Radiation imaging device

Abstract

A radiation imaging device according to one embodiment includes: a radiation detection panel; a base substrate having a support surface for supporting the radiation detection panel; and a housing that houses the radiation detection panel and the base substrate, the housing having a top wall and a bottom wall, the base substrate having a protruding portion that protrudes further outward than the radiation detection panel when viewed from a direction orthogonal to the support surface, the support surface of the protruding portion being provided with a first extension portion, and the support surface of the protruding portion being provided with a second extension portion. A second extending portion disposed at a position facing the first extending portion across the protruding portion is provided on the rear surface of the protruding portion, and the base substrate is supported by the top wall via the first extending portion and is supported by the bottom wall via the second extending portion.

Description

[0001] This application is filed on October 9, 2019 、Application No. 201980068235.5 、The name of the invention is radiation Camera device A divisional application for a patent application. Technical Field

[0002] The present invention relates to a radiation imaging device. Background Art

[0003] An X-ray detection device is described in Patent Document 1. The X-ray detection device includes a support member fixed in a housing (enclosure), and an X-ray detection panel fixed to the support member.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2010-145349 Summary of the invention

[0007] Problems to be solved by the invention

[0008] As described above, in the structure in which the X-ray detection panel is supported in the frame via the supporting member, the supporting member is stably supported in the frame. On the other hand, the above-mentioned Patent Document 1 does not describe a specific structure for fixing the supporting member in the frame.

[0009] An object of one aspect of the present invention is to provide a radiation imaging device capable of stably supporting a base substrate that supports a radiation detection panel.

[0010] Technical means of solving problems

[0011] A radiation imaging device according to one aspect of the present invention comprises: a radiation detection panel having a first surface on which a detection area for detecting radiation is formed, and a second surface on the opposite side to the first surface; a base substrate having a supporting surface opposite to the second surface of the radiation detection panel and supporting the radiation detection panel; and a frame that accommodates the radiation detection panel and the base substrate, the frame having a first wall portion opposite to the first surface and a second wall portion opposite to the second surface, the base substrate having a protrusion protruding outward more than the radiation detection panel when viewed from a first direction orthogonal to the supporting surface, a first extending portion extending in the first direction being provided on the supporting surface of the protrusion, a second extending portion being arranged at a position opposite to the first extending portion across the protrusion and extending in the first direction on the surface of the protrusion opposite to the supporting surface, the base substrate being supported by the first wall portion via the first extension portion, and being supported by the second wall portion via the second extension portion.

[0012] According to the above-mentioned radiation imaging device, the base substrate (protrusion) is clamped by a part of the frame body (the first wall portion and the second wall portion) that are opposite to each other via the first extension portion and the second extension portion. Thus, the base substrate can be stably supported relative to the frame body. Here, as a method of supporting the base substrate relative to the frame body, there is, for example, a method of supporting the back side (the surface opposite to the supporting surface) of the base substrate on the second wall portion via a columnar support member. According to the above-mentioned radiation imaging device, since the base substrate is supported on the frame body via the first extension portion and the second extension portion, the number of support members provided on the back side of the base substrate can be reduced even when the above-mentioned support method is used in combination. Thus, it is difficult to transmit an impact from the outside (especially the second wall portion) relative to the back side of the base substrate. As a result, the impact on the radiation detection panel arranged on the base substrate can be reduced.

[0013] The first extending portion may be a positioning member for positioning the radiation detection panel. According to this structure, since the radiation detection panel can be easily positioned with respect to the supporting surface of the base substrate by the first extending portion, assembly workability can be improved.

[0014] The first extension portion and the second extension portion may be formed separately from the base substrate. According to this configuration, warping of the base substrate can be reduced compared to a case where the base substrate and at least one of the first extension portion and the second extension portion are formed integrally.

[0015] The first extension portion and the second extension portion may also be mounted on the protruding portion by a common mounting member. According to this structure, the relative positional relationship between the first extension portion and the second extension portion can be maintained with high accuracy, and the base substrate can be supported more stably.

[0016] The second extension portion may be larger than the first extension portion when viewed from the first direction, and the second extension portion may have a portion that does not overlap with the first extension portion when viewed from the first direction. The second wall portion of the frame located on the opposite side of the first surface of the radiation detection panel on which the detection area is formed (i.e., opposite to the second surface) becomes a normal grounding surface (bottom wall). Therefore, according to the above structure, by making the second extension portion supported by the second wall portion larger than the first extension portion, the base substrate can be further stably supported. In addition, since the impact from the grounding surface side (second wall portion) can be appropriately absorbed by the second extension portion, it is difficult to transmit the impact to the radiation detection panel.

[0017] A plurality of first extensions arranged at intervals from each other may be provided on the support surface of the protruding portion, and a plurality of second extensions arranged at intervals from each other may be provided in a manner corresponding to the plurality of first extensions. According to this structure, the base substrate can be supported relative to the frame by the first extensions and the second extensions distributed at a plurality of positions spaced from each other. Thus, compared with the case where the first extensions and the second extensions are formed into a wall shape along the edge of the base substrate, for example, the first extensions and the second extensions can be made lighter, and the base substrate can be stably supported relative to the frame.

[0018] The base substrate may include a plurality of protrusions spaced apart from each other, and each of the plurality of protrusions may be provided with a first extension portion and a second extension portion. According to this configuration, by providing the first extension portion and the second extension portion on each protrusion, a configuration that exhibits the above-mentioned effects can be easily realized.

[0019] The radiation detection panel may be formed into a rectangular shape when viewed from the first direction, and a plurality of protrusions may be provided at positions corresponding to the four corners of the radiation detection panel. According to this structure, since the four corners of the base substrate can be well-balancedly clamped by the first wall portion and the second wall portion via the first extension portion and the second extension portion, the base substrate can be further stably supported relative to the frame.

[0020] The frame may also have a third wall portion extending in the first direction and connecting the first wall portion and the second wall portion, the third wall portion being formed into a rectangular ring shape when viewed from the first direction, and a recessed portion for avoiding interference with the protruding portion, the first extension portion, and the second extension portion being formed at the corner of the third wall portion, and the thickness of the third wall portion at the recessed portion is smaller than the thickness of the third wall portion at the edge portion of the third wall portion connecting the corners of adjacent third wall portions. When the thickness of the third wall portion is set to be constant (i.e., the thickness at the corner portion is made the same as the thickness at the edge portion), it is necessary to increase the outer shape of the frame body viewed from the first direction by an amount required to avoid interference with the protruding portion in the corner portion. In this case, the proportion of the insensitive area of ​​the radiation imaging device when viewed from the first direction (i.e., the proportion of the area outside the detection area relative to the area of ​​the entire radiation imaging device) will increase. On the other hand, according to the above structure, by forming the recessed portion, the proportion of the insensitive area can be reduced.

[0021] The first wall may have a shielding member for shielding electromagnetic waves arranged in a manner of surface contact with the third wall, and the first wall may be screwed relative to the edge of the third wall and the first extension. According to this structure, the first wall may be screwed relative to the edge of the third wall and the first extension (i.e., the portion close to the corner of the third wall), and good surface contact between the first wall and the third wall may be achieved in the entire surface of the third wall opposite to the first wall. Thus, the electromagnetic shielding effect may be effectively improved.

[0022] Effects of the Invention

[0023] According to an aspect of the present invention, there can be provided a radiation imaging device which can stably support a base substrate supporting a radiation detection panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a plan view of a radiation imaging device according to an embodiment.

[0025] Figure 2 is along Figure 1 Cross-sectional view along line II-II.

[0026] Figure 3 This is a plan view showing a portion of the radiation detection panel in an enlarged manner.

[0027] Figure 4 is along Figure 3 Cross-sectional view along line IV-IV.

[0028] Figure 5 This is a diagram showing the internal structure of the light receiving unit and the IC chip.

[0029] Figure 6 It is a diagram for explaining the positional relationship between the connection region and the base substrate.

[0030] Figure 7 This is a diagram showing the relationship between the distance from the heater and the temperature in the radiation detection panel.

[0031] Figure 8 This is a diagram showing an example of the manufacturing process of the radiation imaging device.

[0032] Fig. 9 This is a diagram showing an example of the manufacturing process of the radiation imaging device.

[0033] Fig.10 This is a diagram showing an example of the manufacturing process of the radiation imaging device.

[0034] Fig.11 This is a diagram showing an example of the manufacturing process of the radiation imaging device.

[0035] Fig.12 It is a diagram showing an example of arrangement of electrode pads.

[0036] Fig.13 The diagrams show modified examples of the base substrate.

[0037] Fig.14 It is a diagram showing an example of arrangement of the first extending portion. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the accompanying drawings, the same symbols are used for the same or equivalent elements, and repeated descriptions are omitted. The present invention is not limited to these examples, and is intended to include all changes in the meaning and scope equivalent to the scope of the claims. In addition, for easy understanding, Figure 1 to Figure 4 , Figure 6 ,and Figure 8 to Figure 11 The XYZ orthogonal coordinate system is displayed in .

[0039] Figure 1 It is a plan view of the radiation imaging device 1 according to one embodiment of the present invention. Figure 2 is along Figure 1 However, in Figure 1 In the figure, the top wall 11 and the screw member 14 are omitted. The radiation imaging device 1 is, for example, a large-area flat panel sensor used in a medical X-ray imaging system. Figure 1 and Figure 2 As shown, the radiation imaging device 1 includes a housing 10 , a base substrate 20 , a radiation detection panel 30 , a flexible circuit substrate 40 , a control substrate 50 , and a radiation shielding member 60 .

[0040] The frame 10 is a hollow container of a roughly rectangular parallelepiped shape. The frame 10 has a top wall 11 (first wall portion), a bottom wall 12 (second wall portion), and a side wall 13 (third wall portion). The top wall 11 and the bottom wall 12 are respectively formed into rectangular plates extending along the XY plane and are opposite to each other. The side wall 13 extends along the XZ plane or the YZ plane and connects the edge of the top wall 11 with the edge of the bottom wall 12. That is, the side wall 13 is formed into a rectangular ring shape when viewed from the Z direction. The frame 10 accommodates the base substrate 20, the radiation detection panel 30, the flexible circuit substrate 40, the control substrate 50, and the radiation shielding component 60.

[0041] The top wall 11 is composed of a member that allows the detection object of the radiation imaging device 1, that is, radiation (such as X-rays), to pass through the inside of the frame 10. The top wall 11 introduces radiation incident along the Z direction to the inside of the frame 10. That is, the Z direction is the incident direction of the radiation of the detection object. In the present embodiment, the top wall 11 has a two-layer structure. Specifically, the top wall 11 has: a carbon fiber plate 111, which is arranged on the side (outside) where the radiation is incident; and a shielding member 112, which is arranged on the inner surface of the carbon fiber plate 111 and is used to shield electromagnetic waves. The shielding member 112 is, for example, an aluminum shield formed by bonding aluminum foil to the inner surface of the carbon fiber plate 111.

[0042] The bottom wall 12 and the side wall 13 are formed of a metal material (such as iron) that shields radiation. The upper surface 13a of the side wall 13 is in surface contact with the shielding member 112 and is conductive with the shielding member 112. Thus, shielding of electromagnetic waves from the outside of the frame 10 to the inside of the frame 10 is sought. In addition, a plurality of screw holes 13b are provided on the upper surface 13a of the side wall 13. The screw member 14 is inserted into the through hole 11a provided in the top wall 11 and is screwed into the screw hole 13b. Thus, the top wall 11 is fixed to the side wall 13.

[0043] The base substrate 20 is a member that supports the radiation detection panel 30, the control substrate 50, and the radiation shielding member 60. The base substrate 20 is made of metal such as iron, aluminum, stainless steel, tungsten alloy, copper tungsten, etc. In the present embodiment, as an example, the base substrate 20 is formed of relatively lightweight aluminum. The base substrate 20 has a supporting surface 20a and a back surface 20b on the opposite side of the supporting surface 20a. The supporting surface 20a is a surface opposite to the top wall 11, and the back surface 20b is a surface opposite to the bottom wall 12. The supporting surface 20a supports the substrate 31 of the radiation detection panel 30. On the back surface 20b, the control substrate 50 is fixed via one or more supporting members 55, for example, formed in the shape of a column extending in the Z direction.

[0044] The radiation detection panel 30 has a substrate 31 formed in a rectangular plate shape. The substrate 31 has a first surface 31a on which a light receiving portion 32 (light receiving surface) is formed, and a second surface 31b on the opposite side of the first surface 31a. The first surface 31a is a surface opposite to the top wall 11, and the second surface 31b is a surface opposite to the bottom wall 12. A scintillator 34 (conversion portion) is arranged on the light receiving portion 32. The scintillator 34 is formed by, for example, evaporating a scintillator material having CsI as a main component on the light receiving portion 32. The scintillator 34 converts radiation incident through the top wall 11 into light. Specifically, the scintillator 34 outputs scintillation light of an intensity corresponding to the incident intensity of the radiation to the light receiving portion 32. Thus, the area on the first surface 31a where the light receiving portion 32 is formed functions as a detection area R for detecting radiation. The detection area R has, for example, a light receiving area of ​​about 30 cm to 40 cm on one side (as an example, 40 cm×30 cm).

[0045] The substrate 31 is, for example, a transparent glass substrate. The substrate 31 is fixed to the base substrate 20 by fixing the second surface 31b of the substrate 31 to the support surface 20a of the base substrate 20. For example, the second surface 31b of the substrate 31 is fixed to the base substrate 20 via a bonding member G such as a double-sided tape (see Figure 6 ) is fixed to the support surface 20a of the base substrate 20. When viewed from the Z direction, at least the region where the light receiving portion 32 and the scintillator 34 are arranged is included in the support surface 20a. Figure 6) is provided in a region at least overlapping with the light receiving portion 32 when viewed from the Z direction. In addition, the outer end of the adhesive member G is located further inward than the end (the end 21a described below) of the base substrate 20 when viewed from the Z direction. A plurality of electrode pads 33 are formed on the first surface 31a of the substrate 31 outside the detection region R. The plurality of electrode pads 33 are connected to the pixels P formed in the light receiving portion 32 via the wiring (readout wiring and row selection wiring) described below. m,n (Refer to Figure 3 ) are electrically connected. In this embodiment, as an example, 22 (11 × 2 sides) electrode pads 33 are formed on the periphery of the substrate 31 along the X direction. In addition, 14 (7 × 2 sides) electrode pads 33 are formed on the periphery of the substrate 31 along the Y direction.

[0046] The flexible circuit substrate 40 is a circuit member electrically connected to the electrode pad 33. The flexible circuit substrate 40 has a flexible substrate 41 that can be bent or deformed, and an IC chip 42 mounted on the flexible substrate 41. The flexible substrate 41 has a structure in which a circuit pattern formed by a conductor foil (such as copper, etc.) is formed on an insulator (such as polyimide, etc.) on a thin film. One end 41a of the flexible substrate 41 is connected to the electrode pad 33 via a connecting member 70. The connecting member 70 is a member that generates an adhesive force by thermal compression, and is an anisotropic conductive material such as ACF (anisotropic conductive film) or ACP (anisotropic conductive paste). The other end 41b of the flexible substrate 41 is connected to the control substrate 50 (connector 51).

[0047] The control substrate 50 includes a circuit for controlling the operation of the IC chip 42 (for example, the operation of the vertical shift registers 42a, 42b and the signal connection parts 42c, 42d described below) and supplying power to the IC chip 42. Specifically, for example, power is supplied to the control substrate 50 from an external power source (not shown) disposed outside the frame 10 (for example, outside the bottom wall 12, etc.), and the power is supplied to the IC chip 42 via the control substrate 50. In addition, the external power source may be disposed inside the frame 10 (for example, in the space between the control substrate 50 and the bottom wall 12). However, from the viewpoint of suppressing the generation of measurement noise caused by the external power source, it is preferable to dispose the external power source outside the frame 10. The control substrate 50 is fixed to the back surface 20b of the base substrate 20 via the one or more support members 55. In addition, the control substrate 50 is also fixed to the bottom wall 12 via a support member 56 that is the same as the support member 55. In addition, the support members 55 and 56 may be integrally formed as columnar members that penetrate the control substrate 50 in the Z direction and support the control substrate 50. Such columnar members function as members that support the base substrate 20 relative to the bottom wall 12 and support the control substrate 50 relative to the bottom wall 12 and the base substrate 20.

[0048] Here, the IC chip 42 mounted on the flexible circuit substrate 40 and the AD converter 52 mounted on the control substrate 50 are parts (heat generating components) that are particularly prone to heat. In addition, if the heat from the IC chip 42 or the AD converter 52 is transferred to the radiation detection panel 30, there is a concern that noise will be generated in the image obtained by the light receiving portion 32. Therefore, in this embodiment, in order to efficiently release the heat generated from the IC chip 42 and the AD converter 52 toward the bottom wall 12 of the frame 10, a heat dissipation component 57 is arranged between each of the IC chip 42 and the AD converter 52 and the bottom wall 12. The heat dissipation component 57 is, for example, a gel sheet whose main raw material is silicone. As Figure 2 As shown in the figure, when the distance between the IC chip 42 or the AD converter 52 and the bottom wall 12 is large, a convex portion 12a protruding toward the top wall 11 may be provided in the portion of the inner surface of the bottom wall 12 that overlaps with the IC chip 42 or the AD converter 52 as viewed from the Z direction. According to such a convex portion 12a, the heat generated from the IC chip 42 or the AD converter 52 can be appropriately released to the bottom wall 12 via the heat dissipation member 57 and the convex portion 12a. In addition, by partially raising the inner surface of the bottom wall 12, the portion without the convex portion 12a can be used as a space for storing various components.

[0049] The control substrate 50 overlaps with the scintillator 34 and the base substrate 20 when viewed from the Z direction. That is, most of the radiation incident from the top wall 11 and directed toward the control substrate 50 is shielded by the scintillator 34 and the base substrate 20. On the other hand, as in the present embodiment, there is a case where the IC chip 42 mounted on the flexible circuit substrate 40 is arranged at a position that does not overlap with the scintillator 34 and the base substrate 20 when viewed from the Z direction. That is, there is a case where the radiation incident from the top wall 11 and directed toward the IC chip 42 is not shielded by the scintillator 34 and the base substrate 20. In this case, if no countermeasures are taken, there is a concern that the IC chip 42 is damaged by the radiation, causing malfunction of the IC chip 42, etc. Therefore, in the present embodiment, a radiation shielding member 60 is provided to shield the radiation incident from the top wall 11 and directed toward the IC chip 42.

[0050] The radiation shielding member 60 is formed of a material having a high X-ray shielding ability, such as lead or tungsten. In the present embodiment, as an example, the radiation shielding member 60 is formed in a short strip shape and is disposed at the edge of the back surface 20b of the base substrate 20. A portion of the radiation shielding member 60 is exposed to the outside of the base substrate 20 in a manner overlapping with the IC chip 42 when viewed from the Z direction. The radiation shielding member 60 may be provided for each IC chip 42, or one radiation shielding member 60 may be provided for a plurality of adjacent IC chips 42 (i.e., a member formed to a size overlapping with the plurality of IC chips when viewed from the Z direction). In the present embodiment, the base substrate 20 is formed of relatively lightweight aluminum, and on the other hand, a radiation shielding member 60 formed of a relatively heavy material as described above is partially provided at a location where radiation shielding is particularly required, thereby seeking to reduce the weight of the radiation imaging device 1.

[0051] The base substrate 20 has a main body 21 formed in a rectangular shape when viewed from the Z direction (first direction) perpendicular to the support surface 20a, and a protrusion 22 formed at each of the corners (four corners) of the main body 21 and protruding to the outside of the main body 21. In the present embodiment, as an example, the protrusion 22 is formed in a substantially rectangular shape with chamfered corners when viewed from the Z direction. In addition, the main body 21 and the protrusion 22 are formed integrally, and the thickness (plate thickness) of the protrusion 22 is the same as that of the main body 21. That is, the base substrate 20 is configured as a single plate having a substantially uniform thickness.

[0052] When viewed from the Z direction, the end of the base substrate 20 corresponding to the portion of the flexible circuit substrate 40 connected to the electrode pad 33 is located on the inner side (detection area R side) than the end of the radiation detection panel 30 (i.e., the end 31c of the substrate 31). Specifically, the main body 21 is formed in a rectangular shape smaller than the substrate 31 when viewed from the Z direction, and the end 21a of the main body 21 is located on the inner side than the end 31c of the substrate 31. That is, the end of the base substrate 20 corresponding to each side of the radiation detection panel 30 (the portion where the electrode pad 33 is formed) (i.e., the end 21a of the main body 21) is located on the inner side than the end 31c of the substrate 31. Furthermore, in the present embodiment, the base substrate 20 is formed so that, when viewed from the Z direction, the connection area A that overlaps with the electrode pad 33, the connection member 70, and the flexible circuit substrate 40 (one end 41a of the flexible substrate 41) does not overlap. That is, the end 21a of the main body 21 is located on the inner side than the inner end A1 of the connection area A. As a result, a structure is achieved in which the base substrate 20 does not overlap with the connection regions A (36 connection regions A in the present embodiment) when viewed from the Z direction.

[0053] The protrusion 22 protrudes outward from the radiation detection panel 30 at a position (in this embodiment, as an example, a corner of the main body 21) that does not overlap with the flexible circuit substrate 40 when viewed from the Z direction. That is, when viewed from the Z direction, the protrusion 22 is exposed outward from the substrate 31. In this embodiment, when viewed from the Z direction, the protrusion 22 protrudes outward from the end of the flexible substrate 41 (the bent portion, that is, the portion farthest from the end 31c of the substrate 31 in the direction parallel to the XY plane).

[0054] The first extension portion 81 extending in the Z direction is provided on the support surface 20a of the protrusion 22. In the present embodiment, as an example, the first extension portion 81 is made of aluminum. However, the first extension portion 81 may also be formed by other materials. For example, the material of the first extension portion 81 may also be a metal other than aluminum such as iron, an engineering plastic such as polyacetal (POM) and polyetheretherketone (PEEK), etc. The first extension portion 81 is fixed to the protrusion 22 via, for example, a fixing member (such as a screw, etc.) not shown in the figure. In the present embodiment, the first extension portion 81 is a columnar member extending in the Z direction, and functions as a positioning member for positioning the radiation detection panel 30 (i.e., the substrate 31). Specifically, the first extension portion 81 has a guide groove 81a extending in the Z direction in order to accommodate the corner portion 31d of the substrate 31. The guide groove 81a is formed in an L-shape in a manner consistent with the shape of the corner portion 31d of the substrate 31 when viewed from the Z direction. That is, the first extension portion 81 has a shape such that a portion (equivalent to the quadrangular columnar portion of the space formed by the guide groove 81a) of a quadrangular columnar member (a member having the same shape as the second extension portion 82 described below) is grooved. In the present embodiment, such a first extension portion 81 is provided corresponding to each of the four corners of the substrate 31. That is, by arranging each corner portion 31d of the substrate 31 inside the guide groove 81a of each first extension portion 81, the substrate 31 can be positioned.

[0055] The first extension portion 8 is supported on the top wall 11. In the present embodiment, a screw hole 81b is formed on the surface of the first extension portion 81 on the top wall 11 side. Then, the screw member 14 is inserted into the through hole 11a provided in the top wall 11 and screwed into the screw hole 81b. In this way, the first extension portion 81 is supported on the top wall 11 and supported on the protrusion 22. That is, the base substrate 20 is supported on the top wall 11 via the first extension portion 81. In the present embodiment, the base substrate 20 (protrusion 22) is fixedly fixed to the top wall 11 via the first extension portion 81 by screwing.

[0056] On the back side 20b of the protrusion 22, there is provided a second extension portion 82 which is arranged at a position opposite to the first extension portion 81 across the protrusion 22 and extends in the Z direction. In the present embodiment, as an example, the second extension portion 82 is made of aluminum. However, as a material for the second extension portion 82, the same material as that of the first extension portion 81 described above can be used. The second extension portion 82 is supported on the protrusion 22 via, for example, a fixing member (such as a screw, etc.) not shown in the figure. In addition, the first extension portion 81 and the second extension portion 82 can be fixed to the protrusion 22 by screw-fastening from the first extension portion 81 side or the second extension portion 82 side using a common screw, or can be fixed to the protrusion 22 by screw-fastening individually using screws different from each other. In addition, the second extension portion 82 is supported on the bottom wall 12 by the same fixing mechanism as the first extension portion 81. For example, a screw hole (not shown) is formed on the surface of the second extension portion 82 on the bottom wall 12 side, and a screw member (not shown) is inserted through a through hole (not shown) provided on the bottom wall 12 and screwed into the screw hole. In this way, the second extension portion 82 is supported by the protrusion 22 and the bottom wall 12. That is, the base substrate 20 is supported by the bottom wall 12 via the second extension portion 82. In this embodiment, the base substrate 20 (protrusion 22) is fixed to the bottom wall 12 via the second extension portion 82 by screwing.

[0057] In addition, it is not necessary to form a groove portion corresponding to the guide groove 81a of the first extension portion 81 in the second extension portion 82. Therefore, in the present embodiment, the second extension portion 82 is formed in a quadrangular column shape. That is, the second extension portion 82 has a portion overlapping with the first extension portion 81 when viewed from the Z direction, and has a portion overlapping with the quadrangular columnar space formed by the guide groove 81a when viewed from the Z direction. However, for example, in order to make the components common, the second extension portion 82 may also be formed as an L-shaped columnar member of the same size as the first extension portion 81, and arranged in a manner that it completely overlaps with the first extension portion 81 when viewed from the Z direction.

[0058] As described above, in the present embodiment, the first extension portion 81 and the second extension portion 82 are provided at the protrusion 22 provided at the corners (four corners) of the main body 21. That is, the first extension portion 81 and the second extension portion 82 are provided at positions corresponding to the corners 31d of the radiation detection panel 30 (substrate 31). Thus, the side wall 13 is formed into a rectangular ring shape when viewed from the Z direction, and a recess 13c is formed at the corner of the side wall 13 to avoid interference with the protrusion 22, the first extension portion 81, and the second extension portion 82. The thickness t1 of the side wall 13 at the recess 13c is smaller than the thickness t2 of the side wall 13 at the side portion connecting the adjacent corners. In the present embodiment, at the corner of the side wall 13, a recess 13c is formed in a manner separated from the outer edge of the protrusion 22 when viewed from the Z direction by grooving a portion of the inner side surface of the side wall 13. By forming the concave portion 13 c having a small thickness at the corner portion of the side wall 13 in this manner, it is possible to suppress stress concentration on the corner portion of the side wall 13 .

[0059] Here, the screw hole 13b is not provided in the concave portion 13c with a smaller thickness (the portion with thickness t1), but is only provided in the side portion with a larger thickness (the portion with thickness t2). Therefore, at the corners (four corners) of the frame body 10 observed from the Z direction, the top wall 11 and the side wall 13 are not fixed to each other (not fastened by screws). However, instead, in the present embodiment, as described above, the top wall 11 and the first extension portion 81 are fixed to each other by the screw member 14. That is, even at the corners of the frame body 10, the top wall 11 and the side wall 13 are firmly fixed to each other. Thus, at the corners of the frame body 10 (the portion where the top wall 11 and the side wall 13 are not directly fastened by screws), good surface contact between the shielding member 112 of the top wall 11 and the side wall 13 can be achieved. As a result, the leakage of electromagnetic waves from outside the frame body 10 (the invasion into the inside of the frame body 10) can be effectively suppressed.

[0060] In addition, by forming such a recessed portion 13c, the outer shape of the frame 10 as viewed from the Z direction can be minimized. That is, in order to screw the top wall 11 and the side wall 13 at the corner of the frame 10, and to ensure the thickness of the side wall 13 required for providing the screw hole 13b at the corner of the frame 10, it is necessary to increase the outer shape of the frame 10 as viewed from the Z direction. In this case, the ratio of the insensitive area of ​​the radiation imaging device 1 when viewed from the Z direction (that is, the ratio of the area other than the effective light receiving area (detection area R) to the entire area of ​​the radiation imaging device 1) becomes larger. On the other hand, as in the present embodiment, by fixing the first extension portion 81 and the top wall 11 to each other instead of forming the recessed portion 13c and fixing the top wall 11 and the side wall 13 at the corner of the frame 10, it is possible to ensure good surface contact between the top wall 11 and the side wall 13 and reduce the ratio of the insensitive area.

[0061] Next, the operation (radiation detection) of the radiation imaging device 1 is described. In this embodiment, a vertical shift register (vertical scanning circuit) is formed in an IC chip 42 of a flexible circuit substrate 40 connected to an electrode pad 33 formed on the peripheral portion of a substrate 31 along the X direction. Specifically, by Figure 1 A vertical shift register 42a is formed by the IC chip 42 of the flexible circuit substrate 40 provided on the peripheral portion (left side) of the left side of the substrate 31, and a vertical shift register 42b is formed by the IC chip 42 of the flexible circuit substrate 40 provided on the peripheral portion (right side) of the right side of the substrate 31. In addition, an amplifier chip (signal connection portion) for signal readout is formed in the IC chip 42 of the flexible circuit substrate 40 connected to the electrode pad 33 formed on the peripheral portion of the substrate 31 along the Y direction. Specifically, by providing Figure 1 The IC chip 42 of the flexible circuit substrate 40 disposed on the upper peripheral portion (upper side) of the substrate 31 in the circuit board 31 forms a signal connection portion 42c, and the IC chip 42 of the flexible circuit substrate 40 disposed on the lower peripheral portion (lower side) of the substrate 31 forms a signal connection portion 42d. In this way, in order to reduce the noise and increase the speed of signal reading, the present embodiment adopts a structure in which the signal reading line (data line) is divided into two along the upper and lower sides.

[0062] Reference Figure 3 to Figure 5 , the detailed structure of the light receiving unit 32 and the IC chip 42 (the operation of the radiation imaging device 1) will be described. Figure 3 It is a plan view showing a part of the radiation detection panel 30 in an enlarged manner. Figure 4 is along Figure 3 Cross-sectional view along line IV-IV. Figure 5 It is a diagram showing the internal structure of the light receiving unit 32 and the IC chip 42.

[0063] The light receiving unit 32 is configured by two-dimensionally arranging M×N pixels in M ​​rows and N columns. Figure 3 The pixel P shown m,n is the pixel located at the mth row and nth column. Here, m is an integer from 1 to M, and n is an integer from 1 to N. Figure 3 In FIG. 1 , the column direction coincides with the X-axis direction, and the row direction coincides with the Y-axis direction. 1,1 ~P M,N Each of the photodiodes PD and the readout switch SW1 is provided. A bias voltage is applied to the anode terminal of the photodiode PD, and one end (one current terminal) of the readout switch SW1 is connected to the cathode terminal of the photodiode PD. In addition, the other end (the other current terminal) of the readout switch SW1 is connected to the corresponding readout wiring (for example, the pixel P m,nIn the case of n-th column readout wiring L O,n The control terminal of the readout switch SW1 is connected to the corresponding row selection wiring (for example, the pixel P m,n In the case of the mth row, the wiring L V,m ).

[0064] like Figure 4 As shown in FIG. 1 , a silicon film 35 is provided on the entire surface of the first surface 31a of the substrate 31. Then, the photodiode PD, the readout switch SW1, and the n-th column readout wiring L O,n The photodiode PD, the readout switch SW1, and the n-th column readout wiring L are formed on the surface of the silicon film 35. O,n The scintillator 34 is covered with the insulating layer 36. The scintillator 34 is provided on the insulating layer 36 so as to cover the entire detection region R of the first surface 31a of the substrate 31. The photodiode PD is composed of, for example, amorphous silicon.

[0065] The photodiode PD of this embodiment has: an n-type semiconductor layer 91, which is composed of n-type polycrystalline silicon; an i-type semiconductor layer 92, which is provided on the n-type semiconductor layer 91 and is composed of i-type amorphous silicon; and a p-type semiconductor layer 93, which is provided on the i-type semiconductor layer 92 and is composed of p-type amorphous silicon. In addition, the readout switch SW1 is a thin film transistor (TFT: Thin Film Transistor) formed by polycrystalline silicon, and has a structure as a field effect transistor (FET). That is, the readout switch SW1 has: a channel region 94; a source region 95, which is arranged along one side of the channel region 94; a drain region 96, which is arranged along the other side of the channel region 94; a gate insulating film 97 and a gate electrode 98, which are formed on the channel region 94. The n-th column readout wiring L O,n The scintillator 34 generates scintillation light according to incident radiation and converts the radiation image into an optical image, and outputs the optical image to the light receiving unit 32 .

[0066] Figure 5 In the figure, it represents M×N pixels P m,n (m=1, ..., M, n=1, ..., N) to display 4×4 pixels 100. Each pixel 100 includes a photodiode PD and a readout switch SW1. The photodiode PD generates an amount of charge corresponding to the intensity of the incident light and accumulates the generated charge in the junction capacitor. As described above, the readout switch SW1 is connected to the row selection wiring L corresponding to the row to which the pixel 100 belongs. V Here, the pixel P corresponding to the mth row m,n The row selection wiring L V The mth row selection wiring L V,m M row selection wiring L VThe vertical shift registers 42a and 42b generate row selection signals for controlling the conduction state / non-conduction state of the readout switch SW1 for each row, and the row selection wiring L for each row is connected to the vertical shift registers 42a and 42b. V The row selection signals are provided sequentially.

[0067] Output from the vertical shift register 42a or 42b to the row selection wiring L V When the row selection signal is a non-significant value (e.g., low level), the readout switch SW1 is turned off. At this time, the charge generated in the photodiode PD is not output to the corresponding column readout wiring L. O , and is stored in the junction capacitor. Here, the pixel P corresponding to the nth column m,n Column readout wiring L O is the readout wiring L of the nth column mentioned above O,n On the other hand, when the row selection signal is at a valid value (e.g., high level), the readout switch SW1 is closed. At this time, the charge generated in the photodiode PD and accumulated in the junction capacitor portion is output to the corresponding readout wiring L via the readout switch SW1. O The output charge is sent through the readout wiring L O The output signal is sent to the integrating circuit 101. In this embodiment, the readout switches SW1 of the pixels 100 formed in the light receiving unit 32 and located on the upper side of the substrate 31 are connected via the corresponding readout wiring lines L. O , connected to the integration circuit 101 of the signal connection section 42c. On the other hand, the readout switch SW1 of the pixel 100 located on the lower side of the substrate 31 among the pixels 100 formed in the light receiving section 32 is connected via the corresponding readout wiring L O , connected to the integration circuit 101 of the signal connection portion 42d. In addition, the division method of the upper side row and the lower side row of the substrate 31 is arbitrary. For example, when the number of the upper side row of the substrate 31 is set to N1 and the number of the lower side row of the substrate 31 is set to N2, any relationship of "N1=N2", "N1>N2" and "N1<N2" can be established.

[0068] The integration circuit 101 has a so-called charge integration type structure including an amplifier 101a, a capacitor 101b, and a discharge switch 101c. The capacitor 101b and the discharge switch 101c are connected in parallel to each other and are connected between the input terminal and the output terminal of the amplifier 101a. The input terminal of the amplifier 101a is connected to the column readout wiring L O The discharge switch 101c is connected to the reset wiring L R A reset control signal RE is provided.

[0069] The reset control signal RE instructs the opening and closing actions of the discharge switches 101c of the N integration circuits 101. For example, when the reset control signal RE is a non-effective value (e.g., a high level), the discharge switch 101c is closed, the capacitor element 101b is discharged, and the output voltage value of the integration circuit 101 is initialized. In addition, when the reset control signal RE is an effective value (e.g., a low level), the discharge switch 101c is opened, the charge input to the integration circuit 101 is accumulated in the capacitor element 101b, and a voltage value corresponding to the accumulated charge amount is output from the integration circuit 101.

[0070] The signal connection parts 42c and 42d each further include N holding circuits 102 and horizontal shift registers 103. Each holding circuit 102 includes an input switch 102a, an output switch 102b, and a voltage holding part 102c. One end of the voltage holding part 102c is connected to the output end of the integration circuit 101 via the input switch 102a, and the other end of the voltage holding part 102c is connected to the voltage output wiring L via the output switch 102b. OUT For the input switch 102a, the holding wiring L H The holding control signal Hd is given. The holding control signal Hd instructs the opening and closing operation of the input switches 102a of each of the N holding circuits 102. The column selection signal is given to the output switches 102b of the holding circuits 102 from the horizontal shift register 103. The column selection signal instructs the opening and closing operation of the output switches 102b of the holding circuits 102 of the corresponding columns.

[0071] When the hold control signal Hd changes from a high level to a low level, the input switch 102a changes from a closed state to an open state, and the voltage value input to the holding circuit 102 is held in the voltage holding unit 102c. Thereafter, when the column selection signal from the horizontal shift register 103 changes from a low level to a high level in sequence for each column, the output switch 102b is closed in sequence, and the voltage value held in the voltage holding unit 102c is output to the voltage output wiring L in sequence for each column. OUT .

[0072] Secondly, refer to Figure 6 , the positional relationship between the connection region A and the end portion 21a of the base substrate 20 (main body portion 21) is described. Figure 6As shown, one end 41a of the flexible circuit substrate 40 is sandwiched between the one end 41a and the electrode pad 33 by heaters H1 and H2 from top to bottom for heating (thermocompression bonding) while the connecting member 70 is sandwiched between the one end 41a and the electrode pad 33, and is connected to the electrode pad 33 via the connecting member 70. The heater H1 (first heater) is a crimping fixture disposed on the opposite side of the connecting member 70 across the flexible circuit substrate 40. The heater H1 is, for example, a superhard alloy composed of tungsten carbide and cobalt. The heater H2 (second heater) is a crimping fixture disposed on the opposite side of the connecting member 70 across the heater H1 and the radiation detection panel 30 (i.e., substrate 31). The heater H2 is, for example, quartz glass.

[0073] When the flexible circuit substrate 40 is connected to the electrode pad 33, the surface H1a of the heater H1 (the surface opposite to the one end 41a) contacts the one end 41a of the flexible substrate 41 so as to overlap at least the connection area A when viewed from the Z direction. In addition, the surface H2a of the heater H2 (the surface opposite to the second surface 31b of the substrate 31) contacts the second surface 31b of the substrate 31 so as to overlap at least the connection area A when viewed from the Z direction. In this state, heating is performed for several seconds by, for example, the heater H1 heated to 190°C and the heater H2 fixed at 40°C. In order to perform such thermocompression bonding (especially the contact of the heater H2 with the second surface 31b of the substrate 31), in order to suppress interference between the heater H2 and the base substrate 20 during operation, the distance d from the inner end A1 of the connection area A to the end of the base substrate 20 (the end 21a of the main body 21) is preferably 10 μm or more.

[0074] On the other hand, part of the heat generated from the heaters H1 and H2 during thermal compression bonding can be transferred to the light receiving part 32, the scintillator 34 and the bonding member G via the substrate 31. There is a concern that the heat transferred in this way will have an adverse effect on these components. Here, as described above, when observed from the Z direction, the light receiving part 32, the scintillator 34 and the bonding member G are all located closer to the inside than the end 21a of the base substrate 20. That is, it is ensured that the distance (the distance along the XY plane) from the inner end A1 of the connection area A to each of the light receiving part 32, the scintillator 34 and the bonding member G is longer than the distance d. Therefore, by adjusting the distance d, the distance (separation distance longer than the distance d) from the connection area A to each component (the light receiving part 32, the scintillator 34 and the bonding member G) can be ensured. From the viewpoint of suppressing the adverse effects of the heat generated from the heaters H1 and H2 as described above on each component, the distance d is preferably greater than 1 mm.

[0075] Furthermore, when a deliquescent material is used as the scintillator 34, a moisture-proof film (protective film) formed of polyparaxylene or the like may be provided to cover the entire scintillator 34. It is known that the moisture-proof property of such a moisture-proof film decreases at about 50° C. In such a case, the distance d may be set so that the temperature of the scintillator 34 (moisture-proof film) is suppressed to a temperature required to maintain the moisture-proof property (here, 50° C. or less).

[0076] Figure 7 The simulation results are shown in the case where the thermocompression bonding is performed for 8 seconds with the heater H1 set at 200° C. and the heater H2 set at 40° C. Figure 7 (A) is the distance ( Figure 6 The relationship between the distance along the Y axis in the portion corresponding to the distance and the temperature of the substrate 31 in the portion corresponding to the distance. Figure 7 (B) shows the relationship between the distance from the heater H1 and the temperature of the substrate 31 in the portion corresponding to the distance when the substrate 31 is a flexible substrate (here, a thin film material with a thermal conductivity of 0.3 W / mK). When the substrate 31 is a glass substrate, simulations are performed for each of the cases where the thickness t of the substrate 31 is 0.3 mm, 0.5 mm, 0.7 mm, and 0.9 mm. On the other hand, when the substrate 31 is a flexible substrate, simulations are performed for each of the cases where the thickness t of the substrate 31 is 0.1 mm and 0.2 mm.

[0077] like Figure 7 As shown in (A), it was confirmed that when the substrate 31 is the above-mentioned glass substrate, if the distance from the heater H1 is about 3.5 mm or more, the temperature is suppressed to 50°C or less for any thickness (0.3 mm, 0.5 mm, 0.7 mm, 0.9 mm). Figure 7 As shown in (B), it was confirmed that when the substrate 31 is the above-mentioned flexible substrate, if the distance from the heater H1 is about 1.5 mm or more, the temperature is suppressed to below 50°C for any thickness (0.1 mm, 0.2 mm). Here, the distance (length along the Y direction) from the position serving as the reference for the distance from the heater H1 to the inner end A1 of the connection area A is 0.27 mm. In addition, as described above, when viewed from the Z direction, the edge of the scintillator 34 is located closer to the inside than the end 21a of the base substrate 20. Therefore, based on the viewpoint of suppressing the temperature of the scintillator 34 (moisture-proof film) to below 50°C, when the substrate 31 is the above-mentioned glass substrate, the distance d is preferably above 3.23 mm, and when the substrate 31 is the above-mentioned flexible substrate, the distance d is preferably above 1.23 mm.

[0078] Next, refer to Figure 8 to Figure 11 , an example of a method for manufacturing the radiation imaging device 1 is described.

[0079] First, if Figure 8 As shown in (A), a radiation detection panel 30 having a scintillator 34 is prepared. For example, by performing image inspection such as detection on the radiation detection panel 30, the quality of the radiation detection panel 30 is determined. Next, a scintillator material such as CsI is deposited on the pixel area (light receiving part 32) of the radiation detection panel 30 that is determined to be a good product, thereby forming the scintillator 34. Thus, the radiation detection panel 30 is prepared. Figure 8 The radiation detection panel 30 shown in (A).

[0080] In addition, if Figure 8 As shown in (B), a base substrate 20 on which the first extension portion 81 and the second extension portion 82 are mounted is prepared. For example, the base substrate 20 consisting of the above-mentioned main body 21 and the protrusion 22 is manufactured by performing planar shape processing on a single metal plate. Next, the first extension portion 81 is mounted on the supporting surface 20a of the protrusion 22 (in the present embodiment, each of the four protrusions 22 provided at the four corners of the main body 21) by screw fastening or the like. In addition, the second extension portion 82 is mounted on the back surface 20b of the protrusion 22 by screw fastening or the like. In addition, a support member 55 for fixing the control substrate 50 is mounted on the back surface 20b of the main body 21. In addition, in the case where the first extension portion 81 and the second extension portion 82 are individually screw fastened using screws different from each other, the second extension portion 82 may not necessarily be mounted on the protrusion 22 at this stage. In this case, as long as the second extension portion 82 is mounted in the following process of being housed in the box portion of the frame (see Fig.11 ) at any time before the second extension portion 82 is mounted on the protruding portion 22. In addition, the support member 55 does not necessarily have to be mounted on the main body 21 at this stage, as long as it is mounted in the following control substrate 50 mounting step (see Fig. 9 It can be installed on the main body 21 at any time before (A)).

[0081] Then, if Figure 8 As shown in (C), the radiation detection panel 30 (refer to Figure 8 (A)) is fixed to the base substrate 20 (see Figure 8 Here, the radiation detection panel 30 (substrate 31) is positioned by using the guide grooves 81a of the first extension portion 81 provided at the four corners (protrusions 22) of the base substrate 20. Next, the radiation detection panel 30 (substrate 31) is positioned by using an adhesive member G (see FIG. 1 ) such as a double-sided tape provided in advance on the second surface 31b of the substrate 31. Figure 6), the substrate 31 is fixed to the support surface 20a of the base substrate 20. Here, when viewed from the Z direction, a predetermined connection area A (refer to Figure 2 and Figure 6 ) is arranged on the radiation detection panel 30. In this embodiment, as a result of positioning the substrate 31 by the guide groove 81a of the first extension portion 81, the end 21a of the main body 21 of the base substrate 20 is arranged closer to the inside than the end 31c of the substrate 31. Thus, the base substrate 20 is arranged in a manner not to overlap with the connection area A. In addition, Figure 8 In the state shown in (C), the radiation detection panel 30 and the base substrate 20 can be easily carried by holding the portion provided with the protrusion 22 (in the present embodiment, at least one of the protrusion 22, the first extension portion 81, and the second extension portion 82). That is, the operability of the radiation detection panel 30 and the base substrate 20 is improved by the portion provided with the protrusion 22.

[0082] Then, if Fig. 9 As shown in FIG. 2 (A), the control substrate 50 is fixed to the back surface 20 b of the base substrate 20 via the supporting member 55 .

[0083] Then, if Fig. 9 As shown in (B), one end portion 41a of the flexible circuit substrate 40 is connected to the electrode pad 33 via a connecting member 70. For example, an inspection of each IC chip 42 is performed in advance, and the IC chip 42 determined to be a good product during the inspection is mounted on the flexible substrate 41. Then, with the IC chip 42 mounted on the flexible substrate 41, further inspection is performed (for example, confirmation of the conduction between the IC chip 42 and the flexible substrate 41, etc.). Through such inspection, a flexible circuit substrate 40 is prepared for mounting on the electrode pads 33 (36 electrode pads 33 in this embodiment) of the substrate 31. In addition, the installation order of the control substrate 50 and the flexible circuit substrate 40 may be opposite to that described above. That is, after the flexible circuit substrate 40 is mounted on the radiation detection panel 30, the control substrate 50 may be mounted on the base substrate 20.

[0084] Next, the connection member 70 is heated (thermocompression bonding) by a heater H1 disposed on the opposite side of the connection member 70 across the flexible circuit substrate 40 (one end 41a), and a heater H2 disposed on the opposite side of the connection member 70 across the radiation detection panel 30 (substrate 31). As described above, interference between the heater H2 and the base substrate 20 is prevented by disposing the base substrate 20 so as not to overlap with the connection area A. In addition, in the present embodiment, since the substrate 31 is a transparent glass substrate, the position of the electrode pad 33 can be confirmed from the back side (the second surface 31b) of the substrate 31. Thus, the positioning of the heater H2 can be easily performed. Through the above processing, each electrode pad 33 is electrically connected to each flexible circuit substrate 40. In addition, after the flexible circuit substrate 40 is mounted on the electrode pads 33 disposed on each side of the substrate 31, it is difficult to hold each side of the substrate 31, but by holding the portion provided with the protrusion 22 as described above, the radiation detection panel 30 and the base substrate 20 can be easily carried.

[0085] Then, if Fig.10 As shown in FIG. 2A , a radiation shielding member 60 for shielding radiation directed toward the IC chip 42 mounted on each flexible circuit substrate 40 is provided at an edge portion of the back surface 20 b of the base substrate 20 .

[0086] Then, if Fig.10 As shown in (B), the other end 41b of each flexible circuit substrate 40 is connected to the control substrate 50 (connector 51). Thus, each flexible circuit substrate 40 is electrically connected to the control substrate 50. As a result, Fig.10 As shown in (B), the detection unit 1a installed in front of the frame 10 is completed.

[0087] Then, in Fig.10 Here, when a malfunction of a certain flexible circuit substrate 40 is found (for example, malfunction of the IC chip 42 mounted on the flexible circuit substrate 40), a repair operation (a repair method of one embodiment) is performed in the following order.

[0088] First, the other end 41b of the flexible circuit substrate 40 (hereinafter referred to as the "first flexible circuit substrate") in which the defect is found is removed from the connector 51, and the radiation shielding component 60 provided corresponding to the first flexible circuit substrate is removed from the back side 20b of the base substrate 20. Here, the radiation shielding component 60 is partially provided for each one or each of a plurality of IC chips 42, so only a part of the radiation shielding component 60 needs to be removed, thereby improving workability. Next, with the radiation detection panel 30 supported on the base substrate 20, the first flexible circuit substrate (one end 41a) is removed from the electrode pad 33. Specifically, the connecting member 70 is heated to remove the connecting member 70 from the electrode pad 33. In this way, by removing the connecting member 70 from the electrode pad 33, the first flexible circuit substrate (one end 41a) can be removed from the electrode pad 33. As a result, it becomes Fig. 9 The state shown in (A) of FIG. 1 is shown. In addition, the heating of the connecting member 70 when removing the first flexible circuit substrate can be performed by the heaters H1 and H2 in the same manner as when installing the first flexible circuit substrate, or can be performed by other methods. For example, instead of using the heaters H1 and H2, the connecting member 70 can be heated by blowing hot air to one side of the connecting member 70 (for example, the first flexible circuit substrate (one end 41a) side) using an air gun or the like.

[0089] Next, a flexible circuit substrate 40 (second flexible circuit substrate) is prepared for installation on the radiation detection panel 30. For example, when the first flexible circuit substrate described above is repairable (for example, when it is repairable by replacing the IC chip 42 mounted on the first flexible circuit substrate with another IC chip), the repair operation of the first flexible circuit substrate may also be performed. In this case, the repaired first flexible circuit substrate is used as the second flexible circuit substrate. On the other hand, when the first flexible circuit substrate is not repairable, a pre-prepared flexible circuit substrate may be used as the second flexible circuit substrate.

[0090] Next, the second flexible circuit substrate is mounted on the electrode pad 33 while the radiation detection panel 30 is supported on the base substrate 20. Fig. 9As shown in (B), the connecting member 70 is heated (thermocompression bonding) by a heater H1 disposed on the opposite side of the second flexible circuit substrate (one end 41a) and the connecting member 70, and a heater H2 disposed on the opposite side of the radiation detection panel 30 (substrate 31) and the connecting member 70, so that the second flexible circuit substrate is connected to the electrode pad 33 via the connecting member 70. Through the above sequence, the repair of the flexible circuit substrate 40 (i.e., the removal of the failed first flexible circuit substrate and the reinstallation of the second flexible circuit substrate (for example, the repaired first flexible circuit substrate or a spare part, etc.)) is completed. Thereafter, the radiation shielding member 60 temporarily removed for the repair of the flexible circuit substrate 40 is reinstalled on the edge of the back side 20b of the base substrate 20, and the other end 41b of the second flexible circuit substrate is installed on the connector 51, thereby forming a Fig.10 Thus, by arranging the base substrate 20 so as not to overlap with the connection region A, the flexible circuit substrate 40 can be repaired without removing the radiation detection panel 30 from the base substrate 20 .

[0091] Then, if Fig.11 As shown, Fig.10 The detection unit 1a shown in (B) is housed (fixed) in the box portion (bottom wall 12 and side wall 13) of the frame. Specifically, the second extension portion 82 is fixed to the bottom wall 12. In addition, the control substrate 50 is fixed to the bottom wall 12 via the support member 56. In addition, a heat dissipation member 57 is arranged between the IC chip 42 or the AD converter 52 and the convex portion 12a of the bottom wall 12. Next, as shown in FIG. Figure 2 As shown in FIG. 1 , the cover (top wall 11) of the frame is screwed to the side wall 13 and the first extension 81. Thus, the radiographic imaging device 1 is manufactured. In addition, the above-mentioned repair work of the flexible circuit substrate 40 can also be performed after the radiographic imaging device 1 is completed. In this case, the top wall 11 is removed from the side wall 13 and the first extension 81, and the detection unit 1a is removed from the bottom wall 12. Fig.10 After returning to the state shown in (B), the above-mentioned repair work can be carried out.

[0092] Next, the effects of the radiation imaging device 1 will be described.

[0093] According to the radiation imaging device 1, the base substrate 20 (protrusion 22) is sandwiched by the mutually opposing parts (ceiling wall 11 and bottom wall 12) of the frame body 10 via the first extension part 81 and the second extension part 82. Thus, the base substrate 20 can be stably supported with respect to the frame body 10. Here, as a method of supporting the base substrate 20 on the frame body 10, there is a method of supporting the back surface 20b of the base substrate 20 on the bottom wall 12 via, for example, columnar support members 55 and 56 (or a support member in which the support members 55 and 56 are integrated so as to penetrate the control substrate 50 in the Z direction and support the control substrate 50) as shown in the above embodiment. In the above embodiment, the above supporting method is used in combination, but since the base substrate 20 is supported on the frame body 10 via the first extension part 81 and the second extension part 82, the number of support members provided on the back surface 20b of the base substrate 20 can be reduced compared with the case where the first extension part 81 and the second extension part 82 are not provided. Thus, it is possible to prevent impact from the outside (particularly the bottom wall 12) from being transmitted to the back surface 20b of the base substrate 20. As a result, it is possible to reduce impact on the radiation detection panel 30 supported by the base substrate 20. In addition, by reducing the number of support members 56 for supporting the control substrate 50 relative to the bottom wall 12, it is possible to prevent impact from the outside (particularly the bottom wall 12) from being transmitted to the control substrate 50. In addition, by reducing the number of support members that penetrate the control substrate 50, it is possible to increase the degree of freedom in designing the layout of the control substrate 50 (the layout of the circuits and wiring installed in the control substrate 50).

[0094] In addition, the first extension portion 81 functions as a positioning member for positioning the radiation detection panel 30 (substrate 31). According to this structure, since the radiation detection panel 30 (substrate 31) can be easily positioned on the support surface 20a of the base substrate 20 by the first extension portion 81, the assembly workability can be improved.

[0095] In addition, the first extension portion 81 and the second extension portion 82 may be formed integrally with the base substrate 20, but in the above-mentioned embodiment, the first extension portion 81 and the second extension portion 82 are formed separately from the base substrate 20. According to this structure, the warping of the base substrate 20 can be reduced compared with the case where the base substrate 20 is formed integrally with at least one of the first extension portion 81 and the second extension portion 82. In addition, when the first extension portion 81 or the second extension portion 82 is formed integrally with the base substrate 20, it is necessary to cut out a relatively thick metal plate, which has the disadvantage of increasing material cost and working hours. On the other hand, by forming the first extension portion 81 and the second extension portion 82 separately from the base substrate 20, such disadvantages can be avoided.

[0096] In addition, as described above, the first extension portion 81 and the second extension portion 82 may be mounted on the protrusion 22 by a common mounting member (screws, etc.). According to this structure, the relative positional relationship between the first extension portion 81 and the second extension portion 82 can be accurately maintained, and the base substrate 20 can be supported more stably.

[0097] In addition, the second extension portion 82 is larger than the first extension portion 81 when viewed from the Z direction, and has a portion that does not overlap with the first extension portion 81 when viewed from the Z direction. In the present embodiment, the second extension portion 82 is larger than the first extension portion 81 by the amount of the groove portion that does not have the guide groove 81a corresponding to the first extension portion 81. The bottom wall 12 of the frame 10 that is located on the opposite side of the first surface 31a of the radiation detection panel 30 where the detection area R is formed (i.e., opposite to the second surface 31b) becomes a normal grounding surface. Therefore, according to the above-mentioned structure, by making the second extension portion 82 supported by the bottom wall 12 larger than the first extension portion 81, the base substrate 20 can be supported more stably. In addition, since the impact from the grounding surface side (bottom wall 12) can be appropriately absorbed by the second extension portion 82, it is difficult to transmit the impact to the radiation detection panel 30.

[0098] In addition, a plurality of first extensions 81 are provided on the support surface 20a of the protruding portion 22 and are spaced apart from each other, and a plurality of second extensions 82 are provided and are spaced apart from each other so as to correspond to the plurality of first extensions 81. In the present embodiment, four first extensions 81 are provided and are spaced apart from each other, and four second extensions 82 are provided corresponding to the four first extensions 81. According to this structure, the base substrate 20 can be supported relative to the frame body 10 by the first extensions 81 and the second extensions 82 distributed at a plurality of positions spaced apart from each other (in the present embodiment, the four corners of the base substrate 20). Thus, compared with the case where the first extensions and the second extensions are formed in a wall shape along the edge of the base substrate 20, for example, the first extensions 81 and the second extensions 82 can be made lighter and the base substrate 20 can be stably supported relative to the frame body 10.

[0099] In addition, the base substrate 20 has a plurality of (four in this embodiment) protrusions 22 that are spaced apart from each other, and each of the plurality of protrusions 22 is provided with a first extension 81 and a second extension 82. According to this structure, by providing the first extension 81 and the second extension 82 for each protrusion 22, a structure that exhibits the above-mentioned effect can be easily realized. In addition, unlike the above-mentioned embodiment, a plurality of first extensions 81 spaced apart from each other and a plurality of second extensions 82 spaced apart from each other may be provided for one protrusion 22. In this case, the above-mentioned effect can also be exhibited. However, as in this embodiment, by providing each of the plurality of protrusions 22 that are dispersedly arranged with one first extension 81 and one second extension 82, the wasted area of ​​the protrusion 22 (the area where the first extension 81 and the second extension 82 are not provided) can be reduced, and the miniaturization and weight reduction of the protrusion 22 can be sought.

[0100] In addition, the radiation detection panel 30 is formed in a rectangular shape when viewed from the Z direction. A plurality of protrusions 22 are provided at positions corresponding to the four corners of the radiation detection panel 30. According to this structure, since the four corners of the base substrate 20 can be well-balancedly clamped by the top wall 11 and the bottom wall 12 via the first extension portion 81 and the second extension portion 82, the base substrate 20 can be further stably supported on the frame 10.

[0101] In addition, the side wall 13 is formed into a rectangular ring shape when viewed from the Z direction. A recessed portion 13c is formed at the corner of the side wall 13 to avoid interference with the protrusion 22, the first extension portion 81, and the second extension portion 82. The thickness t1 of the side wall 13 at the recessed portion 13c is smaller than the thickness t2 of the side wall 13 at the edge portion connecting the corners of the adjacent side walls 13. When the thickness of the side wall 13 is set to be constant (that is, the thickness at the corner portion is set to be the same as the thickness at the edge portion), it is necessary to increase the outer shape of the frame 10 viewed from the Z direction by an amount that is required to avoid interference with the protrusion 22 in the corner portion. In this case, the proportion of the insensitive area of ​​the radiation imaging device 1 when viewed from the Z direction becomes larger. On the other hand, according to the above-mentioned structure, by forming the recessed portion 13c, the proportion of the insensitive area can be reduced.

[0102] In addition, the top wall 11 has a shielding member 112 arranged in a manner of surface contact with the side wall 13, and the top wall 11 is screwed to the side of the side wall 13 (the screw hole 13b provided in the side of the side wall 13) and the first extension 81 (the screw hole 81b provided in the first extension 81). According to this structure, the top wall 11 is screwed to the side of the side wall 13 and the first extension 81 (that is, the portion close to the corner of the side wall 13), and the top wall 11 can be in good surface contact with the side wall 13 on the entire upper surface 13a of the side wall 13. As a result, the electromagnetic shielding effect can be effectively improved.

[0103] The method for manufacturing the radiation imaging device 1 includes the step of preparing the radiation detection panel 30 ( Figure 8 (A)); the step of supporting the second surface 31b of the radiation detection panel 30 on the supporting surface 20a of the base substrate 20 ( Figure 8 and the process of connecting the flexible circuit substrate 40 to the electrode pad 33 via the connecting member 70 ( Fig. 9 Thus, in the supporting process, when viewed from the Z direction, the end 21a of the base substrate 20 is located in a predetermined connection area A (refer to Figure 6 ) is arranged relative to the radiation detection panel 30 in such a manner that the inner end A1 of the flexible circuit substrate 40 is closer to the inner side. Furthermore, in the connecting process, the connecting member 70 is heated by a heater H1 arranged on the opposite side of the connecting member 70 across the flexible circuit substrate 40, and a heater H2 arranged on the opposite side of the connecting member 70 across the radiation detection panel 30. According to such a manufacturing method, in the supporting process, by arranging the base substrate 20 in such a manner that it does not overlap with the connecting area A, the flexible circuit substrate 40, the connecting member 70 and the radiation detection panel 30 can be sandwiched by the heater H1 and the heater H2 for thermal compression bonding. That is, when the flexible circuit substrate 40 and the electrode pad 33 are connected, the heater H2 and the base substrate 20 can be prevented from interfering with each other. Thus, the flexible circuit substrate 40 can be connected to the radiation detection panel 30 in a state where the radiation detection panel 30 is stably supported by the base substrate 20. In addition, by heating the connection member 70 from both sides (the flexible circuit substrate 40 side and the radiation detection panel 30 side) by the heaters H1 and H2, sufficient connection strength can be ensured at a lower heating temperature (heater temperature) than when heating from one side of the connection member 70. Therefore, according to the above-mentioned manufacturing method, it is also possible to suppress the adverse effects of heat during heating on the radiation detection panel 30 and the like (for example, the scintillator 34 and the like) and ensure connection strength.

[0104] However, the manufacturing sequence of the radiation imaging device 1 is not limited to the above sequence, and the flexible circuit substrate 40 may be connected to the electrode pad 33 of the radiation detection panel 30, for example, before the radiation detection panel 30 is supported on the base substrate 20. That is, the flexible circuit substrate 40 may be connected to the radiation detection panel 30 when the radiation detection panel 30 is not supported on the base substrate 20. In either case, the shape and configuration of the base substrate 20 are designed so as not to overlap with the connection area A, thereby increasing the degree of freedom of the operation sequence during the manufacture of the radiation imaging device 1. Specifically, the timing of the process of connecting the flexible circuit substrate 40 to the radiation detection panel 30 can be arbitrarily selected. That is, the flexible circuit substrate 40 can be connected to the radiation detection panel 30 either before or after the radiation detection panel 30 is supported on the base substrate 20.

[0105] In addition, the above-mentioned repair method of the radiation imaging device 1 includes: a process of removing the first flexible circuit substrate from the electrode pad 33 in a state where the radiation detection panel 30 is supported on the base substrate 20; a process of heating the connecting member 70 by a heater H1 arranged on the opposite side of the connecting member 70 across the second flexible circuit substrate (the first flexible circuit substrate after repair, or other flexible circuit substrate) and a heater H2 arranged on the opposite side of the connecting member 70 across the radiation detection panel 30, thereby connecting the second flexible circuit substrate to the electrode pad 33 via the connecting member 70. According to such a repair method, by arranging the base substrate 20 in a manner not to overlap with the connection area A, the flexible circuit substrate 40 can be repaired (the process of disassembling and the process of connecting) without removing the radiation detection panel 30 from the base substrate 20. Therefore, according to the above-mentioned repair method, the repair operation of the flexible circuit substrate 40 can be easily performed.

[0106] (Note 1)

[0107] The radiation imaging device 1 includes: a radiation detection panel 30 having a first surface 31a in which a detection region R for detecting radiation is formed and an electrode pad 33 is formed outside the detection region R, and a second surface 31b on the opposite side of the first surface 31a; a base substrate 20 having a support surface 20a that is opposite to the second surface 31b of the radiation detection panel 30 and supports the radiation detection panel 30; and a flexible circuit substrate 40 connected to the electrode pad 33 via a connecting member 70. When viewed from the Z direction orthogonal to the supporting surface 20a, the end 21a of the base substrate 20 is located further inward than the inner end A1 of the connection region A where the electrode pad 33, the connecting member 70, and the flexible circuit substrate 40 overlap. In the radiation imaging device 1, when the flexible circuit substrate 40 is connected to the electrode pad 33, it is sometimes necessary to heat the flexible circuit substrate 40, the connecting member 70, and the radiation detection panel 30 from both sides in the Z direction by the heaters H1 and H2. That is, when a member that generates an adhesive force by thermocompression bonding, such as an anisotropic conductive material, is used as the connecting member 70, the thermocompression bonding of the above-mentioned heaters H1 and H2 is required. On the other hand, in the radiation imaging device 1, the end 21a of the base substrate 20 is located closer to the inside than the inner end A1 of the connection area A (all the connection areas A in this embodiment) when viewed from the Z direction. Therefore, interference between the heater H2 arranged on the second surface 31b side of the radiation detection panel 30 and the base substrate 20 can be avoided. Thus, when the flexible circuit substrate 40 needs to be repaired (repaired, replaced, etc.), the flexible circuit substrate 40 can be repaired without removing the radiation detection panel 30 from the base substrate 20. Therefore, according to the radiation imaging device 1, the repair operation of the flexible circuit substrate 40 can be facilitated.

[0108] In addition, assuming that the end 21a of the base substrate 20 is located further outward than the end 31c of the radiation detection panel 30 when viewed from the Z direction, the flexible circuit substrate 40 needs to be pulled around to be further outward than the end 21a of the base substrate 20. Such a pulling amount is required to lengthen the flexible circuit substrate 40, and noise is easily carried in the signal transmitted through the flexible circuit substrate 40. On the other hand, in the radiation imaging device 1, when viewed from the Z direction, the end 21a of the base substrate 20 is located further inward than the inner end A1 of the connection area A (that is, located further inward than the end 31c of the radiation detection panel 30). Therefore, the above-mentioned pulling around of the flexible circuit substrate 40 is not necessary, and the overall length of the flexible circuit substrate 40 can be shortened. As a result, noise in the signal transmitted through the flexible circuit substrate 40 can be suppressed.

[0109] In addition, the radiation detection panel 30 is formed in a rectangular shape when viewed from the Z direction, and one or more connection areas A are formed on at least one side of the radiation detection panel 30. In the present embodiment, as an example, a plurality of connection areas A are formed on each of all (four) sides. The end 21a of the base substrate 20 is located closer to the inside than the inner end A1 of all the connection areas A formed on at least one side (in the present embodiment, each of all sides) when viewed from the Z direction. According to this structure, the outer end 40a of the flexible circuit substrate 40 connected to the connection area A on the at least one side when viewed from the Z direction can be positioned close to the end 31c of the radiation detection panel 30 without interfering with the end 21a of the base substrate 20. That is, the outer end 40a of the flexible circuit substrate 40 on the at least one side can be located as inner as possible. As a result, the size of the frame 10 when viewed from the Z direction can be reduced, and the miniaturization of the radiation imaging device 1 can be sought.

[0110] In addition, the radiation imaging device 1 includes a scintillator 34, which is arranged on the first surface 31a, constitutes the detection area R and converts radiation into light, and when viewed from the Z direction, the end 21a of the base substrate 20 is located on the outside of the detection area R, and the distance d between the inner end A1 of the connection area A and the end 21a of the base substrate 20 in the direction of the XY plane (the second direction) is d (refer to Figure 6 ) may also be greater than 1 mm. According to the above structure, the distance between the heater H1 that heats the connecting member 70 and the scintillator 34 can be ensured to be greater than a certain value (at least greater than 1 mm) when the flexible circuit substrate 40 is connected to the electrode pad 33. As a result, the adverse effect of the heat from the heater H1 on the scintillator 34 can be suppressed. In addition, as described above, there is a case where a moisture-proof film having a moisture-proof property is provided on the scintillator 34. Such a moisture-proof film has a property of being particularly heat-resistant. According to the above structure, the adverse effect of the heat from the heater H1 on the scintillator 34 (including the moisture-proof film) having such a property of being particularly heat-resistant can be suppressed.

[0111] In addition, the base substrate 20 has a protrusion 22 protruding outward from the radiation detection panel 30 (substrate 31) at a position not overlapping with the flexible circuit substrate 40 when viewed in the Z direction. According to this structure, since the protrusion 22 can be used as a gripping portion while the radiation detection panel 30 is supported on the base substrate 20, the operability of the radiation imaging device 1 during manufacturing or repair can be improved.

[0112] [Note 2]

[0113] The radiation imaging device 1 includes: a radiation detection panel 30 having a first surface 31a on which a detection region R for detecting radiation is formed, and a second surface 31b on the opposite side to the first surface 31a; a base substrate 20 having a support surface 20a which is opposite to the second surface 31b of the radiation detection panel 30 and supports the radiation detection panel 30; and a flexible circuit substrate 40 connected to the radiation detection panel 30. When viewed in the Z direction perpendicular to the support surface 20a, an end 21a of the base substrate 20 corresponding to a portion to which the flexible circuit substrate 40 is connected is located further inward than an end 31c of the radiation detection panel 30, and the base substrate 20 has a protrusion 22 which protrudes further outward than the radiation detection panel 30 at a position not overlapping with the flexible circuit substrate 40 when viewed in the Z direction. In the radiation imaging device 1, the end 21a of the base substrate 20 corresponding to the portion connected to the flexible circuit substrate 40 is located further inward than the end 31c of the radiation detection panel 30 (substrate 31). Thus, when the other end 41b of the flexible circuit substrate 40 needs to be connected to the control substrate 50 disposed on the back surface 20b of the base substrate 20 as in the present embodiment, interference between the flexible circuit substrate 40 and the base substrate 20 can be appropriately prevented.

[0114] In addition, from the viewpoint of reducing the ratio of the above-mentioned insensitive area (i.e., the ratio of the area other than the effective light receiving area (detection area R) to the area of ​​the entire radiation imaging device 1), it is preferable to minimize the protruding length of the flexible circuit substrate 40 from the end 31c of the substrate 31 when viewed from the Z direction. Here, the protruding length is the distance between the outer end 40a (the bent portion, i.e., the portion farthest from the end 31c of the substrate 31 in the direction parallel to the XY plane) of the flexible circuit substrate 40 when viewed from the Z direction and the end 31c of the substrate 31. The protruding length can be minimized by positioning the end 21a of the base substrate 20 closer to the inside than the end 31c of the radiation detection panel 30 (substrate 31). Specifically, if the end 21a of the base substrate 20 is located closer to the outside than the end 31c, there is a restriction that the protruding length must be larger than the distance between the end 31c and the end 21a of the base substrate 20. On the other hand, since the end 21 a of the base substrate 20 is located on the inner side than the end 31 c of the radiation detection panel 30 (substrate 31 ), the above-mentioned restriction does not occur.

[0115] In addition, the base substrate 20 has a protrusion 22 protruding outward from the radiation detection panel 30 (substrate 31) at a position not overlapping with the flexible circuit substrate 40 when viewed in the Z direction. Thus, since the protrusion 22 can be used as a gripping portion while the radiation detection panel 30 is supported on the base substrate 20, the operability of the base substrate 20 can be improved.

[0116] In addition, the protrusions 22 are formed at least at two locations. In this case, the base substrate 20 can be stably held at the two locations. In addition, the protrusions 22 can be formed at least at three locations, or at least at four locations. In this embodiment, the protrusions 22 are formed at four locations. In this case, the base substrate 20 can be held more stably.

[0117] In addition, the substrate 31 (radiation detection panel 30) is formed in a rectangular shape when viewed from the Z direction. The protrusion 22 is provided at a position corresponding to the corner of the radiation detection panel 30. By providing the protrusion 22 at a position corresponding to the corner of the substrate 31, each side of the substrate 31 can be used as a space connected to the flexible circuit substrate 40 (that is, an area where the electrode pad 33 is formed) and the operability of the base substrate 20 is improved. In the present embodiment, the protrusions 22 are formed at the four corners of the base substrate 20, and these protrusions 22 are fixed to the frame 10 via the first extension portion 81 and the second extension portion 82. Thus, the base substrate 20 is well-balancedly supported relative to the frame 10 via the protrusions 22 formed at its four corners. In addition, in this case, the base substrate 20 is supported on the frame 10 by the above-mentioned protrusions 22 formed at a position as far away from the radiation detection panel 30 as viewed from the Z direction. Thus, for example, even if an external force is applied to the housing 10 and the housing 10 is deformed, it is possible to preferably suppress the influence of the deformation of the housing 10 from being exerted on the radiation detection panel 30 via the base substrate 20 .

[0118] In addition, the radiation detection panel 30 is formed in a rectangular shape when viewed from the Z direction, and one or more flexible circuit substrates 40 are connected to at least one side of the radiation detection panel 30. In the present embodiment, as an example, a plurality of flexible circuit substrates 40 are connected to each of all (four) sides. The end 21a of the base substrate 20 corresponding to the portion to which all the flexible circuit substrates 40 on at least one side are connected is located closer to the inner side than the end 31c of the radiation detection panel 30. According to this structure, the positions of the outer ends 40a of all the flexible circuit substrates 40 on the at least one side viewed from the Z direction can be made close to the end 31c of the radiation detection panel 30 without interfering with the end 21a of the base substrate 20. That is, the outer ends 40a of the flexible circuit substrates 40 on the at least one side can be located as inner as possible. As a result, the size of the frame 10 when viewed from the Z direction can be reduced, and the miniaturization of the radiation imaging device 1 can be sought.

[0119] Although the preferred embodiments of the present invention have been described in detail above, the present invention is not limited to the above embodiments. For example, the material and shape of each part are not limited to the above materials and shapes, and various materials and shapes can be adopted.

[0120] In the above embodiment, the vertical shift registers 42a, 42b and the signal connection parts 42c, 42d can be externally connected via the flexible circuit substrate 40. In addition, considering the readout performance (noise and readout speed, etc.), electrode pads 33 for connecting the vertical shift registers 42a, 42b are arranged on the left and right sides of the detection area R, and electrode pads 33 for connecting the signal connection parts 42c, 42d are arranged on the upper and lower sides of the detection area R. That is, in the above embodiment, Fig.12 As shown in (A), a plurality of electrode pads 33 are arranged on four sides surrounding the detection region R. However, the electrode pads 33 are not necessarily arranged on all four sides. In addition, the number and arrangement interval of the electrode pads 33 arranged on each side are not particularly limited.

[0121] For example, one of the vertical shift registers 42a and 42b or one of the signal connecting portions 42c and 42d may be omitted. Fig.12 As shown in (B), electrode pads 33 are arranged along three sides of the substrate 31. In addition, one of the vertical shift registers 42a and 42b and one of the signal connecting parts 42c and 42d may be omitted. In this case, Fig.12 As shown in (C), electrode pads 33 are arranged along two sides of the substrate 31. In addition, for example, the circuit corresponding to the vertical shift registers 42a and 42b may be made on the substrate 31 instead of being made on the external IC chip 42. Furthermore, one of the signal connection parts 42c and 42d may be omitted. In this case, Fig.12 As shown in (D), an electrode pad 33 is arranged along one side of the substrate 31. For example, by configuring the substrate 31 as a TFT panel using low-temperature polysilicon, such a circuit can be easily manufactured.

[0122] In addition, if Fig.12 As shown in (E), the sides (here, the two sides on the left and right sides) where the electrode pads 33 are provided in the substrate 31 are provided with a plurality of (here, two as an example) electrode pads 33 arranged at relatively wide intervals. In this example, a relatively wide space where no electrode pads 33 are arranged is formed in the center of the two sides on the left and right sides. In addition, as shown in Fig.12 As shown in (F), the substrate 31 may be provided with an electrode pad 33 on its sides (here, the two sides on the left and right sides), and only one electrode pad 33 may be provided, and a relatively wide space may be formed on both sides of the electrode pad 33. Fig.12 As shown in (B) to (F) of FIG. 1 , when a side portion without an electrode pad 33 or a relatively wide space without an electrode pad 33 is provided in the substrate 31, a protrusion 22 (for example, referring to FIG. 1 ) may be provided in a portion corresponding to the side portion or the space. Fig.13 (E)~(I)).

[0123] In the above embodiment, the protrusions 22 are disposed at the four corners of the main body 21, but the arrangement and number of the protrusions 22 are not limited to the above example. Fig.13 As shown in (A) of FIG. 1 , it is arranged at one corner and can be Fig.13 As shown in (B) of FIG. 1 , the two adjacent corners can be arranged as shown in FIG. Fig.13 As shown in (C), it is arranged at two corners that are diagonally opposite to each other, or it can be arranged as shown in (C). Fig.13 As shown in (D), it is set at the three corners.

[0124] In addition, the position where the protrusion 22 is provided is not limited to the corner of the main body 21, and may also be the side of the main body 21. In this case, for example, the protrusion 22 may be as follows Fig.13 As shown in (E) of Fig.13 As shown in (F) of FIG. 1 , the two adjacent sides can be arranged as follows: Fig.13 As shown in (G) of FIG. 1 , the two sides opposite to each other can be set as Fig.13 It can be set on three sides as shown in (H), or as Fig.13 As shown in (I), it is set on 4 sides. Fig.13 In the examples (F) to (I), the protrusion 22 is provided at the center of each side, but the protrusion 22 may be provided at a position deviated from the center of each side, or two or more protrusions 22 may be provided with respect to one side (for example, see Fig.14 In addition, if Fig.13 As shown in (A) and (E) of FIG. 1 , even if there is only one protrusion 22, the radiation detection panel 30 and the base substrate 20 can be easily carried by holding the protrusion 22. That is, the operability of the radiation detection panel 30 and the base substrate 20 is improved by the portion where the protrusion 22 is provided. On the other hand, when a plurality of protrusions 22 are provided, the base substrate 20 can be stably held at a plurality of locations, thereby further improving the above-mentioned operability.

[0125] In addition, the protrusion 22 may be provided at both the corner and the side of the main body 21. Fig.13 The configurations of the protrusions 22 shown in the above examples may also be arbitrarily combined.

[0126] In the above embodiment, the first extension portion 81 (the first extension portion 81 provided with the guide groove 81a) as the positioning member is provided at the position corresponding to each of the four corners of the substrate 31, but at least one first extension portion 81 as the positioning member only needs to be provided. In this case, since the two adjacent sides (two sides orthogonal to each other) can be positioned across the corner of the substrate 31, the substrate 31 can be positioned. However, if Fig.14As shown in (A) to (C) of FIG. 1 , the first extension portion 81 as a positioning member is preferably provided at positions corresponding to two or more corners of the substrate 31. This can improve workability when placing the substrate 31 on the supporting surface 20a of the base substrate 20.

[0127] In addition, if Fig.14 As shown in (D) to (F) of FIG. 2 , when the protrusion 22 is provided on the side of the main body 21, the first extension portion 81 may also have a guide surface 81c for positioning the side of the substrate 31 (a surface parallel to the side of the corresponding substrate 31 when viewed from the Z direction). In this case, at least one first extension portion 81 is provided on each of the two sides that are orthogonal to each other (a total of two). However, if Fig.14 As shown in (D) to (F) of FIG. 8 , the first extension portions 81 as positioning members are preferably provided at three or more locations. This can improve workability when placing the substrate 31 on the supporting surface 20 a of the base substrate 20 .

[0128] In addition, the first extending portion 81 as a positioning member may be provided at both the corner portion and the side portion of the main body portion 21 .

[0129] The first extension portion 81 used as a positioning member can also be removed after the substrate 31 is fixed to the support surface 20a. However, by leaving the first extension portion 81 even after the substrate 31 is fixed to the support surface 20a, it is possible to prevent the occurrence of operational errors when removing the first extension portion 81, and to prevent damage to components such as the base substrate 20 due to operational errors (that is, a reduction in the yield of the radiation imaging device 1). In addition, by leaving the first extension portion 81, the first extension portion 81 can function as a protective member for protecting the end portion of the substrate 31 (in the above embodiment, the corner portion 31d of the substrate 31). Furthermore, as in the above embodiment, the first extension portion 81 can be used as a supporting member connecting the protrusion 22 and the top wall 11.

[0130] In the above-mentioned embodiment, the first extension portion 81 functions as a positioning member for positioning the substrate 31, and functions as a supporting member for supporting the protrusion 22 relative to the top wall 11, but the first extension portion 81 may have only one of the functions of the positioning member and the supporting member. That is, the portion for positioning the substrate 31 (in the present embodiment, the guide groove 81a) may not be provided in the first extension portion 81. Alternatively, the first extension portion 81 may not be fixed to the top wall 11. Alternatively, the first extension portion 81 may be omitted. In addition, in the case where a plurality of protrusions 22 are provided, the first extension portion 81 may be provided only on a portion of the protrusions 22. Similarly, the second extension portion 82 may be omitted. In addition, in the case where a plurality of protrusions 22 are provided, the second extension portion 82 may be provided only on a portion of the protrusions 22.

[0131] The protruding portion 22 may be omitted. That is, the base substrate 20 may be a member composed only of the above-mentioned main body portion 21. In this case, the first extension portion 81 and the second extension portion 82 fixed to the protruding portion 22 may be omitted.

[0132] In the above embodiment, the base substrate 20 is formed in a manner that does not overlap with all the connection areas A when viewed from the Z direction, but the base substrate 20 only needs to be formed in a manner that does not overlap with at least one connection area A, and is not necessarily formed in a manner that does not overlap with all the connection areas A. For example, the base substrate 20 may also be formed in a manner that does not overlap with the connection area A corresponding to the flexible circuit substrate 40 that carries the IC chip 42 with a particularly high incidence of failure (i.e., prone to repair work), and on the other hand, is formed in a manner that overlaps with other connection areas A. In this case, the sequence shown in the above embodiment (i.e., the sequence of connecting each flexible circuit substrate 40 to each electrode pad 33 after supporting the radiation detection panel 30 on the base substrate 20) cannot be implemented, but the radiation imaging device 1 can be manufactured by connecting each flexible circuit substrate 40 to the radiation detection panel 30 and then supporting the radiation detection panel 30 on the base substrate 20. Furthermore, since the base substrate 20 is formed so as not to overlap with the connection region A corresponding to the flexible circuit substrate 40 on which the IC chip 42 having a high probability of failure is mounted, when the IC chip 42 fails, the repair work of the flexible circuit substrate 40 can be performed without removing the radiation detection panel 30 from the base substrate 20. Thus, even when the base substrate 20 is formed so as not to overlap with only a part of the connection region A as described above, the repair work of the flexible circuit substrate 40 corresponding to the connection region A can be facilitated and the noise of the signal transmitted through the flexible circuit substrate 40 can be suppressed, similarly to the above-mentioned embodiment.

[0133] In the above embodiment, only the flexible circuit substrate 40 is used as the electrical connection means with each electrode pad 33, but a connection means other than the flexible circuit substrate 40 (such as wire bonding, etc.) may be used in combination. For example, some of the electrode pads 33 may be connected to the control substrate 50 via the flexible circuit substrate 40, and the other electrode pads 33 may be connected to the control substrate 50 (or a separately provided control circuit) by wire bonding.

[0134] In addition, in the above-mentioned embodiment, the external IC chip 42 and the electrode pad 33 are electrically connected via the flexible circuit substrate 40, but it is also possible to accommodate a substrate for mounting a chip in the frame 10, and mount the IC chip on the substrate. In addition, the IC chip and the electrode pad 33 may also be electrically connected only by a connection unit (such as the above-mentioned wire bonding, etc.) other than the flexible circuit substrate 40. In addition, in such a case, since there is no connection area A as described in the above-mentioned embodiment, the end 21a of the base substrate 20 may also be arranged closer to the inside than the end 31c of the radiation detection panel 30 (substrate 31) when viewed from the Z direction. That is, a base substrate 20 of a size that completely encloses (includes) the substrate 31 when viewed from the Z direction (that is, when viewed from the Z direction, the entire peripheral portion of the base substrate 20 is located closer to the outside than the substrate 31). In this case, the entire peripheral portion of the base substrate 20 corresponds to the protrusion 22 in the above-mentioned embodiment.

[0135] Furthermore, as described above, based on the viewpoint of preventing interference between the base substrate 20 and the flexible circuit substrate 40 and the viewpoint of reducing the proportion of the insensitive area, the end 21a of the base substrate 20 corresponding to the portion connected to the flexible circuit substrate 40 only needs to be located closer to the inside than the end 31c of the radiation detection panel 30 (substrate 31), and the base substrate 20 can also be formed so as not to overlap with the connection area A when viewed from the Z direction.

[0136] In the above-mentioned embodiment, the detection area R is an area to which an indirect conversion method is applied, in which a radiation image is converted into a light image by a scintillator 34 and then the light image is photographed by the light receiving unit 32 to obtain an image, but the detection area R may also be an area to which a direct conversion method is applied, in which an image is obtained by directly photographing the radiation image. For example, on the first surface 31a of the substrate 31, a pixel circuit configured to store and transfer charges may be provided instead of the light receiving unit 32, and a solid material (conversion unit) (for example, CdTe, CdZnTe, GaAs, InP, TlBr, HgI2, PbI2, Si, Ge, and a-Se, etc.) that directly converts radiation into charges may be provided instead of the scintillator 34. Thus, a detection area R to which a direct conversion method is applied may be obtained. The detection area R in this case is an area to which radiation is incident and is an area to which a bias voltage is applied (i.e., an area to which an image is obtained). In addition, since such a solid material is not resistant to high temperatures, like the scintillator 34, it is preferred to increase the distance between the solid material and the connection area A as much as possible (i.e., the distance d between the end 21a of the base substrate 20 and the inner end A1 of the connection area A). Specifically, even in the case where a solid material is provided (direct conversion method), the distance d is preferably set to be greater than 1 mm, as in the case where a scintillator 34 is provided (indirect conversion method). Thus, the distance between the heater H1 that heats the connecting member 70 in order to connect the flexible circuit substrate 40 to the electrode pad 33 and the solid material can be ensured to be greater than a certain value (at least 1 mm or more). As a result, the adverse effects of the heat from the heater H1 on the solid material can be suppressed.

[0137] In the above embodiment, the radiation detection panel 30 is described as being formed by forming a film of polycrystalline silicon or amorphous silicon on a glass substrate, i.e., the substrate 31. However, the radiation detection panel 30 is not limited to the above structure, and may also have a structure in which, for example, a light receiving portion is formed on a single crystal silicon substrate. In addition, the substrate 31 is not limited to a glass substrate, and may also be, for example, a thin film substrate (flexible substrate).

[0138] Explanation of symbols

[0139] 1…radiation imaging device, 10…frame, 11…top wall (first wall portion), 12…bottom wall (second wall portion), 13…side wall (third wall portion), 13c…recess, 20…base substrate, 20a…support surface, 20b…back surface, 21a…end portion, 22…protrusion, 30…radiation detection panel, 31c…end portion, 32…light receiving portion, 33…electrode pad, 34…scintillator (conversion portion), 40…flexible circuit substrate, 70…connecting member, 81…first extension portion, 82…second extension portion, 112…shielding member, A…connecting region, A1…inner end portion, H1…heater (first heater), H2…heater (second heater).

Claims

1. A radiation imaging device, wherein: have: A radiation detection panel having a first surface on which a detection area for detecting radiation is formed, and a second surface opposite to the first surface; a base substrate having a supporting surface that is opposite to the second surface of the radiation detection panel and supports the radiation detection panel; and a frame housing the radiation detection panel and the base substrate, The frame body has a first wall portion facing the first surface and a second wall portion facing the second surface. The base substrate has a protrusion protruding outward from the radiation detection panel when viewed from a first direction perpendicular to the support surface. An extension portion extending in the first direction is provided on a surface of the protruding portion opposite to the supporting surface. The base substrate is supported by the second wall portion via the extending portion.

2. The radiation imaging device according to claim 1, wherein: The frame body has a third wall portion extending in the first direction and connecting the first wall portion and the second wall portion. The protrusion is provided so as to be spaced apart from the third wall portion.

3. The radiation imaging device according to claim 1 or 2, wherein: The extension portion is formed separately from the base substrate.

4. The radiation imaging device according to any one of claims 1 to 3, wherein: A plurality of the extending portions are provided on a surface of the protruding portion opposite to the supporting surface and are arranged to be spaced apart from each other.

5. The radiation imaging device according to claim 4, wherein: The base substrate has a plurality of protrusions arranged to be spaced apart from each other. The extending portion is provided on each of the plurality of protruding portions.

6. The radiation imaging device according to claim 5, wherein: The radiation detection panel is formed in a rectangular shape when viewed from the first direction. The plurality of protrusions are provided at positions corresponding to four corners of the radiation detection panel.

7. The radiation imaging device according to claim 6, wherein: The frame body has a third wall portion extending in the first direction and connecting the first wall portion and the second wall portion. The third wall portion is formed into a rectangular ring shape when viewed from the first direction, A recessed portion is formed at a corner of the third wall portion to avoid interference with the protruding portion and the extending portion. The thickness of the third wall portion at the recessed portion is smaller than the thickness of the third wall portion at a side portion of the third wall portion connecting corner portions of adjacent third wall portions.

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