Lithographic equipment, use method thereof and gas bath generation device
By designing an air bath generator in the lithography equipment to form a laminar airflow, the problem of difficult control of polluted gases and particles near key components of the lithography equipment is solved, and the photolithography yield and service life of optical components are improved.
CN119668048APending Publication Date: 2025-03-21INST OF MICROELECTRONICS CHINESE ACAD OF SCI LTD
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Patent Information
- Application Number
- CN202411903911.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-03-21
AI Technical Summary
Technical Problem
In existing lithography equipment, polluting gases and particles near key components are difficult to strictly control, resulting in a reduced yield on photolithography and a shorter life of optical components.
Method used
An air bath generator is designed, including an annular air bath generator and an air supply device, which flows near key components of the lithography device by forming a laminar airflow to prevent external contaminants from entering.
Benefits of technology
It effectively controls the polluting gases and particles near key components of the lithography equipment, improves the yield of lithography, and extends the service life of optical components.
✦ Generated by Eureka AI based on patent content.
Abstract
The present invention relates to the technical field of circuit manufacturing, and discloses a lithographic apparatus and a use method thereof, and a gas bath generation device, the device comprises: a gas bath generator having an accommodation space and an annular flow channel, the outer wall of the gas bath generator is provided with at least one ventilation assembly, each ventilation assembly comprises a plurality of through holes arranged around the circumference of the accommodation space at intervals, the through hole is configured to enable working gas in the annular flow channel to flow through the through hole to form laminar flow, and in the first direction, the laminar flow can flow in the direction away from the containing space; and the gas supply device is used for providing working gas into the gas bath generator. During working, the gas supply device is started to form a plurality of laminar gas flows, so that external gas and particulate pollutants cannot flow to an optical element of the photoetching equipment and a space near a silicon wafer, thereby realizing effective control on polluting gas and particles, effectively improving the photoetching yield and also guaranteeing the service life of the optical element.
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