Method for cutting substrate on wafer and substrate

By designing chamfered rectangular cutting track units on the wafer, the problem that traditional chip substrate design is difficult to meet the needs of large-area chips is solved, the utilization rate and cutting quality of wafers are improved, and the effectiveness of chip substrates in biological detection is ensured.

CN119650519APending Publication Date: 2025-03-18GENEMIND BIOSCIENCES CO LTD
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Patent Information

Application Number
CN202311205506.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2023-09-15
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

During chip processing, traditional chip substrate designs are difficult to meet the needs of large-area chips, resulting in a decrease in the utilization rate of wafers. The cutting edges of chip substrates are prone to dust and burrs, affecting the effect of biological detection.

Method used

By presetting the cutting track on the wafer, a rectangular cutting track unit is designed and chamfered, ensuring that the minimum distance between adjacent cutting tracks is greater than 20 μm, and the minimum distance between the chamfer and the outer tangent of the wafer edge is not less than the minimum distance between adjacent cutting track units, so as to improve the cutting quality and wafer utilization.

Benefits of technology

It is possible to cut out a larger number of high-quality chip substrates within a limited wafer area, improve the utilization rate of wafers, and reduce edge damage after cutting, ensuring the effectiveness of chip substrates in biological detection.

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Abstract

The invention provides a method for cutting a substrate on a wafer and the substrate, and the method for cutting the substrate on the wafer comprises the following steps: designing one or more corners, which have the smallest distance from the edge of the wafer, in a rectangular cutting track as first chamfers; the minimum distance between the first chamfer and the outer tangent line of the edge of the wafer is not less than the minimum distance between two adjacent cutting track units; the minimum distance between the intersection point of the extension lines of the two edges adjacent to the first chamfer and the outer tangent line of the edge of the wafer is smaller than the minimum distance between the two adjacent cutting track units, or the intersection point is located on the outer side of the wafer, and therefore on the premise that the quality of the cut chip substrate is not affected, the cutting efficiency of the chip substrate is improved. And more substrates are obtained by cutting in a limited wafer area, so that the utilization rate of the wafer is effectively improved. According to the base plate disclosed by the invention, the corner strength of the base plate can be improved by arranging the chamfer structure in smooth transition, and the risk of corner collapse of the base plate can be reduced when the base plate is fixed in a frame-shaped structure.
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