Method for testing bonding strength between plastic package body of plastic package product and substrate or chip

Abstract

The invention relates to the technical field of plastic package product performance detection, in particular to a method for testing the bonding strength between a plastic package body and a substrate or a chip of a plastic package product, which comprises the following steps: S1, taking a cut single product, and ablating the product by using a laser ablation method, so that the edge between the plastic package body and the substrate or the chip is exposed; the perimeters C of the ablated plastic package bodies in various shapes are set to be consistent after the ablated plastic package bodies are ablated; s2, cooling the ablated product, and carrying out shear force test on the cooled product on a force tester; s3, recording the force value data F of the shearing force, and calculating the bonding force P between the plastic package body and the substrate or the chip; the bonding force calculation formula is P bonding force = F force / S post-ablation plastic package body; and S4, comparing the P bonding forces of the ablated plastic package bodies with different shapes, and taking out a final bonding strength value. According to the scheme, the bonding strength between the product chip or the substrate material and the plastic package body can be measured without depending on a mold.

Description

Technical Field

[0001] The present invention relates to the technical field of performance testing of plastic-sealed products, and specifically provides a method for testing the bonding strength between a plastic-sealed body and a substrate or a chip of a plastic-sealed product. Background Art

[0002] The use of plastic encapsulation materials needs to consider whether the adhesion between the plastic encapsulation materials and the substrate material or the chip material after curing meets the requirements of product reliability, so as to prevent stress stratification and other phenomena due to weak adhesion during the later operation or use of the product, and to prevent the heat dissipation structure from being destroyed due to the adhesion strength between the plastic encapsulation materials and the substrate or chip not meeting the requirements. In the production process of plastic encapsulation products, in order to avoid stratification between the plastic encapsulation materials and the substrate, it is necessary to test the bonding strength between the plastic encapsulation body and the substrate or chip of the plastic encapsulation product.

[0003] At present, the industry usually uses molds to test the adhesion between the plastic package and the substrate or chip. The adhesion between the plastic package and the substrate or chip is tested by the mold molding method, that is, the plastic package is heated and cured on the chip or substrate with a cylindrical mold. Taking the frame material as an example, the mold is placed on the frame to add the plastic package and then solidify it, and then the force tester is used to perform a strong cut test. This test method has the following problems: 1. This method is often very dependent on the mold, and different frame materials have inconsistent contact areas, which may cause large deviations in the results due to the inconsistency of the materials; 2. The packaging manufacturer should start with the actual product and then test the adhesion between the plastic package and the contact material. This method is not suitable for packaging manufacturers; 3. The adhesion of different shapes of molds is different. At the same time, due to the differences in the substrate materials, the adhesion between the plastic package mold and different parts of the substrate material is also different, which will lead to low accuracy of the test results; 4. The test method using the mold is cumbersome and complicated, and there is a difference with the actual test value.

[0004] Therefore, in order to avoid the above problems, how to design a bonding strength test method between a plastic package and a substrate or chip that does not rely on a mold, so as to truly and effectively measure the bonding strength between the product chip or substrate material and the plastic package, is an issue that needs to be solved urgently. Summary of the invention

[0005] In order to solve the above problems, the present invention provides a method for testing the bonding strength between a plastic package body and a substrate or chip of a plastic package product, which can truly and effectively measure the bonding strength between the product chip or substrate material and the plastic package body, and can assist engineers in understanding the bonding strength of the product, and further study methods and technologies for improving product reliability.

[0006] The present invention provides a method for testing the bonding strength between a plastic package body and a substrate or a chip of a plastic package product, comprising the following steps:

[0007] S1: Take the cut single product and use laser ablation to ablate the product so that the edge between the plastic package and the substrate or chip is exposed; the perimeter C of the plastic package of various shapes after ablation is 烧蚀后塑封体 Set to consistent;

[0008] S2: After the ablated product is cooled, it is placed on a force tester for shear force testing;

[0009] S3: Record the shear force data F 力 , calculate the adhesion force P between the plastic package and the substrate or chip 粘接力 ;

[0010] The formula for calculating the bonding strength is: 粘接力 =F 力 / S 烧蚀后塑封体 ;

[0011] S4: The P of the plastic package with different shapes after ablation 粘接力 Compare and obtain the final bonding strength value.

[0012] Furthermore, when the ablation operation is performed in S1, the peripheral edge of the connection part between the plastic package and the substrate or chip is ablated; before starting the ablation operation on the plastic package, the power and time parameters of the laser need to be adjusted first, and the parameter adjustment standard is: the plastic package can be ablated until the peripheral edge can expose the substrate material or chip.

[0013] Furthermore, let the area of ​​the plastic package before ablation be S 烧蚀前塑封体 , the area coefficient of the plastic-encapsulated body of different shapes after ablation is k, then the area ratio of the plastic-encapsulated body after ablation is S 烧蚀后塑封体 =kS 烧蚀前塑封体 ; C of plastic package with different shapes after ablation in S1 烧蚀后塑封体 Introducing S 烧蚀后塑封体 Perform calculations.

[0014] Furthermore, when the shear force test is performed on the ablated product in S2, the shear height and shear rate are set before the test, and the chopper is placed in the middle of a shear edge of a plastic package body of a corresponding shape; the test is performed in the direction opposite to the shear edge where the chopper is placed; during the test, the shear height h of the plastic packages of different shapes after ablation is kept consistent.

[0015] Further, the plastic package of the single product after cutting is ablated into a square; the k value interval is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the perimeter of the plastic package C = k1S 烧蚀前塑封体 ;

[0016] When the product is placed on the force tester for shear force test, any side of the square plastic package body after ablation is taken for shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0017] Adhesion strength P of the square plastic package after ablation 正方形粘接力 =F 正方形力 / k1S 烧蚀前塑封 body.

[0018] Further, the plastic package of the single product after cutting is ablated into a circle; the k value interval is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 ;

[0019] Calculate the area of ​​the circular plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ;

[0020] When the product is placed on a force tester for shear force testing, the middle contact part of the circular plastic package body after ablation that is tangent to the circle is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0021] The bonding strength P of the circular plastic package after ablation 圆形粘接力 =(64πF 圆形力 ) / (k1 2 S 2 ), where S is S 烧蚀前塑封体 .

[0022] Furthermore, the plastic package of the single product after cutting is ablated into an equilateral triangle, the k value interval is set to 0.4-0.9, and a certain k1 value is selected. Then, after the ablation is completed, the perimeter of the plastic package C = k1S 烧蚀前塑封体 ;

[0023] Calculate the area of ​​the plastic package as an equilateral triangle The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ;

[0024] When the product is placed on the force tester for shear force test, any side of the equilateral triangle of the plastic package body after ablation is taken to the opposite direction for shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0025] The bonding strength of the plastic package body with an equilateral triangle after ablation Where S is S 烧蚀前塑封体 .

[0026] Furthermore, the plastic package of the cut single product is ablated into a rhombus, the k value interval is set to 0.4-0.9, and a certain k1 value is selected. Then, after the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 ;

[0027] Calculate the area of ​​the diamond-shaped plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ;

[0028] When the product is placed on the force tester for shear force test, take any side of the diamond-shaped plastic package after ablation and test the shear force in the opposite direction; the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0029] The bonding strength of the diamond-shaped plastic package after ablation Where S is S 烧蚀前塑封体 .

[0030] Furthermore, the plastic package of the single product after cutting is ablated into an isosceles trapezoid, the k value interval is set to 0.4-0.9, and a certain k1 value is selected. Then, after the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 ;

[0031] Calculate the area of ​​the plastic package as an isosceles trapezoid The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ;

[0032] When the product is placed on a force tester for shear force testing, the middle contact part of the plastic package body that is an isosceles trapezoid after ablation and tangent to the isosceles trapezoid is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0033] The bonding strength of the plastic package body with an isosceles trapezoid after ablation Where S is S 烧蚀前塑封体 .

[0034] Furthermore, after the test data of the plastic-encapsulated bodies of various shapes after ablation are calculated, multiple strength tests need to be performed on the plastic-encapsulated bodies of various shapes; in S4, the final bonding strength value is obtained by the following method:

[0035] For a single shape P 粘接力 The value of:

[0036] Case 1: If P under a single shape 粘接力 The deviation is within 3%, and the average value is taken as the final bonding strength under this shape;

[0037] Case 2: If P under a single shape 粘接力 If the deviation is greater than 3% and less than 10%, re-test 2-3 groups;

[0038] If the error between the post-test data and the initial data remains within 3%, the average value is taken as the final bonding strength under this shape;

[0039] If the error between the post-test data and the initial data is still greater than 3%, continue to perform 4-5 more tests;

[0040] If more than 70% of the data deviations are less than 3% after the test, the average value of the data is taken as the final bonding strength under the shape, otherwise all the tests are repeated;

[0041] Case 3: If P under a single shape 粘接力 If the deviation of the test data is greater than 10% and the number of deviations is less than 15%, re-test 3-5 groups of tests and then proceed according to situation 2;

[0042] Case 4: If P under a single shape 粘接力 If the deviation of the test data is greater than 10%, and the number of deviations is greater than 15%, all data will be retested until they are stable;

[0043] For the overall P between the plastic package and the chip or substrate 粘接力 The value of:

[0044] Case 5: If the average bonding strength deviation under different shapes is within 3%, the average value is taken as the final bonding strength of the plastic package;

[0045] Case 6: If the bond strength deviation under three or fewer shapes is greater than 3%, proceed as in Case 2;

[0046] Case 7: If the bond strength deviation under more than three shapes is greater than 3%, all of them shall be retested.

[0047] Compared with the prior art, the present invention can achieve the following beneficial effects: the testing method in the present invention is designed from the perspective of actual plastic package products, which can avoid the problem of excessive test deviation caused by differences in the unevenness or shape of the substrate material, and can truly and effectively measure the bonding strength between the product chip or substrate material and the plastic package, which can assist engineers in understanding the bonding strength of the product and further study methods and technologies for improving product reliability, and can be applicable to various packaging manufacturers with strong versatility. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 is a schematic diagram of a force test of a plastic package body ablated into a square according to an embodiment of the present invention;

[0049] Figure 2 is a schematic diagram of a force test of a plastic package body ablated into a circular shape according to an embodiment of the present invention;

[0050] Figure 3 is a schematic diagram of a force test of a plastic package body ablated into an equilateral triangle according to an embodiment of the present invention;

[0051] Figure 4 is a schematic diagram of a force test of a plastic package body ablated into a diamond shape provided by an embodiment of the present invention;

[0052] Figure 5 It is a schematic diagram of force testing of a plastic package body ablated into an isosceles trapezoid according to an embodiment of the present invention. DETAILED DESCRIPTION

[0053] In the following, reference will be made to the Figure 1-5 Embodiments of the present invention are described. In the following description, the same modules are represented by the same reference numerals. In the case of the same reference numerals, their names and functions are also the same. Therefore, the detailed description thereof will not be repeated.

[0054] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the following Figure 1-5 The present invention is further described in detail with reference to the specific embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings, K1 represents a substrate or chip, K2 represents a plastic package after ablation, and K3 represents a splitter during force testing.

[0055] A method for testing the bonding strength between a plastic package body and a substrate or a chip of a plastic package product comprises the following steps:

[0056] S1: Take the cut single product, such as QFN, and use laser ablation to ablate the product so that the edge between the plastic package and the substrate or chip is exposed. When ablation is performed, the peripheral edge of the connection between the plastic package and the substrate or chip is ablated. Before starting the ablation operation on the plastic package, the power and time parameters of the laser must be adjusted. The parameter adjustment standard is: the plastic package can be ablated until the peripheral edge can expose the substrate material or chip.

[0057] The perimeter C of the plastic package of various shapes after ablation 烧蚀后塑封体 If it is set to be consistent, the area value of the shape to be ablated can be calculated, so that the ablation area can be determined, which is convenient for subsequent ablation of different shapes. That is, it is necessary to ablate multiple plastic sealing bodies of different shapes, and perform shear force tests on the plastic sealing bodies of different shapes. The ablated plastic sealing bodies of different shapes need to maintain the perimeter C 烧蚀后塑封体 Assume that the area of ​​the plastic package before ablation is S 烧蚀前塑封体 , the area coefficient of the plastic-encapsulated body of different shapes after ablation is k, then the area ratio of the plastic-encapsulated body after ablation is S 烧蚀后塑封体 =kS 烧蚀前塑封体 ; C of plastic package with different shapes after ablation in S1 烧蚀后塑封体 Introducing S 烧蚀后塑封体 Perform calculations.

[0058] S2: After the ablated product is cooled, it is placed on a force tester for shear force testing. When performing the shear force test, the shear height and shear rate are set before the test. The splitter is placed in the middle of a shear edge of the corresponding shape of the plastic package. During the test, the test is performed in the direction opposite to the shear edge where the splitter is placed. During the test, the shear height h of the plastic package of different shapes after ablation is kept consistent.

[0059] S3: Record the shear force data F 力 , calculate the adhesion force P between the plastic package and the substrate or chip 粘接力 ; The formula for calculating the bonding strength is, P 粘接力 =F 力 / S 烧蚀后塑封体 .

[0060] S4: The P of the plastic package with different shapes after ablation 粘接力 After the test data of the plastic package of each shape after ablation is calculated, it is necessary to perform multiple strength tests on the plastic package of each shape. The final bonding strength value is obtained by the following method:

[0061] For a single shape P 粘接力 The value of:

[0062] Case 1: If P under a single shape 粘接力The deviation is within 3%, and the average value is taken as the final bonding strength under this shape;

[0063] Case 2: If P under a single shape 粘接力 If the deviation is greater than 3% and less than 10%, re-test 2-3 groups;

[0064] If the error between the post-test data and the initial data remains within 3%, the average value is taken as the final bonding strength under this shape;

[0065] If the error between the post-test data and the initial data is still greater than 3%, continue to perform 4-5 more tests;

[0066] If more than 70% of the data deviations are less than 3% after the test, the average value of the data is taken as the final bonding strength under the shape, otherwise all the tests are repeated;

[0067] Case 3: If P under a single shape 粘接力 If the deviation of the test data is greater than 10% and the number of deviations is less than 15%, re-test 3-5 groups of tests and then proceed according to situation 2;

[0068] Case 4: If P under a single shape 粘接力 If the deviation of the test data is greater than 10%, and the number of deviations is greater than 15%, all data will be retested until they are stable;

[0069] For the overall P between the plastic package and the chip or substrate 粘接力 The value of:

[0070] Case 5: If the average bonding strength deviation under different shapes is within 3%, the average value is taken as the final bonding strength of the plastic package;

[0071] Case 6: If the bond strength deviation under three or fewer shapes is greater than 3%, proceed as in Case 2;

[0072] Case 7: If the bond strength deviation under more than three shapes is greater than 3%, all of them shall be retested.

[0073] In this embodiment, a total of five plastic-encapsulated body areas after ablation were selected for testing, wherein the perimeter of the square was used as a reference, and the perimeters of the other four shapes were all set to be consistent with the perimeter of the square. Those skilled in the art may also select more or fewer plastic-encapsulated body areas after ablation for testing according to actual conditions, or may use the perimeter of a plastic-encapsulated body of a shape other than the square as a reference for measurement. 粘接力 The calculation method is as follows:

[0074] like Figure 1 As shown in the figure, when the shape of the plastic package after ablation is a cube:

[0075] The plastic package of the cut single product is ablated into a square; the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the perimeter of the plastic package C = k1S 烧蚀前塑封体 .

[0076] When the product is placed on a force tester for a shear force test, any side of the square plastic package body after ablation is taken for a shear force test; wherein, the shear height h is 0.1h-0.6h, where 0.1h-0.6h means that the height of the contact between the chopper and the plastic package body during shearing is 0.1-0.6 times the overall height of the plastic package body, and the shear rate is 0.01-1.0m / s.

[0077] Adhesion strength P of the square plastic package after ablation 正方形粘接力 =F 正方形力 / k1S 烧蚀前塑封 body.

[0078] like Figure 2 As shown in the figure, when the shape of the plastic package after ablation is circular:

[0079] The plastic package of the single product after cutting is ablated into a circle; the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package is C = k1S 烧蚀前塑封体 .

[0080] Calculate the area of ​​the circular plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 .

[0081] When the product is placed on a force tester for shear force testing, the middle contact portion of the circular plastic package body after ablation that is tangent to the circle is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s.

[0082] The bonding strength P of the circular plastic package after ablation 圆形粘接力 =(64πF 圆形力 ) / (k1 2 S 2 ), where S is S 烧蚀前塑封体 .

[0083] like Figure 3 As shown in the figure, when the shape of the plastic package after ablation is an equilateral triangle:

[0084] The plastic package of the single product after cutting is ablated into an equilateral triangle, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the perimeter of the plastic package C = k1S烧蚀前塑封体 .

[0085] Calculate the area of ​​the plastic package as an equilateral triangle The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 .

[0086] When the product is placed on a force tester for a shear force test, any side of the equilateral triangle in the plastic package body that is an equilateral triangle after ablation is taken in the opposite direction for a shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s.

[0087] The bonding strength of the plastic package body with an equilateral triangle after ablation Where S is S 烧蚀前塑封体 .

[0088] like Figure 4 As shown in the figure, when the shape of the plastic package after ablation is a rhombus:

[0089] The plastic package of the single product after cutting is ablated into a rhombus, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封 body.

[0090] Calculate the area of ​​the diamond-shaped plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; Here, when calculating the area of ​​the rhombus-shaped plastic package, the angles between two adjacent sides of the rhombus are set to 60° and 120° respectively.

[0091] When the product is placed on a force tester for a shear force test, any side of the diamond-shaped plastic package after ablation is taken in the opposite direction for a shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s.

[0092] The bonding strength of the diamond-shaped plastic package after ablation Where S is S 烧蚀前塑封体 .

[0093] like Figure 5 As shown in the figure, when the shape of the plastic package after ablation is an isosceles trapezoid:

[0094] The plastic package of the single product after cutting is ablated into an isosceles trapezoid, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 .

[0095] Calculate the area of ​​the plastic package as an isosceles trapezoid The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; Here, when calculating the area of ​​the plastic package body which is an isosceles trapezoid, the angles between the two sides of the isosceles trapezoid are set to 60° and 120° respectively.

[0096] When the product is placed on a force tester for shear force testing, the middle contact part of the plastic package body that is an isosceles trapezoid after ablation and tangent to the isosceles trapezoid is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s;

[0097] The bonding strength of the plastic package body with an isosceles trapezoid after ablation Where S is S 烧蚀前塑封体 .

[0098] After the five types of plastic package areas are tested after ablation, the P under the final single shape needs to be specifically taken out according to the method in S4 above. 粘接力 The final value of the overall bonding strength of the plastic package is obtained.

[0099] Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and cannot be understood as limiting the present invention. Those skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

[0100] The above specific implementations of the present invention do not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A method for testing the bonding strength between a plastic package body and a substrate or a chip of a plastic package product, characterized in that: The steps include: S1: Take the cut single product and use laser ablation to ablate the product so that the edge between the plastic package and the substrate or chip is exposed; the perimeter C of the plastic package of various shapes after ablation is 烧蚀后塑封体 Set to consistent; S2: After the ablated product is cooled, it is placed on a force tester for shear force testing; S3: Record the shear force data F 力 , calculate the adhesion force P between the plastic package and the substrate or chip 粘接力 ; The formula for calculating the bonding strength is: 粘接力 =F 力 / S 烧蚀后塑封体 ; S4: The P of the plastic package with different shapes after ablation 粘接力 Compare and obtain the final bonding strength value.

2. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 1, characterized in that: When the ablation operation is performed in S1, the peripheral edge of the connection part between the plastic package and the substrate or chip is ablated; before starting the ablation operation on the plastic package, the power and time parameters of the laser need to be adjusted first, and the parameter adjustment standard is: the plastic package can be ablated until the peripheral edge can expose the substrate material or chip.

3. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 2, characterized in that: Assume the area of ​​the plastic package before ablation is S 烧蚀前塑封体 , the area coefficient of the plastic-encapsulated body of different shapes after ablation is k, then the area ratio of the plastic-encapsulated body after ablation is S 烧蚀后塑封体 =kS 烧蚀前塑封体 ; C of plastic package with different shapes after ablation in S1 烧蚀后塑封体 Introducing S 烧蚀后塑封体 Perform calculations.

4. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 3, characterized in that: When the shear force test is performed on the ablated product in S2, the shear height and shear rate are set before the test, and the splitter is placed in the middle of a shear edge of the plastic package body of the corresponding shape; the test is performed in the direction opposite to the shear edge where the splitter is placed; during the test, the shear height h of the plastic package bodies of different shapes after ablation is kept consistent.

5. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 4, characterized in that: The plastic package of the cut single product is ablated into a square; the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the perimeter of the plastic package C = k1S 烧蚀前塑封体 ; When the product is placed on the force tester for shear force test, any side of the square plastic package body after ablation is taken for shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s; Adhesion strength P of the square plastic package after ablation 正方形粘接力 =F 正方形力 / k1S 烧蚀前塑封体 .

6. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 5, characterized in that: The plastic package of the single product after cutting is ablated into a circle; the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package is C = k1S 烧蚀前塑封体 ; Calculate the area of ​​the circular plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; When the product is placed on a force tester for shear force testing, the middle contact part of the circular plastic package body after ablation that is tangent to the circle is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s; The bonding strength P of the circular plastic package after ablation 圆形粘接力 =(64πF 圆形力 ) / (k1 2 S 2 ), where S is S 烧蚀前塑封体 .

7. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 6, characterized in that: The plastic package of the single product after cutting is ablated into an equilateral triangle, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the perimeter of the plastic package C = k1S 烧蚀前塑封体 ; Calculate the area of ​​the plastic package as an equilateral triangle The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; When the product is placed on the force tester for shear force test, any side of the equilateral triangle of the plastic package body after ablation is taken to the opposite direction for shear force test; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s; The bonding strength of the plastic package body with an equilateral triangle after ablation Where S is S 烧蚀前塑封体 .

8. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 7, characterized in that: The plastic package of the single product after cutting is ablated into a rhombus, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 ; Calculate the area of ​​the diamond-shaped plastic package The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; When the product is placed on the force tester for shear force test, take any side of the diamond-shaped plastic package after ablation and test the shear force in the opposite direction; the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s; The bonding strength of the diamond-shaped plastic package after ablation Where S is S 烧蚀前塑封体 .

9. The method for testing the bonding strength between the plastic package body and the substrate or chip of the plastic package product according to claim 8, characterized in that: The plastic package of the single product after cutting is ablated into an isosceles trapezoid, the k value range is set to 0.4-0.9, and a certain k1 value is selected. After the ablation is completed, the circumference of the plastic package C = k1S 烧蚀前塑封体 ; Calculate the area of ​​the plastic package as an isosceles trapezoid The area of ​​the edge plastic seal that needs to be ablated is in, The S in is S 烧蚀前塑封体 ; When the product is placed on a force tester for shear force testing, the middle contact part of the plastic package body that is an isosceles trapezoid after ablation and tangent to the isosceles trapezoid is taken for shear force testing; wherein, the shear height h is 0.1h-0.6h, and the shear rate is 0.01-1.0m / s; The bonding strength of the plastic package body with an isosceles trapezoid after ablation Where S is S 烧蚀前塑封体 .

10. The method for testing the bonding strength between a plastic package body and a substrate or a chip of a plastic package product according to any one of claims 1 to 9, characterized in that: After the test data of the plastic-encapsulated bodies of various shapes after ablation are calculated, multiple strength tests need to be performed on the plastic-encapsulated bodies of various shapes; the final bonding strength value is obtained in S4 by the following method: For a single shape P 粘接力 The value of: Case 1: If P under a single shape 粘接力 The deviation is within 3%, and the average value is taken as the final bonding strength under this shape; Case 2: If P under a single shape 粘接力 If the deviation is greater than 3% and less than 10%, re-test 2-3 groups; If the error between the post-test data and the initial data remains within 3%, the average value is taken as the final bonding strength under this shape; If the error between the post-test data and the initial data is still greater than 3%, continue to perform 4-5 more tests; If more than 70% of the data deviations are less than 3% after the test, the average value of the data is taken as the final bonding strength under the shape, otherwise all the tests are repeated; Case 3: If P under a single shape 粘接力 If the deviation of the test data is greater than 10% and the number of deviations is less than 15%, re-test 3-5 groups of tests and then proceed according to situation 2; Case 4: If P under a single shape 粘接力 If the deviation of the test data is greater than 10%, and the number of deviations is greater than 15%, all data will be retested until they are stable; For the overall P between the plastic package and the chip or substrate 粘接力 The value of: Case 5: If the average bonding strength deviation under different shapes is within 3%, the average value is taken as the final bonding strength of the plastic package; Case 6: If the bond strength deviation under three or fewer shapes is greater than 3%, proceed as in Case 2; Case 7: If the bond strength deviation under more than three shapes is greater than 3%, all of them shall be retested.

Images