Printing silver paste for touch screen and preparation method thereof

By introducing MXene nanosheets, silver composite materials and modified polyurethane resin into the touch screen silver paste, the problems of high silver powder usage and unstable conductivity at high temperatures were solved, achieving cost reduction and performance improvement, especially improved conductivity and adhesion.

CN119480209BActive Publication Date: 2025-09-12DONGGUAN DOMAL ELECTRONICS SCI & TECH
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Patent Information

Application Number
CN202411586929.7
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-08
Publication Date
2025-09-12
Estimated Expiration
2044-11-08

AI Technical Summary

Technical Problem

The high amount of silver powder used in existing touch screen silver paste leads to high costs and unstable conductivity at high temperatures. It is necessary to find alternative materials with lower costs and better conductivity, while improving the adhesion of silver paste and its conductivity stability at high temperatures.

Method used

MXene nanosheets and silver composite materials are used as conductive fillers, and modified polyurethane resin is used as the bonding phase to prepare printed silver paste for touch screens. The high conductivity of MXene nanosheets and the adhesion and fluidity of modified polyurethane resin are utilized to reduce the amount of silver powder used and improve the conductivity, adhesion and thermal stability of the silver paste.

Benefits of technology

It reduces production costs, improves the conductivity and adhesion of silver paste, enhances mechanical strength and thermal stability, and ensures that excellent conductive properties can be maintained under high temperature conditions.

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Abstract

The present invention relates to the field of touch screen technology and discloses a printed silver paste for touch screens and a preparation method thereof. The silver paste prepared in the present invention is prepared from silver powder, a conductive filler, a modified polyurethane resin, and an organic solvent. The silver powder and the conductive filler act as conductive phases, not only imparting excellent conductivity to the substrate but also improving the hardness, adhesion, and thermal stability of the cured silver paste, thereby reducing the amount of silver powder used and the production cost. The organic silicon introduced into the modified polyurethane resin reduces the viscosity of the polyurethane, improves the fluidity of the silver paste, and facilitates its manufacture and processing.
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