cooling pipe.

[0009] The liquid cooling pipe includes a heat-conducting pipe and a cooling pipe that are interconnected; the heat-conducting pipe is located in the display area, between adjacent color resist layers, and is offset from the color resist layers; the cooling pipe is located in the non-display area and is connected to the heat-conducting pipe.

[0010] In some embodiments, the filter layer further includes a black matrix disposed on one side of the substrate; the black matrix includes a lateral light-shielding layer extending along a first direction and a longitudinal light-shielding layer extending along a second direction, and multiple lateral light-shielding layers and multiple longitudinal light-shielding layers are staggered in the first direction and the second direction to form multiple pixel openings, and a color resist layer is disposed within the pixel openings; wherein the first direction and the second direction intersect.

[0011] The heat pipe is located on the side of the black matrix away from the substrate, and the orthogonal projection of the heat pipe on the substrate is located within the orthogonal projection of the black matrix on the substrate.

[0012] In some embodiments, the heat pipe includes multiple transverse heat-absorbing pipes extending along a first direction or longitudinal heat-absorbing pipes extending along a second direction; wherein, the two ends of the multiple transverse heat-absorbing pipes or the multiple longitudinal heat-absorbing pipes are respectively connected to a cooling pipe, so that the coolant in the heat pipe exchanges heat with the coolant in the cooling pipe after being heated; the two ends of the transverse heat-absorbing pipes or the longitudinal heat-absorbing pipes extend to the non-display area as cooling pipes, or the cooling pipe extends along the non-display area and surrounds the heat pipe; or,

[0013] The heat pipe also includes a connecting pipe; multiple transverse or longitudinal heat-absorbing pipes are connected end-to-end by the connecting pipe, and the two ends of the heat pipe formed by the end-to-end connection are respectively connected to the two ends of the cooling pipe. The connecting pipe extends along a second direction or a first direction, and the orthographic projection of the connecting pipe on the substrate is located within the orthographic projection of the black matrix on the substrate; the cooling pipe extends along the non-display area and surrounds the heat pipe. The heat dissipation assembly also includes a miniature water pump disposed in the pipe of the cooling pipe to drive the coolant to circulate in the pipe; or,

[0014] The heat pipe includes multiple horizontal heat absorption pipes and multiple vertical heat absorption pipes. The horizontal heat absorption pipes and the vertical heat absorption pipes are interconnected to form a heat pipe. The heat pipe has at least two connection ports, which are connected to a cooling pipe. The cooling pipe extends along the non-display area and surrounds the heat pipe.

[0015] In some embodiments, the color filter substrate further includes spacer pillars disposed on the side of the black matrix away from the substrate; the spacer pillars include main spacer pillars and auxiliary spacer pillars, which are alternately arranged; in the direction perpendicular to the substrate, the height of the main spacer pillars is greater than the height of the auxiliary spacer pillars.

[0016] The maximum width of the heat pipe's orthogonal projection onto the substrate does not exceed 0.8 times the width of the black matrix's orthogonal projection onto the substrate; in the direction perpendicular to the substrate, the height of the heat pipe does not exceed the height of the auxiliary spacer pillar.

[0017] In some embodiments, the heat pipe includes a plurality of transverse heat-absorbing pipes extending along a first direction and a plurality of longitudinal heat-absorbing pipes extending along a second direction, wherein the transverse heat-absorbing pipes and the longitudinal heat-absorbing pipes are interconnected to form a heat pipe; the first direction and the second direction intersect.

[0018] The heat pipe is located on one side of the substrate and serves as a black matrix; the vertical heat absorber and the horizontal heat absorber intersect to form multiple pixel openings, and the color resist layer is located in the pixel openings.

[0019] In some embodiments, the color filter substrate further includes spacer pillars disposed on the side of the black matrix away from the substrate;

[0020] The heat pipes and spacer pillars are spaced apart on the black matrix; or,

[0021] The wall of the heat pipe protrudes in a predetermined position away from the substrate to form a sub-heat absorber. The sub-heat absorber has a cavity that communicates with the inside of the heat pipe so that the coolant in the heat pipe fills the cavity. The septum post has a groove on the side near the substrate. The septum post is set at a predetermined position and is interlocked with the sub-heat absorber through the groove.

[0022] In some embodiments, the heat dissipation component further includes a metal heat dissipation layer disposed in the non-display area, the metal heat dissipation layer being disposed between the substrate and the cooling pipe and in contact with the cooling pipe; the metal heat dissipation layer extends along the non-display area and surrounds the display area.

[0023] In some embodiments, the cooling pipes are arranged in a continuous "S" shape in the non-display area; the metal heat dissipation layer is electrically connected to the ground signal.

[0024] To address the aforementioned technical problems, the second technical solution provided in this application is: to provide a display panel. The display panel includes:

[0025] Array substrate;

[0026] A color filter substrate is disposed in a cell with an array substrate, wherein the color filter substrate is the color filter substrate as described in the above technical solution;

[0027] The liquid crystal layer is disposed between the array substrate and the color filter substrate.

[0028] To address the aforementioned technical problems, the third technical solution provided in this application is: to provide a display device. The display device includes:

[0029] The display panel is the same as the display panel described in the above technical solution;

[0030] The backlight module is located on one side of the display panel and is used to provide backlight to the display panel.

[0031] The beneficial effects of this application are as follows: Unlike the prior art, this application provides a color filter substrate, a display panel, and a display device. The color filter substrate includes a substrate and a filter layer, used to form a liquid crystal cell with an array substrate for housing liquid crystal, and for filtering sub-pixel units to achieve full-color display. By further including a heat dissipation component in the color filter substrate, heat dissipation is achieved for the display panel, reducing the impact of high temperatures on the display panel. Furthermore, by including a liquid cooling pipe in the heat dissipation component, and placing the liquid cooling pipe and the filter layer on the same side of the substrate, and by placing coolant in the liquid cooling pipe, the liquid cooling pipe can directly absorb heat from the display panel. Simultaneously, by including interconnected heat-conducting pipes and cooling pipes in the liquid cooling pipe, with the heat-conducting pipe located in the display area and the cooling pipe located in the non-display area, the heat absorbed by the heat-conducting pipe is instantly conducted to the cooling pipe in the non-display area for heat dissipation via the coolant. This effectively improves the heat dissipation rate, effectively prevents the liquid crystal from becoming liquid-like, thus preventing uneven display caused by increased liquid crystal flow. It also effectively reduces the impact of high temperatures on the reliability and lifespan of the display panel, enabling the display panel to adapt to high-temperature environments and operate stably under high temperatures, thereby improving the heat resistance of the display panel. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application;

[0034] Figure 2 This is a schematic diagram of the planar structure of the color filter substrate provided in the first embodiment of this application;

[0035] Figure 3 This is a schematic cross-sectional view of a color filter substrate provided in an embodiment of this application in the second direction;

[0036] Figure 4 This is a schematic diagram of the planar structure of the color filter substrate provided in the first embodiment of the present application in the display area;

[0037] Figure 5 This is a schematic diagram of the planar structure of the color filter substrate provided in the second embodiment of this application;

[0038] Figure 6 This is a schematic diagram of the planar structure of the color filter substrate provided in the third embodiment of this application;

[0039] Figure 7 This is a schematic diagram of the planar structure of the color filter substrate provided in the fourth embodiment of this application;

[0040] Figure 8 This is a schematic diagram of the planar structure of the color filter substrate provided in the fifth embodiment of this application;

[0041] Figure 9 This is a schematic diagram of the planar structure of the color filter substrate provided in the sixth embodiment of this application;

[0042] Figure 10 This is a schematic diagram of the planar structure of the color filter substrate provided in the second embodiment of the display area in this application;

[0043] Figure 11 This is a schematic diagram of the planar structure of the color filter substrate provided in the third embodiment of the display area in this application;

[0044] Figure 12 yes Figure 11 A schematic cross-sectional structure diagram of a central color filter substrate in the AA direction;

[0045] Figure 13 yes Figure 11 A schematic cross-sectional structure diagram of another embodiment of the color filter substrate in the AA direction;

[0046] Figure 14 yes Figure 11 A schematic diagram of the cross-sectional structure of the color filter substrate along the BB direction;

[0047] Figure 15 yes Figure 12 A schematic diagram of the manufacturing process for the color filter substrate;

[0048] Figure 16 This is a schematic diagram of the planar structure of the color filter substrate in the display area provided in the seventh embodiment of this application;

[0049] Figure 17 yes Figure 16 A schematic cross-sectional structure diagram of a color filter substrate in the AA direction according to an embodiment;

[0050] Figure 18 yes Figure 16 A schematic cross-sectional structure diagram of another embodiment of the color filter substrate in the AA direction;

[0051] Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of this application.

[0052] Figure label:

[0053] 100-Display panel; 10-Array substrate; 20-Color filter substrate; 21-Substrate; 211-Display area; 212-Non-display area; 22-Color resist layer; 221-Red color resist layer; 222-Green color resist layer; 223-Blue color resist layer; 224-Mounting groove; 23-Liquid cooling pipe; 231-Heat pipe; 2311-Horizontal heat absorber pipe; 2312-Vertical heat absorber pipe; 2313-Connecting pipe; 2314-Sub-heat absorber; 232-Cooling pipe; 24-Miniature water pump; 25-Metal heat dissipation layer; 26-Spacer pillar; 261-Main spacer pillar; 262-Auxiliary spacer pillar; 263-Groove; 30-Liquid crystal cell; 31-Liquid crystal layer;

[0054] BM - Black matrix; BM1 - Lateral shading layer; BM2 - Vertical shading layer; X - First direction; Y - Second direction; G - Gravity direction. Detailed Implementation

[0055] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0056] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0058] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0059] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0060] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0061] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a display panel provided in one embodiment of this application. In this embodiment, a display panel 100 is provided, which includes an array substrate 10, a color filter substrate 20, and a liquid crystal layer 31. The array substrate 10 and the color filter substrate 20 are disposed opposite each other to form a sealed space. The liquid crystal layer 31 is disposed between the array substrate 10 and the color filter substrate 20, i.e., within the sealed space formed by the array substrate 10 and the color filter substrate 20. The array substrate 10 is used to generate an electric field to drive the liquid crystal to deflect it by a preset angle, thereby controlling the amount of light transmitted and displaying the corresponding brightness. The color filter substrate 20 is used to filter light to display the corresponding color light, thereby achieving full-color image display. In some embodiments, the color filter substrate 20 is also provided with a common electrode to generate an electric field of corresponding intensity with the pixel electrodes opposite to those on the array substrate 10, driving the liquid crystal to deflect by a preset angle.

[0062] In this embodiment, the display panel 100 can be used in applications such as mobile phones, tablets, computers, televisions, laptops, automotive applications, and projectors. The color filter substrate 20 of the display panel 100 is equipped with a heat dissipation component, giving the display panel 100 better heat resistance and enabling stable operation in high-temperature environments, such as automotive and projector applications. For a detailed description of the structure and function of the color filter substrate 20 in the following embodiments, please refer to the following detailed description.

[0063] Please see Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the planar structure of the color filter substrate provided in the first embodiment of this application. Figure 3 This is a schematic cross-sectional view of a color filter substrate provided in an embodiment of this application in the second direction Y. In this embodiment, a color filter substrate 20 is provided, which includes a substrate 21, a filter layer, and a heat dissipation component.

[0064] The substrate 21 can be an optical-grade glass substrate or a flexible substrate to support the filter layer and heat dissipation components. The substrate 21 has a display area 211 and a non-display area 212 surrounding the display area 211; that is, the middle area of ​​the substrate 21 is the display area 211, and the outer border area surrounding the middle area is the non-display area 212. The filter layer is disposed on one side of the substrate 21 and includes multiple color resist layers 22 of different colors. The multiple color resist layers 22 of different colors are distributed in the display area 211 of the substrate 21 according to a preset arrangement to convert white light into colored light, thereby realizing full-color display. In specific applications, the color resist layers 22 of different colors can be red color resist layer 221, green color resist layer 222, and blue color resist layer 223, and each pixel includes at least these three colors of color resist layer 22, thereby performing color mixing display.

[0065] In this embodiment, the heat dissipation component includes a liquid cooling pipe 23, which is disposed on one side of the substrate 21 and on the same side of the substrate 21 as the light filter layer. Coolant is disposed within the liquid cooling pipe 23. It can be understood that both the liquid cooling pipe 23 and the light filter layer are disposed on the side of the substrate 21 closest to the liquid crystal layer 31. By placing the liquid cooling pipe 23 on the side of the substrate 21 closest to the liquid crystal layer 31, not only is the heat absorption path of the liquid cooling pipe 23 shortened, but the heat absorption area between the liquid cooling pipe 23 and the liquid crystal layer 31 is also effectively increased. This avoids the heat inside the display panel 100 from being unable to dissipate in time due to the heat insulation between the substrate 21 and the light filter layer, which would cause the liquid crystal to tend towards a liquid state, increasing its fluidity and causing uneven display in the display panel 100.

[0066] Specifically, the liquid cooling pipe 23 includes a heat-conducting pipe 231 and a cooling pipe 232 that are interconnected. The heat-conducting pipe 231 is disposed in the display area 211, located between adjacent color resist layers 22, and offset from the color resist layers 22; the cooling pipe 232 is disposed in the non-display area 212 and is connected to the heat-conducting pipe 231. It is understandable that placing the heat pipe 231 in the display area 211, between adjacent color resist layers 22 and offset from the color resist layers 22, can prevent the heat pipe 231 from affecting light emission. By connecting the heat pipe 231 to the cooling pipe 232, the coolant in the heat pipe 231 of the display area 211 can absorb the heat generated inside the panel and diffuse it to the cooling pipe 232 of the non-display area 212 for heat dissipation. The cooled coolant in the cooling pipe 232 is exchanged to the heat pipe 231 of the display area 211 to continue absorbing heat, thereby achieving heat exchange for heat dissipation. This effectively improves heat dissipation efficiency and can effectively prevent the liquid crystal from tending to a liquid state, which would increase the fluidity of the liquid crystal and cause uneven display of the display panel 100. It effectively reduces the impact of high temperature on the reliability and service life of the display panel 100, so that the display panel 100 can adapt to high temperature environments, such as automotive environments and projection scenarios, and can operate stably in high temperature environments, thus improving the heat resistance of the display panel 100.

[0067] It should be noted that, under normal circumstances, to ensure the transmittance of the liquid crystal, the signal lines controlling the deflection of the liquid crystal, transistor switches, and other driving components in the display panel 100 are all disposed on the array substrate 10. Specifically, the area where these driving components are located on the array substrate 10 is opposite to the area between adjacent color resist layers 22 on the color filter substrate 20. When the display panel 100 is working, the main heat-generating area inside the panel is the area where these driving components are located. Therefore, the liquid crystal temperature in the corresponding area of ​​the liquid crystal layer 31 is also relatively easier to rise. In this embodiment, by disposing the heat pipe 231 on the color filter substrate 20 in the area opposite to the area where the driving components are located on the array substrate 10, the coolant in the heat pipe 231 can immediately absorb the heat from the area where the temperature is more easily raised, thereby further improving the heat dissipation efficiency and quickly reducing the internal temperature of the panel.

[0068] Please refer to the following: Figure 3 and Figure 4 , Figure 4This is a schematic diagram of the planar structure of the color filter substrate provided in the display area according to the first embodiment of this application. In this embodiment, the filter layer further includes a black matrix BM, which is disposed on one side of the substrate 21. The black matrix BM includes a lateral light-shielding layer BM1 extending along the first direction X and a vertical light-shielding layer BM2 extending along the second direction Y. Multiple lateral light-shielding layers BM1 and multiple vertical light-shielding layers BM2 are staggered in the first direction X and the second direction Y to form multiple pixel openings. The color resist layer 22 is disposed within the pixel openings. The first direction X and the second direction Y intersect. In this embodiment, the color resist layers 22 are arranged in an array. Taking the row direction of the array as the first direction X and the column direction of the array as the second direction Y as an example, it can be understood that the horizontal direction is the first direction X and the vertical direction is the second direction Y. Specifically, the black matrix BM is used to separate the color resist layers 22 to prevent color crosstalk and light leakage.

[0069] In this embodiment, the heat pipe 231 is disposed on the side of the black matrix BM away from the substrate 21, and the orthographic projection of the heat pipe 231 on the substrate 21 lies within the orthographic projection of the black matrix BM on the substrate 21. That is, the heat pipe 231 is disposed on the side of the black matrix BM closer to the liquid crystal layer 31, and the heat pipe 231 does not extend beyond the black matrix BM in the direction parallel to the substrate 21, so as to reduce the influence of the heat pipe 231 on light and avoid the heat pipe 231 blocking light. Furthermore, the maximum width of the orthographic projection of the heat pipe 231 on the substrate 21 may not exceed 0.8 times the width of the orthographic projection of the black matrix BM on the substrate 21, so as to further reduce the influence of the heat pipe 231 on light.

[0070] Please refer to the following: Figure 2 and Figure 4 In this embodiment, the heat pipe 231 includes multiple transverse heat-absorbing pipes 2311 extending along a first direction X and a connecting pipe 2313. The multiple transverse heat-absorbing pipes 2311 are connected end-to-end by the connecting pipe 2313. The two ends of the heat pipe 231 formed by the end-to-end connection are respectively connected to the two ends of the cooling pipe 232 for heat exchange. The connecting pipe 2313 extends along a second direction Y, and the orthographic projection of the connecting pipe 2313 on the substrate 21 lies within the orthographic projection of the black matrix BM on the substrate 21 to avoid the connecting pipe 2313 blocking light. In specific applications, the heat pipe 231 is a single integrated structure; it can be understood that the heat pipe 231 is a single pipe, and the transverse heat-absorbing pipes 2311 and the connecting pipe 2313 are different parts of the heat pipe 231. Figure 2 As shown, the heat pipe 231 is laid out in a serpentine pattern in the display area 211 to increase the length of the heat pipe 231, thereby increasing the heat absorption area of ​​the heat pipe 231 and effectively improving the heat dissipation efficiency.

[0071] Furthermore, such as Figure 2As shown, in this embodiment, the cooling pipe 232 extends along the non-display area 212 and surrounds the heat-conducting pipe 231. Specifically, the cooling pipe 232 can extend along the non-display area 212 to surround the display area 211 at least once, and its two ends are respectively connected to the two ends of the heat-conducting pipe 231, so that the coolant in the liquid cooling pipe 23 can circulate between the heat-conducting pipe 231 and the cooling pipe 232, thereby realizing heat exchange. In this embodiment, by extending the cooling pipe 232 along the non-display area 212 and surrounding the heat-conducting pipe 231, the length of the cooling pipe 232 is increased, thereby increasing the heat dissipation capacity of the coolant, so that more coolant in the heat-conducting pipe 231 can be diffused into the cooling pipe 232 for heat dissipation in an instant, thus improving the heat dissipation effect.

[0072] Furthermore, in this embodiment, the heat dissipation assembly also includes a miniature water pump 24 disposed in the pipe of the cooling pipe 232 to drive the coolant to circulate in the pipe. That is, by distributing the miniature water pump 24 in the pipe of the cooling pipe 232 to drive the coolant to circulate in the pipe, the flow rate of the coolant in the liquid cooling pipe 23 can be increased, thereby enabling the coolant in the heat conduction pipe 231 to quickly flow to the cooling pipe 232 for cooling after absorbing heat, effectively improving the heat dissipation efficiency.

[0073] Furthermore, the display panel 100 provided in this embodiment is also equipped with a temperature sensor for monitoring the in-plane temperature. Specifically, the temperature sensor can be disposed on the color filter substrate 20, specifically in the area where the black matrix BM is located, to improve the sensitivity of the temperature sensor; alternatively, the temperature sensor can also be disposed on the array substrate 10, specifically in the area where the driving component described above is located, to improve the sensitivity of the temperature sensor. The temperature sensor can be electrically coupled to the driving module used to drive the array substrate 10, and the control terminal of the micro water pump 24 is also electrically coupled to the driving module; the driving module can control the temperature sensor to monitor the temperature, receive the temperature signal detected by the temperature sensor, and then control the micro water pump 24 to operate according to the received temperature signal.

[0074] For example, in some embodiments, when the temperature exceeds a threshold, the drive module controls the micro water pump 24 to turn on and operate at a preset speed, so that the coolant in the liquid cooling pipe 23 circulates at a preset flow rate to dissipate heat from the display panel 100 and cool it down. When the temperature is below the threshold, the drive module controls the micro water pump 24 to turn off, and the coolant in the heat conduction pipe 231 diffuses into the cooling pipe 232 after absorbing heat, exchanging coolant with the coolant in the cooling pipe 232.

[0075] Alternatively, in other embodiments, multiple thresholds can be set, such as a first threshold, a second threshold, and a third threshold set sequentially from low to high. When the temperature is greater than the first threshold but less than the second threshold, the drive module controls the micro water pump 24 to operate at a first preset speed, so that the coolant in the liquid cooling pipe 23 circulates at a first preset flow rate. When the temperature is greater than the second threshold but less than the third threshold, the drive module controls the micro water pump 24 to operate at a second preset speed, so that the coolant circulates at a second preset flow rate. When the temperature is greater than the third threshold, the drive module controls the micro water pump 24 to operate at a third preset speed, so that the coolant circulates at a third preset flow rate. By setting a temperature range, the micro water pump 24 operates at the corresponding speed, so that the coolant circulates at the corresponding flow rate, thereby controlling the heat dissipation rate according to the temperature, and thus controlling the temperature of the display panel 100, cooling the display panel 100 to a corresponding degree. This not only precisely controls the heat dissipation effect but also saves power consumption.

[0076] In this embodiment, the heat dissipation assembly further includes a metal heat dissipation layer 25 disposed in the non-display area 212. The metal heat dissipation layer 25 is disposed between the substrate 21 and the cooling pipe 232, and is in contact with the cooling pipe 232; and the metal heat dissipation layer 25 extends along the non-display area 212, surrounding the display area 211. Specifically, the orthographic projection of the metal heat dissipation layer 25 on the substrate 21 coincides with the non-display area 212, thereby maximizing the area of ​​the metal heat dissipation layer 25 to further improve the heat dissipation efficiency of the cooling pipe 232. The metal heat dissipation layer 25 can be made of a metal material with good thermal conductivity and low specific heat capacity, such as copper (Cu), silver (Ag), aluminum (Al), or their alloys.

[0077] Furthermore, in a specific embodiment, the metal heat dissipation layer 25 can be electrically connected to the ground signal. This arrangement not only dissipates heat but also shields the radiation emitted by the gate scanning module in the display panel 100 during operation. Additionally, charged hands or other charged components can touch the edge of the display panel 100 to release static electricity through the metal heat dissipation layer 25, preventing static electricity from penetrating into the interior of the display panel 100 and thus providing electrostatic protection for the gate scanning module.

[0078] Please see Figure 5 , Figure 5This is a schematic diagram of the planar structure of the color filter substrate 20 provided in the second embodiment of this application. In this embodiment, the heat pipe 231 includes multiple longitudinal heat absorption pipes 2312 extending along the second direction Y and a connecting pipe 2313. The multiple longitudinal heat absorption pipes 2312 are connected end to end by the connecting pipe 2313. The two ends of the heat pipe 231 formed by the end-to-end connection are respectively connected to the two ends of the cooling pipe 232 for heat exchange. The connecting pipe 2313 extends along the first direction X, and the orthographic projection of the connecting pipe 2313 on the substrate 21 is located within the orthographic projection of the black matrix BM on the substrate 21, so as to avoid the connecting pipe 2313 blocking light.

[0079] Similar to the previous embodiment, in specific applications, the heat pipe 231 is an integral structure. It can be understood that the heat pipe 231 is a single, continuous tube, with the longitudinal heat-absorbing tube 2312 and the connecting tube 2313 being different parts of the heat pipe 231. It can be understood that the heat pipe 231 is laid out in a serpentine pattern within the display area 211 to increase its length, thereby increasing its heat-absorbing area and effectively improving heat dissipation efficiency.

[0080] In this embodiment, the cooling pipe 232 extends along the non-display area 212 and surrounds the heat-conducting pipe 231. Specifically, the cooling pipe 232 can extend along the non-display area 212 to surround the display area 211 at least once, and its two ends are respectively connected to the two ends of the heat-conducting pipe 231, so that the coolant in the liquid cooling pipe 23 can circulate between the heat-conducting pipe 231 and the cooling pipe 232, thereby realizing heat exchange. In specific applications, the cooling pipe 232 and the heat-conducting pipe 231 are also an integral structure, that is, the liquid cooling pipe 23 is a whole pipe, the part located in the display area 211 is the heat-conducting pipe 231, which is used to absorb heat, and the part located in the non-display area 212 is the cooling pipe 232, which is used to dissipate heat.

[0081] Furthermore, such as Figure 5 As shown in the partially enlarged view of the cooling pipe 232, the cooling pipe 232 extends in a continuous "S" shape in the non-display area 212. That is, the cooling pipe 232 is distributed in a serpentine manner in the non-display area 212 to further increase the length of the cooling pipe 232, thereby increasing the heat dissipation capacity of the coolant. This allows more coolant in the heat pipe 231 to diffuse into the cooling pipe 232 for heat dissipation in a timely manner, improving the heat dissipation effect. It should be noted that the heat dissipation capacity in this embodiment refers to the maximum capacity of coolant that the cooling pipe 232 can hold.

[0082] Please see Figure 6 , Figure 6This is a schematic diagram of the planar structure of the color filter substrate provided in the third embodiment of this application. In this embodiment, the heat pipe 231 includes multiple transverse heat-absorbing pipes 2311 extending along a first direction X. The two ends of each transverse heat-absorbing pipe 2311 are respectively connected to a cooling pipe 232, so that the coolant in the heat pipe 231 exchanges heat with the coolant in the cooling pipe 232 after being heated. The two ends of the transverse heat-absorbing pipes 2311 extend into the non-display area 212 as cooling pipes 232.

[0083] In this embodiment, no temperature micro water pump 24 is provided. After the coolant in the heat pipe 231 absorbs heat and its temperature rises, it will diffuse into the cooling pipe 232 at both ends of the non-display area 212 and exchange with the coolant in the cooling pipe 232, so as to cool down in the cooling pipe 232. The coolant in the cooling pipe 232 then enters the heat pipe 231 to absorb heat, so as to achieve heat circulation and thereby cool down the display panel 100.

[0084] Furthermore, the cooling pipes 232 in the non-display area 212 are also arranged in a continuous "S" shape. That is, the cooling pipes 232 are distributed in a serpentine manner in the non-display area 212 to further increase the length of the cooling pipes 232, thereby increasing the heat dissipation capacity of the coolant. This allows more coolant in the heat pipe 231 to diffuse into the cooling pipes 232 for heat dissipation in a timely manner, improving the heat dissipation effect.

[0085] In other embodiments, the heat pipe 231 may also be a longitudinal heat absorption pipe 2312, with both ends of the longitudinal heat absorption pipe 2312 extending along the second direction Y to the non-display area 212 to serve as a cooling pipe 232, and both ends of the heat pipe 231 serving as cooling pipes 232.

[0086] Please see Figure 7 , Figure 7 This is a schematic planar structure diagram of the color filter substrate provided in the fourth embodiment of this application. Figure 6 Unlike the previous embodiment, in this embodiment, the cooling pipe 232 extends along the display area 211 and surrounds the heat-conducting pipe 231. Both ends of each transverse heat-absorbing pipe 2311 are connected to the cooling pipe 232, allowing the coolant in the transverse heat-absorbing pipe 2311 to diffuse into the cooling pipe 232 after being heated, exchanging heat with the coolant in the cooling pipe 232, thereby achieving cooling. This embodiment increases the length of the cooling pipe 232 by extending it along the display area 211 and surrounding it with the heat-conducting pipe 231, thereby increasing the heat dissipation capacity of the coolant. This allows more coolant in the heat-conducting pipe 231 to diffuse into the cooling pipe 232 for heat dissipation. Furthermore, the cooling pipe 232 in the non-display area 212 also extends in a continuous "S" shape in the non-display area 212 to further increase the length of the cooling pipe 232, thereby increasing the heat dissipation capacity of the coolant.

[0087] Please see Figure 8 , Figure 8 This is a schematic planar structure diagram of the color filter substrate provided in the fifth embodiment of this application. Figure 7 Unlike other embodiments, in this embodiment, the heat pipe 231 includes both a transverse heat-absorbing pipe 2311 extending along the first direction X and a longitudinal heat-absorbing pipe 2312 extending along the second direction Y. The transverse heat-absorbing pipe 2311 and the longitudinal heat-absorbing pipe 2312 are interconnected to form a longitudinal heat-absorbing pipe 2312 heat pipe 231. The longitudinal heat-absorbing pipe 2312 heat pipe 231 has at least two connection ports, which are connected to a longitudinal heat-absorbing pipe 2312 cooling pipe 232. The cooling pipe 232 extends along the non-display area 212 of the longitudinal heat-absorbing pipe 2312 and surrounds the longitudinal heat-absorbing pipe 2312 heat pipe 231. This arrangement increases the diffusion path of the coolant in the heat pipe 231, thereby further improving heat dissipation efficiency and performance.

[0088] Please see Figure 9 , Figure 9 This is a schematic diagram of the planar structure of the color filter substrate provided in the sixth embodiment of this application. In this embodiment, in the display area 211, the distribution density of the transverse heat absorption tubes 2311 gradually increases along the gravitational direction G, thereby increasing the heat dissipation efficiency of the heat dissipation component along the gravitational direction G, further reducing the fluidity of the liquid crystal in the lower region of the display panel 100 along the gravitational direction G, and further reducing gravity mura caused by the increased fluidity of the liquid crystal in the display panel 100 due to gravity.

[0089] Alternatively, in other embodiments, in the display area 211, the diameter of the heat pipe 231 gradually increases along the gravitational direction G, thereby providing more coolant in the area below along the gravitational direction G. This increases the heat dissipation efficiency of the heat dissipation component along the gravitational direction G, further reducing the fluidity of the liquid crystal in the area below along the gravitational direction G in the display panel 100, and further reducing gravity mura caused by the increased fluidity of the liquid crystal under the influence of gravity in the display panel 100. It should be noted that while the diameter of the heat pipe 231 gradually increases along the gravitational direction G, the maximum width of the orthographic projection of the heat pipe 231 onto the substrate 21 does not exceed the width of the orthographic projection of the black matrix BM onto the substrate 21; that is, the orthographic projection of the heat pipe 231 onto the substrate 21 is located within the orthographic projection of the black matrix BM onto the substrate 21, to avoid the heat pipe 231 blocking light.

[0090] Please see Figure 10 , Figure 10This is a schematic diagram of the planar structure of the color filter substrate in the display area according to the second embodiment of this application. In this embodiment, the color filter substrate 20 further includes spacer pillars 26, which are disposed on the side of the black matrix BM away from the substrate 21. The longitudinal heat absorber tubes 2312 and heat conduction tubes 2312, along with the spacer pillars 26, are spaced apart on the black matrix BM to facilitate the placement of the spacer pillars 26. For example, in this embodiment, the heat conduction tubes 231 include multiple transverse heat absorber tubes 2311 arranged along a first direction X, and the spacer pillars 26 are arranged in rows along the first direction X on the transverse light-shielding layer BM1 of the black matrix BM; along the second direction Y, the transverse heat absorber tubes 2311 and the spacer pillars 26 are arranged alternately in rows to facilitate the placement of the spacer pillars 26.

[0091] Furthermore, the septum column 26 includes a main septum column 261 and an auxiliary septum column 262 (see...). Figure 12 The main spacer pillar 261 and the auxiliary spacer pillar 262 are alternately arranged; in the direction perpendicular to the substrate 21, the height of the main spacer pillar 261 is greater than the height of the auxiliary spacer pillar 262; and in the direction perpendicular to the substrate 21, the height of the heat pipe 231 does not exceed the height of the auxiliary spacer pillar 262, so as to avoid the heat pipe 231 affecting the light emission, and at the same time avoid the heat pipe 231 affecting the supporting function of the spacer pillar 26.

[0092] Please see Figure 11 and Figure 12 , Figure 11 This is a schematic diagram of the planar structure of the color filter substrate in the display area according to the third embodiment of this application. Figure 12 yes Figure 11 A cross-sectional structural diagram of the color filter substrate in the AA direction is provided in one embodiment. In this embodiment, the wall of the heat pipe 231 protrudes at a predetermined position in a direction away from the substrate 21 to form a sub-heat absorption portion 2314. The sub-heat absorption portion 2314 has a cavity communicating with the interior of the heat pipe 231, so that the coolant in the heat pipe 231 fills the cavity. The spacer pillar 26 has a groove 263 on the side near the substrate 21. The spacer pillar 26 is disposed at a predetermined position and is interlocked with the sub-heat absorption portion 2314 through the groove 263. With the above arrangement, the coolant can be disposed inside the spacer pillar 26, thereby cooling the liquid crystal in a direction perpendicular to the substrate 21. Moreover, this arrangement allows the heat pipes 231 to be arranged row by row at the black matrix BM, increasing the distribution density of the heat pipes 231 in the display area 211 and increasing the volume of coolant in the heat pipes 231, thereby further improving the heat dissipation efficiency.

[0093] Please see Figure 13 and Figure 14 , Figure 13 yes Figure 11A schematic cross-sectional view of another embodiment of the color filter substrate in the AA direction. Figure 14 yes Figure 11 A schematic cross-sectional view of the color filter substrate along the BB direction. Furthermore, to facilitate the thinning of the display panel 100 and improve the integration of the heat pipe 231 with the black matrix BM, a mounting groove 224 can be formed on the black matrix BM, and the heat pipe 231 is disposed within the mounting groove 224. Moreover, this arrangement can further increase the diameter of the heat pipe 231 in the direction perpendicular to the substrate 21, thereby further increasing the capacity of the coolant in the heat pipe 231 and further improving heat dissipation efficiency.

[0094] Specifically, the liquid cooling tube 23 can be made of organic materials, such as resin. The liquid cooling tube 23 can be fabricated on the black matrix BM using a semi-film deposition process, or it can be fabricated first using 3D printing and then laid onto the black matrix BM area using an adhesive.

[0095] Please see Figure 15 , Figure 15 yes Figure 12 A schematic diagram of the manufacturing process corresponding to the color filter substrate. In this embodiment, a method for manufacturing a color filter substrate 20 is provided, the method comprising:

[0096] S11: Provides substrate 21;

[0097] S12: Fabricate a black matrix BM on substrate 21;

[0098] S13: Fabricate color resist layer 22 on the black matrix BM;

[0099] S14: Fabrication of liquid cooling tube 23: Liquid cooling tube 23 is fabricated on the black matrix BM using a semi-film deposition process; or, liquid cooling tube 23 is fabricated using 3D printing and then laid on the black matrix BM.

[0100] S15: A septum column 26 is deposited on the sub-heat absorber 2314 of the heat pipe 231.

[0101] In step S14, the liquid cooling pipe 23 formed has a sub-heat-absorbing portion 2314 formed by the protrusion of its wall away from the substrate 21 at a predetermined position. The sub-heat-absorbing portion 2314 has a cavity communicating with the interior of the heat-conducting pipe 231, so that the coolant in the heat-conducting pipe 231 fills the cavity. In step S15, a spacer pillar 26 is deposited on the sub-heat-absorbing portion 2314 of the heat-conducting pipe 231. A groove 263 is formed on the side of the spacer pillar 26 near the substrate 21, and the groove 263 is interlocked with the corresponding sub-heat-absorbing portion 2314.

[0102] Furthermore, the color filter substrate 20 typically also includes a planarization layer and an alignment layer (not shown). The planarization layer is disposed on the side of the color resist layer 22 away from the substrate 21 to planarize the side of the color filter substrate 20 close to the liquid crystal layer 31, thereby reinforcing the spacer pillars 26 and making the alignment layer flatter to improve the alignment effect of the liquid crystal.

[0103] Correspondingly, the manufacturing method also includes:

[0104] S16: Create a planarization layer on color resist layer 22;

[0105] S17: Fabricate an alignment layer on the planarization layer.

[0106] Please see Figure 16 and Figure 17 , Figure 16 This is a schematic diagram of the planar structure of the color filter substrate in the display area 211 provided in the seventh embodiment of this application. Figure 17 yes Figure 16 A cross-sectional structural diagram of the color filter substrate in the AA direction is provided in one embodiment. In this embodiment, the heat pipe 231 includes multiple lateral heat absorption pipes 2311 extending along a first direction X and multiple longitudinal heat absorption pipes 2312 extending along a second direction Y. The lateral heat absorption pipes 2311 and the longitudinal heat absorption pipes 2312 are interconnected to form the heat pipe 231. The heat pipe 231 is disposed on one side of the substrate 21 and serves as the black matrix BM; the longitudinal heat absorption pipes 2312 and the lateral heat absorption pipes 2311 intersect to form multiple pixel openings, and the color resist layer 22 is disposed in the pixel openings.

[0107] It is easy to understand that in this embodiment, the heat pipe 231 is not only used for heat absorption, but also serves as the black matrix BM by setting the shape of the heat pipe 231 to the shape of the black matrix BM and setting it at the position of the black matrix BM. In this way, the process of the black matrix BM can be eliminated in the production process, and the structure of the color filter substrate 20 can be simplified, which is conducive to the thin and light design of the display panel 100.

[0108] Please see Figure 18 , Figure 18 yes Figure 16 A schematic cross-sectional view of another embodiment of the color filter substrate in the AA direction. (Compared to...) Figure 12-14Similar to the embodiments in the previous one, in this embodiment, the wall of the heat pipe 231 protrudes at a preset position in a direction away from the substrate 21 to form a sub-heat absorption portion 2314. The sub-heat absorption portion 2314 has a cavity communicating with the interior of the heat pipe 231, so that the coolant in the heat pipe 231 fills the cavity. The spacer pillar 26 has a groove 263 on the side near the substrate 21. The spacer pillar 26 is set at a preset position and is interlocked with the sub-heat absorption portion 2314 through the groove 263. With the above arrangement, the coolant can be placed inside the spacer pillar 26, thereby cooling the liquid crystal in a direction perpendicular to the substrate 21. Moreover, this arrangement allows the heat pipes 231 to be arranged row by row at the black matrix BM, increasing the distribution density of the heat pipes 231 in the display area 211 and increasing the volume of coolant in the heat pipes 231, thereby further improving the heat dissipation efficiency.

[0109] Please see Figure 19 , Figure 19 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. In this embodiment, a display device is provided, which includes a display panel 100 and a backlight module. The backlight module is disposed opposite to the display panel 100 to provide backlight to the display panel 100 for image display.

[0110] The display panel 100 is a liquid crystal panel, and its specific structure is as follows: Figure 1 As shown, the display panel 100 includes an array substrate 10, a color filter substrate 20, and a liquid crystal layer 31; the array substrate 10 and the color filter substrate 20 are disposed in a cell to form a sealed space, and the liquid crystal layer 31 is disposed between the array substrate 10 and the color filter substrate 20, that is, disposed within the sealed space formed by the array substrate 10 and the color filter substrate 20.

[0111] Specifically, the specific structure and function of its color filter substrate 20 are the same as or similar to the specific structure and function of the color filter substrate 20 involved in the above embodiments, and can achieve the same technical effect. Please refer to the detailed introduction above for details, which will not be repeated here.

[0112] The display device provided in this embodiment can adapt to high-temperature environments, such as high-temperature application scenarios like vehicle displays and projection displays. It can operate stably in high-temperature usage scenarios, significantly improving its heat resistance.

[0113] The above are merely embodiments of this application and do not limit the scope of patent protection of this application. Any equivalent structural or procedural changes made using the content of this application’s specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A color film substrate, comprising: a substrate having a display area and a non-display area surrounding the display area; a filter layer disposed on one side of the substrate, comprising a plurality of color resistance layers of different colors; characterized in that the color film substrate further comprises a heat dissipation assembly, the heat dissipation assembly comprising a liquid cooling pipe, the liquid cooling pipe being disposed on the same side of the substrate as the filter layer, and the liquid cooling pipe containing a cooling liquid; wherein the liquid cooling pipe comprises a heat conduction pipe and a cooling pipe in communication with each other; the heat conduction pipe is disposed in the display area and located between adjacent color resistance layers, and is disposed in a staggered manner with the color resistance layers; the cooling pipe is disposed in the non-display area and is in communication with the heat conduction pipe.

2. The color filter substrate according to claim 1, wherein The filter layer further comprises a black matrix, the black matrix being disposed on one side of the substrate; the black matrix comprises a transverse light shielding layer extending in a first direction and a longitudinal light shielding layer extending in a second direction, a plurality of the transverse light shielding layers and a plurality of the longitudinal light shielding layers are arranged in a staggered manner in the first direction and the second direction to form a plurality of pixel openings, and the color resistance layers are arranged in the pixel openings; wherein the first direction and the second direction intersect; the heat conduction pipe is disposed on the side of the black matrix away from the substrate, and the orthographic projection of the heat conduction pipe on the substrate is located within the orthographic projection of the black matrix on the substrate.

3. The color filter substrate according to claim 2, wherein The heat conduction pipe comprises a plurality of transverse heat absorption pipes extending in the first direction or a plurality of longitudinal heat absorption pipes extending in the second direction; wherein the two ends of the plurality of transverse heat absorption pipes or the plurality of longitudinal heat absorption pipes are respectively in communication with the cooling pipe, so that the cooling liquid in the heat conduction pipe exchanges heat with the cooling liquid in the cooling pipe after being heated; the two ends of the transverse heat absorption pipe or the longitudinal heat absorption pipe extend to the non-display area as the cooling pipe, or the cooling pipe extends along the non-display area and surrounds the heat conduction pipe; or, the heat conduction pipe further comprises a connecting pipe; the plurality of transverse heat absorption pipes or the plurality of longitudinal heat absorption pipes are connected end to end through the connecting pipe, the two ends of the heat conduction pipe formed by the end-to-end connection are respectively in communication with the two ends of the cooling pipe, the connecting pipe extends along the second direction or the first direction, and the orthographic projection of the connecting pipe on the substrate is located within the orthographic projection of the black matrix on the substrate; the cooling pipe extends along the non-display area and surrounds the heat conduction pipe, and the heat dissipation assembly further comprises a micro water pump disposed in the pipeline of the cooling pipe, for driving the cooling liquid to circulate in the pipeline; or, the heat conduction pipe comprises a plurality of the transverse heat absorption pipes and a plurality of the longitudinal heat absorption pipes, the transverse heat absorption pipes and the longitudinal heat absorption pipes are in communication with each other to form the heat conduction pipe, and the heat conduction pipe has at least two connection ports in communication with the cooling pipe, and the cooling pipe extends along the non-display area and surrounds the heat conduction pipe.

4. The color filter substrate according to claim 2, wherein The color film substrate further comprises a spacer column, the spacer column is arranged on the side of the black matrix away from the substrate; the spacer column comprises a main spacer column and an auxiliary spacer column, the main spacer column and the auxiliary spacer column are arranged alternately and spaced apart; in the direction perpendicular to the substrate, the height of the main spacer column is greater than the height of the auxiliary spacer column. The maximum width of the orthographic projection of the heat conduction pipe on the substrate is not more than 0.8 times the width of the orthographic projection of the black matrix on the substrate; in the direction perpendicular to the substrate, the height of the heat conduction pipe is not more than the height of the auxiliary spacer column.

5. The color filter substrate according to claim 1, wherein The heat conduction pipe comprises a plurality of transverse heat absorption pipes extending in a first direction and a plurality of longitudinal heat absorption pipes extending in a second direction, the transverse heat absorption pipes and the longitudinal heat absorption pipes are in communication with each other to form the heat conduction pipe; the first direction and the second direction intersect; The heat conduction pipe is arranged on one side of the substrate and serves as a black matrix; the longitudinal heat absorption pipes and the transverse heat absorption pipes intersect to form a plurality of pixel openings, and the color resistance layer is arranged in the pixel openings.

6. The color filter substrate according to claim 2 or 5, wherein The color film substrate further comprises a spacer column, the spacer column is arranged on the side of the black matrix away from the substrate; The heat conduction pipe and the spacer column are arranged spaced apart on the black matrix; or, The pipe wall of the heat conduction pipe is protruded in the direction away from the substrate at a preset position to form a sub-heat absorption part, the sub-heat absorption part has a cavity in communication with the inside of the heat conduction pipe, so that the cooling liquid in the heat conduction pipe fills in the cavity; the side of the spacer column close to the substrate is provided with a groove, the spacer column is arranged at the preset position and is embedded with the sub-heat absorption part through the groove.

7. The color filter substrate according to claim 1, wherein The heat dissipation assembly further comprises a metal heat dissipation layer arranged in the non-display area, the metal heat dissipation layer is arranged between the substrate and the cooling pipe and is in contact with the cooling pipe; the metal heat dissipation layer extends along the non-display area to surround the display area.

8. The color filter substrate according to claim 7, wherein The cooling pipe is arranged in a continuous "S" shape in the non-display area; The metal heat dissipation layer is electrically connected to a ground signal.

9. A display panel, characterized by, Comprise: An array substrate; A color film substrate, which is arranged opposite to the array substrate, and is the color film substrate as claimed in any one of claims 1-8; A liquid crystal layer arranged between the array substrate and the color film substrate.

10. A display device, characterized by comprising: Comprise: A display panel, which is the display panel as claimed in claim 9; A backlight module arranged on one side of the display panel and used for providing backlight to the display panel. A display panel, which is the display panel as claimed in claim 9; A backlight module arranged on one side of the display panel and used for providing backlight to the display panel.

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