Electronic device

By designing a combined structure of the middle frame, circuit board, housing assembly, gas drive mechanism and heat sink in electronic equipment, the problem of low heat dissipation efficiency of existing electronic equipment is solved, and a more efficient heat dissipation effect is achieved.

CN119653734APending Publication Date: 2025-03-18GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD
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Patent Information

Application Number
CN202411872400.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2022-08-09
Publication Date
2025-03-18

AI Technical Summary

Technical Problem

The heat dissipation components of existing electronic devices are unable to effectively meet their increasing heating needs, resulting in inefficient heat dissipation.

Method used

An electronic device is designed, adopting a combined structure of a middle frame, a circuit board, a housing assembly, a gas drive mechanism and a heat sink. A first air duct is provided on the housing assembly and is thermally connected to the first heat source. The gas driving mechanism drives the gas flow to dissipate heat; the heat sink is thermally connected to the gas driving mechanism and the second heat source, and the heat dissipation is accelerated by the air flow.

Benefits of technology

Through this structure, electronic devices can effectively dissipate heat, improve heat dissipation efficiency, and meet the heat dissipation needs under high load conditions.

✦ Generated by Eureka AI based on patent content.
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Abstract

The invention provides electronic equipment. The electronic equipment provided by the embodiment of the invention comprises a middle frame; the circuit board is arranged on the middle frame, the circuit board comprises a substrate, a first heat source and a second heat source, the first heat source and the second heat source are arranged on the two opposite surfaces of the substrate, and the second heat source faces the middle frame; the shell assembly is arranged on the side, provided with the circuit board, of the middle frame, and the shell assembly is provided with a first air channel communicated with the outside; the gas driving mechanism is arranged in the middle frame, communicates with the first air channel and the outside and is used for driving gas to flow in the first air channel so as to dissipate heat of the first heat source; and the cooling fins are arranged on the side, away from the shell assembly, of the middle frame, and the cooling fins are used for transmitting heat of the second heat source to the gas driving mechanism so as to cool the second heat source. The electronic equipment provided by the embodiment of the invention has better heat dissipation efficiency.
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