Filler coating device

Abstract

The present invention relates to a filler application device that applies a filler to gaps formed between edge portions of a plurality of substrates constituting a laminated substrate. A filler application device (100) is provided with: a substrate holding unit (33) that holds and rotates a laminated substrate (Ws) manufactured by joining a first substrate (W1) and a second substrate (W2); a coating device (39) that is disposed apart from the laminated substrate (Ws) held by the substrate holding unit (33) and discharges a filler (F) toward a gap (G) formed between the peripheral edge of the first substrate (W1) and the peripheral edge of the second substrate (W2); and a protector (12) that prevents liquid spatters (Fs) of the filler (F) from adhering to the upper surface and / or the lower surface of the laminated substrate (Ws), said liquid spatters (Fs) being generated when the filler (F) discharged from the coating device (39) collides with the voids (G).

Description

Technical Field

[0001] The present invention relates to a filler coating device for coating a filler on a gap formed between edge portions of a plurality of substrates constituting a laminated substrate. Background Art

[0002] In recent years, in order to achieve further high density and high functionality of semiconductor devices, the development of three-dimensional mounting technology for three-dimensional integration by stacking multiple substrates has been carried out. In the three-dimensional mounting technology, for example, the device surface of the first substrate formed with integrated circuits and electrical wiring is joined to the device surface of the second substrate formed with integrated circuits and electrical wiring. Furthermore, after the first substrate is joined to the second substrate, the second substrate is thinned by a grinding device or a grinding device. In this way, the integrated circuits can be stacked in the vertical direction on the device surfaces of the first substrate and the second substrate. In this specification, the form of multiple substrates joined to each other is sometimes referred to as a "stacked substrate". Furthermore, an example of substrates joined to each other, that is, a form of multiple wafers, is sometimes referred to as a "stacked wafer".

[0003] Usually, in order to prevent breakage (cracks) or chipping (chips), the edge of the substrate is pre-ground into a round or chamfered shape. When grinding the second substrate of a laminate substrate having such a shape, a sharp end is formed on the second substrate. The sharp end (hereinafter referred to as the blade edge) is formed by the back of the second substrate after grinding and the outer peripheral surface of the second substrate. This blade edge is prone to chipping due to physical contact, and the laminate substrate itself may be damaged during transportation. In addition, if the bonding between the first substrate and the second substrate is insufficient, the second substrate may also break during grinding.

[0004] Therefore, in order to prevent the blade from breaking (cracks) or breaking (chips), a filler is applied to the edge of the laminated substrate before grinding the second substrate (for example, see Patent Document 1). The filler is applied to the gap formed between the edge of the first substrate and the edge of the second substrate. The filler supports the blade formed after grinding the second substrate, and can prevent the blade from breaking or breaking.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2022-38834

[0008] (Problems to be solved by the invention)

[0009] In the filler coating assembly described in Patent Document 1, the filler is injected into the gap formed between adjacent substrates (hereinafter referred to as the "gap of the laminated substrate") from the coating assembly separated from the laminated substrate. At this time, the filler discharged from the coating assembly collides with the gap of the laminated substrate, resulting in the filler splashing and contaminating the upper surface and / or lower surface of the laminated substrate.

[0010] That is, the contact between the filler and the laminate substrate may cause the liquid splash of the filler to adhere to the upper surface and / or the lower surface of the laminate substrate, thereby contaminating the laminate substrate.

[0011] When the laminated substrate is contaminated by the splash of the filler liquid, it has a bad influence on the subsequent processing of the laminated substrate, resulting in a decrease in the yield of the device. Summary of the invention

[0012] Therefore, an object of the present invention is to provide a filler coating apparatus that can prevent the upper surface and / or lower surface of a laminated substrate from being contaminated by liquid splashes of the filler.

[0013] (Methods used to solve problems)

[0014] In one embodiment, a filler coating device is provided, comprising: a substrate holding portion that holds a laminated substrate manufactured by bonding a first substrate and a second substrate and rotates the laminated substrate; a coating device that is separately arranged from the laminated substrate held by the substrate holding portion and discharges a filler toward a gap formed between a peripheral portion of the first substrate and a peripheral portion of the second substrate; and a protector that prevents liquid splashes of the filler generated when the filler discharged from the coating device collides with the gap from adhering to the upper surface and / or lower surface of the laminated substrate.

[0015] In one embodiment, the protector is a plate having an opening that allows the inclined surface of the laminated substrate rotated by the substrate holding portion to pass therethrough.

[0016] In one embodiment, the plate body has an upper surface, and the upper surface is located between the top end and the end of the inclined surface portion of the laminated substrate when viewed in the radial direction of the laminated substrate.

[0017] In one embodiment, the edge of the opening of the plate body is made of a material capable of coming into contact with the laminated substrate, or is covered with the material.

[0018] In one embodiment, the plate is made of a material capable of absorbing the filler, or is covered with the material.

[0019] In one embodiment, the protector includes a suction nozzle disposed close to a collision portion between the laminated substrate and the filler.

[0020] In one embodiment, the protector is a dome that covers a collision portion between the laminated substrate and the filler, and the dome has a passage opening that allows the filler discharged from the coating device to pass therethrough.

[0021] In one embodiment, the protector further includes a dome that covers a portion of the laminated substrate protruding from the opening of the plate body, and the dome has a through hole that allows the filler discharged from the coating device to pass therethrough.

[0022] In one embodiment, the dome is made of or covered with a material capable of absorbing the filler.

[0023] In one embodiment, the dome has a plurality of suction holes extending from the inner surface to the outer surface of the dome, and the protector has a dome suction mechanism that sucks the internal space of the dome from the outside of the dome through the plurality of suction holes. The dome suction mechanism has at least one suction nozzle that is close to the outer surface of the dome.

[0024] In one embodiment, the dome has a plurality of non-through holes formed on an inner surface of the dome.

[0025] In one embodiment, the coating device is a dispenser that discharges the filler as intermittent droplets toward the gaps in the laminated substrate.

[0026] [Effects of the invention]

[0027] According to the present invention, the protector prevents the splashing of the filler liquid from reaching the laminated substrate, thereby preventing the upper and lower surfaces of the laminated substrate from being contaminated by the splashing of the filler liquid. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a front view showing a filler coating device according to one embodiment.

[0029] Figure 2 It is a rough representation Figure 1 A side view of the filler coating apparatus is shown.

[0030] Figure 3A This is an enlarged cross-sectional view showing an example of the peripheral portion of a wafer.

[0031] Figure 3B This is an enlarged cross-sectional view showing another example of the peripheral portion of the wafer.

[0032] Figure 4A This is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together.

[0033] Figure 4B It means that Figure 4A A schematic diagram of the stacked wafer after thinning of the second wafer is shown.

[0034] Figure 5 This is a schematic diagram showing a coating module according to one embodiment.

[0035] Figure 6 It is a rough representation Figure 1 and Figure 2 A top view of the protector is shown.

[0036] Fig. 7A It is a rough representation Figure 6 Front view of the protector shown.

[0037] Figure 7B It is a diagram for explaining the top and end of the bevel portion of the stacked wafer.

[0038] Figure 8 It is a schematic diagram showing a protector according to another embodiment.

[0039] Fig. 9 It is a side view schematically showing a protector according to still another embodiment.

[0040] Fig.10 It is a rough representation Fig. 9 A top view of the protector is shown.

[0041] Fig.11 It is a side view schematically showing a protector according to still another embodiment.

[0042] Fig.12 It is a side view schematically showing a protector according to still another embodiment.

[0043] Fig.13 It is a side view schematically showing a protector according to still another embodiment.

[0044] Fig.14 It is a front view showing a filler coating device according to another embodiment.

[0045] Fig.15 It is a front view showing a filler coating device according to still another embodiment.

[0046] Fig.16 It is a top view showing a filler coating device according to still another embodiment. DETAILED DESCRIPTION

[0047] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0048] Figure 1It is a front view showing a filler coating device according to one embodiment. Figure 2 It is a rough representation Figure 1 A side view of the filler coating apparatus is shown. Figure 1 and Figure 2 The filler coating apparatus 100 shown is an apparatus for coating and curing a filler for protecting a knife edge formed on a peripheral portion of a second wafer when thinning a laminated wafer in which a first wafer and a second wafer are bonded, which is an example of a laminated substrate.

[0049] Figure 3A and Figure 3B 1 is an enlarged cross-sectional view showing the peripheral edge of a wafer, which is an example of a substrate. Figure 3A This is a cross-sectional view of a so-called straight wafer. Figure 3B This is a cross-sectional view of a so-called circular wafer. Figure 3A In the chip W, the bevel portion is the outermost peripheral surface of the chip W composed of the upper inclined portion (upper bevel portion) P, the lower inclined portion (lower bevel portion) Q and the side portion (top) R (indicated by the symbol B).

[0050] exist Figure 3B In the wafer W, the chamfer portion is a portion with a curved cross section constituting the outermost peripheral surface of the wafer W (indicated by the symbol B). The top edge portion E1 is a region located radially inward compared to the chamfer portion B, and is a flat portion located radially outward compared to the region D where the device is formed. The top edge portion E1 may also include a region where the device is formed. The bottom edge portion E2 is located on the opposite side of the top edge portion E1, and is a flat portion located radially inward compared to the chamfer portion B. These top edge portions E1 and bottom edge portions E2 may also be collectively referred to as near edge portions.

[0051] Figure 4A is a schematic diagram showing an example of a stacked wafer in which two wafers are bonded together. Figure 4B It means that Figure 4A A schematic diagram of the stacked wafer after thinning of the second wafer is shown. Figure 4A The stacked wafer Ws shown is formed by bonding Figure 3B In the laminated substrate manufactured by using the circular first wafer W1 and the second wafer W2 shown in the figure, a gap G is formed between the peripheral edges of the first wafer W1 and the second wafer W2.

[0052] like Figure 4BAs shown in FIG. 1 , when the second wafer W2 is thinned, a knife edge NE is formed at the peripheral portion of the second wafer W2. The knife edge NE is easily notched due to physical contact, which may cause the stacked wafer Ws to crack or break when the stacked wafer Ws is transported or further processed. In addition, if the first wafer W1 and the second wafer W2 are not bonded sufficiently, the second wafer W2 may also crack or break during the grinding process (i.e., thinning process) of the second wafer W2. When the stacked wafer Ws is formed by Figure 3A In the case where the straight first wafer W1 and the second wafer W2 are bonded to each other, when the second wafer W2 is thinned, a knife edge is also formed on the peripheral edge of the second wafer W2. In addition, in this specification, the portion of the stacked wafer Ws corresponding to the bevel portion B of the first wafer W1 and the bevel portion B of the second wafer W2 is sometimes referred to as "the bevel portion Bs of the stacked wafer Ws" or simply "the bevel portion Bs".

[0053] Therefore, the filler coating apparatus 100 is used to coat the filler in the gap G between the first wafer W1 and the second wafer W2 of the stacked wafer Ws, and the filler is hardened, thereby effectively protecting the knife edge NE.

[0054] like Figure 1 and Figure 2 As shown, the filler coating device 100 includes a rotation holding mechanism (substrate holding section) 33 at its central portion, and the rotation holding mechanism 33 holds a stacked wafer Ws (see FIG. 1 ) in which a plurality of wafers W1 and W2 are stacked. Figure 4A ) to keep it vertical and rotate it. Figure 1 and Figure 2 In FIG. 1 , the rotating holding mechanism 33 is shown to hold the stacked wafer Ws. Figure 2 As shown, when the rotating holding mechanism 33 holds the stacked wafer Ws in a vertical state, the upper surface and the lower surface of the stacked wafer Ws are respectively located in virtual planes extending in a vertical direction perpendicular to the horizontal direction.

[0055] exist Figure 1 and Figure 2 In the embodiment shown, the rotation holding mechanism 33 includes: a dish-shaped holding table 34, which holds the back side of the laminated wafer Ws by vacuum adsorption; a hollow shaft 35, which is connected to the center of the holding table 34; and a motor M, which rotates the hollow shaft 35. The laminated wafer Ws is placed on the holding table 34 by the hand of the substrate transfer device (not shown) in such a way that the center of the laminated wafer Ws is aligned with the axis of the hollow shaft 35. Figure 1 As shown in FIG. 1 , the motor M is configured to move the holding table 34 and the stacked wafer Ws in a direction centered on the central axis Cr of the stacked wafer Ws. Figure 1 The two components rotate as a whole in the direction indicated by the arrow.

[0056] The filler coating device 100 also includes: a coating component (coating device) 39, which is configured to coat the filler F on the stacked chip Ws; a hardening component (hardening device) 60, which hardens the filler F coated by the coating component 39; and a control device 10, which controls the overall operation of the filler coating device including the rotating holding mechanism 33, the coating component 39 and the hardening component 60.

[0057] The coating assembly 39 is located radially outside the stacked wafer Ws held by the holding table 34, and is configured to be disposed in a gap G (see FIG. 1 ) formed between the peripheral edge portion (edge ​​portion E) of the first wafer W1 and the peripheral edge portion (edge ​​portion E) of the second wafer W2 of the stacked wafer Ws. Figure 4A ) to apply the filler F. In the present embodiment, the coating module 39 is arranged above the stacked wafer Ws held by the holding table 34 and faces the gap G of the stacked wafer Ws.

[0058] Figure 5 This is a schematic diagram showing a coating module according to one embodiment. Figure 5 The coating assembly 39 shown has a discharge nozzle 44 for the filler F, and is configured as a dispenser that ejects the filler F from the discharge nozzle 44 toward the gap G of the stacked wafer Ws. Hereinafter, the coating assembly 39 may be referred to as a "dispenser 39." The dispenser 39 is a non-contact coating assembly that is configured separately from the stacked wafer Ws.

[0059] Figure 5 The dispenser 39 shown in the figure includes: a syringe 45 filled with a filler F; a support plate (support member) 48 supporting the syringe 45 and forming a filler flow path 48a, which connects the syringe 45 with the discharge nozzle 44; and a rod 50 that can move back and forth in the support plate 48 to open and close the filler flow path 48a of the support plate 48. The syringe 45 is connected to a pressurized fluid line 53 extending from a pressurized fluid supply source (not shown), and the pressure of the pressurized fluid (for example, compressed air, pressurized nitrogen) supplied to the syringe 45 through the pressurized fluid line 53 is applied to the filler F stored in the syringe 45.

[0060] In this embodiment, the syringe 45 is connected to a connection port formed on the upper surface of the support plate 48, and the filler flow path 48a of the support plate 48 is composed of a connection flow path extending downward from the connection port between the syringe 45 and the support plate 48, a horizontal flow path extending horizontally from the connection flow path, and a discharge flow path extending downward from the horizontal flow path toward the distributor 39. The rod 50 extends from the upper surface of the support plate 48 through the discharge flow path of the filler flow path 48a extending downward, and penetrates the support plate 48 to the discharge nozzle 44.

[0061] The dispenser 39 is further provided with an up-and-down moving mechanism (not shown) that can move the rod 50 up and down. The up-and-down moving mechanism moves the rod 50 up and down at high speed, and droplets of the filler F are intermittently ejected from the discharge nozzle 44 toward the gap G of the laminated wafer Ws. The droplets of the filler F ejected from the discharge nozzle 44 fall toward the gap G, and as a result, the filler F can be applied to the gap G of the laminated wafer Ws. When the application of the filler F is completed, the up-and-down moving mechanism moves the rod 50 downward, and plugs the discharge port of the discharge nozzle 44 with the top end of the rod 50. By the downward movement of the rod 50, even if the pressure of the pressurized fluid is maintained to be applied to the filler F in the syringe 45, the filler F is prevented from leaking from the discharge nozzle 44.

[0062] As long as the dispenser 39 can apply the filler F to the gap G of the laminated wafer Ws, the type and structure of the dispenser 39 are not limited to Figure 5 For example, the dispenser 39 may supply the filler F to the gap G of the laminated substrate Ws by a continuous flow of the filler F.

[0063] The filler F applied to the gap G of the laminated wafer Ws by the dispenser 39 is hardened by the hardening assembly 60 provided on the downstream side of the rotation direction of the laminated wafer Ws rotated by the rotation holding mechanism 33. The hardening assembly 60 is a device for hardening the filler F supplied to the laminated wafer Ws by the dispenser 39. In the present embodiment, the filler F is a filler having thermosetting properties. As an example of such a filler F, a thermosetting resin is cited.

[0064] Figure 1 and Figure 2 The curing unit 60 shown is configured as a light heating unit having a lamp heater 65. The lamp heater 65 includes a lamp 63 and an optical device 68 for directing heat (radiant heat) from the lamp 63 toward the filler F applied to the gap G between the stacked wafers Ws. Although not shown, the optical device 68 is configured by a mirror and / or a lens, etc.

[0065] As long as the filler F applied to the gap G of the laminated wafer Ws can be cured, the type and structure of the curing unit 60 can be arbitrarily selected. For example, the curing unit 60 can also be a hot air gun that blows hot air against the gap G of the laminated wafer Ws.

[0066] The type of filler F can be arbitrarily selected as long as it can be applied to the gap G of the laminated wafer Ws and can be cured in a short time. For example, the filler F may be a photocurable resin.

[0067] In the filler coating device 100 configured as above, first, the laminated wafer Ws is held in a vertical state by vacuum suction on the holding table 34 of the rotating holding mechanism 33. Then, the laminated wafer Ws rotates together with the holding table 34. Next, the filler F is applied to the gap G of the laminated wafer Ws by the dispenser 39, and the filler F applied to the gap G is hardened by the hardening unit 60. The coating process and the hardening process of the filler F are continuously performed in the same processing chamber. Therefore, the wafer processing (substrate processing) for suppressing the cracking and breaking of the laminated wafer Ws can be performed in a very short time.

[0068] When the filler F is ejected from the discharge nozzle 44 of the distributor 39 toward the gap G of the laminated wafer Ws, the filler F collides with the gap G of the laminated wafer Ws, and liquid splashes Fs of the filler F may be generated. When the liquid splashes Fs of the filler F are generated and the upper surface and / or the lower surface of the laminated wafer Ws are contaminated by the filler F, it has a bad influence on the subsequent processing of the laminated wafer Ws, and as a result, the yield of the device may be reduced. Therefore, the filler coating device 100 involved in this embodiment has: a protector 12, which prevents the liquid splashes of the filler F from reaching (i.e., adhering to) the upper surface and / or the lower surface of the laminated wafer Ws; and a moving mechanism 20 (refer to Figure 1 ), the moving mechanism 20 moves the protector 12 (or the components of the protector 12) toward and away from the stacked wafer Ws held by the holding table 34 of the rotating holding mechanism 33.

[0069] By moving the mechanism 20, the protector 12 (or the components of the protector 12) can be moved between a protection position where the protector 12 (or the components of the protector 12) blocks splashes of the liquid of the filler F and a standby position (see FIG. Figure 1 The standby position of the protector 12 is set to a position that does not hinder the movement of other equipment such as the transport of the stacked wafer Ws. As long as the protector 12 (or the components of the protector 12) can move between the protection position and the standby position, the type and structure of the moving mechanism 20 can be arbitrarily selected. For example, the moving mechanism 20 can also be a piston-cylinder mechanism connected to the protector 12 (or the components of the protector 12), or a combination of a ball screw and a motor (such as a stepping motor).

[0070] Figure 6 It is a rough representation Figure 1 and Figure 2 A top view of the protector is shown. Fig. 7A It is a rough representation Figure 6 Front view of the protector shown. Figure 7B It is a diagram for explaining the top and end of the bevel portion of the stacked wafer. Fig. 7AThe protector 12 is shown moved to the protecting position.

[0071] Figure 6 and Fig. 7A The protector 12 shown is a plate 15 having an opening 15a. Fig. 7A As shown, the opening 15a has at least a peripheral edge portion (for example, see Figure 4A When the plate body 15 is moved to the protection position, a portion of the peripheral edge of the laminated wafer Ws passes through the opening 15a and protrudes from the upper surface of the plate body 15. The liquid splash Fs of the filler F is received by the upper surface of the plate body 15, thereby preventing the liquid splash Fs of the filler F from contaminating the upper surface and / or lower surface of the laminated wafer Ws.

[0072] The upper surface of the plate 15 moved to the protection position is at least located below the top of the laminated wafer Ws held by the rotation holding mechanism 33. In order to effectively prevent the liquid splash Fs of the filler F from reaching the upper surface and / or lower surface of the laminated wafer Ws, it is preferred that the edge of the opening 15a of the plate 15 is as close to the laminated wafer Ws as possible. Fig. 7A As shown in FIG. 1 , the upper surface of the plate 15 moved to the protection position is preferably located between the top Bst and the end Bse of the inclined portion Bs of the stacked wafer Ws. Figure 7B As shown in FIG. 1 , the top Bst of the inclined surface Bs of the stacked wafer Ws is located at the outermost periphery of the stacked wafer Ws, which corresponds to the top of the wafer W1 and the top of the wafer W2 of the stacked wafer Ws held by the holding table 34 of the rotation holding mechanism 33. Figure 7B As shown, the end Bse of the bevel portion Bs of the stacked wafer Ws of the wafer W1 or the wafer W2 is at the circular connection line CL (refer to Fig. 7A ) on the laminated wafer Ws, and is located radially inside the top end Bst of the inclined portion Bs of the laminated wafer Ws.

[0073] In one embodiment, the edge of the opening 15a of the plate body 15 may be formed of a soft material that can contact the upper and lower surfaces of the laminated wafer Ws, or the edge of the opening 15a of the plate body 15 may be covered with such a soft material. In these cases, the application and curing of the filler F may be performed while the edge of the opening 15a of the plate body 15 is in contact with the laminated wafer Ws. Examples of such soft materials include (polymer) resin materials such as sponges.

[0074] Furthermore, the plate body 15 may be made of a material that can absorb the filler F, or the plate body 15 may be covered with such a material. Examples of materials that can absorb the filler F include (polymer) resin materials such as sponges and porous resin materials. Furthermore, the plate body 15 may contact the upper and lower surfaces of the laminated wafer Ws, and may be made of a material that can absorb the filler F, or the plate body 15 may be covered with such a material. In addition, the edges of the opening 15a of the plate body 15 may contact the upper and lower surfaces of the laminated wafer Ws, and may be made of and covered with a material that can absorb the filler F.

[0075] Figure 8 It is a schematic diagram showing a protector according to another embodiment. Figure 8 The protector 12 shown is a suction mechanism having at least one (two in the example shown) suction nozzle 18 and a vacuum line 19, wherein the suction nozzle 18 is arranged close to the collision portion between the stacked wafer Ws and the filler F, and the vacuum line 19 extends from each suction nozzle 18 to a vacuum source (e.g., a suction pump) not shown. In one embodiment, a flow regulator such as a flow regulating valve may be provided in the vacuum line 19, and a pressure gauge may also be provided.

[0076] Although not shown, a moving mechanism 20 is also provided in this embodiment, which moves the suction nozzle 18 of the protector 12 between a protection position where the suction nozzle 18 blocks liquid splashes of the filler F and a standby position farther from the stacked wafer Ws than the protection position.

[0077] According to the suction mechanism of the protector 12 involved in this embodiment, since the suction nozzle 18 sucks droplets of filler F generated when the filler F collides with the gap G of the stacked chip Ws, liquid splashes of the filler F are prevented from contaminating the upper surface and / or lower surface of the stacked chip Ws.

[0078] As shown by the imaginary lines (dotted lines) in FIG. 7 , the protector 12 may also have, in addition to the plate body 15, at least one suction nozzle 18, which is arranged close to the collision portion between the laminated wafer Ws and the filler F (i.e., the opening 15a of the plate body 15); and a vacuum line 19, which extends from each suction nozzle 18 to a vacuum source (e.g., a suction pump) not shown. In this case, the moving mechanism 20 moves the plate body 15 and the suction nozzle 18 between the protection position and the standby position.

[0079] Fig. 9 is a side view schematically showing a protector according to another embodiment. Fig.10 It is a rough representation Fig. 9 A top view of the protector is shown. Fig. 9 and Fig.10The protector 12 shown in the figure has a dome 23 that covers the collision portion between the laminated wafer Ws and the filler F. The dome 23 has an opening 23a that faces the laminated wafer Ws held by the holding table 34 of the rotation holding mechanism 33. When the moving mechanism 20 is operated to move the dome 23 to the protection position, the peripheral edge of the laminated wafer Ws enters the internal space of the dome 23 from the opening 23a.

[0080] The dome 23 has a through hole 23b at its top, and the through hole 23b allows the filler F discharged from the dispenser 39 to pass through. The inner wall of the dome 23 is close to the collision portion between the laminated wafer Ws and the filler F.

[0081] The dome 23 is made of a material that can absorb the filler F, or is covered with such a material. In one embodiment, only the inner wall of the dome 23 may be covered with a material that can absorb the filler F. According to this structure, the droplets of the filler F generated when the filler F collides with the gap G of the stacked wafer Ws are absorbed by the inner wall of the dome 23, and the liquid splash of the filler F is prevented from contaminating the upper surface and / or the lower surface of the stacked wafer Ws. In this embodiment, as examples of the material that can absorb the filler F, (polymer) resin materials such as sponges and porous resin materials are listed.

[0082] In addition, in the present embodiment, the dome 23 that absorbs the filler F is replaced periodically. The replacement cycle of the dome 23 is determined, for example, by experiments or simulations performed in advance. The replacement cycle of the dome 23 may also be stored in the control device 10 in advance, for example, as the number of processed wafers of the stacked wafers Ws. In this case, the control device 10 resets the number of processed wafers and restarts the calculation of the number of processed wafers every time the dome 23 is replaced. The control device 10 may also be configured to issue a replacement alarm for the dome 23 when the number of processed wafers reaches the replacement cycle.

[0083] Although not shown, the present embodiment also includes a moving mechanism 20 that moves the dome 23 of the protector 12 between a protection position where the dome 23 blocks splashes of the filler F and a standby position farther from the stacked wafer Ws than the protection position.

[0084] Fig.11 This is a side view schematically showing a protector according to another embodiment. Fig. 9 and Fig.10 The structures of the embodiments to be described are the same, so repeated descriptions are omitted.

[0085] Fig.11The dome 23 of the protector 12 shown is made of a porous material such as a punched metal plate. In other words, the dome 23 has a plurality of suction holes 23c extending from its inner surface to the outer surface. Furthermore, the protector 12 has: at least one suction nozzle 18, which is arranged close to the outer surface of the dome 23; and a vacuum line 19, which extends from each suction nozzle 18 to a vacuum source (such as a vacuum pump) not shown. According to this structure, droplets Fs of the filler F are sucked from the internal space of the dome 23 to the suction nozzle 18 through the plurality of suction holes 23c of the dome 23, resulting in preventing the liquid splash Fs of the filler F from contaminating the upper surface and / or lower surface of the stacked wafer Ws.

[0086] In addition, in the present embodiment, the dome 23, particularly the suction hole 23c of the dome 23, is contaminated by the filler F, and the suction hole 23c of the dome 23 may be clogged by the filler F. Therefore, the dome 23 is cleaned regularly. The cleaning cycle of the dome 23 is determined, for example, by experiments or simulations conducted in advance. The cleaning cycle of the dome 23 may also be stored in the control device 10 in advance, for example, as the number of processed wafers of the stacked wafers Ws. In this case, the control device 10 resets the number of processed wafers and restarts the calculation of the number of processed wafers every time the dome 23 is cleaned. The control device 10 may also be configured to issue an alarm urging the replacement of the dome 23 when the number of processed wafers reaches the replacement cycle.

[0087] In one embodiment, a pressure gauge (vacuum gauge) may be arranged in the vacuum line 19, and when the measured value of the pressure gauge exceeds a predetermined threshold, the dome 23 is cleaned. In this case, the pressure gauge is connected to the control device 10, and the control device 10 monitors the pressure of the vacuum line 19. Furthermore, the control device 10 is configured to store the predetermined threshold in advance, and when the pressure measured value of the vacuum line 19 exceeds the predetermined threshold, an alarm is issued to urge the cleaning of the dome 23.

[0088] Although not shown in the figure, a moving mechanism 20 is also provided in this embodiment, which moves the dome 23 and the suction nozzle 18 of the protector 12 between a protection position where the dome 23 and the suction nozzle 18 prevent liquid splashes of the filler F and a standby position farther away from the stacked chip Ws than the protection position.

[0089] Fig.12 It is a side view schematically showing a protector according to still another embodiment. Fig.12 The protector 12 shown in the figure includes a dome 23 that covers the collision portion between the laminated wafer Ws and the filler F, and has a plurality of non-through holes 23d. Each non-through hole 23d is a recessed portion formed in the inner wall (inner surface) of the dome 23.

[0090] In the present embodiment as well, the dome 23 is made of a material capable of absorbing the filler F, or is covered with such a material. In one embodiment, only the inner wall of the dome 23 may be covered with a material capable of absorbing the filler F. According to such a structure, droplets of the filler F generated when the filler F collides with the gap G of the stacked wafer Ws are accumulated on the inner surface of the dome 23, particularly the non-through hole 23d, and are effectively absorbed by the inner surface of the dome 23. As a result, the liquid splash of the filler F is prevented from contaminating the upper surface and / or the lower surface of the stacked wafer Ws. In the present embodiment as well, examples of the material capable of absorbing the filler F include (polymer) resin materials such as sponges and porous resin materials.

[0091] In this embodiment, a moving mechanism 20 is also provided, which moves the dome 23 of the protector 12 and the suction nozzle 18 between a protection position where the dome 23 and the suction nozzle 18 prevent liquid splashes of the filler F and a standby position farther away from the stacked wafer Ws than the protection position. In addition, in this embodiment, the dome 23 is cleaned regularly. The cleaning cycle of the dome 23 is determined, for example, by experiments or simulations conducted in advance. The cleaning cycle of the dome 23 can also be stored in the control device 10 in advance, for example, as the number of processed wafers of the stacked wafer Ws. In this case, the control device 10 resets the number of processed wafers and restarts the calculation of the number of processed wafers every time the dome 23 is cleaned. The control device 10 can also be configured to issue an alarm urging the replacement of the dome 23 when the number of processed wafers reaches the replacement cycle.

[0092] Fig.13 It is a side view schematically showing a protector according to still another embodiment. Fig.13 The protector 12 shown has a combination of the dome 23 and the plate 15. Since the structure of this embodiment which is not particularly described is the same as that of the above-described embodiment, repeated description will be omitted.

[0093] exist Fig.13 In the embodiment shown, Fig. 9 and Fig.10 The opening 23a of the dome 23 shown is closed by the plate body 15. The dome 23 and the plate body 15 may be formed integrally, or the dome 23 and the plate body 15 may be formed as separate bodies and joined. Hereinafter, the combination of the dome 23 and the plate body 15 may be referred to as a "bottomed dome 24".

[0094] When the bottom dome 24 is moved to the protection position, the peripheral edge of the laminated wafer Ws invades the internal space of the bottom dome 24 through the opening 15a of the plate body 15. The internal space of the bottom dome 24 is a space divided by the dome 23 and the plate body 15. The dome 23 is made of a material that can absorb the filler F, or is covered with such a material. Alternatively, the dome 23 can also be made of a porous material such as a punched metal plate. When the dome 23 is made of a porous material, the filler coating device 100 is provided with a dome suction mechanism. In the present embodiment, the dome suction mechanism is composed of at least one suction nozzle 18 and a vacuum line 19, wherein the suction nozzle 18 is arranged near the outer surface of the dome 23, and the vacuum line 19 extends from a vacuum source (such as a suction pump) not shown in the figure to each suction nozzle 18.

[0095] Although not shown in the figure, a moving mechanism 20 is also provided in this embodiment, which enables the bottom dome 24 (and the suction nozzle 18) of the protector 12 to move between a protection position where the bottom dome 24 (and the suction nozzle 18) prevents liquid splashes of the filler F and a standby position farther away from the stacked chip Ws than the protection position.

[0096] Fig.14 2 is a front view showing a filler coating device according to another embodiment. Since the structure of this embodiment not specifically described is the same as that of the above-described embodiment, repeated description is omitted. This embodiment differs from the above-described embodiment only in the structure of the rotation holding mechanism (substrate holding portion) 33. Therefore, Fig.14 The protector 12 shown is a reference Figure 1 and Figure 2 The structure of the protector 12 is not limited to the plate body 15 described with reference to FIG. 7 , but the structure of the protector 12 is not limited to this example. The protector 12 may also include the structure of the plate body 15 and the suction nozzle 18 described with reference to FIG. 7 , or may include the structure of the plate body 15 and the suction nozzle 18 described with reference to FIG. Figure 8 The structure of the suction nozzle 18 described above may also be provided with reference to Figures 9 to 12 The structure of the dome 23 described here may also be a structure having reference Fig.13 The structure of the bottomed dome 24 is illustrated.

[0097] The rotation holding mechanism 33 of the present embodiment includes: three or more (four in the present embodiment) rollers 41 that can contact the peripheral edge of the stacked wafer Ws; a roller rotating mechanism (not shown) that rotates each roller 41 about its axis; and a roller moving mechanism (not shown) that moves each roller 41. In the present embodiment, the rotation holding mechanism 33 includes four rollers 41, but the rotation holding mechanism 33 may include three or five or more rollers.

[0098] Four rollers 41 are arranged around the reference center point O of the rotation holding mechanism 33. The rollers 41 are configured to contact the peripheral edge of the laminated wafer Ws to hold the laminated wafer Ws vertically. That is, the laminated wafer Ws is held in a vertical state by the rollers 41 of the rotation holding mechanism 33.

[0099] The roller rotating mechanism is configured to be connected to the four rollers 41 so that the four rollers 41 rotate in the same direction at the same speed. The structure of the roller rotating mechanism is arbitrary as long as it can rotate three or more rollers 41 in the same direction at the same speed, and a known rotating mechanism can be used as the roller rotating mechanism. As an example of the roller rotating mechanism, a combination of a motor, a pulley (and / or a gear) and a rotating belt is cited.

[0100] The roller moving mechanism is configured to be connected to the four rollers 41, and to move each roller 41 in a direction approaching the reference center point O of the rotation holding mechanism 33 and in a direction away from the reference center point O. The roller moving mechanism can move the four rollers 41 to the holding position (refer to Fig.14 The solid line) and the release position of the laminated wafer Ws from the roller 41 (refer to Fig.14 As long as the four rollers 41 can be moved between the holding position and the release position, the structure of the roller moving mechanism is arbitrary, and a known moving mechanism can be used as the roller moving mechanism. Examples of the roller moving mechanism include a piston cylinder mechanism and a combination of a ball screw and a motor (stepping motor).

[0101] The roller rotating mechanism and the roller moving mechanism of the rotation holding mechanism 33 are electrically connected to the control device 10 , and the operations of the roller rotating mechanism and the roller moving mechanism of the rotation holding mechanism 33 are controlled by the control device 10 .

[0102] The stacked wafer Ws is transported by a transport device (not shown) to a position where the axis of the stacked wafer Ws coincides with the reference center point O of the rotation holding mechanism 33. At this time, the roller 41 is in the release position and the protector 12 is in the standby position (see Fig.14 Then, the four rollers 41 are moved to the holding position by the roller moving mechanism, so that the peripheral edge of the laminated wafer Ws is held by the four rollers 41. By this action, the laminated wafer Ws is held in a vertical state by the four rollers 41. The four rollers 41 moved to the holding position are rotated by the roller rotating mechanism, and the laminated wafer Ws rotates around its axis.

[0103] When the four rollers 41 at the holding position are moved to the releasing position by the roller moving mechanism, the four rollers 41 are separated from the peripheral edge of the laminated substrate Ws, and the laminated wafer Ws can be released from the four rollers 41. The released laminated wafer Ws is transported from the rotating holding device 33 to a transport device (not shown).

[0104] The application of the filler F by the dispenser 39 and the hardening of the filler F by the hardening unit 60 are performed simultaneously with the rotation of the stacked wafer Ws held vertically by the rotating holding device 33. While the filler F is applied by the dispenser 39, the protector 12 is moved to the protective position, thereby preventing the liquid splash of the filler F from contaminating the upper surface and / or the lower surface of the stacked wafer Ws.

[0105] In one embodiment, the roller rotating mechanism may be configured to rotate only a part of the rollers 41. For example, the roller rotating mechanism may be connected to two rollers 41 among the four rollers 41 so that the two rollers rotate in the same direction at the same speed. In this case, the remaining two rollers 41 are configured to rotate freely. When the four rollers are arranged in the holding position, the two rollers 41 connected to the roller rotating mechanism rotate, and the other two rollers 41 rotate along with the two rollers 41 connected to the roller rotating mechanism via the stacked wafer Ws.

[0106] In one embodiment, the roller moving mechanism may be configured to move only a part of the rollers 41. For example, the roller moving mechanism may be connected to two rollers 41 among the four rollers 41 so that the two rollers 41 move between the holding position and the release position. In this case, the remaining two rollers 41 are pre-fixed at the holding position. The stacked substrate Ws is transported by the transport device to a position where the peripheral edge of the stacked substrate Ws contacts the two fixed rollers 41. By moving the two rollers 41 connected to the roller moving mechanism to the holding position, the stacked wafer Ws can be held in a vertical position. By moving the two rollers 41 connected to the roller moving mechanism to the release position, the stacked wafer Ws can be released.

[0107] In the above-mentioned embodiment, the rotating holding device 33 is configured to hold the laminated wafer Ws vertically. That is, the laminated wafer Ws is held in a vertical state by the rotating holding device 33. However, as long as the filler F can be applied to the gap G, the holding method of the laminated wafer Ws is not limited to the above-mentioned embodiment. For example, the filler coating device 100 may also have a rotating holding device 33, which is configured to hold the laminated wafer Ws horizontally. In this case, the laminated wafer Ws is held in a horizontal state by the rotating holding device 33. When the laminated wafer Ws is held in a horizontal state, the upper surface and the lower surface of the laminated wafer Ws are respectively located in an imaginary plane extending in the horizontal direction.

[0108] Fig.15 It is a front view showing a filler coating device according to still another embodiment. Fig.15 The rotating holding mechanism 33 of the filler coating device 100 shown in FIG. Figure 1 and Figure 2The rotating holding mechanism 33 of the filler coating device 100 shown is different in that the disc-shaped holding table 34 holds the stacked wafer Ws horizontally, rotates the stacked wafer Ws, and places the upper surface of the stacked wafer Ws within an imaginary plane extending in the horizontal direction. In this embodiment, a hollow shaft 35 is connected to the central portion of the holding table 34, and the rotating holding mechanism 33 includes a motor M for rotating the hollow shaft 35.

[0109] The dispenser 39 and the curing unit 60 are located radially outside the stacked wafer Ws held horizontally by the rotation holding mechanism 33. The filler F is ejected horizontally from the dispenser 39 and applied to the gap G of the rotating stacked wafer Ws.

[0110] Even in this embodiment, when the filler F ejected horizontally from the dispenser 39 hits the gap G of the stacked wafer Ws, liquid splashes of the filler F are generated, and the upper surface and / or lower surface of the stacked wafer Ws may be contaminated by the liquid splashes. Therefore, in this embodiment, the filler coating device 100 is also provided with a protector 12.

[0111] Although the protector of this embodiment is based on Figure 1 and Figure 2 The plate 15 is described in detail, but the moving mechanism 20 moves the plate 15 in the horizontal direction, which is different from the reference Figure 1 and Figure 2 The embodiment described in the ... Figure 8 The structure of the suction nozzle 18 described above may also be provided with reference to Figures 9 to 12 The structure of the dome 23 described here may also be a structure having reference Fig.13 Even in these cases, the moving mechanism 20 moves the plate body 15, the suction nozzle 18, the dome 23 or the bottomed dome 24 in the horizontal direction.

[0112] Fig.16 It is a top view showing a filler coating device according to another embodiment. Fig.16 The rotating holding mechanism 33 of the filler coating device 100 shown in FIG. Fig.15 The filler coating device 100 shown is different in that it is provided with more than three (four in the present embodiment) rollers 41 that can contact the peripheral portion of the laminated substrate Ws, a roller rotating mechanism (not shown) that rotates each roller 41 around its axis, and a roller moving mechanism (not shown) that moves each roller 41, instead of the holding table 34, the hollow shaft 35 and the motor M.

[0113] The structure of the three or more rollers 41 is similar to that of the reference except that the stacked wafer Ws is held horizontally. Fig.14 The roller rotating mechanism is the same as that of the embodiment described above except that the roller rotating mechanism rotates the stacked wafer Ws held horizontally by three or more rollers 41. Fig.14 The roller moving mechanism also has a holding position (see FIG. 1 ) in which three or more rollers 41 are held horizontally by the rollers 41 at the peripheral edge of the stacked wafer Ws. Fig.16 The solid line) and the release position of the laminated wafer Ws released from the roller 41 (refer to Fig.16 Except for the point moved between the point line) and the reference Fig.14 The same as the embodiment described above.

[0114] Even in this embodiment, when the filler F ejected horizontally from the dispenser 39 hits the gap G of the stacked wafer Ws, liquid splashes of the filler F are generated, and the upper surface and / or lower surface of the stacked wafer Ws may be contaminated by the liquid splashes. Therefore, the filler coating device 100 is also provided with the protector 12 in this embodiment.

[0115] Although the protector 12 of this embodiment is a reference Figure 1 and Figure 2 The plate 15 is described in detail, but the moving mechanism 20 moves the plate 15 in the horizontal direction, which is different from the reference Figure 1 and Figure 2 The embodiment described in the ... Figure 8 The structure of the suction nozzle 18 described above may also be provided with reference to Figures 9 to 12 The structure of the dome 23 described here may also be a structure having reference Fig.13 Even in these cases, the moving mechanism 20 moves the plate body 15, the suction nozzle 18, the dome 23 or the bottomed dome 24 in the horizontal direction.

[0116] The above-mentioned embodiments are recorded for the purpose of enabling a person with ordinary knowledge in the field to which the present invention belongs to implement the present invention. Those skilled in the art can certainly complete various variations of the above-mentioned embodiments, and the technical ideas of the present invention are also applicable to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is interpreted within the maximum scope of the technical ideas defined by the scope of the claim for protection.

[0117] [Industrial Applicability]

[0118] The present invention can be used for a filler coating device for coating a filler to a gap formed between edge portions of a plurality of substrates constituting a laminated substrate.

[0119] Explanation of symbols

[0120] 10: Control device

[0121] 12: Protector

[0122] 15: Board body

[0123] 15a: Opening

[0124] 18: Suction nozzle

[0125] 19: Vacuum line

[0126] 20: Mobile mechanism

[0127] 23: Dome

[0128] 23a: Opening

[0129] 23b: Through the hole

[0130] 23c: Suction hole

[0131] 23d: Non-through hole

[0132] 24: Dome with bottom

[0133] 33: Rotation holding mechanism (substrate holding part)

[0134] 34: Keeping table

[0135] 35: Hollow shaft

[0136] 39: Coating component (dispenser)

[0137] 44: Exhaust nozzle

[0138] 45: Syringe

[0139] 48: Support plate (support component)

[0140] 50: Stick

[0141] 53: Pressurized fluid line

[0142] 60: Hardening components (hardening devices)

[0143] 63: Light

[0144] 65: Lamp Heater

[0145] 68: Optical equipment

[0146] 100: Filler coating device

[0147] F: Filler

[0148] Fs: Liquid splash

[0149] G: Gap

[0150] M: Motor

[0151] W1: First substrate (first wafer)

[0152] W2: Second substrate (second wafer)

[0153] Ws: laminated substrate (laminated wafer).

Claims

1. A filler coating device, characterized in that: have: a substrate holding portion that holds a laminated substrate manufactured by bonding the first substrate and the second substrate and rotates the laminated substrate; a coating device disposed separately from the laminated substrate held by the substrate holding portion and discharging a filler toward a gap formed between a peripheral portion of the first substrate and a peripheral portion of the second substrate; as well as A protector prevents liquid splashes of the filler, which are generated when the filler discharged from the coating device collides with the gap, from adhering to the upper surface and / or the lower surface of the laminated substrate.

2. The filler coating device according to claim 1, characterized in that: The protector is a plate having an opening that allows the inclined surface of the laminated substrate rotated by the substrate holding portion to pass therethrough.

3. The filler coating device according to claim 2, characterized in that: The plate body has an upper surface, and when viewed in the radial direction of the laminated substrate, the upper surface is located between the top end and the end of the inclined portion of the laminated substrate.

4. The filler coating device according to claim 3, characterized in that: The edge of the opening of the plate body is made of a material capable of contacting the laminated substrate, or is covered by the material.

5. The filler coating device according to claim 2, characterized in that: The plate body is made of a material capable of absorbing the filler, or is covered with the material.

6. The filler coating device according to claim 1, characterized in that: The protector includes a suction nozzle disposed close to a collision portion between the laminated substrate and the filler.

7. The filler coating device according to claim 1, characterized in that: The protector is a dome covering the collision portion between the laminate substrate and the filler. The dome has a through opening that allows the filler discharged from the coating device to pass therethrough.

8. The filler coating device according to claim 2, characterized in that: The protector further includes a dome that covers a portion of the laminate substrate protruding from the opening of the plate body. The dome has a through opening that allows the filler discharged from the coating device to pass therethrough.

9. The filler coating device according to claim 7 or 8, characterized in that: The dome is made of, or covered with, a material capable of absorbing the filler.

10. The filler coating device according to claim 7 or 8, characterized in that: The dome has a plurality of suction holes extending from the inner surface to the outer surface of the dome, The protector includes a dome suction mechanism that sucks the internal space of the dome from the outside of the dome through the plurality of suction holes. The dome suction mechanism has at least one suction nozzle that is close to the outer surface of the dome.

11. The filler coating device according to claim 7 or 8, characterized in that: The dome has a plurality of non-through holes formed on the inner surface of the dome.

12. The filler coating device according to claim 1, characterized in that: The coating device is a dispenser that discharges the filler as intermittent droplets toward the gaps of the laminated substrate.

Images