Display module and electronic device

Abstract

The present application relates to the technical field of display device, specifically relates to a display module and electronic equipment, through the first solder pad connecting the coil and the solder side, and the first solder pad is arranged on the side of the antenna device, the coil and the screen body are fixedly connected through the first solder pad on the side, the space occupied in the thickness direction (i.e. the direction from the display surface to the non-display surface) can be reduced, so as to reduce the thickness of the display panel.Compared with the prior art, since the foam / PET buffer material for attaching is also saved between the screen body and the antenna device, therefore, the overall thickness of the display module is reduced through the combination of the above design, so that the thin design of the product is realized.

Description

Technical Field

[0001] This invention relates to the technical field of display devices, and more specifically to a display module and electronic device. Background Technology

[0002] There are many types of displays, including liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs).

[0003] NFC (Near Field Communication) is a short-range wireless communication technology that allows contactless, point-to-point data transfer between electronic devices (within ten centimeters). NFC technology is considered to have great application potential in areas such as mobile payments.

[0004] With the development of mobile payment, simply adding an NFC antenna device can no longer meet the design requirements for thinner products. Summary of the Invention

[0005] The purpose of this application is to provide a display module and an electronic device.

[0006] This application provides a display module, including: a screen body having a display surface, a non-display surface, and a soldering side surface, wherein the display surface and the non-display surface are disposed opposite to each other, the soldering side surface connects the display surface and the non-display surface, and the soldering side surface has a soldering area; and an antenna device including a coil and a first solder pad connected to each other, wherein the coil is disposed on the non-display surface, and the first solder pad is located on the side of the antenna device and is fixedly electrically connected to the soldering area.

[0007] In one exemplary embodiment of this application, the welding area abuts against the first pad, and solder joints are provided on the welding area and the first pad, the welding area and the first pad being connected through the solder joints; preferably, the welding area and the first pad are welded and fixed; preferably, the welding area and the first pad are located on the same side of the solder joints.

[0008] In one exemplary embodiment of this application, the first pad is connected to the outer end of the coil, and the antenna device includes a second pad connected to the inner end of the coil; preferably, the first pad and the second pad are rectangular in shape; preferably, the first pad and the second pad are square in shape.

[0009] In one exemplary embodiment of this application, the coil is arranged from the inside out, and the coil includes a first coil, a second coil, and a third coil. The first coil is located on the outer periphery, the second coil is located on the inner periphery, and the third coil is located between the second coil and the first coil. The end of the first coil is connected to the first pad, and the first pad protrudes from the side of the first coil away from the third coil. The end of the second coil is connected to the second pad, and the second pad protrudes from the side of the second coil away from the third coil. The second pad is spaced apart from the third coil. Preferably, the number of coils between the first coil and the second coil can be configured to be multiple.

[0010] In one exemplary embodiment of this application, the antenna device includes a first substrate disposed between the coil and the screen, and the coil is disposed on the first substrate; the display module includes a circuit board electrically connected to the screen, the circuit board extending bent toward the side of the antenna device away from the screen, the circuit board extending to the second pad and electrically connected to the second pad; preferably, the first substrate includes a flexible substrate; preferably, the circuit board includes a flexible circuit board.

[0011] In one exemplary embodiment of this application, the antenna device further includes a semiconductor layer formed on the side of the coil opposite to the first substrate; preferably, the semiconductor layer comprises a ferrite material.

[0012] In one exemplary embodiment of this application, the number of turns of the coil configuration is between 2 and 5, and an insulating layer is provided between adjacent coils; preferably, the number of coils is 3; preferably, the insulating layer comprises an organic insulating material.

[0013] In one exemplary embodiment of this application, the display module includes a high-temperature resistant layer disposed between the antenna device and the non-display surface; preferably, the high-temperature resistant layer includes asbestos material; preferably, the thickness of the high-temperature resistant layer is between 0.05 and 0.3 mm.

[0014] In one exemplary embodiment of this application, the display module further includes a silicone layer disposed between the high-temperature resistant layer and the non-display surface of the screen; preferably, the silicone layer is formed on the screen or the high-temperature resistant layer by coating.

[0015] This application also provides an electronic device including the aforementioned display module.

[0016] This application discloses a display module and electronic device, which has the following advantages: By connecting the coil and the soldering side via a first solder pad, and placing the first solder pad on the side of the antenna device, the coil and the screen are fixedly electrically connected via the first solder pad on the side. This reduces the space occupied in the thickness direction (i.e., the direction from the display surface to the non-display surface), thereby reducing the thickness of the display panel. Compared with the prior art, foam / PET cushioning material for attachment is also eliminated between the screen and the antenna device. Therefore, the combination of the above design reduces the overall thickness of the display module, thus achieving a thinner product design.

[0017] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0020] Figure 1 This is a schematic diagram of the structure of a display module according to an embodiment of the present invention;

[0021] Figure 2 This is a first structural schematic diagram of a portion of the display module in an embodiment of the present invention;

[0022] Figure 3 yes Figure 2 A cross-sectional schematic diagram;

[0023] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0024] Figure 5 This is a schematic diagram of the coil structure in an embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the second structure of a portion of the display module in an embodiment of the present invention;

[0026] Figure 7 yes Figure 6 Enlarged view of point B in the middle;

[0027] Figure 8 This is a schematic diagram of the circuit board structure in an embodiment of the present invention;

[0028] Figure 9 yes Figure 6 Enlarged diagram of point C in the middle.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1. Cover plate; 2. Adhesive layer; 3. Polarizing film; 10. Screen body; 11. Display surface; 12. Non-display surface; 13. Welding side; 131. Welding area; 14. Second substrate; 15. Light-emitting layer; 20. Antenna device; 21. Coil; 211. First coil; 212. Second coil; 213. Third coil; 22. First pad; 221. Solder joint; 23. Second pad; 24. First substrate; 25. Insulating layer; 30. High-temperature resistant layer; 40. Silicone layer; 50. Semiconductor layer; 60. Circuit board; 61. Connecting part; 62. Bending part. Detailed Implementation

[0031] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided to make this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art.

[0032] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a thorough understanding of embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, apparatuses, steps, etc., can be employed. In other instances, well-known methods, apparatuses, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0033] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present application, and should not be construed as limiting the present application.

[0034] It should be noted that "multiple" in this article refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0035] There are many types of displays, including liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs).

[0036] NFC (Near Field Communication) is a short-range wireless communication technology that allows contactless, point-to-point data transfer between electronic devices (within ten centimeters). NFC technology is considered to have great application potential in areas such as mobile payments.

[0037] With the development of mobile payment, simply adding an NFC antenna device can no longer meet the design requirements for thinner products.

[0038] To solve the above-mentioned technical problems, refer to Figures 1 to 4 As shown, this application provides a display module, including a screen body 10 and an antenna device 20. The screen body 10 has a display surface 11, a non-display surface 12 and a soldering side surface 13. The display surface 11 and the non-display surface 12 are arranged opposite to each other. The soldering side surface 13 is connected to the display surface 11 and the non-display surface 12 and has a soldering area 131. The antenna device 20 includes a coil 21 and a first solder pad 22 connected to each other. The coil 21 is disposed on the non-display surface 12, and the first solder pad 22 is located on the side of the antenna device 20 and is fixedly electrically connected to the soldering area 131.

[0039] In this embodiment, the coil 21 and the soldering side 13 are connected by the first solder pad 22. The soldering side 13 is located on the periphery of the screen body 10, and the first solder pad 22 is located on the side of the antenna device 20. The coil 21 and the screen body 10 are fixedly electrically connected by the first solder pad 22 on the side, which can reduce the space occupied in the thickness direction (i.e., the direction from the display surface 11 to the non-display surface 12), thereby reducing the thickness of the display panel. Compared with the prior art, the foam / PET cushioning material used for attachment is also eliminated between the screen body 10 and the antenna device 20. Therefore, the combination of the above design reduces the overall thickness of the display module, thereby achieving a thinner product design.

[0040] In some embodiments, refer to Figures 2 to 4 As shown, the screen 10 includes a second substrate 14 and a light-emitting layer 15. A soldering area 131 is located on the side of the second substrate 14. The second substrate 14 includes a driving circuit layer to drive the light-emitting layer 15 to emit light. The driving circuit layer has poor light transmittance to form a non-display surface 12, where the side opposite to the non-display surface 12 is the display surface 11. The display surface 11 is used to display images that can be received by the user. Multiple side surfaces surround the display surface 11 and the non-display surface, with the soldering side 13 located on one side. The size of the soldering area 131 is determined according to actual needs; no specific limitation is made here.

[0041] In some embodiments, refer to Figures 2 to 4 As shown, the second substrate 14 has at least one side that is flat on its periphery, the welding area 131 is disposed on the side of the flat surface, and the display screen is an organic electroluminescence display (OLED).

[0042] In some embodiments, the second substrate 14 may be a low-temperature polycrystalline silicon substrate. Using low-temperature polycrystalline silicon as a substrate material has many advantages, such as making thin film circuits thinner and smaller, and reducing power consumption.

[0043] In some embodiments, refer to Figures 2 to 4 As shown, the soldering area 131 abuts against the first solder pad 22, and solder joints 221 are provided on the soldering area 131 and the first solder pad 22. The soldering area 131 and the first solder pad 22 are connected by solder joints 221. Preferably, the soldering area 131 and the first solder pad 22 are soldered together. Preferably, the soldering area 131 and the first solder pad 22 are located on the same side of the solder joint 221. By placing the solder joint 221 on the soldering area 131 and the first solder pad 22, and placing the soldering area 131 and the first solder pad 22 on the same side, soldering and fixing can be performed from the side of the screen body 10 and the antenna device 20. That is, the solder joint 221 is placed on the periphery of the screen body 10, thereby reducing the space occupied by the solder joint 221 in the thickness direction of the screen body 10, and thus reducing the thickness of the display device. The size of the soldering area 131 is not specifically limited here, and can be selected according to actual needs.

[0044] In some embodiments, refer to Figures 2 to 4 As shown, the screen body 10 generally includes a cover plate 1, and a polarizer 3 (POL) and an adhesive layer 2 are disposed between the cover plate 1 and the screen body 10. (Refer to...) Figure 3 As shown, the polarizer 3 is close to the screen 10, the adhesive layer 2 is close to the cover plate 1, the polarizer 3 and the circuit board 60 are on the same layer and spaced apart, so that the emitted light can pass through the polarizer 3 and the cover plate 1 in sequence, and the electrical signal transmitted by the circuit board 60 reduces the negative impact on the polarizer 3.

[0045] In some embodiments, adhesive layer 2 may include an optically transparent adhesive film (OCA), or the like. However, adhesive layer 2 is not limited to this, but may include typical adhesives and adhesives. For example, adhesive layer 2 may include an optically transparent resin (OCR) or pressure-sensitive adhesive (PSA) film, or may be made of an optically transparent resin or pressure-sensitive adhesive film.

[0046] In some embodiments, refer to Figure 3As shown, the display module includes a high-temperature resistant layer 30, which is disposed between the antenna device 20 and the non-display surface 12. This high-temperature resistant layer 30 functions as a backlight and has the advantages of low heat transfer and good heat insulation. It is used to isolate heat transfer between the antenna device 20 and the screen 10. The screen 10 generates a large amount of heat during display, which is transferred to the antenna device 20, reducing its signal transmission efficiency. Therefore, the high-temperature resistant layer 30 effectively isolates heat transfer between the screen 10 and the antenna device 20.

[0047] In some embodiments, the high-temperature resistant layer 30 includes materials such as asbestos, glass wool, and rock wool. Preferably, the high-temperature resistant layer 30 is made of asbestos.

[0048] In some embodiments, the thickness of the high-temperature resistant layer 30 is between 0.05 and 0.3 mm; specifically, the thickness of the high-temperature resistant layer 30 is 0.1 mm, 0.5 mm, 0.8 mm, 1.2 mm, 1.5 mm, 2.0 mm, 2.5 mm, etc., and one of the thicknesses can be selected as the thickness of the high-temperature resistant layer 30 according to the actual situation. Of course, the thickness of the high-temperature resistant layer 30 is not limited to this.

[0049] In some embodiments, refer to Figure 3 As shown, the display module also includes a silicone layer 40, which is disposed between the high-temperature resistant layer 30 and the non-display surface 12 of the screen 10. This silicone layer 40 is used to allow the antenna device 20 to adhere to the screen 10, and it maintains a long-term adhesion effect at the high temperature of the screen 10. The silicone layer 40 is formed on the screen 10 or the high-temperature resistant layer 30 by coating.

[0050] In some embodiments, refer to Figure 5 As shown, the first pad 22 is connected to the outer end of the coil 21, and the antenna device 20 includes a second pad 23, which is connected to the inner end of the coil 21. Compared to placing the first pad 22 and the second pad 23 simultaneously at either the outer or inner end, placing the first pad 22 and the second pad 23 at the inner and outer ends respectively eliminates the need for jumpers, thereby reducing the thickness of the coil 21 and also reducing the thickness of the display device.

[0051] In some embodiments, refer to Figure 5 As shown, the shape of the first pad 22 can be polygonal, preferably rectangular (e.g., ...). Figure 5 As shown), it is further preferably square. The first pad 22 and the outer end of the coil 21 can be an integral structure; or, the first pad 22 is welded to the outer end of the coil 21, depending on the actual needs.

[0052] In some embodiments, refer to Figure 5As shown, the first pad 22 protrudes outward from the outer periphery of the coil 21. The height of the protrusion is not specifically limited here, as long as it enables the first pad 22 to achieve a good electrical connection with the soldering area 131.

[0053] In some embodiments, refer to Figure 5 As shown, the shape of the second pad 23 can be polygonal, preferably rectangular (e.g., ...). Figure 5 As shown), it is further preferably square. The second pad 23 and the inner end of the coil 21 can be an integral structure; or, the second pad 23 is welded to the inner end of the coil 21, depending on the actual needs.

[0054] In some embodiments, refer to Figure 5 As shown, the second pad 23 protrudes towards the inner periphery of the coil 21. The height of the protrusion is not specifically limited here, as long as it enables the first pad 22 to achieve a good electrical connection.

[0055] In some embodiments, refer to Figure 5 As shown, the coil 21 is arranged to wrap around from the inside out, and the first pad 22 protrudes outwards. The coil 21 is arranged to form a "vortex" shape, and each coil 21 is square in shape. The first pad 22 is connected to one of the coils 21 on the outer periphery. In other embodiments, the shape of each coil 21 can also be polygonal, circular, or irregular, depending on the actual needs.

[0056] In some embodiments, refer to Figure 5 As shown, the antenna device 20 may include multiple coils 21, with the number of turns of each coil 21 ranging from -1 to -2; preferably, the number of coils 21 is three. The more coils 21 there are, the stronger the signal reception and transmission capabilities of the antenna device 20. However, too many coils 21 will occupy a larger area of ​​the non-display surface 12, thus reducing the space available for other components on the non-display surface 12. Therefore, setting the number of coils 21 to three achieves a balance between its occupied area and signal capability.

[0057] In some embodiments, refer to Figure 5 As shown, coil 21 can be defined as first coil 211, second coil 212 and third coil 213 respectively. As can be seen from the figure, first coil 211 is connected to third coil 213, and third coil 213 is connected to second coil 212, thus forming a "vortex" shape.

[0058] In some embodiments, refer to Figure 5As shown, the first coil 211 is located on the outer periphery, the second coil 212 is located on the inner periphery, and the third coil 213 is located between the second coil 212 and the first coil 211. The end of the first coil 211 is connected to the first pad 22, which protrudes from the side of the first coil 211 away from the third coil 213. The end of the second coil 212 is connected to the second pad 23, which protrudes from the side of the second coil 212 away from the third coil 213. The second pad 23 and the third coil 213 are spaced apart. The number of coils 21 between the first coil 211 and the second coil 212 can also be multiple. This allows for the possibility of no electrical contact between the first pad 22 and the second pad 23 and the third coil 213, thereby achieving insulation between the first pad 22, the second pad 23, and the third coil 213. Since the second coil 212 and the third coil 213 are arranged adjacent to each other, and the second pad 23 is made of metal, the second pad 23 needs to be spaced apart from the third coil 213 to achieve insulation between them so that the electrical signals between them will not interfere with each other. Furthermore, the second pad 23 is protruding to increase the soldering area between the second pad 23 and the circuit board 60.

[0059] In some embodiments, refer to Figure 5 As shown, an insulating layer 25 is provided between adjacent coils 21 to insulate the first coil 211, the second coil 212, and the third coil 213 from each other. The material of the insulating layer 25 includes organic insulating materials, inorganic insulating materials, plastics, etc. Preferably, the insulating layer 25 is an organic insulating material.

[0060] In some embodiments, the number of turns of the coil 21 between the first coil 211 and the second coil 212 can be configured to be multiple. The specific number of turns of the coil 21 configured between the first coil 211 and the second coil 212 is not limited here, and can be set according to actual needs.

[0061] In some embodiments, refer to Figures 6 to 9 As shown, the antenna device 20 includes a first substrate 24 disposed between the coil 21 and the screen 10, with the coil 21 disposed on the first substrate 24. The display module includes a circuit board 60 electrically connected to the screen 10. The circuit board 60 bends and extends toward the side of the antenna device 20 away from the screen 10, extending to and electrically connecting to a second pad 23. The first substrate 24 is used to support the coil 21, facilitating the fabrication of the antenna device 20. The circuit board 60 is connected to the screen 10 on one side and electrically connected to the second pad 23 on the other side, enabling the transmission of magnetic flux signals from the antenna device 20 to the screen 10. The circuit board 60 can also transmit signals between the screen 10 and the power supply and processor.

[0062] In some embodiments, refer to Figures 6 to 9As shown, the circuit board 60 includes a bent portion 62 and two connecting portions 61. The two connecting portions 61 and the bent portion 62 are an integral structure. One connecting portion 61 extends into the screen body 10 to connect to the driving circuit of the substrate, and the other connecting portion 61 extends on the side of the antenna device 20 away from the screen body 10 and connects to the second pad 23. The bent portion 62 extends through the screen body 10 and the antenna device 20. This design reduces the thickness of the display device by utilizing the bent portion 62 of the circuit board 60.

[0063] In some embodiments, the circuit board 60 includes a flexible circuit board, and the first substrate 24 includes a flexible substrate. The flexible circuit board or flexible substrate is a highly reliable and highly flexible printed circuit board made of polyimide or polyester film as a substrate. It features high wiring density, light weight, thinness, and good bending properties.

[0064] In some embodiments, refer to Figures 6 to 9 As shown, the antenna device 20 further includes a semiconductor layer 50, which is formed on the side of the coil 21 facing away from the first substrate 24. Preferably, the semiconductor layer 50 comprises a ferrite material. Ferrite material is a high-temperature sintered ferrite material that can reduce the absorption of signal magnetic fields by metallic materials. Furthermore, the ferrite material itself is formed by high-temperature sintering, which effectively increases the sensing distance by increasing the magnetic field strength. Other semiconductor materials can also be selected based on actual needs.

[0065] This application also provides an electronic device including the aforementioned display module. The coil 21 of the display module is arranged in a spiral configuration from the inside out. The antenna device 20 is electrically connected to the screen 10 by welding a first pad 22 connected to the outer end of the coil 21 to a welding area 131 on the welding side 13, and by welding a second pad 23 connected to the inner end of the coil 21 to a circuit board 60. A high-temperature resistant layer 30 is disposed between the antenna device 20 and the non-display surface 12, and is used to isolate heat transfer between the antenna device 20 and the screen 10. Compared to the prior art, since the foam / PET cushioning material used for attachment is eliminated between the display screen and the antenna device 20, and the welding area 131 is located on the side, welding fixation does not increase the overall thickness. Therefore, the combination of the above design reduces the overall thickness of the display module, thereby achieving a thinner product design and good heat insulation.

[0066] In this application, unless otherwise expressly specified and limited, the terms "set up (provided)" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] In the description of this specification, references to terms such as "some embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment is included in at least one embodiment of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0068] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application. Therefore, any changes or modifications made in accordance with the claims and description of this application should fall within the scope of this patent application.

Claims

1. A display module, characterized in that, include: The screen body has a display surface, a non-display surface, and a welding side surface. The display surface and the non-display surface are arranged opposite to each other. The welding side surface connects the display surface and the non-display surface and has a welding area. An antenna device includes an interconnected coil and a first pad, the coil being disposed on the non-display surface, and the first pad being located on the side of the antenna device and being fixedly electrically connected to the soldering area; The first pad is connected to the outer end of the coil, and the antenna device includes a second pad, which is connected to the inner end of the coil. The antenna device includes a first substrate, which is disposed between the coil and the screen, and the coil is disposed on the first substrate; The display module includes a circuit board electrically connected to the screen body. The circuit board bends and extends toward the side of the antenna device away from the screen body. The circuit board extends to the second pad and is electrically connected to the second pad.

2. The display module according to claim 1, characterized in that, The welding area abuts against the first pad, and solder joints are provided on the welding area and the first pad, and the welding area and the first pad are connected by the solder joints.

3. The display module according to claim 2, characterized in that, The welding area and the first welding pad are welded and fixed.

4. The display module according to claim 2, characterized in that, The welding area and the first pad are located on the same side of the solder joint.

5. The display module according to claim 1, characterized in that, The first pad and the second pad are rectangular in shape.

6. The display module according to claim 1, characterized in that, The coils are arranged from the inside out, and the coils include a first coil, a second coil, and a third coil. The first coil is located on the outer periphery, the second coil is located on the inner periphery, and the third coil is located between the second coil and the first coil. The end of the first coil is connected to the first pad, and the first pad protrudes from the side of the first coil away from the third coil. The end of the second coil is connected to the second pad, and the second pad protrudes from the side of the second coil away from the third coil. The second pad and the third coil are spaced apart.

7. The display module according to claim 6, characterized in that, The number of coils between the first coil and the second coil can be configured to be multiple.

8. The display module according to claim 1, characterized in that, The first substrate includes a flexible substrate; and / or the circuit board includes a flexible circuit board.

9. The display module according to claim 1, characterized in that, The antenna device further includes a semiconductor layer formed on the side of the coil away from the first substrate.

10. The display module according to any one of claims 1 to 8, characterized in that, The number of turns of the coil is between 2 and 5, and an insulating layer is provided between adjacent coils.

11. The display module according to any one of claims 1 to 8, characterized in that, The display module includes a high-temperature resistant layer, which is disposed between the antenna device and the non-display surface.

12. The display module according to claim 11, characterized in that, The high-temperature resistant layer includes asbestos material; And / or, the thickness of the high-temperature resistant layer is between 0.05 and 0.3 mm.

13. The display module according to any one of claims 11, characterized in that, The display module also includes a silicone layer, which is disposed between the high-temperature resistant layer and the non-display surface of the screen.

14. An electronic device, characterized in that, Includes the display module as described in any one of claims 1 to 13.

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