Paint removing jig

By designing a paint removal fixture including support components, movable parts and positioning molds, the problem of paint removal solvent splashing during the paint removal process of electronic component lead wire is solved, and effective protection and reliability guarantee for electronic components is achieved.

CN119651430APending Publication Date: 2025-03-18SHENZHEN ZHENHUA FU ELECTRONICS
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Patent Information

Application Number
CN202411752973.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-28
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

When chemically depainting the lead wire of the electronic component, the paint removal solvent is prone to splashing on other parts of the electronic component, resulting in damage to the paint film of the copper wire, and a risk of short circuit, affecting the reliability of the electronic component.

Method used

A paint removal fixture is designed, including a support assembly, a movable part and a positioning mold. The movable part is slidably arranged on the support assembly in the first direction. The positioning mold is arranged on the movable part. The positioning mold has a positioning cavity. The main cavity is used to place electronic components. The lead cavity allows the lead wire to pass out to the outside of the positioning mold. The movable part drives the positioning mold and the electronic components to move to the paint removal solvent, so that the lead wire extends into the solvent for paint removal.

Benefits of technology

It effectively avoids the risk of paint removal solvent splashing on other parts of the electronic component, protects other copper wires of the electronic component, and ensures the reliability of the electronic component.

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Abstract

The invention provides a paint removing jig, and belongs to the technical field of paint removing of enameled wires, the paint removing jig comprises a supporting assembly, a movable part and a positioning mold, the movable part is slidably arranged on the supporting assembly in the first direction, the positioning mold is arranged on the movable part, and the positioning mold is provided with at least one positioning cavity; the positioning cavity comprises a main cavity and at least one lead cavity, and the main cavity is communicated with the external space through the lead cavities. During use, an electronic component is fixed in the main cavity, a lead wire of the electronic component extends out of the positioning mold through the lead wire cavity, then the electronic component is driven to move through the movable part, the lead wire is immersed in a paint removal solvent, a paint layer on the lead wire is dissolved, and in the paint removal process, the positioning cavity can protect the electronic component, so that the service life of the electronic component is prolonged. The paint removing solvent is prevented from splashing to other parts of the electronic element, and the reliability of the electronic element in subsequent use is ensured.
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