Fusion sensor microsystem chip

Abstract

The invention relates to a micro-system chip of a fusion sensor, which belongs to a new-generation information technology intelligent fusion sensor and is composed of a microcontroller, a sensing element, a power management unit, a resistor, a capacitor, a crystal oscillator, a substrate, a pin and a packaging body. And the microcontroller performs multi-dimensional data fusion, data filtering, correction and compensation on the acquired various external environment variables, and outputs resolved and processed host sensing data. The whole microsystem chip circuit layout is of a three-layer three-dimensional hierarchical structure, a power management unit is pre-embedded into a substrate power layer, resistors and capacitors are pre-embedded into an inner electric layer of a substrate, a sensing element, a microcontroller and a crystal oscillator are fixed to the surface layer of the substrate in a reflow soldering mode, all the layers are subjected to circuit bonding through through holes, pins are laid on the side edges of the substrate through metal foils, and the metal foils are arranged on the pins. And the electronic element and the substrate are encapsulated into the flat cubic microsystem chip by the semi-crystalline high polymer material through injection molding. The microsystem chip is connected with peripheral equipment through a pin; the communication interface is defined on the pins and comprises one or more of UART, USART, SPI, CAN and I2C.