Resonant sensor PUF characteristic value generation method and PUF key generation method

Abstract

The present application provides a method for generating PUF characteristic values ​​of a resonant sensor and a method for generating PUF keys. The method includes: providing a resonant sensor, turning on the power of the resonant sensor, the resonant sensor including a power module, a processor, a temperature adjustment module and a resonant sensor module, the processor is used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module; through the temperature adjustment module, the ambient temperature of the resonant sensor module is respectively a plurality of test temperatures; measuring the resonant parameters of the resonant sensor module under each test temperature; using the plurality of test temperatures as excitation, using the resonant parameters under each test temperature as response, and generating PUF characteristic values, based on which, no additional design and production costs are required, thus reducing the PUF cost.

Description

Technical Field

[0001] The present application relates to the field of information security technology, and in particular to a method for generating a PUF characteristic value of a resonant sensor and a method for generating a PUF key. Background Art

[0002] Physically Unclonable Function (PUF) has the characteristics of uniqueness and non-replicability, and has been successfully applied in the field of information security. It is a safe and effective encryption technology. The hardware identity is managed through the physical characteristics of the hardware PUF (Physical Unclonable Function), and the root key is generated based on this characteristic. The key generation technology based on PUF allows the key to be kept within the device, which is highly secure. In addition, the cost of using PUF hardware is low, and it is also suitable for low-cost terminal devices such as wireless sensor devices.

[0003] In the related art, PUF has been used in some large mobile terminal devices, such as using the data value after SRAM and DRAM initialization as PUF source data. However, this method is not suitable for small terminals, such as sensors. Therefore, an effective implementation method for PUF on sensors is needed. Summary of the invention

[0004] Based on this, it is necessary to provide a resonant sensor PUF characteristic value generation method and a PUF key generation method that can solve the above technical problems and effectively implement the PUF on the sensor.

[0005] In a first aspect, the present application provides a method for generating a PUF characteristic value of a resonant sensor, comprising:

[0006] Providing a resonant sensor, turning on the power of the resonant sensor, the resonant sensor comprising a power module, a processor, a temperature adjustment module and a resonant sensor module, the processor being used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module;

[0007] The temperature adjustment module is used to adjust the ambient temperature of the resonant sensor module to a plurality of test temperatures.

[0008] Measuring and obtaining the resonance parameters of the resonant sensor module at each set of test temperatures;

[0009] The plurality of test temperatures are used as excitations, and the resonance parameters at each test temperature are used as responses to generate PUF characteristic values.

[0010] In one embodiment, the resonant sensor module includes: a resonator, wherein the resonator generates resonance under the action of an excitation source, wherein the resonance includes a main vibration and a secondary vibration, wherein the resonance parameters include a main vibration frequency and a main vibration amplitude, or wherein the resonance parameters include a main vibration frequency, a main vibration amplitude, and a secondary vibration frequency, or wherein the resonance parameters include a main vibration frequency, a main vibration amplitude, a secondary vibration frequency, and a secondary vibration amplitude;

[0011] A driver connected to the resonator, the driver is used to generate an excitation source to drive the resonator to resonate;

[0012] A detector connected to the resonator, wherein the detector is used to detect a resonance parameter of the resonator.

[0013] In one embodiment, the resonator is a cantilever beam resonator, a double-ended fixed beam resonator, a ring resonator, a diaphragm resonator, a columnar resonator, a comb-tooth capacitor resonator, a piezoelectric resonator, or a nanowire resonator.

[0014] In one of the embodiments, the resonant sensor module further comprises: a temperature control module for controlling the ambient temperature of the resonator;

[0015] A temperature compensation module, used to correct the frequency drift of the resonator at different operating temperatures;

[0016] Among them, the temperature adjustment module reuses the temperature control module, and the processor is used to make the ambient temperature of the resonant sensor module be a plurality of groups of test temperatures respectively through the working state of the temperature control module during the test process of the PUF characteristic value; the processor is also used to control the resonator to be at a relatively stable working temperature through the working state of the temperature control module in the working state.

[0017] In one embodiment, the resonator is a cantilever beam resonator or a double-ended fixed beam resonator, the temperature adjustment module is a heating resistor arranged on the cantilever beam or fixed beam of the resonator, and the processor is used to control the voltage or current flowing through the heating resistor to control the test temperature of the resonator.

[0018] In one of the embodiments, the heating resistor is arranged in the secondary vibration generating area of ​​the cantilever beam or the fixed beam, and the resonance parameters are the secondary vibration frequency and the secondary vibration amplitude.

[0019] In one embodiment, the power module further includes a driving voltage adjustment circuit, and the PUF characteristic value generation method further includes:

[0020] The plurality of driving voltages are input to the driver through the driving voltage adjustment circuit, and the excitation source generated by the driver drives the resonator to generate resonance;

[0021] The detector is used to measure the main vibration amplitude and the secondary vibration amplitude of the resonator under each set of driving voltages, so as to obtain multiple sets of main vibration amplitudes and secondary vibration amplitudes under different driving voltages;

[0022] The generating of the PUF characteristic value is specifically as follows: using the multiple groups of the driving voltages and the multiple groups of the test temperatures as excitations, and using the primary oscillation amplitude and the secondary oscillation amplitude under each group of driving voltages, and the resonance parameters under each group of test temperatures as responses, to generate the PUF characteristic value.

[0023] In one of the embodiments, the resonant sensor is a MEMS sensor or an NMES sensor; the resonant sensor is a resonant pressure sensor, a resonant force sensor, a resonant displacement sensor, a resonant mass sensor, a resonant strain sensor, a resonant flow sensor, a resonant torque sensor, a resonant vibration sensor, a resonant liquid level sensor, a resonant gyroscope, a resonant gas sensor, a resonant magnetic sensor, a resonant biosensor, a resonant humidity sensor, a resonant temperature sensor, a resonant chemical sensor, a resonant acceleration sensor, or a resonant inertial sensor.

[0024] In a second aspect, the present application also provides a resonant sensor PUF key generation method, comprising:

[0025] Combining the PUF characteristic values ​​obtained by the PUF characteristic value generation method described in any one of the embodiments of the first aspect above to obtain a plurality of CRP stimulus-response pairs;

[0026] Performing analog-to-digital conversion on the response in the CRP stimulus-response pair to obtain bit data;

[0027] The bit data is processed using a hash algorithm to generate a PUF key.

[0028] In one of the embodiments, the PUF key is stored in a security verification device of the resonant sensor.

[0029] In a third aspect, the present application also provides a method for safety verification of a resonant sensor, comprising:

[0030] A resonant sensor to be tested is provided, a security verification device is connected to the resonant sensor to be tested, and a power supply of the resonant sensor is turned on, wherein the security verification device stores a PUF key of the resonant sensor to be tested generated by the PUF key generation method in any one of the embodiments of the second aspect;

[0031] The security verification device generates a first random number and sends the first random number to the resonant sensor to be tested, and the resonant sensor to be tested takes the first random number as a challenge and generates a first response;

[0032] The resonant sensor to be tested encrypts the first random number to obtain a second response, and sends the second response to the security verification device, wherein the encryption key of the first random number is the first response;

[0033] Decrypting the second response using the PUF key stored in the security verification device as a decryption key to obtain a second random number;

[0034] The second random number is compared with the first random number, and if the two are the same, it is determined that the resonant sensor to be tested is a safety device.

[0035] In a fourth aspect, the present application further provides a safety verification device for a resonant sensor, wherein the safety verification device can use the above-mentioned safety verification method to perform safety verification on the resonant sensor, and the safety verification device includes:

[0036] A memory, used to store PUF keys of multiple resonant sensors generated by the method described in any one of the embodiments of the second aspect above;

[0037] A random number generation module, used to generate a first random number;

[0038] a decryption module, configured to decrypt a second response returned by the resonant sensor using the PUF key to obtain a second random number;

[0039] A comparison module, used for comparing the second random number with the first random number to obtain a comparison result;

[0040] A display module is used to display the comparison result and / or display the first random number and the second random number.

[0041] In a fifth aspect, the present application also provides a resonant sensor to which the PUF characteristic value generation method described in any one of the embodiments of the first aspect above can be applied.

[0042] The above-mentioned resonant sensor PUF characteristic value generation method and PUF key generation method provide a resonant sensor, turn on the power of the resonant sensor, the resonant sensor includes a power module, a processor, a temperature adjustment module and a resonant sensor module, the processor is used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module; through the temperature adjustment module, the ambient temperature of the resonant sensor module is respectively a plurality of test temperatures; the resonant parameters of the resonant sensor module under each test temperature are measured; the plurality of test temperatures are used as excitations, and the resonant parameters under each test temperature are used as responses to generate PUF characteristic values. Based on this, using a plurality of test temperatures as excitations, and a plurality of resonant parameters of the resonant sensor at different test temperatures as responses, PUF characteristic values ​​are generated. Since the resonant parameters at different test temperatures have unique and stable characteristics, the PUF characteristic values ​​of the sensor are generated in this way, and no additional design and production costs are required, thereby reducing the PUF cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0044] Figure 1 A schematic diagram of a flow chart of a method for generating a PUF characteristic value of a resonant sensor in one embodiment of the present application;

[0045] Figure 2 This is a graph showing the relationship between the secondary vibration frequency and the test temperature change in one embodiment of the present application;

[0046] Figure 3 A graph showing the relationship between the amplitude and the test temperature change according to an embodiment of the present application;

[0047] Figure 4 This is a schematic structural diagram of a resonant sensor module in one embodiment of the present application;

[0048] Figure 5 A schematic diagram of the structure of a cantilever beam resonator in one embodiment of the present application;

[0049] Figure 6 This is a structural schematic diagram of a temperature adjustment module configuration method in one embodiment of the present application;

[0050] Figure 7 This is a schematic diagram of the MEMS main oscillation frequency, secondary oscillation frequency and amplitude under the initial driving voltage in one embodiment of the present application;

[0051] Figure 8 This is a schematic diagram of the main frequency amplitude of MEMS under different driving voltages in one embodiment of the present application;

[0052] Fig. 9 A schematic diagram of the secondary vibration amplitude of MEMS under different driving voltages in one embodiment of the present application;

[0053] Fig.10 A schematic diagram of a flow chart of a method for generating a PUF key for a resonant sensor in one embodiment of the present application;

[0054] Fig.11 A schematic diagram of a flow chart of a safety verification method for a resonant sensor in one embodiment of the present application;

[0055] Fig.12 A circuit diagram of a voltage adjustment module in a resonant sensor in one embodiment of the present application;

[0056] Fig.13 It is a schematic diagram of the structure of a safety verification device for a resonant sensor in one embodiment of the present application. DETAILED DESCRIPTION

[0057] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0058] It is understandable that PUF, or Physical Unclonable Functions, is an important type of hardware security technology that uses the inherent properties of silicon-based semiconductors to randomly extract unclonable physical features, similar to biological fingerprints, and is a unique identifier for each chip. It uses the inevitable tiny differences in semiconductor devices during the manufacturing process (such as transistor threshold voltage, interconnect length, capacitance, etc.) to generate unique and unpredictable outputs. These differences make the response of each device unique and cannot be completely replicated even using the same manufacturing process. Therefore, PUF can be used as a "fingerprint" for devices for security applications such as identity authentication, key generation, and data encryption.

[0059] In the related art, PUFs based on other hardware features include Static RAM static random access memory (SRAM), ring oscillator (RO), arbiter PUFs, coating PUFs and dynamic RAM dynamic random access memory (DRAM). However, the limitation of hardware resources of wireless sensors makes it impossible to effectively use PUFs based on SRAM and DRAM. Secondly, RO PUF technology that increases additional design and production costs is not suitable. Therefore, in view of the lack of effective implementation methods for PUF on sensors in the related art, a resonant sensor PUF feature value generation method is proposed, which can solve the effective implementation of PUF applications on wireless sensors while realizing the application of PUF key technology on resonant MEMS sensors at a low cost.

[0060] In one embodiment, Figure 1 As shown, Figure 1 The following is a flow chart of a method for generating a PUF characteristic value of a resonant sensor in one embodiment of the present application; the method for generating a PUF characteristic value of a resonant sensor includes the following steps:

[0061] Step 102, providing a resonant sensor, turning on the power of the resonant sensor, the resonant sensor includes a power module, a processor, a temperature adjustment module and a resonant sensor module, the processor is used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module.

[0062] Among them, resonant sensors use the resonance characteristics of the vibration system to achieve high-precision physical quantity measurement. This type of sensor is usually based on the working principle of the mass-spring-damper system, and indirectly measures external physical quantities by detecting the resonant frequency, amplitude or phase change of the vibration system. Resonant MEMS sensors have the advantages of high sensitivity, low power consumption, miniaturization and good stability, and are widely used in various types of sensors.

[0063] The resonant sensor can be a wireless resonant sensor or a wired sensor. For resonant sensors with different transmission modes, the resonant sensor can be, but is not limited to, a MEMS sensor or an NMES sensor. The type of the resonant sensor is not limited here, and the structure of the resonant sensor is not specifically limited. This application is described as a resonant MEMS sensor.

[0064] In an exemplary embodiment, the resonant sensor includes a power supply module, a processor, a temperature adjustment module and a resonant sensor module; wherein the power supply module is used to provide stable and appropriate voltage and current to each module inside the resonant sensor; wherein the processor is used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module.

[0065] The temperature adjustment module refers to a circuit or component used to adjust the ambient temperature of the resonant sensor module, and is not specifically limited here; for example, the temperature adjustment module can be built into the resonant sensor module or can be arranged outside the resonant sensor module.

[0066] Among them, the resonant sensor module is the part that actually detects physical quantities and can respond to changes in the measured physical quantity using the resonance principle.

[0067] Further, in an exemplary embodiment, the resonant sensor is a MEMS sensor or an NMES sensor; the resonant sensor is a resonant pressure sensor, a resonant force sensor, a resonant displacement sensor, a resonant mass sensor, a resonant strain sensor, a resonant flow sensor, a resonant torque sensor, a resonant vibration sensor, a resonant liquid level sensor, a resonant gyroscope, a resonant gas sensor, a resonant magnetic sensor, a resonant biosensor, a resonant humidity sensor, a resonant temperature sensor, a resonant chemical sensor, a resonant acceleration sensor, and a resonant inertial sensor.

[0068] Step 104: The temperature of the environment in which the resonant sensor module is located is adjusted to a plurality of test temperatures through the temperature adjustment module.

[0069] Step 106 , measuring and obtaining the resonance parameters of the resonant sensor module at each set of test temperatures.

[0070] It can be understood that in order to expand the CRP set of MEMS, multiple groups of test temperature-controlled resonant sensor modules can be adjusted to generate corresponding multiple groups of different resonance parameters, wherein the resonance parameters include the main oscillation frequency and the main oscillation amplitude, or the resonance parameters include the main oscillation frequency, the main oscillation amplitude, and the secondary oscillation frequency, or the resonance parameters include the main oscillation frequency, the main oscillation amplitude, the secondary oscillation frequency, and the secondary oscillation amplitude; it is necessary to measure according to actual needs and no specific limitation is made here.

[0071] Among them, the main vibration frequency refers to the frequency corresponding to the most important resonant mode in the resonant sensor; the main vibration amplitude refers to the vibration amplitude occurring at the main vibration frequency; the secondary vibration frequency refers to other vibration frequencies existing in the resonant sensor except the main vibration frequency; the secondary vibration amplitude refers to the vibration amplitude occurring at the secondary vibration frequency.

[0072] In an exemplary embodiment, see Figure 2 , take the sub-oscillation frequency in the resonance parameter as an example to illustrate, Figure 2 This is a graph showing the relationship between the secondary vibration frequency and the test temperature change in an embodiment of the present application. Figure 2 It can be seen that the changing trend of the sub-oscillation frequency is positively correlated with the changing trend of the test temperature.

[0073] In another exemplary embodiment, see Figure 3 , take the main vibration amplitude and the secondary vibration amplitude in the resonance parameters as an example to illustrate; Figure 3 This is a graph showing the relationship between the amplitude and the test temperature change of an embodiment of the present application. Figure 3 It can be seen that the changing trend of the amplitude is inversely proportional to the changing trend of the test temperature, that is, the increase in temperature may inhibit the further increase of the amplitude.

[0074] Step 108 , using multiple groups of test temperatures as excitations and the resonance parameters at each group of test temperatures as responses to generate PUF characteristic values.

[0075] The PUF characteristic value includes excitation and response, and each PUF characteristic value may include a test temperature and a resonance parameter at the test temperature.

[0076] In actual processing, CRP can be a set of data, which can come from the resonance parameters at multiple test temperatures. The size of the data combination can range from the smallest 1 data to the entire data set.

[0077] In an exemplary embodiment, the resonance parameters include the main oscillation frequency, the main oscillation amplitude, the secondary oscillation frequency, and the secondary oscillation amplitude. The PUF characteristic values ​​are shown in Table 1. Multiple groups of test temperatures are used as excitations, and the resonance parameters at each group of test temperatures are used as responses to generate PUF characteristic values.

[0078] Table 1 PUF characteristic values

[0079]

[0080] In this embodiment, multiple groups of test temperatures are used as excitations, and multiple groups of resonance parameters of the resonant sensor at different test temperatures are used as responses to generate PUF characteristic values. Since the resonance parameters at different test temperatures have unique and stable characteristics, the PUF characteristic values ​​of the sensor are generated in this way without increasing additional design and production costs, thereby reducing the PUF cost.

[0081] In one embodiment, Figure 4 As shown, Figure 4Schematic diagram of the structure of a resonant sensor module in an embodiment of the present application; the resonant sensor module includes: a resonator, the resonator generates resonance under the action of an excitation source, the resonance includes a main vibration and a secondary vibration, the resonance parameters include a main vibration frequency and a main vibration amplitude, or the resonance parameters include a main vibration frequency, a main vibration amplitude, and a secondary vibration frequency, or the resonance parameters include a main vibration frequency, a main vibration amplitude, a secondary vibration frequency, and a secondary vibration amplitude;

[0082] A driver connected to the resonator, the driver is used to generate an excitation source to drive the resonator to resonate;

[0083] A detector connected to the resonator is used to detect the resonance parameters of the resonator.

[0084] It should be noted that the principles of resonators are different and the excitation sources are also different. For example, electrical excitation: the resonator is driven by applying AC voltage or current, which is suitable for capacitive and piezoelectric resonators. Mechanical excitation: the resonator is driven by applying mechanical vibration or force, which is suitable for mechanical resonators. Optical excitation: the optical fiber resonator is driven by laser or other light sources, which is suitable for optical resonant sensors. Piezoelectric excitation: the inverse piezoelectric effect of piezoelectric materials is used to make the resonator produce mechanical vibrations by applying voltage. Electromagnetic excitation: the resonator is driven by the alternating magnetic field generated by the coil.

[0085] Among them, the detector is used to monitor the change of the resonant frequency of the resonator and convert it into an electrical signal. The accuracy and sensitivity of the detection circuit directly affect the measurement accuracy of the sensor. According to the working principle of the resonator, the detection circuit can use different technologies to measure the change of the resonant frequency. For example, the detection circuit can use electrical detection, optical detection, mechanical detection, etc. Further, electrical detection can be to determine the resonant frequency by measuring the electrical characteristics of the resonator (such as impedance, phase, amplitude, etc.), which is applicable to capacitive and piezoelectric resonators. Optical detection can be to determine the resonant frequency by measuring the interference, reflection or transmission of the optical signal, which is applicable to optical fiber resonators. Mechanical detection can be to determine the resonant frequency by measuring the mechanical displacement or vibration amplitude of the resonator, which is applicable to mechanical resonators.

[0086] Furthermore, electrical detection may include phase-locked loop detection and spectrum analysis detection. Phase-locked loop (PLL) detection: the resonant frequency change of the resonator is tracked by the phase-locked loop circuit, and the corresponding electrical signal is output. Spectrum analysis detection: the spectrum characteristics of the resonator are measured by a spectrum analyzer to determine its resonant frequency. Optical detection may include optical interference detection: the resonant frequency of the optical fiber resonator is determined by measuring the interference fringes of the light wave.

[0087] Optionally, the resonator is any one of a cantilever beam resonator, a double-ended fixed beam resonator, a ring resonator, a diaphragm resonator, a columnar resonator, a comb-tooth capacitive resonator, a piezoelectric resonator, or a nanowire resonator. Among them, the cantilever beam resonator: is suitable for accelerometers, pressure sensors, and mass sensors. The double-ended fixed beam resonator: is suitable for high-precision accelerometers and gyroscopes. The ring resonator: is suitable for high-frequency filters and inertial sensors. The diaphragm resonator: is suitable for pressure sensors and acoustic sensors. The columnar resonator: is suitable for mass sensors and inertial sensors. The comb-tooth capacitive resonator: is suitable for high-frequency oscillators and inertial sensors. The piezoelectric resonator: is suitable for high-precision accelerometers, pressure sensors, and ultrasonic sensors. The nanowire resonator: is suitable for high-sensitivity sensors at the nanoscale. By way of example, the cantilever beam resonator is used as an example for explanation, Figure 5 A top view of the cantilever beam resonator is given. The cantilever beam resonator includes a main vibration electrode and two secondary vibration electrodes. The main vibration electrode is used to generate a main vibration, and the secondary vibration electrode is used to generate a secondary vibration.

[0088] Based on the above-mentioned resonant sensor module, the main oscillation frequency, main oscillation amplitude, secondary oscillation frequency and secondary oscillation amplitude can be obtained without adding additional detection circuits, thereby reducing the test cost.

[0089] In one embodiment, the resonant sensor module further includes: a temperature control module, configured to control the ambient temperature of the resonator;

[0090] Temperature compensation module, used to correct the frequency drift of the resonator at different operating temperatures;

[0091] Among them, the temperature adjustment module reuses the temperature control module, and the processor is used to make the ambient temperature of the resonant sensor module be a plurality of test temperatures respectively through the working state of the temperature control module during the test process of the PUF characteristic value; the processor is also used to control the resonator to be at a relatively stable working temperature through the working state of the temperature control module when in working state.

[0092] It should be noted that the temperature control module of this embodiment is built into the resonant sensor module, and is common to the temperature adjustment module.

[0093] The temperature compensation module corrects the frequency drift caused by temperature by software or hardware. For example, by measuring the ambient temperature and combining the pre-calibrated temperature-frequency relationship, the change of the resonant frequency is corrected in real time. It should be noted that the temperature compensation module only works when the resonant sensor module is in working state.

[0094] The temperature control module may include, but is not limited to, a temperature sensor, a heating element, a cooling element, and a controller; the temperature sensor is used to monitor the operating temperature of the resonator in real time and convert the temperature signal into an electrical signal; the controller is used to adjust the power of the heating or cooling element according to the feedback signal of the temperature sensor to maintain the resonator within a set temperature range. For example, if the temperature of the resonator is lower than the target temperature, the controller will start the heating element to increase the temperature of the resonator. The power of the heating element can be adjusted according to the size of the temperature deviation, and PWM (pulse width modulation) technology is usually used to control the heating power. If the temperature of the resonator is higher than the target temperature, the controller will start the cooling element to reduce the temperature of the resonator. The power of the cooling element can also be adjusted according to the temperature deviation to ensure that the temperature quickly returns to the set value. The target temperature may be, but is not limited to, any test temperature, which needs to be set according to the actual test requirements. The heating element may include, but is not limited to, a heating resistor; the cooling element may include, but is not limited to, a heat sink.

[0095] It should be noted that the temperature control module adopts a closed-loop feedback control mechanism, that is, the controller continuously receives the feedback signal of the temperature sensor and adjusts the power of the heating or cooling element according to the feedback signal. In this way, the temperature control module can achieve precise temperature control. Optionally, the temperature control module can also adopt any one of the control strategies such as PWM control, adaptive control and fuzzy logic control, which is not specifically limited here.

[0096] It should be noted that when the temperature rises, the frequencies of the main vibration and secondary vibration of the resonance will decrease with the increase of temperature due to the influence of thermal expansion and change of elastic modulus. The amplitudes of the main vibration and secondary vibration of the resonance will decrease with the increase of temperature due to the damping effect and thermal expansion. The temperature of the resonant sensor module can be controlled with the help of the temperature control module, and the frequency drift of the resonator at different operating temperatures can be corrected with the help of the temperature compensation module, so as to avoid the problem of inaccurate resonance parameters when the resonant sensor module resonates under the test state due to the influence of ambient temperature.

[0097] In an exemplary embodiment, when the resonant sensor module is in a working state, the temperature compensation module can correct the frequency drift of the resonator at different working temperatures to ensure the stability and reliability of the resonant sensor module during operation; when the resonant sensor module is in a testing state, the working state of the temperature control module can make the ambient temperature of the resonant sensor module be multiple groups of test temperatures, and the temperature compensation module does not work at this time.

[0098] It should be noted that the multiple groups of test temperatures may include the operating temperature or may not include the operating temperature, which needs to be selected according to the actual test requirements and is not specifically limited here; among them, the operating temperature refers to the temperature at which the resonant sensor module is working normally.

[0099] In this embodiment, based on the temperature control module, the ambient temperature of the resonator can be accurately controlled; at the same time, based on the temperature compensation module, when the resonant sensor module is in working state, the frequency drift of the resonator at different working temperatures can be corrected, thereby ensuring the stability and reliability of the resonant sensor module during operation.

[0100] In one embodiment, the resonator is a cantilever beam resonator or a double-ended fixed beam resonator, the temperature adjustment module is a heating resistor arranged on the cantilever beam or fixed beam of the resonator, and the processor is used to control the voltage or current flowing through the heating resistor to control the test temperature of the resonator.

[0101] Furthermore, the heating resistor is arranged in the secondary vibration generating area of ​​the cantilever beam or the fixed beam, and the resonance parameters are the secondary vibration frequency and the secondary vibration amplitude, that is, the response is the secondary vibration frequency and the secondary vibration amplitude.

[0102] The heating resistor refers to a resistor element used to convert electrical energy into thermal energy. The heating resistor is heated by the Joule heating effect generated when current flows through it. The secondary vibration generating area refers to a specific position on the cantilever beam or fixed beam where the secondary vibration can be generated. It needs to be determined according to the actual structure of the cantilever beam or fixed beam, and is not specifically limited here.

[0103] For example, the resonator is a cantilever beam resonator. Figure 6 As shown, Figure 6 This is a structural schematic diagram of the temperature adjustment module setting method in an embodiment of the present application; the heating resistor is set in the secondary vibration generating area of ​​the cantilever beam, and the processor can control the voltage or current flowing through the heating resistor, thereby controlling the test temperature of the resonator.

[0104] In this embodiment, the test temperature of the resonator can be accurately and quickly controlled by the heating resistor on the cantilever beam or fixed beam of the resonator, which lays a foundation for generating the PUF characteristic value of the resonant sensor.

[0105] In one embodiment, the power supply module also includes a battery, a first switch module and a driving voltage adjustment circuit. The voltage adjustment module is electrically connected to the battery through the first switch module. The first switch module controls the voltage adjustment module to output a corresponding driving voltage in response to a first test signal sent by the processor.

[0106] The driving voltage adjustment circuit is used to adjust the driving voltage of the input resonant sensor module. The driving voltage adjustment circuit can adjust the driving voltage of the input resonant sensor by adjusting the size of the resistor in the driving voltage adjustment circuit connected to the resonant sensor, thereby adjusting the driving voltage of the input resonant sensor. The resistor in the driving voltage adjustment circuit can be arranged in parallel or in series, or a variable resistance structure such as a sliding rheostat can be used, which is not specifically limited here.

[0107] In other embodiments, the driving voltage adjustment circuit may be a voltage adjustment circuit composed of one or more of a switching regulator, a resistor voltage divider, a Zener diode, and a sliding rheostat. For example, for a sliding rheostat, based on the voltage division principle, the resistance value may be changed by the position of the sliding contact of the sliding rheostat on the resistance wire to meet the need of connecting different resistance values ​​in the circuit, thereby applying voltages at different resistance values ​​to the resonant sensor module, thereby meeting the need of applying different driving voltages to the resonant sensor module.

[0108] Furthermore, the PUF characteristic value generation method further includes the following steps:

[0109] Step 1: Input multiple sets of driving voltages to the driver through a driving voltage adjustment circuit, and the excitation source generated by the driver drives the resonator to generate resonance.

[0110] Step 2: Use a detector to measure the main vibration amplitude and the secondary vibration amplitude of the resonator under each set of driving voltages to obtain multiple sets of main vibration amplitudes and secondary vibration amplitudes under different driving voltages.

[0111] Exemplarily, when the external pressure applied to the resonant sensor is zero, a detector is used to measure the main vibration amplitude and the secondary vibration amplitude of the resonator under each set of driving voltages to obtain multiple sets of main vibration amplitudes and secondary vibration amplitudes. It is understandable that the main vibration frequency and the secondary vibration frequency under each set of driving voltages measured by the detector can be measured when the resonant sensor is under the same external pressure; wherein the external pressure can be zero or atmospheric pressure, which is not specifically limited here. In this way, the main vibration amplitude and the secondary vibration amplitude of the resonator under each set of driving voltages are measured by the detector, and no additional external detection circuit is required, thereby reducing costs.

[0112] In an exemplary embodiment, Figure 7 As shown, a schematic diagram of the MEMS main oscillation frequency, secondary oscillation frequency and amplitude under the initial driving voltage is provided, where the horizontal axis is the frequency and the vertical axis is the amplitude.

[0113] In an exemplary embodiment, Figure 8As shown in FIG. 1 , a schematic diagram of the main frequency amplitude of MEMS under different driving voltages is provided, where the horizontal axis is the driving voltage and the vertical axis is the vibration amplitude. Fig. 9 As shown, a schematic diagram of the secondary vibration amplitude of MEMS under different driving voltages is provided, where the horizontal axis is the driving voltage and the vertical axis is the vibration amplitude.

[0114] Step 3, generating PUF characteristic values ​​is specifically as follows: using multiple groups of driving voltages and multiple groups of test temperatures as excitations, and using the primary oscillation amplitude and secondary oscillation amplitude under each group of driving voltages, and the resonance parameters under each group of test temperatures as responses to generate PUF characteristic values.

[0115] The PUF characteristic value includes excitation and response. The excitation can be multiple groups of driving voltages, and the response is the primary oscillation amplitude and the secondary oscillation amplitude corresponding to each group of driving voltages.

[0116] It should be noted that when the driving voltage of the resonator of the MEMS resonant sensor changes, the changes in the main vibration amplitude and the secondary vibration amplitude are as follows:

[0117] Main oscillation amplitude: Under low driving voltage, the main oscillation amplitude is proportional to the driving voltage, and the amplitude increases linearly with the driving voltage; when the driving voltage increases to a certain level, the increase rate of the amplitude will slow down, or even reach saturation. In addition, the increase in temperature may inhibit the further increase of the amplitude.

[0118] Secondary vibration amplitude: At low driving voltage, the secondary vibration amplitude is small; when the driving voltage increases to a certain extent, the secondary vibration amplitude may increase, especially when modal coupling occurs between the primary vibration mode and the secondary vibration mode. However, the temperature increase may inhibit the further increase of the secondary vibration amplitude.

[0119] Furthermore, in order to ensure the stability and accuracy of the resonator under different driving voltages, the driving voltage can be controlled within a certain range to avoid the resonator operating in a nonlinear vibration state during the test.

[0120] In an exemplary embodiment, the number of PUF characteristic values ​​can be multiple, which is not specifically limited here; the PUF characteristic values ​​are shown in Table 2, and multiple groups of driving voltages and multiple groups of test temperatures are used as excitations, and the main vibration amplitude and secondary vibration amplitude under each group of driving voltages, as well as the resonance parameters under each group of test temperatures are used as responses to generate PUF characteristic values. It should be noted that by controlling the temperature of the resonant sensor module through the temperature control module recorded in the above embodiment, it is possible to ensure that the main vibration amplitude and secondary vibration amplitude of the resonator under different driving voltages are obtained, thereby obtaining the excitation-response pair required by the PUF technology.

[0121] Table 2 PUF characteristic values

[0122]

[0123] The above-mentioned method for generating PUF characteristic values ​​of resonant sensors utilizes the fact that the main oscillation amplitude and the secondary oscillation amplitude of the resonant sensor are different under different driving voltages, but the main oscillation amplitude and the secondary oscillation amplitude under different driving voltages have unique and stable characteristics. Multiple groups of driving voltages and multiple groups of test temperatures are used as excitations, and the main oscillation amplitude and the secondary oscillation amplitude under each group of driving voltages, as well as the resonance parameters under each group of test temperatures are used as responses to generate the PUF characteristic values ​​of the sensor. There is no need to increase additional design and production costs, which reduces the PUF cost. Furthermore, the response parameters are increased, thereby improving the uniqueness of the PUF and the difference in PUF characteristic values ​​of different sensors.

[0124] In an exemplary embodiment, Fig.10 As shown, a resonant sensor PUF key generation method is provided, comprising the following steps:

[0125] Step 1002: Combine the obtained PUF characteristic values ​​to obtain multiple CRP stimulus-response pairs.

[0126] The PUF characteristic value obtained can be determined based on the PUF characteristic value generation method recorded in any of the above embodiments, which will not be described in detail here. CRP: Challenge and Response Pair, refers to the pairing of independent challenges and responses during the device authentication process. The combination method can be implemented by the existing combination method, which will not be described in detail here.

[0127] Exemplarily, the resonant sensor obtains a PUF characteristic value determined based on the PUF characteristic value generation method recorded in any of the above embodiments, and combines the obtained PUF characteristic values ​​to obtain multiple CRP stimulus-response pairs.

[0128] Step 1004: Perform analog-to-digital conversion on the response in the CRP stimulus-response pair to obtain bit data.

[0129] It is understandable that analog-to-digital conversion can be achieved through existing methods, which will not be elaborated here.

[0130] Step 1006: Process the bit data using a hash algorithm to generate a PUF key.

[0131] Among them, the hash algorithm can convert an input of any length into an output of a fixed length. This output is called a hash value or hash value, which is used for authentication. This method can effectively prevent the key from being predicted or copied, and improve security. The hash algorithm can be, but is not limited to, any one of SM3, MD5 (Message Digest Algorithm 5), and RIPEMD (RACE Integrity Primitives Evaluation Message Digest).

[0132] In the above PUF key generation method, the security and reliability of the PUF key can be enhanced by performing analog-to-digital conversion and hash algorithm processing on the CRP stimulus-response pair.

[0133] Furthermore, the PUF key can also be stored in a security verification device, server or cloud server of the resonant sensor to perform security verification on the resonant sensor, which can effectively improve the security verification effect of the resonant sensor, improve security and reliability, and is suitable for resource-constrained platforms.

[0134] It is worth noting that PUF can be used to verify the identity of the device, ensuring that only legitimate devices can access the system or network, and can be used to verify the integrity of the firmware, ensuring that the device loads authenticated firmware when it starts up, preventing malware or firmware tampering, and can also verify the authenticity of the product, etc. In order to ensure the performance and reliability of the sensor, the sensor needs to be securely verified. In an exemplary embodiment, a security verification method for a resonant sensor is provided, such as Fig.11 As shown, the following steps are included:

[0135] Step 1102, provide a resonant sensor to be tested, connect a security verification device to the resonant sensor to be tested, turn on the power of the resonant sensor, and store the PUF key of the resonant sensor to be tested generated by the above-mentioned PUF key generation method in the security verification device.

[0136] The PUF key may be generated in the manner described in the above embodiments but is not limited thereto, which will not be described in detail here. The type of the resonant sensor to be tested may be the resonant sensor described in any of the above embodiments, and the structure of the resonant sensor to be tested will not be described in detail here.

[0137] Step 1104: the security verification device generates a first random number and sends it to the resonant sensor to be tested. The resonant sensor to be tested takes the first random number as a challenge and generates a first response.

[0138] The first random number may be generated by a pseudo-random number generator or a time-based random number generator, which is not specifically limited here.

[0139] Step 1106: The resonant sensor to be tested encrypts the first random number to obtain a second response, and sends the second response to the security verification device. The encryption key of the first random number is the first response.

[0140] Step 1108: Use the PUF key stored in the security verification device as a decryption key to decrypt the second response to obtain a second random number.

[0141] Step 1110: compare the second random number with the first random number. If the two are the same, determine that the resonant sensor to be tested is a safety device.

[0142] In the above-mentioned security verification method of the resonant sensor, by using the PUF key and the challenge-response mechanism, the security verification of the resonant sensor is achieved, the security and authenticity of the sensor are ensured, and unauthorized access and potential cloning attacks are effectively prevented, thereby enhancing security and anti-attack capabilities.

[0143] Furthermore, according to actual application requirements, the security verification of the resonant sensor can be: for the registration of a device (e.g., a resonant sensor), when used for the first time, the device sends a challenge-response pair (CRP) generated by its PUF to the authentication server. The server compares these CRPs with the pre-stored CRPs to verify the authenticity of the device. If the match is successful, the device will be registered as a legitimate device and assigned a unique identifier.

[0144] Then, for actual application needs, there may be a situation where random numbers are used in combination with challenges in CRP. In this case, the verification server will generate a random number and use it as part of the challenge, combined with the random number and the incentive in CRP. Based on the combination of the random number and the incentive in CRP, the challenge is determined, a response is generated, and the response is returned to the server. The server regenerates the expected response with the same random number and compares it with the received response. In this method, random numbers are introduced on the basis of CRP to ensure that the challenge used for each verification is unique and prevent replay attacks. In addition, random numbers increase the security of the system, making it difficult for attackers to predict or guess the content of the challenge.

[0145] In an exemplary embodiment, a resonant sensor to which any one of the above-mentioned PUF characteristic value generation methods can be applied is provided.

[0146] The resonant sensor includes: a power module, a processor, a storage module, an interface module, and a resonant sensor module. The power module is used to provide power to the processor, the storage module, the interface module, and the resonant sensor module; the power module includes a battery and a voltage adjustment module. The processor is used to control the working state of the power module, and the processor is also used to control the change of the driving voltage value output by the power module to the resonant sensor module in response to the test signal of the external test equipment.

[0147] Wherein, when the resonant sensor is in a testing state, the battery is electrically connected to the resonant sensor module via the voltage adjustment module, and when the resonant sensor is in a working state, the battery directly supplies power to the resonant sensor module.

[0148] In a specific embodiment, see Fig.12 The power module includes a battery U1 and a first switch module S1. The voltage adjustment module 110 is electrically connected to the battery U1 through the first switch module S1. The first switch module S1 responds to a first test signal sent by a processor (not shown in the figure) to turn on or off the connection between the voltage adjustment module 110 and the battery U1. The voltage adjustment module 110 responds to a voltage signal sent by the processor to adjust the driving voltage value output to the resonant sensor module.

[0149] Specifically, the voltage adjustment module includes k voltage output nodes, and resistors R1 to Rk connected in series in sequence, where k is a positive integer, and a voltage output node is arranged between two adjacent resistors. The first switch module S1 responds to the first test signal sent by the processor, and selects to connect the corresponding voltage output node to control the voltage adjustment module 110 to output the corresponding driving voltage V1.

[0150] It should be noted that when it is necessary to output different driving voltage values ​​to the resonant sensor module, the voltage division principle can be used to connect different numbers of resistors according to different needs, so that the voltages on different numbers of resistors can be applied to the resonant sensor module, thereby meeting the needs of applying different driving voltages to the resonant sensor module. Based on this, the driving voltage can be automatically adjusted at the hardware or software level, reducing labor costs and improving test efficiency.

[0151] Optionally, the voltage adjustment module is a sliding resistor.

[0152] It should be noted that, based on the voltage division principle, the resistance value can be changed by the position of the sliding contact of the sliding rheostat on the resistance wire to meet the need to connect different resistance values ​​in the circuit, thereby applying voltages at different resistance values ​​to the resonant sensor module, thereby meeting the need to apply different voltages to the resonant sensor module, and then obtaining the excitation-response pair required for PUF technology.

[0153] In a specific embodiment, the driving voltage of the resonant sensor module increases, the main oscillation frequency and the secondary oscillation frequency of the resonator remain unchanged, and the main oscillation amplitude and the secondary oscillation amplitude of the resonator increase; the driving voltage of the resonant sensor module decreases, the main oscillation frequency and the secondary oscillation frequency of the resonator remain unchanged, and the main oscillation amplitude and the secondary oscillation amplitude of the resonator decrease.

[0154] In a specific embodiment, the power supply module further includes an inverter disposed between the voltage adjustment module and the resonant sensor module, for converting the direct current output by the voltage adjustment module into alternating current.

[0155] It should be noted that the inverter can convert direct current (DC) into alternating current (AC), that is, convert the DC from batteries, solar panels or other DC power sources into standard AC, so that electronic devices that require AC can work normally. The inverter can not only realize the conversion of electrical energy forms, but also control the output voltage and frequency to ensure the quality and stability of the output power to meet the needs of different loads. In addition, the inverter also has a protection function to prevent faults such as overload, short circuit and voltage fluctuation, ensuring the safe and reliable operation of the system.

[0156] Optionally, in an exemplary embodiment, when the resonant sensor to be tested is a wireless MEMS sensor, the safety verification device of the resonant sensor also includes an antenna module and a communication module. The antenna module enables the device to transmit data wirelessly without physical connection, and the communication module enables it to exchange data with an external system, including sending data collected by the sensor and receiving external instructions.

[0157] Furthermore, in an exemplary embodiment, a safety verification device for a resonant sensor is provided, such as Fig.13 As shown, a schematic diagram of the structure of a safety verification device for a resonant sensor is provided. The safety verification device can use the above-mentioned safety verification method to perform safety verification on the resonant sensor. The safety verification device includes:

[0158] A memory 1302, used to store the PUF keys of multiple resonant sensors generated in any of the above embodiments;

[0159] A random number generation module 1304, configured to generate a first random number;

[0160] A decryption module 1306 is used to decrypt the second response returned by the resonant sensor using the PUF key to obtain a second random number;

[0161] A comparison module 1308, configured to compare the second random number with the first random number to obtain a comparison result;

[0162] The display module 1310 is used to display the comparison result and / or display the first random number and the second random number.

[0163] The above-mentioned security verification device uses the first random number as a challenge to the resonant sensor to be tested to generate a first response, and uses the PUF key to decrypt the second response obtained after encryption based on the first random number to obtain a second random number, and performs security verification on the resonant sensor to be tested by comparing the first random number with the second random number. This method uses the PUF key and the challenge-response mechanism to achieve security verification of the resonant sensor, ensure the authenticity of the sensor and the security of the data, thereby enhancing security and anti-attack capabilities.

[0164] It should be understood that, although the various steps in the flowcharts involved in the above-mentioned embodiments are displayed in sequence according to the indication of the arrows, these steps are not necessarily executed in sequence according to the order indicated by the arrows. Unless there is a clear explanation in this article, the execution of these steps does not have a strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in the flowcharts involved in the above-mentioned embodiments can include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily to be carried out in sequence, but can be executed in turn or alternately with other steps or at least a part of the steps or stages in other steps.

[0165] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0166] In one embodiment, a computer program product is provided, including a computer program, which implements the steps in the above method embodiments when executed by a processor.

[0167] In one embodiment, a computer device is further provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps in the above method embodiments when executing the computer program.

[0168] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0169] In addition, the terms "first" and "second" are used only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, device, product or equipment that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0170] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0171] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0172] The technical features of the above embodiments can be combined without changing the basic principles of the present application. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0173] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A method for generating a PUF characteristic value of a resonant sensor, characterized in that: include: Providing a resonant sensor, turning on the power of the resonant sensor, the resonant sensor comprising a power module, a processor, a temperature adjustment module and a resonant sensor module, the processor being used to adjust the ambient temperature of the resonant sensor module through the temperature adjustment module; The temperature adjustment module is used to adjust the ambient temperature of the resonant sensor module to a plurality of test temperatures. The resonance parameters of the resonant sensor module are measured at each test temperature; the resonance parameters include a main oscillation frequency and a main oscillation amplitude, or the resonance parameters include a main oscillation frequency, a main oscillation amplitude, and a secondary oscillation frequency, or the resonance parameters include a main oscillation frequency, a main oscillation amplitude, a secondary oscillation frequency, and a secondary oscillation amplitude; The plurality of test temperatures are used as excitations, and the resonance parameters at each test temperature are used as responses to generate PUF characteristic values.

2. The PUF feature value generation method according to claim 1, characterized in that: The resonant sensor module comprises: a resonator, wherein the resonator generates resonance under the action of an excitation source, and the resonance comprises a primary vibration and a secondary vibration; A driver connected to the resonator, the driver is used to generate an excitation source to drive the resonator to resonate; A detector connected to the resonator, wherein the detector is used to detect a resonance parameter of the resonator.

3. The PUF feature value generation method according to claim 2, characterized in that: The resonator is a cantilever beam resonator, a double-ended fixed beam resonator, a ring resonator, a diaphragm resonator, a columnar resonator, a comb-tooth capacitor resonator, a piezoelectric resonator, or a nanowire resonator.

4. The PUF feature value generation method according to claim 3, characterized in that: The resonant sensor module further comprises: a temperature control module, used to control the ambient temperature of the resonator; A temperature compensation module, used to correct the frequency drift of the resonator at different operating temperatures; Among them, the temperature adjustment module reuses the temperature control module, and the processor is used to make the ambient temperature of the resonant sensor module be a plurality of groups of test temperatures respectively through the working state of the temperature control module during the test process of the PUF characteristic value; the processor is also used to control the resonator to be at a relatively stable working temperature through the working state of the temperature control module in the working state.

5. The PUF feature value generation method according to claim 3, characterized in that: The resonator is a cantilever beam resonator or a double-ended fixed beam resonator, the temperature adjustment module is a heating resistor arranged on the cantilever beam or fixed beam of the resonator, and the processor is used to control the voltage or current flowing through the heating resistor to control the test temperature of the resonator.

6. The PUF feature value generation method according to claim 5, characterized in that: The heating resistor is arranged in the secondary vibration generating area of ​​the cantilever beam or the fixed beam, and the resonance parameters are the secondary vibration frequency and the secondary vibration amplitude.

7. The PUF feature value generation method according to claim 3, characterized in that: The power module further includes a driving voltage adjustment circuit, and the PUF characteristic value generation method further includes: The plurality of driving voltages are input to the driver through the driving voltage adjustment circuit, and the excitation source generated by the driver drives the resonator to generate resonance; The detector is used to measure the main vibration amplitude and the secondary vibration amplitude of the resonator under each set of driving voltages, so as to obtain multiple sets of main vibration amplitudes and secondary vibration amplitudes under different driving voltages; The generating of the PUF characteristic value is specifically as follows: using the multiple groups of the driving voltages and the multiple groups of the test temperatures as excitations, and using the primary oscillation amplitude and the secondary oscillation amplitude under each group of driving voltages, and the resonance parameters under each group of test temperatures as responses, to generate the PUF characteristic value.

8. The method for generating a PUF characteristic value according to any one of claims 1 to 7, characterized in that: The resonant sensor is a MEMS sensor or an NMES sensor; the resonant sensor is a resonant pressure sensor, a resonant force sensor, a resonant displacement sensor, a resonant mass sensor, a resonant strain sensor, a resonant flow sensor, a resonant torque sensor, a resonant vibration sensor, a resonant liquid level sensor, a resonant gyroscope, a resonant gas sensor, a resonant magnetic sensor, a resonant biosensor, a resonant humidity sensor, a resonant temperature sensor, a resonant chemical sensor, a resonant acceleration sensor, and a resonant inertial sensor.

9. A resonant sensor PUF key generation method, characterized in that: include: Combining the PUF characteristic values ​​obtained by the PUF characteristic value generation method according to any one of claims 1 to 8 to obtain a plurality of CRP stimulus-response pairs; Performing analog-to-digital conversion on the response in the CRP stimulus-response pair to obtain bit data; The bit data is processed using a hash algorithm to generate a PUF key.

10. The resonant sensor PUF key generation method according to claim 9, characterized in that: The method also includes storing the PUF key in a security verification device of the resonant sensor.

11. A method for safety verification of a resonant sensor, characterized in that: include: A resonant sensor to be tested is provided, a security verification device is connected to the resonant sensor to be tested, and a power supply of the resonant sensor is turned on, wherein the security verification device stores a PUF key of the resonant sensor to be tested generated by the PUF key generation method according to claim 9 or claim 10; The security verification device generates a first random number and sends the first random number to the resonant sensor to be tested, and the resonant sensor to be tested takes the first random number as a challenge and generates a first response; The resonant sensor to be tested encrypts the first random number to obtain a second response, and sends the second response to the security verification device, wherein the encryption key of the first random number is the first response; Decrypting the second response using the PUF key stored in the security verification device as a decryption key to obtain a second random number; The second random number is compared with the first random number, and if the two are the same, it is determined that the resonant sensor to be tested is a safety device.

12. A safety verification device for a resonant sensor, characterized in that: The safety verification device can use the safety verification method of claim 11 to perform safety verification on the resonant sensor, and the safety verification device includes: A memory, used to store PUF keys of multiple resonant sensors generated by the method of claim 9; A random number generation module, used to generate a first random number; A decryption module, configured to decrypt a second response returned by the resonant sensor using the PUF key to obtain a second random number; A comparison module, used for comparing the second random number with the first random number to obtain a comparison result; A display module is used to display the comparison result and / or display the first random number and the second random number.

13. A resonant sensor to which the PUF characteristic value generation method according to any one of claims 1 to 8 can be applied.

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