Display panel and display device

Abstract

The present application discloses a display panel and a display device. The display panel's display area is sequentially stacked with a substrate, a first encapsulation segment, a black matrix layer with an opening, and a color filter layer located within the opening. The display panel's encapsulation segment is sequentially stacked with a substrate, a second encapsulation segment, and a filling portion. The filling portion includes a portion of at least one of the black matrix layer and the color filter layer located within the encapsulation segment. In a direction perpendicular to the plane of the substrate, the distance from the second encapsulation segment to the substrate, which is distal to the substrate, is less than the distance from the first encapsulation segment to the substrate, which is distal to the substrate. The present application reduces the step difference between the display area and the opening area due to terrain elevation without requiring an additional process for filling the opening area. This can reduce the production cost of the display panel and increase production capacity.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] To achieve a full-screen design, a hole is opened in the display area of ​​the display panel to form an O-CUT area, where the front camera is installed. In the manufacturing process of traditional display panels, since the thin-film transistor device layer, pixel definition layer, and light-emitting device are not installed in the O-CUT area, the terrain of the O-CUT area is lower than that of the display area. When other film layers are subsequently attached, the step difference formed by the high and low terrain can cause bubbles or stress concentration in the film layer above the O-CUT area, causing the film layer above the O-CUT area to crack.

[0003] To prevent the impact of the low terrain in the aperture area on subsequent manufacturing steps of traditional display panels, an additional process for filling the aperture area is added to the manufacturing process to reduce the step difference between the aperture area and the display area caused by the uneven terrain. However, this additional process increases the production cost of the display panel and affects production capacity.

[0004] Therefore, it is necessary to propose a new technical solution to solve the above technical problems. Summary of the Invention

[0005] The purpose of the present application is to provide a display panel and a display device, which can reduce the step difference between the display area and the opening area due to the high and low terrain, while eliminating the need for an additional process of filling the opening area, thereby reducing the production cost of the display panel and improving production capacity.

[0006] To solve the above problems, the technical solutions of this application are as follows:

[0007] In a first aspect, the present application provides a display panel, comprising a non-display area and a display area located outside the non-display area, wherein the non-display area includes an encapsulation area and an aperture area, wherein the encapsulation area is located between the display area and the aperture area, and the display panel comprises:

[0008] substrate;

[0009] an encapsulation layer, comprising a first encapsulation segment and a second encapsulation segment connected to each other, wherein the first encapsulation segment is located in the display area, and the second encapsulation segment is located in the encapsulation area, and in a direction perpendicular to a plane where the substrate is located, a distance from a side of the second encapsulation segment away from the substrate to the substrate is smaller than a distance from a side of the first encapsulation segment away from the substrate to the substrate;

[0010] a black matrix layer, at least a portion of the black matrix layer being located in the display area, the portion of the black matrix layer being located in the display area being disposed on a side of the first packaging segment away from the substrate, and the portion of the black matrix layer being located in the display area being provided with a plurality of openings;

[0011] a color filter layer, at least a portion of the color filter layer being located in the display area, and at least a portion of the color filter layer being located in the display area being disposed within the opening; and

[0012] a filling portion, located in the packaging area, and arranged on a side of the second packaging section away from the substrate;

[0013] Wherein, the filling portion includes at least one of the black matrix layer and the color filter layer;

[0014] In a direction perpendicular to a plane of the substrate, a distance from a side of the filling portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

[0015] In one embodiment of the present application, the black matrix layer includes:

[0016] a first black sub-portion, located in the display area and disposed on a side of the first packaging segment away from the substrate, the first black sub-portion being provided with a plurality of the openings; and

[0017] a second black sub-portion, located in the packaging area and disposed on a side of the second packaging section away from the substrate, the second black sub-portion being made of the same material as the first black sub-portion;

[0018] Wherein, the filling portion includes the second black sub-portion;

[0019] In a direction perpendicular to the plane of the substrate, a distance from the second black sub-portion away from the substrate to the substrate is less than or equal to a distance from the first packaging segment away from the substrate to the substrate.

[0020] In one embodiment of the present application, the first black sub-portion is connected to the second black sub-portion, and the thickness of the second black sub-portion is greater than the thickness of the first black sub-portion.

[0021] In one embodiment of the present application, the color filter layer includes:

[0022] a first sub-section located in the display area and disposed in the opening, wherein the first sub-section is one of a red filter block, a blue filter block, and a green filter block; and

[0023] A second sub-section is located in the packaging area and is provided on a side of the second black sub-section away from the substrate, wherein the material of the second sub-section includes the material of at least one of the red filter block, the blue filter block, and the green filter block;

[0024] Wherein, the filling portion further includes a second sub-portion;

[0025] In a direction perpendicular to the plane of the substrate, a distance from a side of the second sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

[0026] In one embodiment of the present application, the second sub-unit includes:

[0027] a first sub-layer, provided on a side of the second black sub-portion away from the substrate, wherein a material of one of the red filter block, the blue filter block, and the green filter block is the same as that of the first sub-layer; and

[0028] A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as that of the second sub-layer;

[0029] wherein the material of the first sub-layer is different from the material of the second sub-layer;

[0030] In a direction perpendicular to the plane of the substrate, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0031] In one embodiment of the present application, the second sub-section further includes a third sub-layer, which is provided on a side of the second sub-layer away from the substrate, and the material of the third sub-layer is the same as the material of the other one of the red filter block, the blue filter block, and the green filter block;

[0032] The material of the first sub-layer, the material of the second sub-layer and the material of the third sub-layer are all different;

[0033] In a direction perpendicular to the plane of the substrate, a distance from a side of the third sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0034] In one embodiment of the present application, the thickness of the second sub-portion is greater than the thickness of the second black sub-portion.

[0035] In one embodiment of the present application, the display panel further includes a planarization layer, and the planarization layer includes:

[0036] a first flat portion, located in the display area, and disposed on the first black sub-portion and a side of the first sub-portion away from the substrate; and

[0037] a second flat portion, located in the packaging area and provided on a side of the second sub-portion away from the substrate, wherein the material of the second flat portion is the same as that of the first flat portion;

[0038] Wherein, in a direction perpendicular to the plane of the substrate, a distance from a side of the second flat portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

[0039] In one embodiment of the present application, the second flat portion is connected to the first flat portion, and a thickness of the second flat portion is greater than a thickness of the first flat portion.

[0040] In one embodiment of the present application, the color filter layer includes:

[0041] a first sub-section located in the display area and disposed in the opening, wherein the first sub-section is one of a red filter block, a blue filter block, and a green filter block; and

[0042] a second sub-section, located in the packaging area and disposed on a side of the second packaging section away from the substrate;

[0043] Wherein, the second sub-unit includes:

[0044] a first sub-layer, provided on a side of the second packaging segment away from the substrate, wherein a material of one of the red filter block, the blue filter block, and the green filter block is the same as that of the first sub-layer; and

[0045] A second sub-layer is provided on a side of the first sub-layer away from the substrate, and the material of the other one of the red filter block, the blue filter block, and the green filter block is the same as that of the second sub-layer;

[0046] Wherein, the material of the first sub-layer is different from the material of the second sub-layer, and the filling portion further includes a second sub-portion;

[0047] In a direction perpendicular to the plane of the substrate, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

[0048] In one embodiment of the present application, the display panel further includes:

[0049] a thin film transistor device layer, disposed on one side of the substrate, at least a portion of the thin film transistor device layer being located in the display area; and

[0050] A plurality of light-emitting devices are provided on a side of the thin film transistor device layer away from the substrate and located in the display area;

[0051] The encapsulation layer includes:

[0052] a first inorganic encapsulation layer, disposed on one side of the substrate, wherein a portion of the first inorganic encapsulation layer located in the display area covers the light-emitting device and the thin film transistor device layer, and a portion of the first inorganic encapsulation layer located in the encapsulation area covers the substrate;

[0053] an organic encapsulation layer, located in the display area and disposed on a side of the first inorganic encapsulation layer away from the substrate; and

[0054] a second inorganic encapsulation layer, wherein a portion of the second inorganic encapsulation layer located in the display area covers the organic encapsulation layer, a portion of the second inorganic encapsulation layer located in the encapsulation area covers a portion of the first inorganic encapsulation layer located in the encapsulation area, and the second inorganic encapsulation layer separates the filling portion and the organic encapsulation layer;

[0055] The portion of the first inorganic encapsulation layer located in the display area, the organic encapsulation layer, and the portion of the second inorganic encapsulation layer located in the display area form the first encapsulation segment;

[0056] The portion of the first inorganic encapsulation layer located in the encapsulation area and the portion of the second inorganic encapsulation layer located in the encapsulation area form the second encapsulation segment;

[0057] In a direction perpendicular to the plane of the substrate, the distance from the side of the second inorganic encapsulation layer located in the encapsulation area away from the substrate to the substrate is less than the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate to the substrate; the distance from the side of the filling portion away from the substrate to the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate to the substrate.

[0058] In the second aspect, the present application proposes a display device, including a display panel, wherein the display panel includes a non-display area and a display area located outside the non-display area, the non-display area includes a packaging area and an opening area, and the packaging area is located between the display area and the opening area. The display panel also includes a substrate, a thin film transistor device layer, a plurality of light-emitting devices, an packaging layer, a black matrix layer, a color filter layer and a filling portion. The thin film transistor device layer is arranged on one side of the substrate, and at least part of the thin film transistor device layer is located in the display area; a plurality of light-emitting devices are arranged on a side of the thin film transistor device layer away from the substrate and are located in the display area; the packaging layer includes a first packaging segment and a second packaging segment connected to each other, the first packaging segment is located in the display area, the first packaging segment covers the light-emitting device and the thin film transistor device layer, the second packaging segment is located in the packaging area, the second packaging segment covers the substrate, and in a direction perpendicular to the plane of the substrate, the second packaging segment is away from the The distance from one side of the substrate to the substrate is smaller than the distance from the side of the first packaging segment away from the substrate to the substrate; at least a portion of the black matrix layer is located in the display area, and the portion of the black matrix layer located in the display area is provided on the side of the first packaging segment away from the substrate, and the portion of the black matrix layer located in the display area is provided with a plurality of openings; at least a portion of the color filter layer is located in the display area, and at least a portion of the color filter layer located in the display area is provided in the opening; at least a portion of the filling portion is located in the packaging area, and the filling portion located in the packaging area is provided on the side of the second packaging segment away from the substrate; the filling portion includes a portion of at least one of the black matrix layer and the color filter layer located in the packaging area; in a direction perpendicular to the plane of the substrate, the distance from the side of the filling portion away from the substrate to the substrate is smaller than or equal to the distance from the side of the first packaging segment away from the substrate to the substrate.

[0059] In the present application, the display panel includes a substrate, a thin film transistor device layer, a plurality of light emitting devices, an encapsulation layer, a black matrix layer, a color filter layer, and a filling portion. Among them, the thin film transistor device layer and the plurality of light emitting devices are only arranged in the display area, so that the terrain of the display area is too high, and the terrain of the encapsulation area and the opening area is too low. In order to reduce the step difference caused by the high and low terrain, the present application fills the material of at least one of the black matrix layer and the color filter layer into the encapsulation area and the opening area in the subsequent process of forming the black matrix layer and the color filter layer of the display panel. The material filled in the encapsulation area and the opening area forms a filling portion. The formation of the filling portion can raise the terrain of the encapsulation area and the opening area, so that the step difference caused by the high and low terrain between the encapsulation area, the opening area and the display area is reduced, thereby reducing the generation of bubbles or stress concentration in the film layer attached above the opening area. After the film layer is attached, the filling portion in the opening area will be hollowed out to install the front camera. The present application utilizes existing processes to reduce the step difference between the display area and the opening area, and does not require an additional process for filling the opening area, thereby reducing the production cost of the display panel and improving production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 is a schematic diagram of a first embodiment of a display panel of the present application;

[0061] Figure 2 is a schematic diagram of a manufacturing process of the black matrix layer of the first embodiment of the display panel of the present application;

[0062] Figure 3 is another schematic diagram of the first embodiment of the display panel of the present application;

[0063] Figure 4 is a schematic diagram of another manufacturing process of the black matrix layer of the first embodiment of the display panel of the present application;

[0064] Figure 5 is a schematic diagram of a second embodiment of a display panel of the present application;

[0065] Figure 6 is a schematic diagram of a manufacturing process of a color filter layer of a second embodiment of a display panel of the present application;

[0066] Figure 7 is a schematic diagram of a third embodiment of the display panel of the present application;

[0067] Figure 8 is a schematic diagram of a manufacturing process of a color filter layer of a display panel according to a third embodiment of the present application;

[0068] Figure 9 is a schematic diagram of a fourth embodiment of the display panel of the present application;

[0069] Figure 10is a schematic diagram of a manufacturing process of a color filter layer of a display panel according to a fourth embodiment of the present application;

[0070] Figure 11 is a schematic diagram of a fifth embodiment of the display panel of the present application;

[0071] Figure 12 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a fifth embodiment of a display panel of the present application;

[0072] Figure 13 is a schematic diagram of a sixth embodiment of the display panel of the present application;

[0073] Figure 14 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a sixth embodiment of a display panel of the present application;

[0074] Figure 15 is a schematic diagram of a seventh embodiment of the display panel of the present application;

[0075] Figure 16 is a schematic diagram of a manufacturing process of a black matrix layer and a color filter layer of a seventh embodiment of a display panel of the present application;

[0076] Figure 17 is a schematic diagram of an eighth embodiment of the display panel of the present application;

[0077] Figure 18 It is a schematic diagram of a manufacturing process of the black matrix layer, the color filter layer, and the planarization layer of the eighth embodiment of the display panel of the present application. DETAILED DESCRIPTION

[0078] The meanings of the terms used in this specification and claims correspond to those commonly understood by persons of ordinary skill in the art to which this application belongs. The terms used in this specification and claims are intended solely to facilitate the description and understanding of this application and are not intended to limit this application to the narrow interpretations of the specific terms used in the specification and claims.

[0079] This application proposes a display device, which can be a mobile phone, tablet computer, e-reader, electronic display screen, laptop computer, mobile phone, augmented reality (AR) / virtual reality (VR) device, media player, wearable device, digital camera, car navigation system, etc. The display device includes a display panel 100.

[0080] The present application proposes a display panel 100, which may be an organic light emitting diode (OLED) display panel 100. The subsequent embodiments of the present application are described using the OLED display panel 100 as an example.

[0081] See also Figure 1 In this application, the display panel 100 includes a non-display area NA and a display area AA located outside the non-display area NA. The non-display area NA includes an encapsulation area NA1 and an aperture area NA2. The encapsulation area NA1 is located between the display area AA and the aperture area NA2.

[0082] In the present application, the display panel 100 further includes a substrate 10 , a thin film transistor device layer 20 , a plurality of light emitting devices 40 , an encapsulation layer 50 , a black matrix layer 60 , a color filter layer 70 and a filling portion 80 .

[0083] Optionally, the thin film transistor device layer 20 is disposed on one side of the substrate 10 , and at least a portion of the thin film transistor device layer 20 is located in the display area AA.

[0084] Optionally, a plurality of light emitting devices 40 are disposed on a side of the thin film transistor device layer 20 away from the substrate 10 and located in the display area AA.

[0085] Optionally, the encapsulation layer 50 includes a first encapsulation segment 50a and a second encapsulation segment 50b connected to each other. The first encapsulation segment 50a is located in the display area AA and covers the light-emitting device 40 and the thin-film transistor device layer 20. The second encapsulation segment 50b is located in the encapsulation area NA1 and covers the substrate 10.

[0086] Optionally, in a direction perpendicular to the plane of the substrate 10 , a distance L0 from the side of the second packaging segment 50 b away from the substrate 10 to the substrate 10 is smaller than a distance L1 from the side of the first packaging segment 50 a away from the substrate 10 to the substrate 10 .

[0087] Optionally, at least part of the black matrix layer 60 is located in the display area AA. The portion of the black matrix layer 60 located in the display area AA is located on a side of the first encapsulation segment 50a away from the substrate 10. The portion of the black matrix layer 60 located in the display area AA has a plurality of openings.

[0088] Optionally, at least a portion of the color filter layer 70 is located in the display area AA. At least a portion of the color filter layer 70 located in the display area AA is disposed in the opening.

[0089] Optionally, at least a portion of the filling portion 80 is located in the encapsulation area NA1 . The filling portion 80 located in the encapsulation area NA1 is provided on a side of the second encapsulation section 50 b away from the substrate 10 .

[0090] Optionally, the filling portion 80 includes a portion of at least one of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1 .

[0091] Optionally, in a direction H perpendicular to the plane of the substrate 10 , a distance L2 from the side of the filling portion 80 away from the substrate 10 to the substrate 10 is less than or equal to a distance L1 from the side of the first packaging segment 50 a away from the substrate 10 to the substrate 10 .

[0092] In the present application, the display panel 100 includes a substrate 10, a thin film transistor device layer 20, a plurality of light emitting devices 40, an encapsulation layer 50, a black matrix layer 60, a color filter layer 70, and a filling portion 80. The thin film transistor device layer 20 and the plurality of light emitting devices 40 are disposed only in the display area AA, resulting in the display area AA having a high elevation and the encapsulation area NA1 and the opening area NA2 having a low elevation. To reduce the step difference caused by uneven terrain, the present application fills the material of at least one of the black matrix layer 60 and the color filter layer 70 into the encapsulation area NA1 and the aperture area NA2 during the subsequent process of forming the black matrix layer 60 and the color filter layer 70 of the display panel 100. The material filled into the encapsulation area NA1 and the aperture area NA2 forms a filling portion 80. The formation of the filling portion 80 can raise the terrain of the encapsulation area NA1 and the aperture area NA2, thereby reducing the step difference caused by the uneven terrain between the encapsulation area NA1, the aperture area NA2, and the display area AA, thereby reducing the generation of bubbles or stress concentration in the film layer attached above the aperture area NA2. After the film layer is attached, the filling portion 80 in the aperture area NA2 is hollowed out to install the front camera. The present application utilizes existing processes to reduce the step difference between the display area AA and the aperture area NA2 without adding an additional process to fill the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0093] Optionally, the substrate 10 includes a base and a buffer layer disposed on one side of the base, and the thin film transistor is disposed on a side of the buffer layer away from the base.

[0094] Optionally, the substrate is a hard substrate, and the material of the substrate is glass.

[0095] Optionally, the substrate is a flexible substrate, and the material of the substrate is polyimide. In this case, the flexible substrate can be used to manufacture the flexible display panel 100.

[0096] Optionally, the display panel 100 further includes a pixel defining layer 30, which is disposed on a side of the thin-film transistor device layer 20 away from the substrate 10. The pixel defining layer 30 has a plurality of pixel openings, each of which has a light-emitting device 40 disposed therein. An encapsulation layer 50 covers the side of the pixel defining layer 30 away from the substrate 10.

[0097] Optionally, the non-display area NA further includes a transition area NA3 located between the encapsulation area NA1 and the opening area NA2 , a portion of the thin film transistor device layer 20 is also disposed in the transition area NA3 , and a portion of the organic encapsulation layer 52 covers the transition area NA3 .

[0098] Optionally, the light emitting device 40 includes a red light emitting device 40 a , a green light emitting device 40 b and a blue light emitting device 40 c . One light emitting device 40 is disposed corresponding to one opening of the black matrix layer 60 .

[0099] Optionally, the color filter layer 70 includes a red filter block 71a, a green filter block 71b, and a blue filter block 71c. The red filter block 71a is disposed in an opening corresponding to the red light-emitting device 40a, the green filter block 71b is disposed in an opening corresponding to the green light-emitting device 40b, and the blue filter block 71c is disposed in an opening corresponding to the blue light-emitting device 40c.

[0100] Optionally, the display panel 100 further includes a first barrier wall Dam1.

[0101] Optionally, the first barrier wall Dam1 is provided on the substrate 10 and is located between the transition area NA3 and the encapsulation area NA1. The first barrier wall Dam1 is used to separate the transition area NA3 and the encapsulation area NA1 and prevent the organic encapsulation layer 52 from overflowing from the transition area NA3 to the encapsulation area NA1.

[0102] Optionally, during the manufacturing process of the display panel 100, a second retaining wall Dam2 is further provided. The second retaining wall Dam2 is provided on the substrate 10 and on the side of the first retaining wall Dam1 away from the display area AA. The second retaining wall Dam2 is used to prevent further overflow of the organic encapsulation layer 52 during the manufacturing process. A groove is formed between the first retaining wall Dam1 and the second retaining wall Dam2. The groove can be used to store organic ink that overflows from the organic encapsulation layer 52 during the manufacturing process.

[0103] Optionally, the second retaining wall Dam2 may be located within the encapsulation area NA1. The second retaining wall Dam2 may also be located between the encapsulation area NA1 and the opening area NA2. The second retaining wall Dam2 may also be located within the opening area NA2. To avoid redundancy, subsequent embodiments related to the display panel 100 manufacturing process will be described using the example of the second retaining wall Dam2 being located within the opening area NA2.

[0104] It should be noted that after the film layers are attached to the display panel 100, the film layers within the aperture area NA2 are removed by laser cutting to facilitate installation of the front-facing camera. The film layers within the aperture area NA2 include the substrate 10 located in the aperture area NA2, the second retaining wall Dam2 located in the aperture area NA2, and the filling portion 80 located in the aperture area NA2.

[0105] Optionally, the encapsulation layer 50 includes a first inorganic encapsulation layer 51 , an organic encapsulation layer 52 and a second inorganic encapsulation layer 53 .

[0106] Optionally, the first inorganic encapsulation layer 51 is provided on one side of the substrate 10. The first inorganic encapsulation layer 51 in the display area AA covers the light emitting device 40 and the thin film transistor device layer 20. The first inorganic encapsulation layer 51 in the encapsulation area NA1 covers the substrate 10.

[0107] Optionally, the organic encapsulation layer 52 is located in the display area AA and is disposed on a side of the first inorganic encapsulation layer 51 away from the substrate 10 .

[0108] Optionally, the second inorganic encapsulation layer 53 in the display area AA covers the organic encapsulation layer 52. The second inorganic encapsulation layer 53 in the encapsulation area NA1 covers the first inorganic encapsulation layer 51 in the encapsulation area NA1. The second inorganic encapsulation layer 53 separates the filling part 80 and the organic encapsulation layer 52.

[0109] Optionally, the portion of the first inorganic encapsulation layer 51 located in the display area AA, the portion of the organic encapsulation layer 52 and the portion of the second inorganic encapsulation layer 53 located in the display area AA form a first encapsulation segment 50 a .

[0110] Optionally, a portion of the first inorganic encapsulation layer 51 located in the encapsulation area NA1 and a portion of the second inorganic encapsulation layer 53 located in the encapsulation area NA1 are formed as a second encapsulation segment 50 b .

[0111] Optionally, in the direction H perpendicular to the plane of the substrate 10, the distance L0 from the side of the second inorganic encapsulation layer 53 located in the encapsulation area NA1 away from the substrate 10 to the substrate 10 is smaller than the distance L1 from the side of the second inorganic encapsulation layer 53 located in the display area AA away from the substrate 10 to the substrate 10.

[0112] Optionally, in the direction H perpendicular to the plane of the substrate 10, the distance L2 from the side of the filling portion 80 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the second inorganic encapsulation layer 53 located in the display area AA to the substrate 10 away from the substrate 10.

[0113] From the film structure of the display panel 100 , it can be seen that the topography of the display area AA and the through-hole area is mainly contributed by the organic encapsulation layer 52 , the light emitting device 40 , the pixel definition layer 30 and the thin film transistor device layer 20 .

[0114] See also Figure 1 , in the first embodiment of the present application:

[0115] Optionally, the filling portion 80 only includes a portion of the black matrix layer 60 located in the encapsulation area NA1 .

[0116] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is disposed on the side of the first encapsulation segment 50a away from the substrate 10. The first black sub-portion 61 has a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is disposed on the side of the second encapsulation segment 50b away from the substrate 10. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The filling portion 80 includes the second black sub-portion 62.

[0117] In the direction H perpendicular to the plane of the substrate 10 , the distance L2 from the second black sub-portion 62 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the first packaging segment 50 a away from the substrate 10 to the substrate 10 .

[0118] See also Figure 2 In the first embodiment, during the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2. The second black sub-portion 62 provided in the packaging area NA1 and the opening area NA2 can reduce the step difference caused by the high and low terrain of the packaging area NA1, the opening area NA2 and the display area AA, thereby reducing the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers in the opening area NA2 are hollowed out to install the front camera, forming a Figure 1 The structure of the display panel 100 is shown. The first embodiment utilizes the existing manufacturing process for the black matrix layer 60. While forming the first black sub-portion 61 in the display area AA, the second black sub-portion 62 is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the traditional manufacturing process of the display panel 100, this application does not require an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0119] In the first embodiment of the present application, the black matrix layer 60 has a light-absorbing property. In a traditional display panel, a front-facing camera is installed corresponding to the opening area NA2. Due to the design of the hole in the opening area NA2, external light irradiating the front-facing camera will be reflected from the light-emitting side of the traditional display panel, so that the position corresponding to the opening area NA2 on the light-emitting side of the traditional display panel will show a reflection of the corresponding color. In this embodiment, a second black sub-portion 62 is provided in the packaging area NA1. When external light irradiates the front-facing camera, the second black sub-portion 62 will absorb a portion of the external light; when external light is reflected from the front-facing camera back to the light-emitting side of the display panel 100, the second black sub-portion 62 will absorb a portion of the reflected light, thereby reducing or even eliminating the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0120] Optionally, the material of the black matrix layer 60 is black photoresist, which is an organic material with leveling properties.

[0121] See also Figure 3 Optionally, the first black sub-portion 61 is connected to the second black sub-portion 62 . The thickness of the second black sub-portion 62 is greater than the thickness of the first black sub-portion 61 .

[0122] See also Figure 4 In this embodiment, the first black sub-section 61 and the second black sub-section 62 are formed simultaneously in the same process, and the second black sub-section 62 is connected to the first black sub-section 61. The first black sub-section 61 is located in the display area AA with higher terrain, and the second black sub-section 62 is located in the encapsulation area NA1 with lower terrain. During the process of forming the black matrix layer 60, due to the influence of gravity and the leveling properties of the organic material, part of the material of the first black sub-section 61 will flow into the encapsulation area NA1 before curing, forming part of the second black sub-section 62. After the black matrix layer 60 is cured, the thickness of the second black sub-section 62 will be greater than that of the first black sub-section 61. Since in this embodiment, the filling portion 80 only includes the portion of the black matrix layer 60 located in the encapsulation area NA1, that is, the filling portion 80 only includes the second black sub-section 62. This embodiment increases the thickness of the second black sub-portion 62 by connecting the first black sub-portion 61 and the second black sub-portion 62, thereby increasing the thickness of the filling portion 80, so that the difference between the distance L2 from the side of the second black sub-portion 62 away from the substrate 10 to the substrate 10 and the distance L1 from the side of the first packaging segment 50a away from the substrate 10 to the substrate 10 is further reduced, thereby further reducing the step difference between the display area AA and the opening area NA2, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2, improving the yield of the display panel 100, thereby reducing production costs and improving production capacity.

[0123] See also Figure 5, in the second embodiment of the present application:

[0124] In order to avoid redundancy, the second embodiment of the present application will describe parts that are different from the first embodiment of the present application.

[0125] The second embodiment of the present application is different from the first embodiment of the present application in that:

[0126] Optionally, the filling portion 80 only includes the portion of the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a single-layer structure.

[0127] In the present application, the color filter layer 70 includes a red filter block 71a, a green filter block 71b, and a blue filter block 71c, and the red filter block 71a, the green filter block 71b, and the blue filter block 71c are manufactured step by step during the manufacturing process of the color filter layer 70.

[0128] Optionally, the color filter layer 70 includes a first sub-portion 71 and a second sub-portion 72. The first sub-portion 71 is located in the display area AA and is disposed within the opening. The first sub-portion 71 is one of a red filter block 71a, a blue filter block 71c, and a green filter block 71b. The second sub-portion 72 is located in the encapsulation area NA1 and is disposed on the side of the second encapsulation segment 50b away from the substrate 10. The second sub-portion 72 is a single-layer structure. The material of the second sub-portion 72 is the same as the material of one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b. The filling portion 80 includes only the second sub-portion 72. In the direction H perpendicular to the plane of the substrate 10, the distance L0 from the side of the second sub-portion 72 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation segment 50a away from the substrate 10 to the substrate 10.

[0129] Optionally, the material of the second sub-section 72 can be the same as that of the red filter block 71a, the material of the second sub-section 72 can be the same as that of the green filter block 71b, and the material of the second sub-section 72 can also be the same as that of the blue filter block 71c. To avoid redundancy, the second embodiment is described using the example where the material of the second sub-section 72 is the same as that of the blue filter block 71c.

[0130] See also Figure 6In the second embodiment, during the process of manufacturing the color filter layer 70, when forming the first sub-portion 71 in the display area AA, a second sub-portion 72 of a single-layer structure is also formed in the packaging area NA1 and the opening area NA2. The second sub-portion 72 provided in the packaging area NA1 and the opening area NA2 can reduce the step difference caused by the high and low terrain of the packaging area NA1, the opening area NA2 and the display area AA, thereby reducing the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 of the single-layer structure and other film layers in the opening area NA2 are hollowed out to install the front camera, forming a structure as shown in FIG. Figure 5 The structure of the display panel 100 is shown. This embodiment utilizes the existing process of manufacturing the color filter layer 70. When forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a single-layer structure is also formed in the encapsulation area NA1 and the opening area NA2. This reduces the manufacturing process of the display panel 100.

[0131] Compared with the traditional manufacturing process of the display panel 100, the present application does not need to add an additional process for filling the opening area NA2, thereby reducing the production cost of the display panel 100 and improving the production capacity.

[0132] In the second embodiment of the present application, the color filter layer 70 has a light filtering property. In the traditional display panel 100, a front camera is installed corresponding to the opening area NA2. Due to the hole design of the opening area NA2, external light irradiating the front camera will be reflected from the light-emitting side of the traditional display panel, so that the position corresponding to the opening area NA2 on the light-emitting side of the traditional display panel will show a reflection of the corresponding color. In this embodiment, by setting a second sub-section 72 in the packaging area NA1, when external light irradiates the front camera, the second sub-section 72 will filter out a part of the external light; when external light is reflected from the front camera back to the light-emitting side of the display panel 100, the second sub-section 72 will filter out a part of the reflected light, thereby weakening or even eliminating the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0133] See also Figure 7 , in the third embodiment of the present application:

[0134] In order to avoid redundancy, the third embodiment of the present application will describe parts different from the second embodiment of the present application.

[0135] The third embodiment of the present application is different from the second embodiment of the present application in that:

[0136] Optionally, the filling portion 80 only includes the portion of the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a double-layer structure.

[0137] Optionally, the second sub-section 72 includes a first sub-layer 72a and a second sub-layer 72b. The first sub-layer 72a is provided on the side of the second packaging segment 50b away from the substrate 10. The material of one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b is the same as the material of the first sub-layer 72a. The second sub-layer 72b is provided on the side of the first sub-layer 72a away from the substrate 10. The material of the other of the red filter block 71a, the blue filter block 71c, and the green filter block 71b is the same as the material of the second sub-layer 72b. The material of the first sub-layer 72a is different from the material of the second sub-layer 72b. In the direction H perpendicular to the plane of the substrate 10, the distance L4 from the side of the second sub-layer 72b away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first packaging segment 50a away from the substrate 10 to the substrate 10.

[0138] It should be understood that the filling portion 80 of the second and third embodiments only includes the portion of the color filter layer 70 located in the packaging area NA1, but the filling portion 80 of the second embodiment is a single-layer structure, and the filling portion 80 of the third embodiment is a double-layer structure. The thickness of the filling portion 80 with the double-layer structure is thicker than the thickness of the filling portion 80 with the single-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2.

[0139] Optionally, the material of the first sub-layer 72 a is the same as that of the red filter block 71 a , and the material of the second sub-layer 72 b is the same as that of the green filter block 71 b .

[0140] Optionally, the material of the first sub-layer 72 a is the same as that of the red filter block 71 a , and the material of the second sub-layer 72 b is the same as that of the blue filter block 71 c .

[0141] Optionally, the material of the first sub-layer 72 a is the same as that of the green filter block 71 b , and the material of the second sub-layer 72 b is the same as that of the red filter block 71 a .

[0142] Optionally, the material of the first sub-layer 72 a is the same as that of the green filter block 71 b , and the material of the second sub-layer 72 b is the same as that of the blue filter block 71 c .

[0143] Optionally, the material of the first sub-layer 72 a is the same as that of the blue filter block 71 c , and the material of the second sub-layer 72 b is the same as that of the red filter block 71 a .

[0144] Optionally, the material of the first sub-layer 72 a is the same as that of the blue filter block 71 c , and the material of the second sub-layer 72 b is the same as that of the green filter block 71 b .

[0145] To avoid redundancy, the third embodiment is described by taking as an example that the material of the first sub-layer 72 a is the same as that of the blue filter block 71 c , and the material of the second sub-layer 72 b is the same as that of the green filter block 71 b .

[0146] See also Figure 8 In the process of manufacturing the color filter layer 70 of the third embodiment, when forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a double-layer structure is also formed in the packaging area NA1 and the opening area NA2. The second sub-portion 72 includes a first sub-layer 72a and a second sub-layer 72b. The first sub-layer 72a is located between the second packaging section 50b and the second sub-layer 72b. The second sub-portion 72 provided in the packaging area NA1 and the opening area NA2 can reduce the step difference caused by the high and low terrain of the packaging area NA1, the opening area NA2 and the display area AA. Compared with the filling portion 80 of the single-layer structure of the second embodiment, the thickness of the filling portion 80 of the double-layer structure of the third embodiment is thicker. The display panel 100 of the third embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2. After the film layer is attached, the double-layer structure filling portion 80 and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure as shown below. Figure 7 The structure of the display panel 100 is shown. The third embodiment utilizes the existing manufacturing process for the color filter layer 70. While forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a dual-layer structure is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the traditional manufacturing process of the display panel 100, this application does not require an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0147] In the third embodiment of the present application, the double-layer color filter layer 70 achieves enhanced filtering effectiveness. Because the material of the first sublayer 72a is the same as that of the blue filter block 71c, natural light passing through the first sublayer 72a is filtered out, leaving only blue light. The material of the second sublayer 72b is the same as that of the green filter block. Blue light entering the second sublayer 72b is completely filtered out. Compared to the single-layer color filter layer 70 of the second embodiment, this achieves enhanced filtering effectiveness, further reducing or even eliminating reflections generated at the location corresponding to the aperture area NA2 on the light-emitting side of the display panel, thereby enhancing the display quality.

[0148] See also Figure 9 , in the fourth embodiment of the present application:

[0149] In order to avoid redundancy, the fourth embodiment of the present application will describe parts that are different from the third embodiment of the present application.

[0150] The fourth embodiment of the present application is different from the third embodiment of the present application in that:

[0151] Optionally, the filling portion 80 only includes the portion of the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a three-layer structure.

[0152] Optionally, the second sub-section 72 further includes a third sub-layer 72c, which is disposed on a side of the second sub-layer 72b away from the substrate 10. The material of the third sub-layer 72c is the same as the material of another one of the red filter block 71a, the blue filter block 71c, and the green filter block 71b, and the material of the third sub-layer 72c. The materials of the first sub-layer 72a, the second sub-layer 72b, and the third sub-layer 72c are all different. In a direction H perpendicular to the plane of the substrate 10, a distance L5 from the side of the third sub-layer 72c away from the substrate 10 to the substrate 10 is less than or equal to a distance L1 from the side of the first encapsulation segment 50a away from the substrate 10 to the substrate 10.

[0153] It should be understood that the filling portion 80 of the fourth embodiment and the third embodiment only includes the portion of the color filter layer 70 located in the packaging area NA1, but the filling portion 80 of the third embodiment is a double-layer structure, and the filling portion 80 of the fourth embodiment is a three-layer structure. The thickness of the filling portion 80 with the three-layer structure is thicker than the thickness of the filling portion 80 with the double-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached to the top of the opening area NA2.

[0154] Optionally, the material of the first sublayer 72a is the same as that of the red filter block 71a, the material of the second sublayer 72b is the same as that of the green filter block 71b, and the material of the third sublayer 72c is the same as that of the blue filter block 71c.

[0155] Optionally, the material of the first sublayer 72a is the same as that of the red filter block 71a, the material of the second sublayer 72b is the same as that of the blue filter block 71c, and the material of the third sublayer 72c is the same as that of the green filter block 71b.

[0156] Optionally, the material of the first sublayer 72a is the same as that of the green filter block 71b, the material of the second sublayer 72b is the same as that of the red filter block 71a, and the material of the third sublayer 72c is the same as that of the blue filter block 71c.

[0157] Optionally, the material of the first sublayer 72a is the same as that of the green filter block 71b, the material of the second sublayer 72b is the same as that of the blue filter block 71c, and the material of the third sublayer 72c is the same as that of the red filter block 71a.

[0158] Optionally, the material of the first sublayer 72a is the same as that of the blue filter block 71c, the material of the second sublayer 72b is the same as that of the red filter block 71a, and the material of the third sublayer 72c is the same as that of the green filter block 71b.

[0159] Optionally, the material of the first sublayer 72a is the same as that of the blue filter block 71c, the material of the second sublayer 72b is the same as that of the green filter block 71b, and the material of the third sublayer 72c is the same as that of the red filter block 71a.

[0160] To avoid redundancy, the fourth embodiment is described by taking the example that the material of the first sublayer 72a is the same as that of the blue filter block 71c, the material of the second sublayer 72b is the same as that of the green filter block 71b, and the material of the third sublayer 72c is the same as that of the red filter block 71a.

[0161] See also Figure 10 In the fourth embodiment, during the fabrication process of the color filter layer 70, while forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a three-layer structure is also formed in the encapsulation area NA1 and the aperture area NA2. The second sub-portion 72 includes a first sub-layer 72a, a second sub-layer 72b, and a third sub-layer 72c. The first sub-layer 72a is located between the second encapsulation segment 50b and the second sub-layer 72b, and the second sub-layer 72b is located between the first sub-layer 72a and the third sub-layer 72c. The second sub-portion 72 disposed in the encapsulation area NA1 and the aperture area NA2 can reduce the step difference caused by the elevation difference between the encapsulation area NA1, the aperture area NA2, and the display area AA. Compared to the double-layer filling portion 80 of the third embodiment, the triple-layer filling portion 80 of the fourth embodiment is thicker. Therefore, the display panel 100 of the fourth embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the aperture area NA2. After the film layer is attached, the filling portion 80 and other film layers of the three-layer structure in the opening area NA2 are hollowed out to install the front camera, forming a Figure 9 The structure of the display panel 100 is shown. The fourth embodiment utilizes the existing manufacturing process for the color filter layer 70. While forming the first sub-portion 71 in the display area AA, a second sub-portion 72 with a three-layer structure is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the traditional manufacturing process of the display panel 100, this application does not require an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0162] In the fourth embodiment of the present application, the three-layer color filter layer 70 has a better filtering effect. The material of the first sub-layer 72a is the same as that of the blue filter block 71c. After the natural light from the outside passes through the first sub-layer 72a, only blue light is left after filtering. The material of the second sub-layer 72b is the same as that of the green light block. After the blue light enters the second sub-layer 72b, it will be completely filtered out. The third sub-layer 72c can ensure that part of the natural light that is not filtered out by the first sub-layer 72a and the second sub-layer 72b is completely filtered out. Compared with the double-layer color filter layer 70 of the third embodiment, it has a better filtering effect, thereby further reducing or even eliminating the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0163] See also Figure 11 , in the fifth embodiment of the present application:

[0164] In order to avoid redundancy, the fifth embodiment of the present application will describe portions different from those of the second embodiment of the present application.

[0165] The fifth embodiment of the present application is different from the second embodiment of the present application in that:

[0166] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a double-layer structure.

[0167] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation segment 50a away from the substrate 10. The first black sub-portion 61 is provided with a plurality of openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation segment 50b and the second sub-portion 72. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The filling portion 80 of the double-layer structure is formed by a single-layer second black sub-portion 62 and a single-layer second sub-portion 72. In the direction H perpendicular to the plane of the substrate 10, the distance L6 from the side of the second sub-portion 72 away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation segment 50a away from the substrate 10 to the substrate 10.

[0168] It should be understood that the filling portion 80 of the fifth embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the fifth embodiment has a double-layer structure. The filling portion 80 of the second embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the second embodiment has a single-layer structure. The thickness of the double-layer filling portion 80 is greater than that of the single-layer filling portion 80, which can further reduce the step difference between the display area AA and the opening area NA2 caused by the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2.

[0169] See also Figure 12 In the fifth embodiment, during the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed in the packaging area NA1 and the opening area NA2 at the same time. In the fifth embodiment, during the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the single-layer structure is also formed in the packaging area NA1 and the opening area NA2 at the same time. The second black sub-portion 62 and the second sub-portion 72 of the single-layer structure can form a filling portion 80 of a double-layer structure. Compared with the filling portion 80 of the single-layer structure of the second embodiment, the thickness of the filling portion 80 of the double-layer structure of the fifth embodiment is thicker. The display panel 100 of the fifth embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the filling portion 80 of the double-layer structure and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure as shown below. Figure 11 The structure of the display panel 100 is shown. The fifth embodiment utilizes the existing manufacturing processes for the black matrix layer 60 and the color filter layer 70. While forming the first black sub-portion 61 and the first sub-portion 71 in the display area AA, a second black sub-portion 62 and a second sub-portion 72 with a double-layer structure are also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the traditional manufacturing process of the display panel 100, this application does not require an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0170] Optionally, the thickness of the second sub-portion 72 is greater than the thickness of the second black sub-portion 62. The thickness of the filling portion 80 can be further increased to further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2.

[0171] The thickness of the second black sub-portion 62 is in the range of 1 micrometer to 1.5 micrometers, and the thickness of the second black sub-portion 62 is one of 1 micrometer, 1.1 micrometers, 1.2 micrometers, 1.3 micrometers, 1.4 micrometers, and 1.5 micrometers.

[0172] When the second sub-portion 72 is a single-layer structure, the thickness of the second sub-portion 72 is within a range of 2.5 microns to 3.5 microns. The thickness of the second sub-portion 72 is one of 2.5 microns, 2.6 microns, 2.7 microns, 2.8 microns, 2.9 microns, 3 microns, 3.1 microns, 3.2 microns, 3.3 microns, 3.4 microns, and 3.5 microns. When the material of the second sub-portion 72 is the same as that of the red filter block 71a, the thickness of the second sub-portion 72 is within a range of 2.5 microns to 3 microns. When the material of the second sub-portion 72 is the same as that of the green filter block 71b, the thickness of the second sub-portion 72 is within a range of 2.8 microns to 3.5 microns. When the material of the second sub-portion 72 is the same as that of the blue filter block 71c, the thickness of the second sub-portion 72 is within a range of 2.8 microns to 3.5 microns.

[0173] In the fourth embodiment of the present application, the filling portion 80 of the double-layer structure includes a second black sub-portion 62 and a second sub-portion 72. The second black sub-portion 62 has a light absorption effect, and the second sub-portion 72 has a light filtering effect. After the natural light from the outside passes through the second sub-portion 72, part of the external light will be filtered out. The light that is not filtered out by the second sub-portion 72 passes through the second black sub-portion 62 and will be absorbed by the second black sub-portion 62. Compared with the second embodiment in which only a single layer of the second black sub-portion 62 is provided, the embodiment has better light filtering and light absorption effects. The fifth embodiment can further reduce or even eliminate the reflection generated by the position corresponding to the opening area NA2 on the light-emitting side of the display panel, thereby improving the display effect.

[0174] See also Figure 13 , in the sixth embodiment of the present application:

[0175] In order to avoid redundancy, the sixth embodiment of the present application will describe parts that are different from the third embodiment of the present application.

[0176] The sixth embodiment of the present application is different from the third embodiment of the present application in that:

[0177] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a three-layer structure.

[0178] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation segment 50a away from the substrate 10. The first black sub-portion 61 has multiple openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation segment 50b and the first sub-layer 72a. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The three-layer filling portion 80 is formed by a single-layer second black sub-portion 62 and a double-layer second sub-portion 72. The double-layer second sub-portion 72 includes a first sub-layer 72a and a second sub-layer 72b. In a direction H perpendicular to the plane of the substrate 10, the distance L7 from the side of the second sub-layer 72b away from the substrate 10 to the substrate 10 is less than or equal to the distance L1 from the side of the first encapsulation segment 50a away from the substrate 10.

[0179] It should be understood that the filling portion 80 of the sixth embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the sixth embodiment has a three-layer structure. The filling portion 80 of the third embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the third embodiment has a two-layer structure. The thickness of the three-layer filling portion 80 is greater than that of the two-layer filling portion 80, which can further reduce the step difference between the display area AA and the opening area NA2 caused by the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2.

[0180] See also Figure 14 In the sixth embodiment, during the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed simultaneously in the encapsulation area NA1 and the opening area NA2. In the sixth embodiment, during the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the double-layer structure is also formed simultaneously in the encapsulation area NA1 and the opening area NA2. The second black sub-portion 62 and the second sub-portion 72 of the double-layer structure can form a filling portion 80 of a three-layer structure. Compared with the filling portion 80 of the double-layer structure of the third embodiment, the filling portion 80 of the three-layer structure of the sixth embodiment is thicker. The display panel 100 of the sixth embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the filling portion 80 of the three-layer structure and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure as shown below. Figure 13The structure of the display panel 100 is shown. The sixth embodiment utilizes the existing manufacturing processes for the black matrix layer 60 and the color filter layer 70. While forming the first black sub-portion 61 and the first sub-portion 71 in the display area AA, a three-layer structure comprising a second black sub-portion 62, a first sub-layer 72a, and a second sub-layer 72b is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the conventional manufacturing process of the display panel 100, this application eliminates the need for an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0181] Compared to the third embodiment, which only includes two color filter layers 70, the sixth embodiment's filling portion 80 comprises a three-layer structure, including a second black sub-portion 62. The second black sub-portion 62 exhibits a light-absorbing effect, further absorbing ambient light compared to the third embodiment. Compared to the third embodiment, which only includes two color filter layers 70, the sixth embodiment further reduces or even eliminates reflections generated on the light-emitting side of the display panel corresponding to the aperture area NA2, thereby improving the display quality.

[0182] See also Figure 15 , in the seventh embodiment of the present application:

[0183] In order to avoid redundancy, the seventh embodiment of the present application will describe the parts that are different from the fourth embodiment of the present application.

[0184] The seventh embodiment of the present application is different from the fourth embodiment of the present application in that:

[0185] Optionally, the filling portion 80 includes portions of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1 , and the filling portion 80 is a four-layer structure.

[0186] Optionally, the black matrix layer 60 includes a first black sub-portion 61 and a second black sub-portion 62. The first black sub-portion 61 is located in the display area AA and is provided on the side of the first encapsulation segment 50a away from the substrate 10. The first black sub-portion 61 has multiple openings. The second black sub-portion 62 is located in the encapsulation area NA1 and is located between the second encapsulation segment 50b and the first sub-layer 72a. The second black sub-portion 62 is made of the same material as the first black sub-portion 61. The four-layer filling portion 80 is formed by a single-layer second black sub-portion 62 and a three-layer second sub-portion 72. The three-layer second sub-portion 72 includes a first sub-layer 72a, a second sub-layer 72b, and a third sub-layer 72c. In a direction H perpendicular to the plane of the substrate 10, the distance L8 between the side of the third sub-layer 72c away from the substrate 10 and the substrate 10 is less than or equal to the distance L1 between the side of the first encapsulation segment 50a away from the substrate 10 and the substrate 10.

[0187] It should be understood that the filling portion 80 of the seventh embodiment includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the seventh embodiment has a four-layer structure. The filling portion 80 of the fourth embodiment only includes the portion of the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the fourth embodiment has a three-layer structure. The thickness of the four-layer filling portion 80 is greater than that of the three-layer filling portion 80, which can further reduce the step difference between the display area AA and the opening area NA2 caused by the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2.

[0188] See also Figure 16 In the seventh embodiment, during the process of manufacturing the black matrix layer 60, when the first black sub-portion 61 is formed in the display area AA, the second black sub-portion 62 is also formed simultaneously in the packaging area NA1 and the opening area NA2. In the seventh embodiment, during the process of manufacturing the color filter layer 70, when the first sub-portion 71 is formed in the display area AA, the second sub-portion 72 of the three-layer structure is also formed simultaneously in the packaging area NA1 and the opening area NA2. The second black sub-portion 62 and the second sub-portion 72 of the three-layer structure can form a filling portion 80 of a four-layer structure. Compared with the filling portion 80 of the three-layer structure of the fourth embodiment, the filling portion 80 of the four-layer structure of the seventh embodiment is thicker. The display panel 100 of the seventh embodiment can further reduce the generation of bubbles or stress concentration in the film layer attached above the opening area NA2. After the film layer is attached, the filling portion 80 of the four-layer structure and other film layers in the opening area NA2 will be hollowed out to install the front camera, forming a structure as shown below. Figure 15 The structure of the display panel 100 is shown. The seventh embodiment utilizes the existing manufacturing processes for the black matrix layer 60 and the color filter layer 70. While forming the first black sub-portion 61 and the first sub-portion 71 in the display area AA, a four-layer structure comprising a second black sub-portion 62, a first sub-layer 72a, a second sub-layer 72b, and a third sub-layer 72c is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the conventional manufacturing process of the display panel 100, this application eliminates the need for an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0189] Compared to the fourth embodiment, which included only three color filter layers 70, the seventh embodiment's filling portion 80 comprises a four-layer structure, including a second black sub-portion 62. The second black sub-portion 62 exhibits a light-absorbing effect, further absorbing external light compared to the fourth embodiment. Compared to the fourth embodiment, which included only three color filter layers 70, the seventh embodiment further reduces or even eliminates reflections generated on the light-emitting side of the display panel corresponding to the aperture area NA2, thereby enhancing the display quality.

[0190] See also Figure 17 , in the eighth embodiment of the present application:

[0191] In order to avoid redundancy, the eighth embodiment of the present application will describe the parts that are different from the seventh embodiment of the present application.

[0192] The eighth embodiment of the present application is different from the seventh embodiment of the present application in that:

[0193] Optionally, the display panel 100 further includes a passivation layer 90 (PAS). The planarization layer 90 includes a first flat portion 91 and a second flat portion 92. The first flat portion 91 is located in the display area AA and is disposed on the side of the first black sub-portion 61 and the first sub-portion 71 away from the substrate 10. The second flat portion 92 is located in the encapsulation area NA1 and is disposed on the side of the second sub-portion 72 away from the substrate 10. The material of the second flat portion 92 is the same as that of the first flat portion 91. In a direction H perpendicular to the plane of the substrate 10, a distance L9 from the side of the second flat portion 92 away from the substrate 10 to the substrate 10 is less than or equal to a distance L1 from the side of the first encapsulation segment 50a away from the substrate 10 to the substrate 10.

[0194] Optionally, the material of the planarization layer 90 includes an organic photoresist material. The organic photoresist material has a leveling property.

[0195] Optionally, the filling portion 80 includes the black matrix layer 60 , the color filter layer 70 , and the portion of the planarization layer 90 located in the encapsulation area NA1 , and the filling portion 80 is a five-layer structure.

[0196] It should be understood that the filling portion 80 of the eighth embodiment includes the portion of the black matrix layer 60, the color filter layer 70, and the planarization layer 90 located in the encapsulation area NA1, and the filling portion 80 of the eighth embodiment has a five-layer structure. The filling portion 80 of the seventh embodiment only includes the portion of the black matrix layer 60 and the color filter layer 70 located in the encapsulation area NA1, and the filling portion 80 of the seventh embodiment has a four-layer structure. The thickness of the filling portion 80 of the five-layer structure is thicker than that of the filling portion 80 of the four-layer structure, which can further reduce the step difference between the display area AA and the opening area NA2 due to the high and low terrain, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2.

[0197] Optional, see Figure 18 In the eighth embodiment, during the process of manufacturing the planarization layer 90, when forming the first flat portion 91 in the display area AA, the second flat portion 92 is also formed simultaneously in the encapsulation area NA1 and the opening. The five-layer structure of the filling portion 80 of the eighth embodiment includes the second black sub-portion 62, the first sub-layer 72a, the second sub-layer 72b, the third sub-layer 72c, and the second flat portion 92. Compared with the four-layer structure of the filling portion 80 of the seventh embodiment, the five-layer structure of the filling portion 80 of the eighth embodiment is thicker.

[0198] The display panel 100 of the eighth embodiment can further reduce the occurrence of bubbles or stress concentration in the film layer attached to the opening area NA2. After the film layer is attached, the filling portion 80 and other film layers of the five-layer structure in the opening area NA2 are hollowed out to install the front camera, forming a Figure 17 The structure of the display panel 100 is shown. The eighth embodiment utilizes the existing manufacturing processes for the black matrix layer 60, color filter layer 70, and planarization layer 90. While forming the first black sub-portion 61, first sub-portion 71, and first planar portion 91 in the display area AA, a five-layer structure comprising a second black sub-portion 62, a first sub-layer 72a, a second sub-layer 72b, a third sub-layer 72c, and a second planar portion 92 is also formed in the encapsulation area NA1 and the aperture area NA2. This reduces the step difference between the display area AA and the aperture area NA2 due to the high and low terrain during the manufacturing process of the display panel 100. Compared to the conventional manufacturing process of the display panel 100, this application eliminates the need for an additional process for filling the aperture area NA2, thereby reducing the production cost of the display panel 100 and improving production capacity.

[0199] Optionally, the second flat portion 92 is connected to the first flat portion 91 . The thickness of the second flat portion 92 is greater than the thickness of the first flat portion 91 .

[0200] In this embodiment, the first flat portion 91 and the second flat portion 92 are formed simultaneously in the same process, and the second flat portion 92 is connected to the first flat portion 91. The first flat portion 91 is located in the display area AA, which is higher in terrain, and the second flat portion 92 is located in the packaging area NA1, which is lower in terrain. During the process of forming the planarization layer 90, due to the influence of gravity and the leveling properties of the organic material, part of the material of the first flat portion 91 will flow into the packaging area NA1 before solidification, forming part of the second flat portion 92. After the planarization layer 90 is solidified, the thickness of the second flat portion 92 will be greater than the thickness of the first flat portion 91. Since in this embodiment, the filling portion 80 also includes the portion of the planarization layer 90 located in the packaging area NA1, that is, the filling portion 80 also includes the second flat portion 92. This embodiment increases the thickness of the second flat portion 92 by connecting the first flat portion 91 and the second flat portion 92, thereby increasing the thickness of the filling portion 80, further reducing the step difference between the display area AA and the opening area NA2, thereby further reducing the generation of bubbles or stress concentration in the film layer attached above the opening area NA2, improving the yield of the display panel 100, thereby reducing production costs and increasing production capacity.

[0201] The above describes in detail the specific embodiments of the present application. The above embodiments disclosed in this application are merely preferred embodiments of the present application. Those skilled in the art will appreciate that many variations and improvements can be made without departing from the spirit of the present application. These variations and improvements fall within the scope of protection defined by the claims of this application.

Claims

1. A display panel comprising a non-display area and a display area located outside the non-display area, wherein the non-display area comprises a packaging area and an opening area, and the packaging area is located between the display area and the opening area, characterized in that: The display panel includes: substrate; an encapsulation layer, disposed on one side of the substrate, comprising a first encapsulation segment and a second encapsulation segment connected to each other, wherein the first encapsulation segment is located in the display area, and the second encapsulation segment is located in the encapsulation area, wherein in a direction perpendicular to the plane of the substrate, a distance from a side of the second encapsulation segment away from the substrate to the substrate is smaller than a distance from a side of the first encapsulation segment away from the substrate to the substrate; a black matrix layer, at least a portion of the black matrix layer being located in the display area, the portion of the black matrix layer being located in the display area being disposed on a side of the first packaging segment away from the substrate, and the portion of the black matrix layer being located in the display area being provided with a plurality of openings; a color filter layer, comprising a first sub-portion and a second sub-portion, wherein the first sub-portion is located in the display area and disposed within the opening, and is one of a red filter block, a blue filter block, and a green filter block; the second sub-portion is located in the packaging area and is disposed on a side of the second packaging segment away from the substrate; the second sub-portion comprises a first sub-layer and a second sub-layer, the first sub-layer being disposed on a side of the second packaging segment away from the substrate, the material of one of the red filter block, the blue filter block, and the green filter block being the same as the material of the first sub-layer, the second sub-layer being disposed on a side of the first sub-layer away from the substrate, the material of the other of the red filter block, the blue filter block, and the green filter block being the same as the material of the second sub-layer, and the material of the first sub-layer being different from the material of the second sub-layer; and a filling portion, located in the packaging area, and arranged on a side of the second packaging section away from the substrate; The filling portion includes at least one of the black matrix layer and the color filter layer, and the filling portion further includes the second sub-portion; In a direction perpendicular to a plane of the substrate, a distance from a side of the filling portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging section away from the substrate to the substrate.

2. The display panel according to claim 1, wherein The black matrix layer includes: a first black sub-portion, located in the display area and disposed on a side of the first packaging segment away from the substrate, the first black sub-portion being provided with a plurality of the openings; and a second black sub-portion, located in the packaging area and disposed on a side of the second packaging section away from the substrate, the second black sub-portion being made of the same material as the first black sub-portion; Wherein, the filling portion includes the second black sub-portion; In a direction perpendicular to the plane of the substrate, a distance from the second black sub-portion away from the substrate to the substrate is less than or equal to a distance from the first packaging segment away from the substrate to the substrate.

3. The display panel according to claim 2, wherein: The first black sub-portion is connected to the second black sub-portion, and a thickness of the second black sub-portion is greater than a thickness of the first black sub-portion.

4. The display panel according to claim 2, wherein: In a direction perpendicular to the plane of the substrate, a distance from a side of the second sub-portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

5. The display panel according to claim 4, wherein: The first sub-layer is provided on a side of the second black sub-portion away from the substrate; In a direction perpendicular to the plane of the substrate, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

6. The display panel according to claim 5, wherein: The second sub-section further includes a third sub-layer, which is provided on a side of the second sub-layer away from the substrate, wherein a material of the third sub-layer is the same as a material of another one of the red filter block, the blue filter block, and the green filter block; The material of the first sub-layer, the material of the second sub-layer and the material of the third sub-layer are all different; In a direction perpendicular to the plane of the substrate, a distance from a side of the third sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

7. The display panel according to any one of claims 4 to 6, wherein: The thickness of the second sub-portion is greater than the thickness of the second black sub-portion.

8. The display panel according to any one of claims 4 to 6, wherein: The display panel further includes a planarization layer, and the planarization layer includes: a first flat portion, located in the display area, and disposed on the first black sub-portion and a side of the first sub-portion away from the substrate; and a second flat portion, located in the packaging area and provided on a side of the second sub-portion away from the substrate, wherein the material of the second flat portion is the same as that of the first flat portion; Wherein, in a direction perpendicular to the plane of the substrate, a distance from a side of the second flat portion away from the substrate to the substrate is less than or equal to a distance from a side of the first packaging segment away from the substrate to the substrate.

9. The display panel according to claim 8, wherein: The second flat portion is connected to the first flat portion, and a thickness of the second flat portion is greater than a thickness of the first flat portion.

10. The display panel according to claim 1, wherein In a direction perpendicular to the plane of the substrate, a distance from a side of the second sublayer away from the substrate to the substrate is less than or equal to a distance from a side of the first encapsulation segment away from the substrate to the substrate.

11. The display panel according to any one of claims 1 to 6, wherein: The display panel further includes: a thin film transistor device layer, disposed on one side of the substrate, at least a portion of the thin film transistor device layer being located in the display area; and A plurality of light-emitting devices are provided on a side of the thin film transistor device layer away from the substrate and located in the display area; The encapsulation layer includes: a first inorganic encapsulation layer, disposed on one side of the substrate, wherein a portion of the first inorganic encapsulation layer located in the display area covers the light-emitting device and the thin film transistor device layer, and a portion of the first inorganic encapsulation layer located in the encapsulation area covers the substrate; an organic encapsulation layer, located in the display area and disposed on a side of the first inorganic encapsulation layer away from the substrate; and a second inorganic encapsulation layer, wherein a portion of the second inorganic encapsulation layer located in the display area covers the organic encapsulation layer, a portion of the second inorganic encapsulation layer located in the encapsulation area covers a portion of the first inorganic encapsulation layer located in the encapsulation area, and the second inorganic encapsulation layer separates the filling portion and the organic encapsulation layer; The portion of the first inorganic encapsulation layer located in the display area, the organic encapsulation layer, and the portion of the second inorganic encapsulation layer located in the display area form the first encapsulation segment; The portion of the first inorganic encapsulation layer located in the encapsulation area and the portion of the second inorganic encapsulation layer located in the encapsulation area form the second encapsulation segment; In a direction perpendicular to the plane of the substrate, the distance from the side of the second inorganic encapsulation layer located in the encapsulation area away from the substrate to the substrate is less than the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate to the substrate; the distance from the side of the filling portion away from the substrate to the substrate is less than or equal to the distance from the side of the second inorganic encapsulation layer located in the display area away from the substrate to the substrate.

12. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 11.

Images