Device and method for collecting metal ions on surface of silicon wafer
By designing a device for metal ion acquisition on the surface of silicon wafers, and using a robotic arm and a dual scanning head to scan the silicon wafer simultaneously, the problem of low scanning efficiency in the prior art is solved, and a more efficient testing process is achieved.
CN119643215AActive Publication Date: 2025-03-18XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
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Patent Information
- Application Number
- CN202411778613.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2044-12-05
AI Technical Summary
Technical Problem
In the prior art, multiple silicon wafers are scanned in sequence to collect metal ions, which takes a long time and has low scanning efficiency.
Method used
A metal ion acquisition device on the surface of silicon wafer is designed, and the silicon wafer is fixed with a robot arm and a mirror-setting stage, equipped with a dual scanning head and a scanning liquid pipeline, which can transport and recover the scanning liquid through pressure and suction, and realize the simultaneous scanning of two silicon wafers.
Benefits of technology
It improves the efficiency of silicon wafer scanning, reduces test time, improves production rhythm, and ensures the accuracy of testing.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a silicon wafer surface metal ion collection device and method, and belongs to the technical field of semiconductor manufacturing. The silicon wafer surface metal ion collecting device comprises at least one set of mechanical arms, each set of mechanical arms comprises a pair of carrying tables arranged in a mirror image mode, and the carrying tables are used for fixing silicon wafers; the scanning assembly comprises a main body structure and a pair of scanning heads which are arranged at one end of the main body structure in a mirroring mode, the scanning heads correspond to the carrying tables one to one, a scanning pipeline used for transmitting scanning liquid is arranged in the main body structure, and the scanning pipeline is communicated with liquid outlets of the two scanning heads; and the scanning liquid storage structure is used for conveying the scanning liquid to the liquid outlet through the scanning pipeline under the action of pressure, or recycling the scanning liquid from the liquid outlet through the scanning pipeline under the action of suction force. According to the invention, the efficiency of scanning the silicon wafer can be improved.
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