PCB (Printed Circuit Board) copper plating device and production method for improving PCB production deposition efficiency by adopting same

Abstract

The invention relates to the technical field of PCB electroplating, in particular to a PCB copper plating device and a production method for improving the PCB production deposition efficiency through the PCB copper plating device, the PCB copper plating device comprises a frame body provided with a containing cavity, a liquid containing piece provided with a processing groove, a hanging mechanism and a driving mechanism, and the driving mechanism is arranged at the top of the frame body; the movable end of the driving mechanism is connected with an installation part located in the containing cavity, the liquid containing part is arranged in the containing cavity and located under the installation part, the hanging mechanism is detachably connected with the installation part and provided with a plurality of parallel hanging positions used for hanging PCBs to be plated with copper, the processing tank is provided with a plurality of spaced electroplating areas corresponding to the PCBs to be plated with copper, and the electroplating areas correspond to the PCBs to be plated with copper. The driving mechanism drives the mounting part to drive the hanging mechanism to ascend and descend, so that the PCBs to be subjected to copper plating enter or leave the electroplating areas, the PCBs to be subjected to copper plating synchronously move up and down and are subjected to copper plating synchronously, and the copper plating efficiency of the PCBs to be subjected to copper plating is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of PCB electroplating, and in particular to a PCB copper plating device and a production method for improving the deposition efficiency of PCB production by using the same. Background Art

[0002] Copper plating is the most widely used pre-plating in the electroplating industry to improve the bonding strength of the plating. In the process of PCB board production, the role of copper plating is very important. PCB printed circuit board copper plating refers to printing the circuit board by electroplating copper on the surface of the circuit board and the hole wall. Copper plating refers to depositing a layer of copper plating on the circuit board and the hole wall by electroplating copper to meet customer needs. Deep hole copper plating is the key process of printed circuit boards.

[0003] To copper plate the surface of a PCB, the PCB is usually placed in a copperizing solution, first chemically copper plated on the PCB, and then electroplated to make the copper layer more solid. Depending on different needs, copper plating can be performed multiple times to obtain a thicker copper layer.

[0004] In the related art, the electroplating system for copper plating of PCB boards uses a motor to drive a conveyor belt to load the PCB boards to be copper plated, and the endless belt plate drives it to move and completes the electroplating during the movement. At present, there is also a vertical electroplating equipment, which is equipped with a special electroplating rack corresponding to the product to be electroplated, and the electroplating rack enters the electroplating tank at the same time as the PCB product. The structure is complicated. Both types of copper plating equipment cannot support the copper plating operation of multiple PCB boards at one time, and the efficiency of the copper plating process is greatly reduced. Summary of the invention

[0005] The object of the present invention is to provide a PCB copper plating device, aiming to achieve the purpose of simultaneously copper plating a plurality of PCB boards to be copper plated in a single operation to improve the copper plating efficiency.

[0006] In order to achieve the above-mentioned purpose, the present invention provides a PCB copper plating device, comprising a frame provided with a cavity, a liquid holding member provided with a processing tank, a mounting mechanism and a driving mechanism, wherein the driving mechanism is arranged on the top of the frame, the movable end of the driving mechanism is connected to a mounting member located in the cavity, the liquid holding member is arranged in the cavity and is located directly below the mounting member, the mounting mechanism is detachably connected to the mounting member, the mounting mechanism is provided with a plurality of parallel mounting positions for hanging PCB boards to be copper plated, the processing tank is provided with a plurality of spaced electroplating areas corresponding to the PCB boards to be copper plated, and the driving mechanism drives the mounting member to drive the mounting mechanism to rise and fall, so that a plurality of PCB boards to be copper plated enter or leave the plurality of electroplating areas.

[0007] Optionally, the PCB copper plating device further comprises a plurality of anode plates connected to the positive pole of a power supply, each of the anode plates being arranged on one side corresponding to the electroplating area, and the PCB board to be copper plated is located on the other side of the electroplating area and electrically connected to the negative pole of the power supply.

[0008] Optionally, a cathode electrode is provided in the electroplating area on the opposite side of the anode plate, and an electrical connection portion is provided at the mounting position, and the PCB board to be copper plated is electrically connected to the cathode electrode via the electrical connection portion.

[0009] Optionally, the plurality of anode plates are arranged on the same side of the plurality of electroplating areas.

[0010] Optionally, the liquid containing part includes a shell having the processing tank and a plurality of partition plates, wherein the plurality of partition plates are spaced apart in the processing tank and are detachably connected to the shell to divide the processing tank space into a plurality of electroplating zones, and the side edges of the plurality of partition plates are spaced apart from the shell to allow the electrolytes in the plurality of electroplating zones to communicate with each other.

[0011] Optionally, a liquid inlet structure and a liquid discharge structure are provided at intervals at the bottom of the liquid holding member, and an overflow structure is provided on the side wall of the liquid holding member adjacent to the notch.

[0012] Optionally, a first opening and a second opening are provided on opposite sides of the cavity, a line connecting the first opening and the second opening is perpendicular to an arrangement direction of a plurality of PCB boards to be copper plated, and the mounting mechanism feeds material from the first opening and discharges material from the second opening.

[0013] Optionally, a stopper is provided on the frame, and a limiter is provided on the mounting mechanism, and the limiter abuts against the stopper to limit the position, so that the PCB board to be copper-plated is located directly above the processing tank.

[0014] The present invention provides a production method for improving the deposition efficiency of PCB production by using the above PCB copper plating device, and the production method comprises the following steps:

[0015] S1. Pre-install the PCB to be copper plated on the mounting mechanism and place it into the loading station from the loading end;

[0016] S2. The mounting mechanism carrying the PCB to be copper plated is horizontally transferred to the top of the processing tank, and the driving mechanism drives the mounting member together with the mounting mechanism and the PCB to be copper plated to move downward into the processing tank;

[0017] S3. The copper-plated PCB board enters the treatment tank and is immersed in the electrolyte and connected to the negative electrode of the power supply. The copper-plated PCB board and the anode plate connected to the positive electrode of the power supply undergo an electrochemical reaction in the electrolyte in the tank to achieve copper plating of the PCB board;

[0018] S4. The drive mechanism transports the mounting mechanism upward and leaves the processing tank, and transports the mounting mechanism and the PCB board to the top of the next processing tank for the next process;

[0019] S5. Repeat the above steps until the processing is completed and the mounting mechanism reaches the unloading end for unloading.

[0020] The PCB copper plating device of the present invention comprises a frame provided with a cavity, a liquid holding member provided with a processing tank, a mounting mechanism and a driving mechanism, wherein the driving mechanism is arranged on the top of the frame, the movable end of the driving mechanism is connected with a mounting member located in the cavity, the liquid holding member is arranged in the cavity and is located directly below the mounting member, the mounting mechanism is detachably connected with the mounting member, the mounting mechanism is provided with a plurality of parallel mounting positions for hanging PCB boards to be copper-plated, the processing tank is provided with a plurality of spaced electroplating areas corresponding to the PCB boards to be copper-plated, the driving mechanism drives the mounting member to drive the mounting mechanism up and down, so that a plurality of PCB boards to be copper-plated enter or leave a plurality of electroplating areas, thereby realizing the operation of synchronously moving up and down and performing copper plating on a plurality of PCB boards to be copper-plated, and effectively improving the copper plating efficiency of the PCB boards to be copper-plated. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the PCB copper plating device of the present invention.

[0022] Figure 2 It is a side structural schematic diagram of the PCB board copper plating device of the present invention, when the PCB board to be copper-plated has not entered the processing tank.

[0023] Figure 3 It is a schematic diagram of the liquid holding part and the internal cross-sectional structure of the PCB copper plating device of the present invention.

[0024] Figure 4 This is a side structural schematic diagram of a PCB board to be copper-plated entering a processing tank of the PCB board copper plating device of the present invention.

[0025] In the figure: 100, PCB copper plating device; 10, frame; 10A, cavity; 10B, first port; 10C, second port; 20, mounting member; 30, liquid storage member; 30A, treatment tank; 30B, electroplating area; 30C, overflow port; 31, shell; 33, partition plate; 40, anode plate; 50, mounting mechanism; 51, mounting plate; 53, mounting position; 55, power connection part; 57, limiter; 61, liquid inlet structure; 63, liquid discharge structure; 65, overflow structure; 70, driving mechanism; 80, horizontal transfer mechanism; 81, horizontal motor; 83, driving wheel; 85, passive wheel; 900, PCB to be copper plated. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present invention clearer and more understandable, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings.

[0027] Copper plating is the most widely used pre-plating in the electroplating industry to improve the bonding strength of the plating. In the process of PCB board production, the role of copper plating is very important. PCB printed circuit board copper plating refers to printing the circuit board by electroplating copper on the surface of the circuit board and the hole wall. Copper plating refers to depositing a layer of copper plating on the circuit board and the hole wall by electroplating copper to meet customer needs. Deep hole copper plating is the key process of printed circuit boards.

[0028] To copper plate the surface of a PCB, the PCB is usually placed in a copperizing solution, first chemically copper plated on the PCB, and then electroplated to make the copper layer more solid. Depending on different needs, copper plating can be performed multiple times to obtain a thicker copper layer.

[0029] In the related art, the electroplating system for copper plating of PCB boards uses a motor to drive a conveyor belt to load the PCB boards to be copper plated, and the endless belt plate drives it to move and completes the electroplating during the movement. At present, there is also a vertical electroplating equipment, which is equipped with a special electroplating rack corresponding to the product to be electroplated, and the electroplating rack enters the electroplating tank at the same time as the PCB product. The structure is complicated. Both types of copper plating equipment cannot support the copper plating operation of multiple PCB boards at one time, and the efficiency of the copper plating process is greatly reduced.

[0030] like Figures 1 to 4 As shown, in order to achieve the above-mentioned purpose, the present invention provides a PCB copper plating device 100. Figure 1 The PCB copper plating device 100 includes a frame 10 with a cavity 10A, a liquid holding member 30 with a processing tank 30A, a mounting mechanism 50 and a driving mechanism 70. The driving mechanism 70 is arranged on the top of the frame 10. The movable end of the driving mechanism 70 is connected to the mounting member 20 located in the cavity 10A. The liquid holding member 30 is arranged in the cavity 10A and is located directly below the mounting member 20. The mounting mechanism 50 is detachably connected to the mounting member 20. The mounting mechanism 50 is provided with a plurality of parallel mounting positions 53 for hanging the PCB board 900 to be copper plated. The processing tank 30A is provided with a plurality of spaced electroplating areas 30B corresponding to the PCB board 900 to be copper plated. The driving mechanism 70 drives the mounting member 20 to drive the mounting mechanism 50 to rise and fall, so that a plurality of PCB boards 900 to be copper plated enter or leave the plurality of electroplating areas 30B.

[0031] The PCB copper plating device 100 of the present invention includes a frame 10 provided with a cavity 10A, a liquid holding member 30 provided with a processing tank 30A, a mounting mechanism 50 and a driving mechanism 70. The driving mechanism 70 is arranged on the top of the frame 10. The movable end of the driving mechanism 70 is connected to the mounting member 20 located in the cavity 10A. The liquid holding member 30 is arranged in the cavity 10A and is located directly below the mounting member 20. The mounting mechanism 50 is detachably connected to the mounting member 20. The mounting mechanism 50 is provided with a plurality of parallel mounting positions 53 for hanging the PCB board 900 to be copper-plated. The processing tank 30A is provided with a plurality of spaced electroplating areas 30B corresponding to the PCB board 900 to be copper-plated. The driving mechanism 70 drives the mounting member 20 to drive the mounting mechanism 50 to rise and fall, so that the plurality of PCB boards 900 to be copper-plated enter or leave the plurality of electroplating areas 30B, thereby realizing the synchronous up and down movement of the plurality of PCB boards 900 to be copper-plated and the synchronous copper plating operation, thereby effectively improving the copper plating efficiency of the PCB boards 900 to be copper-plated.

[0032] The arrangement direction of multiple PCB boards to be copper plated is defined as the X-axis direction, and the lifting direction of the PCB boards is defined as the Z-axis direction. The directions perpendicular to the X-axis and the Z-axis are defined as the Y-axis direction. The intersection of the X-axis, the Y-axis and the Z-axis is the origin O, and the three axes and the origin O together form a spatial rectangular coordinate system O-XYZ. The following describes each embodiment using this coordinate system as the orientation standard.

[0033] Furthermore, a guide rod is provided at the top of the cavity 10A downward along the Z-axis direction, a guide portion is provided on the edge of the mounting member 20 and passes through the mounting member 20, and a guide portion is provided on both sides of the mounting member 20 along the X-axis direction. The guide portion can be configured as a U-shaped slot, and the notches of the U-shaped slots on both sides are opposite. The guide rod is slidably penetrated in the U-shaped slot to guide the movement direction of the mounting member 20 and the mounting mechanism 50 driven by the mounting member 20, thereby improving the linearity of the lifting direction, ensuring that each PCB to be copper-plated accurately enters the electroplating area 30B directly below it, and improving the reliability of the electroplating accuracy.

[0034] It can be understood that the guide rods and the U-shaped slots are arranged in a one-to-one correspondence, and the number of the guide rods is at least two located on both sides. Multiple guide rods can also be arranged as needed to improve the flexibility of the guide layout.

[0035] Optionally, a first opening 10B and a second opening 10C are provided on both sides of the cavity 10A, and the line connecting the first opening 10B and the second opening 10C is perpendicular to the arrangement direction of the multiple PCB boards 900 to be copper-plated, and the mounting mechanism 50 feeds materials from the first opening 10B and discharges materials from the second opening 10C.

[0036] In this embodiment, the line connecting the first through-port 10B and the second through-port 10C is the Y-axis direction, and the arrangement direction of the plurality of PCB boards 900 to be copper plated is the X-axis direction. The mounting mechanism 50 can pre-assemble the plurality of PCB boards 900 to be copper plated, and then feed the materials through the first through-port 10B and detachably connect the mounting member 20 through the mounting position 53. After the copper plating is completed, the mounting position 53 and the mounting member 20 are disassembled and the materials are discharged through the second through-port 10C. At this time, the next mounting mechanism 50 can continuously feed the materials through the first through-port 10B, thereby improving the operation efficiency of the process.

[0037] Optionally, a stopper is provided on the frame 10, and a limiter 57 is provided on the mounting mechanism 50. The limiter 57 abuts against the stopper to limit the position so that the PCB board 900 to be copper-plated is located directly above the processing tank 30A.

[0038] In the present embodiment, when the mounting member 20 and the mounting mechanism 50 are fully assembled, the stop portion on the frame 10 abuts against the limiter 57 of the mounting mechanism 50 to limit the position, thereby improving the alignment accuracy between the PCB board 900 to be copper-plated and the processing tank 30A. At the same time, it also ensures the alignment accuracy between each PCB board 900 to be copper-plated and the electroplating area 30B directly below it, ensures the electroplating zoning accuracy, avoids electroplating interference between adjacent PCB boards 900 to be copper-plated, and improves the copper plating efficiency and copper plating quality.

[0039] Combined with reference Figure 3 As shown, optionally, the PCB board copper plating device 100 also includes multiple anode plates 40 connected to the positive pole of the power supply, each anode plate 40 is arranged on one side of the corresponding electroplating area 30B, and the PCB board 900 to be copper plated is located on the other side of the electroplating area 30B and is electrically connected to the negative pole of the power supply.

[0040] In this embodiment, the positive and negative electrodes of the power supply are respectively connected to the anode plate 40 and the PCB board 900 to be copper plated, thereby forming an electrolytic circuit. Specifically, each PCB board 900 to be copper plated enters the electroplating area 30B of the processing tank 30A and is immersed in the electrolyte and connected to the negative electrode of the power supply. The PCB board and the anode plate 40 connected to the positive electrode of the power supply react through the electrolyte in the tank to achieve copper plating of the PCB board.

[0041] Optionally, multiple anode plates 40 are arranged on the same side of multiple electroplating areas 30B, so that the setting position of the anode plates 40 is regular and the setting position of the positive pole of the power supply is fixed, avoiding the risk of cross-current between adjacent electroplating areas 30B. It also facilitates the fixation of the mounting position 53 on the mounting mechanism 50 and the setting position of the PCB board 900 to be copper-plated, thereby facilitating standardized operations.

[0042] Optionally, a cathode electrode is provided in the electroplating area 30B on the opposite side of the anode plate 40 , and a power connection portion 55 is provided at the mounting position 53 , and the PCB board 900 to be copper plated is electrically connected to the cathode electrode via the power connection portion 55 .

[0043] In this embodiment, the mounting mechanism 50 includes a mounting plate 51, a mounting position 53 provided on the mounting plate 51, and a power connection portion 55 provided at the end of the mounting position 53, wherein the mounting plate 51 is provided in the form of a U-shaped plate, an assembly portion is formed at the end of the U-shaped side wall of the U-shaped plate, and the assembly portion is detachably connected to the mounting member 20, and multiple mounting positions 53 are provided at the bottom of the U-shaped plate facing away from the mounting member 20. The mounting plate 51 is provided with at least two mounting positions 53 corresponding to each PCB board 900 to be copper-plated, and the connecting line of the mounting positions 53 of the same PCB board 900 to be copper-plated is arranged along the Y-axis.

[0044] Each mounting position 53 is provided with a mounting groove, and the PCB board 900 to be copper plated is provided with a hanging hole, and the groove wall of the mounting groove passes through the hanging hole to hang the PCB board 900 to be copper plated. Among them, the mounting groove is a step groove with different upper and lower groove widths, and the upper groove width is greater than the lower groove width to facilitate the early hanging assembly of the hanging hole of the PCB board 900 to be copper plated and the groove wall of the mounting groove, and the lower groove width is slightly greater than or equal to the thickness of the PCB board 900 to be copper plated, so that the PCB board 900 to be copper plated can be relatively limited by the groove wall of the lower groove after hanging and assembling to prevent the PCB board 900 to be copper plated from shaking.

[0045] Furthermore, the power connection part 55 is arranged on the wall of the mounting groove, and after the mounting assembly, the power connection part 55 is electrically connected to the PCB board 900 to be copper plated. When the driving mechanism 70 drives the mounting member 20 to drive the mounting mechanism 50 downward to completely enter the processing tank 30A, the other end of the power connection part 55 is electrically connected to the negative electrode to successfully connect the PCB board 900 to be copper plated to the electrolytic circuit, thereby performing the electrolytic copper plating operation. The setting of the step groove of the mounting groove also improves the reliability of the electrical connection between the power connection part 55 and the PCB board 900 to be copper plated.

[0046] Furthermore, the PCB copper plating device 100 also includes a horizontal transfer mechanism 80, which includes a horizontal motor 81, a driving wheel 83 and a passive wheel 85. The horizontal motor 81 is arranged on the mounting member 20 and is located in the space between the mounting member 20 and the mounting plate 51. The layout is flexible and does not occupy space. A driving wheel 83 and a passive wheel 85 are arranged at intervals on the same side of the mounting member 20 along the Y-axis direction and are matched to form a one-side transmission structure. Two sets of driving wheels 83 and passive wheels 85 form transmission structures on both sides. The transmission structures on both sides are arranged on both sides of the mounting member 20 along the X-axis. The assembly part of each mounting plate 51 is detachably assembled with the transmission structure on the same side. After the assembly is completed, the stopper on the frame 10 and the limiter 57 of the mounting mechanism 50 are abutted against each other to limit, indicating that multiple PCB boards 900 to be copper plated have been accurately located directly above multiple electroplating areas 30B.

[0047] When the mounting mechanism 50 enters the cavity 10A through the first opening 10B, the horizontal motor 81 can drive the active wheel 83 and the passive wheel 85 to rotate so as to carry the mounting plate 51 to enter the cavity 10A along the Y axis to realize feeding, and after the electroplating is completed, when the mounting mechanism 50 moves out of the cavity 10A through the second opening 10C, the horizontal motor 81 can again drive the active wheel 83 and the passive wheel 85 to rotate so as to carry the mounting plate 51 to move out of the cavity 10A along the Y axis to realize unloading. The horizontal transfer mechanism 80 can then transport the next mounting mechanism 50 to enter the cavity 10A through the first opening 10B to perform the copper plating operation of the next mounting mechanism 50.

[0048] Optionally, the liquid holding member 30 includes a shell 31 having a processing tank 30A and a plurality of partition plates 33. The plurality of partition plates 33 are spaced apart in the processing tank 30A and are detachably connected to the shell 31 to divide the processing tank 30A into a plurality of electroplating areas 30B. The side edges of the plurality of partition plates 33 are spaced apart from the shell 31 so that the electrolytes in the plurality of electroplating areas 30B can communicate with each other.

[0049] In this embodiment, a plurality of partition plates 33 are arranged at intervals along the X-axis direction, and each partition plate 33 is in the O-YZ plane, wherein both side edges of each partition plate 33 along the Y-axis direction are spaced from both side plates of the shell 31 along the Y-axis, so that the electrolytes of a plurality of electroplating areas 30B in the same processing tank 30A are interconnected, thereby improving the uniformity of the distribution of the electrolyte in each electroplating area 30B in the same processing tank 30A and improving the uniformity of the copper plating quality.

[0050] Optionally, a liquid inlet structure 61 and a liquid discharge structure 63 are provided at intervals at the bottom of the liquid holding member 30 , and an overflow structure 65 is provided on the side wall of the liquid holding member 30 adjacent to the notch.

[0051] In this embodiment, the bottom of the liquid holding part 30 is provided with a liquid inlet corresponding to the liquid inlet structure 61, and the corresponding liquid discharge structure 63 is provided with a liquid discharge port, and the side wall of the liquid holding part 30 is provided with an overflow port 30C corresponding to the overflow structure 65. The PCB copper plating device 100 also includes a liquid inlet valve, a liquid discharge valve and an overflow valve, and the liquid inlet valve, the liquid discharge valve and the overflow valve are respectively installed at the liquid inlet, the liquid discharge port and the overflow port 30C. The multiple electroplating areas 30B in the same processing tank 30A are uniformly fed with liquid through the liquid inlet valve, so that the electrolyte can be evenly distributed in the multiple electroplating areas 30B. After the electrolyte in the processing tank 30A is full, it flows out through the overflow valve. The liquid discharge valve is closed during the electrolyte inlet process and the electrolysis process, and is used to empty the electrolyte in the processing tank 30A until the electrolyte needs to be replaced.

[0052] The present invention provides a production method for improving the deposition efficiency of PCB production by using the above PCB copper plating device 100. The production method comprises the following steps:

[0053] S1. Pre-install the copper-plated PCB board 900 on the mounting mechanism 50, and place the pre-installed whole from the loading end into the loading station;

[0054] S2. The mounting mechanism carrying the PCB to be copper plated is horizontally transferred to the top of the processing tank, and the driving mechanism drives the mounting member together with the mounting mechanism and the PCB to be copper plated to move downward into the processing tank;

[0055] S3. The copper-plated PCB board enters the treatment tank and is immersed in the electrolyte and connected to the negative electrode of the power supply. The copper-plated PCB board and the anode plate connected to the positive electrode of the power supply undergo an electrochemical reaction in the electrolyte in the tank to achieve copper plating of the PCB board;

[0056] S4. The drive mechanism transports the mounting mechanism upward and leaves the processing tank, and transports the mounting mechanism and the PCB board to the top of the next processing tank for the next process;

[0057] S5. Repeat the above steps until the processing is completed, and the mounting mechanism brings the electroplated PCB board to the unloading end for unloading.

[0058] Furthermore, after the first four steps mentioned above, the mounting mechanism together with the PCB board can be transferred to the top of the processing tank of the next process through the horizontal transfer mechanism 80. During the transfer process, the structure of the next process also includes the horizontal transfer mechanism 80, and the horizontal transfer mechanism 80 in the next process cooperates with the horizontal transfer mechanism 80 of the previous process to horizontally transfer the mounting mechanism together with the PCB board, so that the PCB board copper plating device of the present invention can automatically transport the PCB board into each processing tank, which can realize the automated copper plating process of the PCB board and reduce the investment in labor costs.

[0059] In the present invention, if the terms "inside", "outside", "upper", "lower" and the like appear to indicate an orientation or position relationship, they are based on the orientation or position relationship shown in the drawings, or are the orientation or position relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0060] In the present invention, unless otherwise clearly specified and limited, the terms "set", "install", "fix", and "connect" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0061] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A PCB copper plating device, characterized in that: The invention comprises a frame with a cavity, a liquid holding part with a processing tank, a mounting mechanism and a driving mechanism, wherein the driving mechanism is arranged on the top of the frame, the movable end of the driving mechanism is connected to a mounting part located in the cavity, the liquid holding part is arranged in the cavity and is located directly below the mounting part, the mounting mechanism is detachably connected to the mounting part, the mounting mechanism is provided with a plurality of parallel mounting positions for hanging PCB boards to be copper plated, the processing tank is provided with a plurality of spaced electroplating areas corresponding to the PCB boards to be copper plated, and the driving mechanism drives the mounting part to drive the mounting mechanism to rise and fall, so that a plurality of PCB boards to be copper plated enter or leave the plurality of electroplating areas.

2. The PCB copper plating device according to claim 1, characterized in that: The PCB copper plating device also includes multiple anode plates connected to the positive pole of the power supply, each of the anode plates is arranged on one side corresponding to the electroplating area, and the PCB board to be copper plated is located on the other side of the electroplating area and is electrically connected to the negative pole of the power supply.

3. The PCB copper plating device according to claim 2, characterized in that: The electroplating area is provided with a cathode electrode on the opposite side of the anode plate, and the mounting position is provided with an electrical connection portion, and the PCB board to be copper plated is electrically connected to the cathode electrode through the electrical connection portion.

4. The PCB copper plating device according to claim 2, characterized in that: The plurality of anode plates are arranged on the same side of the plurality of electroplating areas.

5. The PCB copper plating device according to claim 1, characterized in that: The liquid containing part includes a shell having the processing tank and a plurality of partition plates. The plurality of partition plates are spaced apart in the processing tank and are detachably connected to the shell to divide the processing tank space into a plurality of electroplating areas. The side edges of the plurality of partition plates are spaced apart from the shell to allow the electrolytes in the plurality of electroplating areas to communicate with each other.

6. The PCB copper plating device according to claim 1, characterized in that: A liquid inlet structure and a liquid discharge structure are provided at intervals at the bottom of the liquid holding member, and an overflow structure is provided at a side wall of the liquid holding member adjacent to the notch.

7. The PCB copper plating device according to claim 1, characterized in that: The cavity is provided with a first opening and a second opening on two opposite sides, the connection line between the first opening and the second opening is perpendicular to the arrangement direction of multiple PCB boards to be copper-plated, and the mounting mechanism feeds material from the first opening and discharges material from the second opening.

8. The PCB copper plating device according to claim 7, characterized in that: The frame is provided with a stopper, and the mounting mechanism is provided with a limiter, and the limiter abuts against the stopper to limit the position, so that the PCB board to be copper-plated is located directly above the processing tank.

9. A production method for improving the deposition efficiency of PCB production by using the PCB copper plating device according to any one of claims 1 to 8, characterized in that: The production method steps include: S1. Pre-install the PCB to be copper plated on the mounting mechanism and place it into the loading station from the loading end; S2. The mounting mechanism carrying the PCB to be copper plated is horizontally transferred to the top of the processing tank, and the driving mechanism drives the mounting member together with the mounting mechanism and the PCB to be copper plated to move downward into the processing tank; S3. The copper-plated PCB board enters the treatment tank and is immersed in the electrolyte and connected to the negative electrode of the power supply. The copper-plated PCB board and the anode plate connected to the positive electrode of the power supply undergo an electrochemical reaction in the electrolyte in the tank to achieve copper plating of the PCB board; S4. The drive mechanism transports the mounting mechanism upward and leaves the processing tank, and transports the mounting mechanism and the PCB board to the top of the next processing tank for the next process; S5. Repeat the above steps until the processing is completed and the mounting mechanism reaches the unloading end for unloading.

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