Control method of edge grinding equipment and edge grinding equipment

Abstract

The invention provides a control method of edge grinding equipment and the edge grinding equipment, and the method comprises the steps: in the edge grinding process of a silicon wafer, detecting whether the position of at least one grinding wheel of the edge grinding equipment is deviated or not; and under the condition that the position of one or more grinding wheels deviates and the deviation duration is larger than the target duration, alarm operation is executed. The precision of the grinding wheel can be effectively monitored in the edge grinding process of the silicon wafer, abnormal deviation of the position of the grinding wheel can be found in time, edge shape abnormity caused by the precision problem of the grinding wheel is reduced, spindle abnormal operation caused by the precision abnormity of the grinding wheel is reduced, equipment abrasion and economic loss are reduced, and the grinding efficiency is improved. Products with Chipping and abnormal edge parameters can be effectively intercepted, and the stability of the edge process parameters of the silicon wafer is improved.

Description

Technical Field

[0001] The present application relates to the technical field of silicon wafer edge morphology control, and in particular to a control method for edge grinding equipment and edge grinding equipment. Background Art

[0002] Edge grinding is an indispensable process in the semiconductor manufacturing process, which has a direct impact on the mechanical strength of silicon wafers, the reliability of subsequent processes and the yield of products. The relevant edge grinding equipment is equipped with a grinding wheel for edge grinding of silicon wafers. In the edge grinding process of silicon wafers, the precision of the grinding wheel is extremely high to ensure that the edge morphology of the silicon wafer meets the process standards.

[0003] However, the grinding wheel accuracy of related edge grinding equipment is difficult to be effectively monitored during the processing process. The accuracy of the installed grinding wheel can only be confirmed when the equipment is shut down. It is difficult to monitor the grinding wheel accuracy in real time during the silicon wafer processing. The grinding wheel accuracy will only be checked when problems such as chipping of the silicon wafer edge and abnormal edge parameters occur. This post-detection method has a delay and it is difficult to intercept abnormal products in time, resulting in a decrease in product yield.

[0004] Based on this, the present application provides a control method of an edge grinding device and an edge grinding device to improve the relevant technology. Summary of the invention

[0005] The purpose of the present application is to provide a control method and an edge grinding device for edge grinding equipment, so as to effectively monitor the grinding wheel accuracy and improve the stability of silicon wafer edge parameters.

[0006] The purpose of this application is achieved by the following technical solutions:

[0007] In a first aspect, the present application provides a control method for an edge grinding device, the method comprising: during the edge grinding process of a silicon wafer, detecting whether a position deviation occurs in at least one grinding wheel of the edge grinding device; and performing an alarm operation when a position deviation occurs in one or more grinding wheels and the deviation duration is greater than a target duration.

[0008] In some embodiments, the performing of the alarm operation includes: performing the alarm operation on a target grinding wheel, wherein the target grinding wheel includes: one or more grinding wheels having position deviation and the deviation duration being greater than the target duration.

[0009] In some embodiments, the method further includes: in the case where the alarm operation has been executed, after the edge grinding process of the silicon wafer is completed, controlling the edge grinding device to stop operating.

[0010] In some embodiments, after controlling the edge grinding device to stop operating, the method further includes: reinstalling the target grinding wheel; and detecting whether a position of the reinstalled target grinding wheel is deviated.

[0011] In some embodiments, the target time is a preset edge grinding time of a silicon wafer.

[0012] In a second aspect, the present application provides an edge grinding device, which includes: at least one grinding wheel; and a control module for performing an alarm operation when a position deviation of one or more grinding wheels is detected during the edge grinding process of a silicon wafer and the deviation duration is greater than a target duration.

[0013] In some embodiments, the edge grinding device also includes: a position sensor, each grinding wheel corresponds to at least one position sensor; the control module detects whether the position of the grinding wheel deviates in the following manner: when one or more position sensors corresponding to the grinding wheel output a position deviation signal, it is determined that the position of the grinding wheel deviates.

[0014] In some embodiments, the height of the position sensor is lower than the height of the lower surface of the corresponding grinding wheel, and the distance between the position sensor and the preset rotation axis of the corresponding grinding wheel is greater than the radius of the grinding wheel.

[0015] In some embodiments, each grinding wheel corresponds to multiple position sensors, and the heights of the multiple position sensors corresponding to the same grinding wheel are the same; and / or, the distances between the multiple position sensors corresponding to the same grinding wheel and the preset rotation axis of the corresponding grinding wheel are the same.

[0016] In some embodiments, the at least one grinding wheel comprises one or more of a peripheral rough grinding wheel, a peripheral fine grinding wheel, a groove fine grinding wheel, and a groove rough grinding wheel.

[0017] The present application provides a control method and an edge grinding device for edge grinding equipment. During the edge grinding process of a silicon wafer, the position of at least one grinding wheel of the edge grinding equipment is detected to see if there is a deviation. When a deviation is detected in the position of one or more grinding wheels, and the duration of the deviation (i.e., the deviation duration) is greater than the preset target duration, the device will perform an alarm operation. By adopting the above method, the accuracy of the grinding wheel can be effectively monitored during the edge grinding of the silicon wafer, abnormal deviations in the position of the grinding wheel can be discovered in time, and the abnormal edge morphology caused by the accuracy of the grinding wheel can be reduced, thereby reducing the loss of product yield. Secondly, the abnormal operation of the spindle caused by abnormal grinding wheel accuracy can be reduced, and equipment wear and economic losses can be reduced. In addition, through the control of grinding wheel accuracy, products with chipping and abnormal edge parameters can be effectively intercepted, the stability of the silicon wafer edge process parameters can be improved, and product quality can be ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present application is further described below in conjunction with the accompanying drawings and specific implementation methods.

[0019] Figure 1 It is a schematic diagram of a grinding wheel of an edge grinding device provided in an embodiment of the present application.

[0020] Figure 2 It is a schematic diagram of a grinding wheel of an edge grinding device provided in an embodiment of the present application (with a position sensor installed).

[0021] Figure 3 It is a flow chart of a control method for edge grinding equipment provided in an embodiment of the present application.

[0022] Figure 4 It is a schematic diagram (front view) of the installation position of a position sensor provided in an embodiment of the present application.

[0023] Figure 5 It is a schematic diagram (top view) of the installation position of a position sensor provided in an embodiment of the present application.

[0024] Figure 6 This is a flow chart of a grinding wheel precision control operation provided in an embodiment of the present application.

[0025] In the figure: 101, peripheral rough grinding wheel; 102, peripheral fine grinding wheel; 103, groove fine grinding wheel; 104, groove rough grinding wheel; 105, rotating shaft; 201, position sensor; 301, silicon wafer. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in this application to clearly and completely describe the technical solutions in the implementation mode of this application. Obviously, the described implementation mode is only a part of the implementation mode of this application, not all the implementation modes. Based on the implementation mode in this application, all other implementation modes obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0027] In the description of the embodiments of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0028] See also Figure 1 , Figure 1Schematic diagram of a grinding wheel of an edge grinding device provided in an embodiment of the present application. During the edge grinding process of a wafer (i.e., a silicon wafer), the grinding wheel accuracy of the edge grinding equipment is difficult to monitor effectively, and abnormal edge morphology caused by grinding wheel accuracy problems often occurs, resulting in yield loss. Problems associated with abnormal grinding wheel accuracy can cause abnormal operation of the spindle on which the grinding wheel is installed, causing wear and causing high economic losses. The related technology only confirms the grinding wheel accuracy after the grinding wheel is installed, or only confirms when problems such as chipping and edge parameter abnormalities occur during the operation, and it is difficult to effectively intercept abnormal products. In addition, it is difficult to effectively monitor the operating status of the grinding wheel through the fluctuations of the silicon wafer edge parameters, making it difficult to analyze the cause of the abnormality. Among them, the silicon wafer edge parameters may include edge process parameters, such as the edge flatness of the silicon wafer.

[0029] See also Figure 2 and Figure 3 , Figure 2 Schematic diagram of a grinding wheel of an edge grinding device provided in an embodiment of the present application (installation position sensor 201), Figure 3 It is a flow chart of a control method for edge grinding equipment provided in an embodiment of the present application.

[0030] An embodiment of the present application provides a control method for edge grinding equipment, the method comprising steps S101 to S102.

[0031] Step S101: During the edge grinding process of the silicon wafer 301, detecting whether the position of at least one grinding wheel of the edge grinding device is deviated.

[0032] Step S102: When a position deviation of one or more grinding wheels occurs and the deviation duration is greater than a target duration, an alarm operation is performed.

[0033] For example, assuming that the edge grinding equipment is a chamfering equipment, a precision sensing sensor is installed below the grinding wheel position of the chamfering equipment. When the grinding wheel position is offset for a long time, an alarm will be triggered. That is, the grinding wheel accuracy includes, for example, position accuracy. When the relevant edge grinding equipment is grinding the edge of a silicon wafer, the grinding wheel accuracy can only be confirmed when the equipment is stopped. It is difficult to check during the wafer processing process (that is, the edge grinding process of the silicon wafer 301). The grinding effect can only be confirmed when the edge morphology data of the silicon wafer 301 is tested later, which has a delay. In addition, there are many grinding wheels in the chamfering equipment, such as Figure 1As shown, for example, it includes a peripheral rough grinding wheel 101, a peripheral fine grinding wheel 102, a notch (i.e., groove, or notch) fine grinding wheel 103, and a notch rough grinding wheel 104. There are many edge parameters, and they are extremely sensitive to the grinding wheel accuracy, which is generally required to be within 5um, so it is very necessary to ensure the grinding wheel accuracy. Among them, the accuracy sensor can be, for example, a position sensor 201, and the grinding wheel can be, for example, a grinding wheel.

[0034] The above embodiment does not limit the size of the silicon wafer 301 , which may be, for example, 12 inches (ie, 12 inches).

[0035] The above embodiment does not limit the target time length. In some embodiments, the target time length may be a preset edge grinding time length of a silicon wafer 301 .

[0036] In the above embodiment, the alarm operation may include, for example, one or more of a voice alarm operation, a light alarm operation, and an alarm information push operation. The alarm information push operation may, for example, push the alarm information to the terminal device (e.g., a mobile phone, a tablet computer, a desktop computer, a wearable device, etc.) of the relevant process personnel. A grinding wheel with a position deviation and a deviation duration greater than the target duration is regarded as an abnormal grinding wheel. The corresponding voice content of the voice alarm operation may, for example, include the identification of the abnormal grinding wheel, and the alarm information may, for example, include the identification of the abnormal grinding wheel. The identification may, for example, include one or more of Chinese, English, numbers, graphics, and special symbols.

[0037] The above-mentioned embodiment can effectively monitor the accuracy of the grinding wheel during the edge grinding process of the silicon wafer 301, and can reduce the abnormal loss of edge morphology caused by the grinding wheel accuracy problem. Effective control of the grinding wheel accuracy can improve the wear problem of the rotating shaft 105 (of the grinding wheel) caused by abnormal operation and reduce economic losses. Problems such as chipping and abnormal silicon wafer edge parameters caused by poor grinding wheel accuracy during operation can be effectively intercepted. These measures enable the stability of silicon wafer edge parameters (for example, the edge flatness of the silicon wafer 301) to be better controlled. The automated monitoring and alarm mechanism reduces the reliance on manual inspection, simplifies the operating process, facilitates process personnel to perform maintenance and correction in a timely manner, and improves the convenience and safety of operation.

[0038] In some embodiments, the performing of the alarm operation may include: performing the alarm operation for a target grinding wheel, wherein the target grinding wheel includes: one or more grinding wheels having position deviation and the deviation duration being greater than the target duration.

[0039] In the above embodiment, different grinding wheels may have corresponding alarm operations. As an example, assume that the edge grinding device is provided with grinding wheel A, grinding wheel B, grinding wheel C, and grinding wheel D. The alarm operation corresponding to grinding wheel A may be, for example, a voice alarm operation, the alarm operation corresponding to grinding wheel B may be, for example, a red light alarm operation, the alarm operation corresponding to grinding wheel C may be, for example, a yellow light alarm operation, and the alarm operation corresponding to grinding wheel D may be, for example, an alarm information push operation.

[0040] See also Figure 4 and Figure 5 , Figure 4 is a schematic diagram (front view) of the installation position of a position sensor 201 provided in an embodiment of the present application, Figure 5 It is a schematic diagram (top view) of the installation position of a position sensor 201 provided in an embodiment of the present application.

[0041] A precision sensing sensor (e.g., position sensor 201) is installed below the grinding wheel, and each grinding wheel corresponds to one or more precision sensing sensors, such as Figure 2 , Figure 4 and Figure 5 As shown, when the grinding wheel is offset (e.g., slightly offset) and the time (i.e., the deviation duration) is greater than the target duration (e.g., the processing time of a single wafer), it indicates that there is a problem with the grinding wheel accuracy at this time, and a targeted alarm operation will be performed, and then the process personnel can confirm the grinding wheel accuracy and product data. Among them, the processing time of a single wafer is, for example, the preset edge grinding time of a silicon wafer 301.

[0042] As an example, assume that a position sensor A1 is installed under grinding wheel A. At time T1, position sensor A1 senses that the position of grinding wheel A is deviated, and starts to time the deviation duration of grinding wheel A; at time T2, position sensor A1 senses that the position of grinding wheel A is deviated again, and at this time, the deviation duration of grinding wheel A is updated to T2-T1; at time T3, position sensor A1 senses that the position of grinding wheel A is deviated again, and at this time, the deviation duration of grinding wheel A is updated to T3-T1. Assuming that (T2-T1)<target duration<(T3-T1), the alarm operation will not be executed at time T2, but after time T3, the corresponding alarm operation of grinding wheel A will be automatically executed, such as a voice alarm operation containing the logo of grinding wheel A. This makes it convenient for process personnel to deal with the situation where there is a problem with the grinding wheel accuracy in a timely manner, ensuring the grinding wheel accuracy and product quality. In the case where different grinding wheels correspond to different alarm operations, process personnel can also easily know from the voice alarm operation that there is a problem with the accuracy of grinding wheel A.

[0043] In some embodiments, the method may further include: when the alarm operation has been executed, after the edge grinding process of the silicon wafer 301 is completed, controlling the edge grinding device to stop working. That is to say, when the grinding wheel position is offset for a long time, not only will an alarm be triggered, but the device will also stop processing after the grinding of the current silicon wafer 301 is completed, and will no longer automatically load and grind the next silicon wafer. Automatically stopping the operation improves the automation level of the edge grinding device.

[0044] In some embodiments, after controlling the edge grinding device to stop operation, the method may further include: reinstalling the target grinding wheel; and detecting whether the position of the reinstalled target grinding wheel is deviated. When detecting the reinstalled target grinding wheel, the edge grinding device may be turned on, a silicon wafer may be placed, and during the grinding of the edge silicon wafer, the position of the target grinding wheel may be detected to determine whether the position is deviated (for example, using the position sensor 201 to detect the position deviation); or, naked eye observation, detection by other detection equipment, etc. may be used, and the above embodiment does not limit this.

[0045] See also Figure 6 , Figure 6 This is a flow chart of a grinding wheel precision control operation provided in an embodiment of the present application.

[0046] like Figure 6 As shown, in a specific application scenario, an edge grinding device is used to process a silicon wafer 301 (for example, edge grinding). When the position of the grinding wheel deviates, the precision sensing sensor (for example, the position sensor 201) can sense the position deviation and output a position deviation signal. When the accuracy abnormality time of the grinding wheel (i.e., the deviation duration) is greater than the target duration (for example, the processing time of a single wafer), the edge grinding device will alarm (i.e., the grinding wheel accuracy control alarm) and stop processing after the current silicon wafer 301 is processed. Afterwards, the process personnel can reconfirm the grinding wheel accuracy and make corrections. The corrective operation for the abnormal grinding wheel is, for example, to adjust the position by reinstalling it. After reinstalling the grinding wheel, it can be confirmed whether the grinding wheel accuracy meets the processing requirements.

[0047] The embodiment of the present application also provides an edge grinding device, which includes at least one grinding wheel and a control module. The control module is used to perform an alarm operation when it is detected that the position of one or more grinding wheels deviates during the edge grinding process of the silicon wafer 301 and the deviation duration is greater than the target duration.

[0048] In some embodiments, the edge grinding device may further include a position sensor 201, and each grinding wheel corresponds to at least one position sensor 201. The control module may detect whether the position of the grinding wheel is deviated in the following manner: when one or more position sensors 201 corresponding to the grinding wheel output a position deviation signal, it is determined that the position of the grinding wheel is deviated.

[0049] As an example, assume that position sensor B1 and position sensor B2 are installed under grinding wheel B. At time T1, position sensor B1 senses that the position of grinding wheel B is deviated, and position sensor B1 outputs a position deviation signal. The control module receives the position deviation signal from position sensor B1 and starts timing the deviation duration of grinding wheel B. At time T2, position sensor B2 senses that the position of grinding wheel B is deviated and outputs a position deviation signal. The control module updates the deviation duration of grinding wheel B to T2-T1. At time T3, position sensor B1 senses that the position of grinding wheel B is deviated again and outputs a position deviation signal. The control module updates the deviation duration of grinding wheel B to T3-T1. Assuming that (T2-T1)<target duration<(T3-T1), after time T3, the control module will automatically execute the corresponding alarm operation of grinding wheel B, such as a red light alarm operation. Process personnel can easily know from the red light alarm operation that there is a problem with the accuracy of grinding wheel B.

[0050] In some embodiments, the height of the position sensor 201 may be lower than the height of the lower surface of the corresponding grinding wheel, and the distance between the position sensor 201 and the preset rotation axis of the corresponding grinding wheel may be greater than the radius of the grinding wheel.

[0051] Among them, the rotation axis is a geometric straight line on which rotationally symmetrical actions are performed. The position of the preset rotation axis of the grinding wheel, for example, matches the position of the rotating shaft 105 when there is no deviation in the position of the grinding wheel. It should be noted that the preset rotation axis is a geometric straight line, and its position will not change, so it can be used as an installation reference line for the position sensor 201; while the rotating shaft 105 corresponding to the grinding wheel (that is, the main shaft on which the grinding wheel is installed) is a physical component. If the position of the grinding wheel deviates, the rotating shaft 105 may have abnormal operation and cause wear. When installing the position sensor 201, the installation position of the position sensor 201 can be determined according to the position of the preset rotation axis.

[0052] In the above embodiment, the position sensor 201 does not directly contact the grinding wheel and the silicon wafer 301. Specifically, the position sensor 201 is located in the outer area of ​​the grinding wheel and below the grinding wheel, and can accurately sense the slight deviation of the grinding wheel without being affected or less affected by debris and vibration during the grinding process, thereby improving the sensitivity and reliability of position detection. Secondly, the installation position of the position sensor 201 makes it easy to maintain and replace, which is conducive to the continuous operation of the equipment.

[0053] In some embodiments, each grinding wheel may correspond to multiple position sensors 201, and the heights of the multiple position sensors 201 corresponding to the same grinding wheel are the same. In some embodiments, the distances between the multiple position sensors 201 corresponding to the same grinding wheel and the preset rotation axis of the corresponding grinding wheel may be the same.

[0054] In the above embodiment, multiple position sensors 201 are arranged at the same height and / or the same radial distance (for example, symmetrically or asymmetrically, evenly or unevenly), which can monitor the displacement of the grinding wheel in an all-round way and reduce the monitoring blind area. As a result, when the grinding wheel has a position deviation in any direction, at least one position sensor 201 can sense it in time, which improves the sensitivity and accuracy of position deviation detection and realizes real-time monitoring of grinding wheel precision. Secondly, the position sensors 201 are arranged at the same height and / or the same radial distance, which reduces the detection error caused by height difference and radial distance difference, improves the consistency and reliability of measurement data, and helps to accurately judge whether the position deviation of the grinding wheel exceeds the allowable range, so as to take alarm and shutdown measures in time to prevent the production of defective products. Thirdly, the layout design of this position sensor 201 simplifies the installation and calibration process and reduces the complexity and maintenance cost of the equipment. At the same time, the evenly distributed sensors can monitor the operating status of the grinding wheel more comprehensively and avoid monitoring blind areas. By configuring a plurality of position sensors 201 with the same height and radial distance for each grinding wheel, the ability to detect the position deviation of the grinding wheel is enhanced, and the reliability of the edge grinding equipment and the processing quality of the product are improved.

[0055] In some embodiments, the at least one grinding wheel may include one or more of a peripheral rough grinding wheel 101, a peripheral fine grinding wheel 102, a groove fine grinding wheel 103, and a groove rough grinding wheel 104. By configuring various types of grinding wheels (e.g., rough grinding wheels and fine grinding wheels), grinding tasks with different precision requirements can be met respectively, ensuring that the edge of the silicon wafer can meet the predetermined morphology standards in both the rough machining and fine machining stages, thereby improving the overall edge quality. Secondly, equipping corresponding grinding wheels for different edge areas (e.g., periphery and grooves) can achieve more precise and targeted grinding operations. This partitioned grinding method helps to evenly control the edge morphology of each area, reduce local abnormalities, and improve product consistency and yield. In addition, the use of a variety of grinding wheels in combination can flexibly respond to different process requirements and material properties, and improve the adaptability of the equipment.

[0056] In some embodiments, the edge grinding equipment may be a chamfering equipment. The above embodiments can realize the monitoring and control of the grinding wheel precision of the chamfering equipment. By detecting the grinding wheel position deviation, the abnormality of the grinding wheel can be discovered and corrected in time, the accuracy and consistency of the chamfered edge morphology can be ensured, the edge defects caused by the grinding wheel precision problem can be reduced, and the overall quality of the product can be improved. The abnormal operation of the spindle caused by the abnormal grinding wheel precision can be reduced, the excessive wear of the equipment can be reduced, the service life of the chamfering equipment and its components can be extended, and the maintenance and replacement costs can be reduced. The automatic alarm and shutdown function can respond quickly when an abnormality occurs, reduce the yield loss and equipment maintenance costs caused by abnormal edge morphology, and significantly reduce the economic losses in the production process. By effectively controlling the working state of the chamfering grinding wheel and stabilizing the edge process parameters, the chamfering quality of each silicon wafer 301 can be ensured to be consistent, and the controllability and repeatability of the process can be improved.

[0057] It should be noted that each embodiment in the present application is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0058] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0059] It will be understood that when an element such as a layer, film, region, or substrate is referred to as being “on” or “under” another element, it can be “directly on” or “under” the other element or intervening elements may be present.

[0060] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0061] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A control method for edge grinding equipment, characterized in that: The method comprises: During the edge grinding process of the silicon wafer, detecting whether the position of at least one grinding wheel of the edge grinding device is deviated; When the position of one or more grinding wheels deviates and the deviation duration is greater than the target duration, an alarm operation is performed.

2. The control method of edge grinding equipment according to claim 1, characterized in that: The executing alarm operation includes: An alarm operation is performed for a target grinding wheel, wherein the target grinding wheel includes: one or more grinding wheels having a position deviation and the deviation duration is greater than the target duration.

3. The control method of edge grinding equipment according to claim 2, characterized in that: The method further comprises: In the case where the alarm operation has been executed, after the edge grinding process of the silicon wafer is completed, the edge grinding device is controlled to stop the operation.

4. The control method of edge grinding equipment according to claim 3, characterized in that: After controlling the edge grinding device to stop operating, the method further includes: reinstalling the target grinding wheel; Detect whether the position of the reinstalled target grinding wheel is deviated.

5. The control method of edge grinding equipment according to claim 1, characterized in that: The target time is a preset edge grinding time of a silicon wafer.

6. An edge grinding device, characterized in that: The edge grinding device comprises: at least one grinding wheel; The control module is used to perform an alarm operation when it is detected that the position of one or more grinding wheels deviates during the edge grinding process of the silicon wafer and the deviation duration is greater than the target duration.

7. The edge grinding device according to claim 6, characterized in that: The edge grinding device also includes: Position sensor, each grinding wheel corresponds to at least one position sensor; The control module detects whether the position of the grinding wheel is deviated in the following manner: when one or more position sensors corresponding to the grinding wheel output a position deviation signal, it is determined that the position of the grinding wheel is deviated.

8. The edge grinding device according to claim 7, characterized in that: The height of the position sensor is lower than the height of the lower surface of the corresponding grinding wheel, and the distance between the position sensor and the preset rotation axis of the corresponding grinding wheel is greater than the radius of the grinding wheel.

9. The edge grinding device according to claim 8, characterized in that: Each grinding wheel corresponds to a plurality of position sensors, and the heights of the plurality of position sensors corresponding to the same grinding wheel are the same; and / or the distances between the plurality of position sensors corresponding to the same grinding wheel and the preset rotation axis of the corresponding grinding wheel are the same.

10. The edge grinding device according to claim 6, characterized in that: The at least one grinding wheel includes one or more of a peripheral rough grinding wheel, a peripheral fine grinding wheel, a groove fine grinding wheel, and a groove rough grinding wheel.

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