Display module, manufacturing method thereof, and display device

Abstract

The present application provides a display module and its preparation method, and a display device. The preparation method includes: bonding the display panel and the support member through optical glue to form an initial display module; filling a first glue material on the side of the edge of the optical glue located outside the third through hole facing the third through hole. A first through hole is provided on the display panel, a second through hole is provided on the support member, and a third through hole is provided on the optical glue. The first through hole, the second through hole and the third through hole are connected; in a direction parallel to the plane where the display module is located, the edge of the optical glue facing the third through hole shrinks inward relative to the edge of the display panel facing the first through hole in a direction away from the third through hole, and the edge of the optical glue facing the third through hole shrinks inward relative to the edge of the support member facing the second through hole in a direction away from the third through hole. The modulus of the first glue material is greater than the modulus of the optical glue. The first glue material can play a role in supporting the display panel, which is beneficial to reducing the probability of damage to part of the circuit structure due to bending of the display panel.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module, a preparation method thereof, and a display device. Background Art

[0002] With the continuous development of manufacturing technology, display modules equipped with camera devices have gradually become a common module type. Normally, a hole needs to be reserved on the display module to place the camera device. The hole often passes through part of the structure in the display module. For example, the hole can pass through the protective layer and support structure used to protect the display panel. It should be noted that the above-mentioned protective layer and the support structure are often bonded together by optical glue. In order to avoid the optical glue adhering to the camera device in the hole, it is usually chosen to set the optical glue to shrink in the direction away from the hole. However, the shrinkage of the above-mentioned optical glue often leads to a step area between the above-mentioned protective layer and the supporting structure. There is no structure in the step area that can support the protective layer.

[0003] In this case, if the area on the display module corresponding to the hole is subjected to force, the above-mentioned protective layer and the display panel may easily bend and deform in the step area. In particular, the conductive structure in the display panel (such as wiring or semiconductor devices, etc.) may be damaged, thereby reducing the display effect. Summary of the Invention

[0004] In view of this, the present application provides a display module and a manufacturing method thereof, and a display device.

[0005] In a first aspect, the present application provides a method for preparing a display module, comprising:

[0006] The display panel and the support are bonded together by optical glue to form an initial display module; a first through hole is provided on the display panel, a second through hole is provided on the support, and a third through hole is provided on the optical glue, and the first through hole, the second through hole and the third through hole are connected; in a direction parallel to the plane where the display module is located, the edge of the optical glue toward the third through hole is retracted inwardly relative to the edge of the display panel toward the first through hole in a direction away from the third through hole, and the edge of the optical glue toward the third through hole is retracted inwardly relative to the edge of the support toward the second through hole in a direction away from the third through hole.

[0007] A first adhesive is filled on a side of the optical adhesive located at the periphery of the third through hole and facing the third through hole. The modulus of the first adhesive is greater than the modulus of the optical adhesive.

[0008] In a second aspect, based on the same inventive concept, the present application provides a display module, including a display module prepared by the preparation method provided in the first aspect.

[0009] In a third aspect, based on the same inventive concept, the present application provides a display device, comprising the display module provided in the second aspect.

[0010] In the embodiment of the present application, when the portion of the display panel located in the first region tends to bend toward the support member due to force, because the first adhesive can contact both the first contact portion and the second contact portion, the first adhesive can support the display panel, preventing the portion of the display panel located in the first region from further bending, thereby reducing the probability of damage to some circuit structures in the array substrate. In addition, because the modulus of the first adhesive is greater than the modulus of the optical adhesive, the solution of filling the first adhesive can provide better support for the display panel than the solution of filling the first edge facing the third through hole with optical adhesive, thereby helping to further reduce the degree of display panel bending. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] Figure 1 This is a schematic diagram of a partial structure of a display module related to the present application;

[0013] Figure 2 for Figure 1 The schematic diagram of the display module shown is under stress;

[0014] Figure 3 A schematic diagram of the steps of a method for preparing a display module provided in this application;

[0015] Figure 4 A schematic diagram of a partial structure of a display module provided in this application;

[0016] Figure 5 A schematic diagram of some steps of a preparation method provided in this application;

[0017] Figure 6 For Figure 5 Schematic diagram of the process corresponding to the preparation method;

[0018] Figure 7 is a schematic diagram of some steps in the preparation process of the display module;

[0019] Figure 8 A schematic diagram of the steps of a method for preparing a display module provided in this application;

[0020] Figure 9 A schematic diagram of the steps of a method for preparing a display module provided in this application;

[0021] Figure 10 For Figure 9 Schematic diagram of the process corresponding to the preparation method;

[0022] Figure 11 A schematic diagram of a partial structure of a display module provided in this application;

[0023] Figure 12 A schematic diagram of a partial structure of a display module provided in this application;

[0024] Figure 13 A schematic diagram of a partial structure of a display module provided in this application;

[0025] Figure 14 A schematic diagram of a display device provided in this application. DETAILED DESCRIPTION

[0026] In order to better understand the technical solution of the present application, the embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0027] It should be clear that the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0028] The terms used in the embodiments of the present application are for the purpose of describing specific embodiments only and are not intended to limit the present application. The singular forms "a", "an", "the" and "the" used in the embodiments of the present application and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise.

[0029] It should be understood that the term "and / or" as used herein simply describes a relationship between associated objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the associated objects.

[0030] It will be apparent to those skilled in the art that various modifications and variations can be made to this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and variations of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the embodiments provided in the examples of this application may be combined with each other unless there is any inconsistency.

[0031] Figure 1 This is a schematic diagram of a partial structure of a display module related to the present application.

[0032] In the prior art, Figure 1 As shown, display module 10' may include a stacked support structure 01', a protective structure 02', and an array substrate 03'. Protective structure 02' is located between support structure 01' and array substrate 03', and is bonded to support structure 01' via a first optical adhesive layer 04'. To accommodate a camera, display module 10' may also include a hole structure 05'. This hole structure 05' may penetrate support structure 01', protective structure 02', array substrate 03', polarizing layer 06', cover plate 08' (polarizing layer 06' and cover plate 08' bonded via a second optical adhesive layer 07'), and other structures. To minimize the impact on the camera's lighting process, other structures (such as a transparent adhesive layer) may not be included in hole structure 05'.

[0033] It should be noted that to prevent the optical adhesive in the first optical adhesive layer 04' from overflowing and contacting the camera device in the hole structure 05', the first optical adhesive layer 04' is typically configured to be recessed toward the edge of the hole structure 05', away from the hole structure 05', to form a stepped region 09'. Similar to the hole structure 05', no other structure is required in the stepped region 09'. Therefore, no structure capable of supporting the protective structure 02' exists in the stepped region 09'.

[0034] Figure 2 for Figure 1 The diagram shows a schematic diagram of the display module under stress.

[0035] like Figure 2 As shown, when the area corresponding to the hole structure 05' on the side of the cover plate 08' away from the array substrate 03' is subjected to a force, particularly a force with a small area and high intensity (for example, during a pointed impact test), the portion of the protective structure 02' that overlaps the step area 09' is prone to bending and deformation because there is no structure in the step area 09' that can provide support. This can also cause the portion of the protective structure 02' facing away from the support structure 01' (for example, the array substrate 03') to bend and deform. Because the array substrate 03' may include circuit structures such as wiring structures, when the array substrate 03' is bent, some of the wiring structures included therein are prone to breakage, which can cause some light-emitting devices electrically connected to the wiring structures to emit abnormal light (for example, causing bright lines to appear on the display screen), thereby reducing the display effect.

[0036] Figure 3This is a schematic diagram of the steps of a method for preparing a display module provided in this application. Figure 4 This is a schematic diagram of a partial structure of a display module provided in this application.

[0037] In view of the above problems, the present application provides a method for preparing a display module. Figure 3 and Figure 4 , the preparation method comprises:

[0038] S1: Bond the display panel 01 and the support member 02 with optical adhesive 03 to form an initial display module.

[0039] like Figure 4 As shown, the display module 10 may include a display panel 01, a support member 02, and optical adhesive 03. The display panel 01 may include a protective layer 01a and an array substrate 01b. The protective layer 01a may be located on the side of the array substrate 01b closest to the support member 02. The protective layer 01a may be used to protect the array substrate 01b and reduce the degree of corrosion of the array substrate 01b by water and oxygen. The array substrate 01b may include circuit structures such as wiring, which may be used to drive the light-emitting devices to emit light. The support member 02 may have a high degree of rigidity and may be used to enhance the structural stability of the display module 10. The support member 02 may include titanium metal.

[0040] The display panel 01 and the support member 02 are bonded together by the optical adhesive 03 . It can be understood that the protective layer 01 a on the display panel 01 can be bonded together with the support member 02 by the optical adhesive 03 .

[0041] In addition, the display module 10 may further include a polarizing structure 04 and a cover plate 05. The cover plate 05 may be located on a side of the polarizing structure 04 away from the display panel 01. The cover plate 05 may be bonded to the polarizing structure 04 via an adhesive material 06. The components included in the adhesive material 06 may be the same as those included in the optical adhesive 03.

[0042] like Figure 4 As shown, a first through hole 011 is formed on the display panel 01, a second through hole 021 is formed on the support member 02, and a third through hole 031 is formed on the optical adhesive 03. The first through hole 011, the second through hole 021, and the third through hole 031 are connected. The overlapping portion of the first through hole 011, the second through hole 021, and the third through hole 031, along a direction perpendicular to the plane of the display module 10, can be used to place a camera device. In addition, to avoid obstructing the lighting process of the camera device, the first through hole 011, the second through hole 021, and the third through hole 031 may not be filled with adhesive or the like. In particular, the medium in the above three may only include air.

[0043] In a direction parallel to the plane of the display module 10, the edge of the optical adhesive 03 facing the third through hole 031 is retracted inward, away from the third through hole 031, relative to the edge of the display panel 01 facing the first through hole 011. Therefore, in a direction perpendicular to the plane of the display module 10, the first region 010 on the display panel 01 does not overlap with the optical adhesive 03.

[0044] The edge of the optical adhesive 03 facing the third through hole 031 is retracted away from the third through hole 031 relative to the edge of the support member 02 facing the second through hole 021. In a direction perpendicular to the plane of the display module 10, the second area 020 on the support member 02 does not overlap with the optical adhesive 03.

[0045] S2: Fill the first adhesive material 071 on the side of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031. Figure 4 As shown, the first adhesive material 071 can be located on the side of the first edge s1 of the optical adhesive 03 facing the third through hole 031, the first adhesive material 071 can contact the portion of the protective layer 01a located in the first area 010 (the first contact portion), and the first adhesive material 071 can contact the portion of the support member 02 located in the second area 020 (the second contact portion).

[0046] The modulus of the first adhesive 071 is greater than that of the optical adhesive 03. When the force conditions corresponding to the first adhesive 071 and the optical adhesive 03 are the same (the magnitude of the force, the area of ​​action, etc. are the same), the deformation degree of the first adhesive 071 is lower than that of the optical adhesive 03.

[0047] In the embodiment of the present application, when the portion of the display panel 01 located in the first region 010 has a tendency to bend toward the support member 02 due to force, because the first adhesive 071 can contact both the first contact portion and the second contact portion, the first adhesive 071 can support the display panel 01, preventing the portion of the display panel 01 located in the first region 010 from further bending, thereby reducing the probability of damage to some circuit structures in the array substrate 01a. In addition, because the modulus of the first adhesive 071 is greater than the modulus of the optical adhesive 03, compared to the solution of filling the first edge s1 with optical adhesive 03 on the side facing the third through hole 031, the solution of filling the first adhesive 071 can provide better support for the display panel 01, helping to further reduce the degree of bending of the display panel 01.

[0048] In one embodiment of the present application, the modulus k of the first adhesive material 071 satisfies: 200 kPa≤k≤400 kPa.

[0049] In the embodiment of the present application, the greater the modulus k of the first adhesive material 071, the less deformation of the first adhesive material 071 when subjected to a fixed force, which helps to improve the support effect of the first adhesive material 071. It should be noted that when the modulus k of the first adhesive material 071 is too large, the rigidity of the first adhesive material 071 itself is also relatively strong, which can easily lead to local deformation of the display panel 01 due to the excessive support effect of the first adhesive material 071. Therefore, in this embodiment, by controlling the modulus k of the first adhesive material 071 to satisfy 200kPa ≤ k ≤ 400kPa, it helps to reduce the risk of local deformation of the display panel 01 while still supporting the display panel 01.

[0050] Figure 5 This is a schematic diagram of some steps of a preparation method provided in this application. Figure 6 For Figure 5 The flow chart corresponding to the preparation method in the embodiment is provided for easy understanding. Figure 6 The following is shown in Figure 5 The structure of the corresponding display module when the preparation method is shown.

[0051] In one embodiment of the present application, Figure 5 and Figure 6 S2: Filling the first adhesive material 071 on the side of the edge of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031, including:

[0052] S21: Adjusting the positions of the initial display module 100 and the glue dispenser 20 so that the display panel 01 of the initial display module 100 is located on the side of the support 02 away from the glue dispenser 20 and the outlet 201 of the glue dispenser 20 faces the groove 08;

[0053] The groove 08 is located between the display panel 01 and the support member 02 and the opening of the groove 08 faces the third through hole 031, wherein the inner wall of the groove 08 may include a portion of the protective layer 01a located in the first area 010 on the surface of the support member 02 facing the display panel 01, a portion of the support member 02 located in the second area 020 on the surface of the display panel 01, and the first edge s1 of the optical glue 03.

[0054] S22 : Controlling the glue dispenser 20 to flow out the first glue material 071 , so that the first glue material 071 at least flows into the groove 08 .

[0055] In the embodiment of the present application, after adjusting the positions of the initial display module 100 and the glue dispenser 20, the glue dispenser 20 may be located vertically above the initial display module 100. In this case, when the glue dispenser 20 is controlled to leave the first glue material 071, the first glue material 071 can flow into the groove 08 under the action of gravity. In addition, the action of gravity helps the first glue material 071 to preferentially fill the bottom of the groove 08, thereby improving the filling effect of the first glue material 071 in the groove 08.

[0056] In one embodiment of the present application, Figure 6 As shown, the depth h of the groove 08 is less than or equal to 0.3 mm.

[0057] In the embodiment of the present application, when h≤0.3 mm, the depth of the groove 08 is relatively small. When the first adhesive 071 is filled, the first adhesive 071 easily fills the gaps in the groove 08 , which helps to enhance the supporting effect of the first adhesive 071 on the display panel 01 .

[0058] Figure 7 This is a schematic diagram of some steps in the preparation process of the display module. For easy understanding, Figure 7 The figure shows the positional relationship between the initial display module and the dispenser during the preparation of the display module.

[0059] In one embodiment of the present application, Figure 7 As shown, after adjusting the positions of the initial display module 100 and the glue dispenser 20, the angle θ between the initial display module 100 and the outlet 021 of the glue dispenser 20 satisfies: 30°≤θ≤80°. The angle θ here can be understood as the angle between the plane where the initial display module 100 is located and the direction of the outlet 021 of the glue dispenser 20.

[0060] In the embodiment of the present application, when 30°≤θ≤80°, it means that the direction of the outlet 021 of the dispenser 20 may not be perpendicular to the direction of the outlet of the groove 08, and the outlet 021 of the dispenser 20 may be directed toward the bottom of the groove 08. In this case, it is more conducive to the first glue material 071 flowing into the bottom of the groove 08.

[0061] Figure 8 A schematic diagram of the steps of a method for preparing a display module provided in this application.

[0062] In one embodiment of the present application, Figure 8 As shown, S2: before filling the first adhesive material 071 on the side of the edge of the optical adhesive 03 located at the periphery of the third through hole 031 and facing the third through hole 031, the preparation method further includes:

[0063] S11 : performing laser irradiation on the surfaces of the support member 02 and the display panel 01 facing the groove 08 to increase the roughness of the surfaces of the support member 02 and the display panel 01 facing the groove 08 .

[0064] In this embodiment of the present application, during the filling process of the first adhesive 071, the first adhesive 071 flowing into the groove 08 may contact a portion of the inner wall of the groove 08 (the surfaces of the support member 02 and the display panel 01 facing the groove 08, and the first edge S1 of the optical adhesive 03). The laser irradiation employed in this embodiment can increase the roughness of a portion of the inner wall of the groove 08, thereby improving the wettability between the first adhesive 071 and the inner wall of the groove 08, and thus promoting uniform filling of the first adhesive 071 within the groove 08.

[0065] Figure 9 This is a schematic diagram of the steps of a method for preparing a display module provided in this application. Figure 10 For Figure 9 The flow chart corresponding to the preparation method in the embodiment is provided for easy understanding. Figure 10 The following is shown in Figure 9 The structure of the corresponding display module when the preparation method is shown.

[0066] In one embodiment of the present application, Figure 9 and Figure 10 Before bonding the display panel 01 and the support member 02 by the optical adhesive 03, the preparation method further includes:

[0067] S01: Attach the optical adhesive 03 to the first portion 02a of the support 02.

[0068] S02: Prepare a second adhesive material 072 on the side of the second portion 02b of the support member 02 facing the optical adhesive 03. Note that when preparing the second adhesive material 072, the support member 02 has not yet been bonded to the display panel 01. By adjusting the position between the support member 02 and the adhesive dispenser 20, the second adhesive material 072 can be applied to the first edge s1 of the optical adhesive 03. Therefore, after bonding the display panel 01 to the support member 02, the second adhesive material 072 can be located at the bottom of the groove 08.

[0069] The modulus of the second adhesive material 072 is greater than the modulus of the optical adhesive 03. The optical adhesive 03 is not attached to the second portion 02b and the second portion 02b is located on a side of the first portion 02a close to the second through hole 021.

[0070] In the embodiment of the present application, by preparing the second adhesive material 072 before filling the first adhesive material 071, the second adhesive material 072 is placed at the bottom of the groove 08, and the first adhesive material 071 is placed at the exit of the groove 08. In other words, the adhesive filling level in the groove 08 is relatively high. In addition, because the modulus of the second adhesive material 072 is also greater than the modulus of the optical adhesive 03, the second adhesive material 072 can also provide good support for the display panel 01.

[0071] Furthermore, it should be noted that when the display panel 01 is bent under stress, in addition to causing the wiring structure to break, it is also prone to causing positional offset between the display panel 01 and the support member 02, which can cause the display panel 01 to peel off from the support member 02. In this embodiment, the provision of the second adhesive material 072 increases the amount of adhesive material that can be attached to the support member 02, that is, it enhances the bonding strength between the display panel 01 and the support member 02 and reduces the risk of peeling between the display panel 01 and the support member 02.

[0072] In one embodiment of the present application, Figure 10 As described above, the width w of the second portion 02b satisfies: 0.3 mm ≤ w ≤ 2 mm.

[0073] In the embodiment of the present application, the surface of the second portion 02b facing the optical adhesive 03 can serve as part of the inner wall of the groove 08. The width w of the second portion 02b can affect the depth of the groove 08. The greater the width w of the second portion 02b, the greater the depth of the groove 08 can be, and the more difficult it is for the adhesive to fill the bottom of the groove 08. When 0.3mm≤w≤2mm, the first adhesive 071 is difficult to fill to the bottom of the groove 08. Therefore, the embodiment of the present application fills the groove 08 with the second adhesive 072 between the first adhesive 071, thereby increasing the amount of adhesive filling the groove 08 and enhancing the support effect on the display panel 01.

[0074] In one embodiment of the present application, the first adhesive material 071 and the second adhesive material 072 are made of the same material.

[0075] In the embodiment of the present application, the first adhesive material 071 and the second adhesive material 072 are made of the same material, which means that the modulus of the first adhesive material 071 and the modulus of the second adhesive material 072 can be the same. Since the distribution positions of the first adhesive material 071 and the second adhesive material 072 in the groove 08 can be different, the setting method of this embodiment helps to achieve the effect of uniformly supporting the display panel 01 in various areas of the groove 08.

[0076] The present application provides a display module, which is prepared using the preparation method described in the above embodiment.

[0077] In the display module provided by the present application, the phenomenon of partial circuit structure breakage in the display panel 01 is greatly suppressed.

[0078] Figure 11 This is a schematic diagram of a partial structure of a display module provided in this application.

[0079] This application provides a display module 10, such as Figure 11 As shown, it comprises a stacked display panel 01 and a support member 02. The display panel 01 is provided with a first through hole 011, and the support member 02 is provided with a second through hole 021, and the first through hole 011 and the second through hole 021 are connected.

[0080] Display module 10 also includes optical adhesive 03 positioned between display panel 01 and support member 02. Optical adhesive 03 defines a third through-hole 031, which communicates with first through-hole 011 and second through-hole 021. In a direction parallel to the plane of display module 10, the edge of optical adhesive 03 facing third through-hole 031 contracts inward relative to the edge of display panel 01 facing first through-hole 011, away from third through-hole 031, and also contracts inward relative to the edge of support member 02 facing second through-hole 021, away from third through-hole 031, forming a groove 08.

[0081] The display module 10 further includes a glue material 07 . The glue material 07 at least fills the groove 08 . The modulus of the glue material 07 is greater than the modulus of the optical glue 03 .

[0082] In the embodiment of the present application, the adhesive material 07 filled in the groove 08 can support the display panel 01 and reduce the deformation of the display panel 01. In addition, because the modulus of the adhesive material 07 is greater than the modulus of the optical adhesive 03, the adhesive material 07 provides a better support for the display panel 01 than the optical adhesive 03, which helps further reduce the deformation of the display panel 01.

[0083] In one embodiment of the present application, the modulus k of the adhesive material 07 satisfies: 200 kPa≤k≤400 kPa.

[0084] In this embodiment, k is controlled to satisfy 200 kPa≤k≤400 kPa, which helps to reduce the risk of local deformation of the display panel 01 while supporting the display panel 01 .

[0085] Figure 12 This is a schematic diagram of a partial structure of a display module provided in this application.

[0086] This application provides a display module 10, such as Figure 12As shown, in a direction perpendicular to the plane where the display module 10 is located, the edge of the adhesive 07 facing the third through hole 031 is flush with the edge of the display panel 01 facing the first through hole 011 .

[0087] In this embodiment of the present application, since the overlapping portion of the first through-hole 011, the second through-hole 021, and the third through-hole 031 can accommodate a camera device, to prevent the adhesive 07 from contacting the camera device, the edge s2 of the adhesive 07 can be set flush with the edge s3 of the display panel 01. In this manner, the risk of the adhesive 07 subsequently contacting the camera device is reduced. Furthermore, the adhesive 07 can contact the portion of the display panel 01 near the first through-hole 011, providing better support.

[0088] Figure 13 This is a schematic diagram of a partial structure of a display module provided in this application.

[0089] This application provides a display module 10, such as Figure 13 As shown, the display panel 01 includes a protrusion 012. In a direction parallel to the plane where the display module 10 is located, the protrusion 012 protrudes in a direction close to the first through hole 011 relative to the edge of the support member 02 toward the second through hole 021. It should be noted that when the display panel 01 has a tendency to bend and deform, the risk of the protrusion 012 bending and causing positional displacement is higher than other parts on the display panel 01. The reason is that when the display panel 01 has a tendency to bend, the optical adhesive 03 can support the display panel 01. Based on the principle of leverage, the part of the display panel 01 that is not supported and is farther away from the optical adhesive 03 is more likely to bend, that is, the protrusion 012 is more likely to bend.

[0090] The adhesive material 07 covers the side of the protrusion 012 facing the support member 02 .

[0091] In the embodiment of the present application, by disposing the adhesive material 07 on the side of the protrusion 012 facing the support member 02 , the adhesive material 07 helps to support the protrusion 012 , thereby reducing the probability of the protrusion 012 being bent.

[0092] Figure 14 A schematic diagram of a display device provided in this application.

[0093] The present application provides a display device 30, such as Figure 14 As shown, the display device 30 includes the display module 10 provided in the above embodiment. The display device 30 can be a mobile phone. In addition, the display device 30 can also be an electronic device such as a computer or a television.

[0094] The probability of bright lines appearing on the display screen of the display device 30 provided in the embodiment of the present application is greatly reduced.

[0095] In this specification, reference can be made to the same or similar parts between the various embodiments. In particular, for the device embodiment and the terminal embodiment, since they are basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.

Claims

1. A method for preparing a display module, characterized in that: The preparation method comprises: The display panel and the support member are bonded together using optical adhesive to form an initial display module; the display panel is provided with a first through hole, the support member is provided with a second through hole, and the optical adhesive is provided with a third through hole, wherein the first through hole, the second through hole, and the third through hole are connected; in a direction parallel to the plane where the display module is located, an edge of the optical adhesive facing the third through hole is inwardly contracted relative to an edge of the display panel facing the first through hole in a direction away from the third through hole, and an edge of the optical adhesive facing the third through hole is inwardly contracted relative to an edge of the support member facing the second through hole in a direction away from the third through hole to form a groove; Filling a first adhesive material on a side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole; the modulus of the first adhesive material is greater than the modulus of the optical adhesive; The step of filling the first adhesive material on the side of the edge of the optical adhesive located at the periphery of the third through hole and facing the third through hole comprises: Adjust the positions of the initial display module and the glue dispenser so that the display panel of the initial display module is located on the side of the support member away from the glue dispenser and the outlet of the glue dispenser faces the groove; the angle θ between the initial display module and the outlet of the glue dispenser satisfies the following: 30°≤θ≤80°; the groove is located between the display panel and the support member and the opening of the groove faces the third through hole; The glue dispenser is controlled to flow out the first glue material so that the first glue material at least flows into the groove.

2. The preparation method according to claim 1, characterized in that The modulus k of the first adhesive material satisfies: 200 kPa≤k≤400 kPa.

3. The preparation method according to claim 1, characterized in that The depth of the groove is less than or equal to 0.3 mm.

4. The preparation method according to claim 1, characterized in that Before filling the first adhesive material on a side of an edge of the optical adhesive located at the periphery of the third through hole facing the third through hole, the preparation method further includes: Laser irradiation is performed on surfaces of the support member and the display panel facing the groove to increase the roughness of the surfaces of the support member and the display panel facing the groove.

5. The preparation method according to claim 1, characterized in that Before bonding the display panel and the support member by optical adhesive, the preparation method further includes: attaching the optical adhesive to the first portion of the support; A second adhesive is prepared on the side of the second part of the support member facing the optical adhesive; the modulus of the second adhesive is greater than the modulus of the optical adhesive; the optical adhesive is not adhered to the second part and the second part is located on the side of the first part close to the second through hole.

6. The preparation method according to claim 5, characterized in that The width w of the second portion satisfies: 0.3 mm ≤ w ≤ 2 mm.

7. The preparation method according to claim 5, characterized in that The first adhesive material and the second adhesive material are made of the same material.

8. A display module, characterized in that: The method comprises preparing the product by the method according to any one of claims 1 to 7; The display module includes: A display panel and a support member are stacked; the display panel is provided with a first through hole, the support member is provided with a second through hole, and the first through hole is connected to the second through hole; an optical adhesive disposed between the display panel and the support member, the optical adhesive defining a third through hole, the third through hole being in communication with the first through hole and the second through hole; an edge of the optical adhesive facing the third through hole being inwardly contracted relative to an edge of the display panel facing the first through hole in a direction away from the third through hole, and being inwardly contracted relative to an edge of the support member facing the second through hole in a direction away from the third through hole, in a direction parallel to the plane of the display module; The adhesive material is at least filled in the groove, and the modulus of the adhesive material is greater than the modulus of the optical adhesive.

9. The display module according to claim 8, wherein: The modulus k of the adhesive material satisfies: 200kPa≤k≤400kPa.

10. The display module according to claim 8, wherein: In a direction perpendicular to the plane where the display module is located, an edge of the adhesive facing the third through hole is flush with an edge of the display panel facing the first through hole.

11. The display module according to claim 8, wherein: The display panel includes a protrusion; in a direction parallel to the plane where the display module is located, the protrusion protrudes relative to the edge of the support member toward the second through hole and toward the first through hole; The adhesive material covers a side of the protrusion facing the support member.

12. A display device, characterized in that: Comprising the display module according to any one of claims 8 to 11.

Images