Optical device and optical transceiver

Abstract

The optical device includes, for example, a first substrate having a first surface facing a first direction and intersecting the first direction; an optical transceiver disposed offset in a first direction with respect to the first substrate; a socket that is positioned between the first substrate and the optical transceiver and has a plurality of connection conductors that electrically connect the conductor of the first substrate and the conductor of the optical transceiver, and an insulator that supports the plurality of connection conductors; and a positioning pin extending in a first direction between the first substrate and the optical transceiver and penetrating through the receptacle to position the first substrate, the optical transceiver, and the receptacle in a direction intersecting the first direction.

Description

Technical Field

[0001] The invention relates to an optical device and an optical transceiver. Background Art

[0002] Conventionally, as an optical transceiver used in a network switch device, a small optical transceiver described in Patent Document 1 is known (eg, Patent Document 1).

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-27147 Summary of the invention

[0006] Problems to be solved by the invention

[0007] In a network switch device that implements CPO (co-packaged optics), a switch ASIC (application specific integrated circuit) and a plurality of optical transceivers are mounted on a substrate.

[0008] With the rapid increase in data center communication volume, the top priority is to increase the capacity and reduce power consumption of network switch devices. In the architecture that uses existing pluggable transceivers, the number of transceiver connections on the front panel of the switch device becomes a bottleneck, and the limit of increasing capacity can be seen. For this reason, small optical transceivers such as ultra-small CPO (Co-Packaged Optics) optical transceivers that are configured very close to LSI are sought. If the optical transceiver is further miniaturized, the spacing between the multiple conductors that transmit electrical signals between the substrate and the optical transceiver will be narrowed. In conjunction with this, in order to ensure the electrical connection between the multiple conductors provided on the substrate and the multiple conductors provided on the optical transceiver, the positioning accuracy between the substrate and the optical transceiver is sought to be improved.

[0009] Therefore, one of the objects of the present invention is to obtain an improved new optical device and optical transceiver that can more reliably ensure electrical connection between a substrate of an optical device and an optical transceiver, for example.

[0010] Means for solving problems

[0011] The optical device of the present invention, for example, comprises: a first substrate having a first surface facing a first direction and intersecting the first direction; an optical transceiver, which is offset relative to the first substrate in the first direction; a socket, which is located between the first substrate and the optical transceiver and has a plurality of connecting conductors that electrically connect the conductors of the first substrate and the conductors of the optical transceiver, and an insulator that supports the plurality of connecting conductors; and a positioning pin, which extends between the first substrate and the optical transceiver in the first direction and penetrates the socket to position the first substrate, the optical transceiver and the socket in a direction intersecting the first direction.

[0012] In the optical device, the optical transceiver may include: a second substrate having a plurality of conductors and an insulator; and a first member provided between the first substrate and the second substrate and having a first opening for inserting the positioning pin.

[0013] In the optical device, the first opening may penetrate the first member, the positioning pin may penetrate the first opening, the second substrate may be provided with a second opening for inserting the positioning pin, and the optical transceiver may be positioned with the positioning pin at the second opening.

[0014] In the optical device, the optical transceiver may include a second member that covers the second substrate on a side opposite to the first member with respect to the second substrate.

[0015] In the optical device, the second member may be provided with a third opening arranged in parallel with the second opening in the first direction.

[0016] In the optical device, the optical transceiver may include a coupling member that integrates the first member and the second member.

[0017] In the optical device, the optical transceiver may include: a heat generating element provided on the second substrate; and a heat conducting member interposed between the heat generating element and the first member or the second member.

[0018] In the optical device, the heat conduction member may be flexible.

[0019] In the optical device, the second substrate may include a second surface facing a direction opposite to the first direction and facing the socket, and on the second surface, the plurality of conductors of the second substrate form a land grid array package (LGA).

[0020] In the optical device, the plurality of conductors of the second substrate may be arranged in a rhombic lattice on the second surface.

[0021] In the optical device, the plurality of conductors of the second substrate may be arranged at intervals of 0.6 [mm] or less on the second surface.

[0022] The optical device includes a plurality of optical transceivers as the optical transceivers.

[0023] In the optical device, the plurality of optical transceivers may be arranged along a side of the first substrate.

[0024] In the optical device, the plurality of optical transceivers may be arranged along four sides of the first substrate, and semiconductor integrated circuits may be mounted on the first surface at positions farther from the sides than the optical transceivers.

[0025] In the optical device, the plurality of connection conductors may be provided at a position closer to the semiconductor integrated circuit than to a center of the optical transceiver when viewed in the first direction.

[0026] The optical device may include an optical fiber extending from the optical transceiver in the first direction.

[0027] The optical transceiver of the present invention is applied to an optical device, for example. The optical device comprises: a first substrate having a first surface facing a first direction and intersecting the first direction; an optical transceiver offset in the first direction relative to the first substrate; a socket located between the first substrate and the optical transceiver and having a plurality of connecting conductors electrically connecting the conductors of the first substrate and the conductors of the optical transceiver, and an insulator supporting the plurality of connecting conductors; and a positioning pin extending in the first direction between the first substrate and the optical transceiver and penetrating the socket to position the first substrate, the optical transceiver and the socket in a direction intersecting the first direction, wherein the optical transceiver is provided with a positioning opening for positioning the positioning pin.

[0028] Alternatively, the optical transceiver includes: a second substrate having a plurality of conductors and an insulator; and a first member provided between the first substrate and the second substrate and having a first opening for inserting the positioning pin.

[0029] In the optical transceiver, the first opening may pass through the first member, the positioning pin may pass through the first opening, and a second opening may be provided in the second substrate as the positioning opening.

[0030] The optical transceiver may include a second member covering the second substrate on a side opposite to the first member with respect to the second substrate, and the first member, the second member, and the second substrate may constitute a part of an outer surface of the optical transceiver.

[0031] Effects of the Invention

[0032] According to the present invention, for example, it is possible to obtain an improved new optical device and optical transceiver that can more reliably ensure electrical connection between a substrate of the optical device and an optical transceiver. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is an illustrative and schematic perspective view of the switch device according to the embodiment.

[0034] Figure 2 It is an illustrative and schematic top view of the switch device of the embodiment.

[0035] Figure 3 is an illustrative and schematic side view of a portion of a switchgear of an embodiment.

[0036] Figure 4 yes Figure 2 IV-IV cross-sectional view of .

[0037] Figure 5 This is an illustrative and schematic plan view of a portion of the switch device according to the embodiment, and is a view showing a state before an optical transceiver is mounted, a state after the optical transceiver is mounted, and a state after the optical transceiver is installed.

[0038] Figure 6 It is an illustrative and schematic perspective view of an optical transceiver according to an embodiment.

[0039] Figure 7 It is an illustrative and schematic exploded perspective view of an optical transceiver according to an embodiment.

[0040] Figure 8 yes Figure 5 VIII-VIII cross-sectional view of .

[0041] Fig. 9 FIG. 1 is an illustrative and schematic top view of the bottom surface of the optical transceiver according to the embodiment. DETAILED DESCRIPTION

[0042] Hereinafter, multiple embodiments of the present invention are disclosed. The structure of the embodiment shown below, and the action and result (effect) brought about by the structure are examples. The present invention can also be realized by structures other than those disclosed in the following embodiments. In addition, according to the present invention, at least one of the various effects (including derived effects) obtained by the structure can be obtained.

[0043] The multiple embodiments shown below have the same structure. Therefore, according to the structure of each embodiment, the same action and effect based on the same structure can be obtained. In addition, the same symbols are given to these same structures below, and repeated descriptions are sometimes omitted.

[0044] In this specification, ordinal numbers are given for convenience in order to distinguish between components, members, locations, directions, etc., and do not indicate priority or order, nor do they limit the number, etc.

[0045] In each of the drawings, arrow X indicates the X direction, arrow Y indicates the Y direction, and arrow Z indicates the Z direction. The X direction, the Y direction, and the Z direction intersect and are orthogonal to each other.

[0046] [Implementation Method]

[0047] [Switch device]

[0048] Figure 1 It is a perspective view of the switch device 100 according to the embodiment. Figure 2 1 is a top view of the switch device 100 . Figure 3 is Figure 1 A side view of a portion of the switch device 100 when viewed in the Y direction from the arrow III. Figure 4 yes Figure 2 IV-IV cross-sectional view of .

[0049] like Figure 1 As shown, the switch device 100 is mounted on the motherboard 200. In the present embodiment, only one switch device 100 is mounted on the motherboard 200, but a plurality of switch devices 100 may be mounted on the motherboard 200. The motherboard 200 may also be called an integrated substrate. The switch device 100 is an example of an optical device.

[0050] like Figure 1 , Figure 2 As shown, the switch device 100 includes: a substrate 10; a switch ASIC 20; a plurality of optical transceivers 30; a heat sink 21 for the switch ASIC 20; a fixing mechanism 40 for fixing the optical transceiver 30 to the substrate 10; and a heat dissipation mechanism 50 for the optical transceiver 30. The substrate 10, the fixing mechanism 40, and the heat dissipation mechanism 50 in the switch device 100 are referred to as a substrate assembly. The substrate assembly can be mounted on the motherboard 200.

[0051] like Figure 2 As shown in FIG. 1 , the substrate 10 has four sides 10 c extending in the X direction or the Y direction. Figure 4As shown in the figure, the substrate 10 crosses and extends orthogonally to the Z direction, and has a plate-like shape, and has a surface 10a facing the Z direction, and a surface 10b facing the opposite direction of the Z direction on the side opposite to the surface 10a. The surfaces 10a and 10b cross and extend orthogonally to the Z direction. The substrate 10 is, for example, a printed wiring board. The Z direction is an example of a first direction of the substrate 10, and can also be called a thickness direction of the substrate 10. The substrate 10 is an example of a first substrate, and the surface 10a is an example of a first surface.

[0052] like Figure 2 As shown in FIG. 1 , a plurality of optical transceivers 30 are arranged along the four sides 10c of the substrate 10. Each optical transceiver 30 has a photodiode array as a light receiving unit for receiving an optical signal. The light receiving unit receives the optical signal transmitted in the optical fiber 32 and outputs an electrical signal corresponding to the optical signal. The electrical signal is transmitted to the optical fiber 32 via a socket 43 (see FIG. 1 ). Figure 4 ) and the conductor of the substrate 10 are input to the switch ASIC 20. The optical transceiver 30 also has an electronic component that operates when outputting an electrical signal corresponding to the received optical signal.

[0053] In addition, the optical transceiver 30 has a VCSEL array (VCSEL: vertical cavity surface emitting laser) as a light emitting unit that outputs an optical signal. The light emitting unit receives an electrical signal from the switch ASIC 20 via a conductor provided on the substrate 10 and the socket 43, and outputs an optical signal corresponding to the electrical signal. The optical signal is coupled to the optical fiber 32 and transmitted in the optical fiber 32. The optical transceiver 30 also has an electronic component that operates when outputting an optical signal corresponding to the received electrical signal.

[0054] like Figure 1 , Figure 2 As shown, the plurality of optical transceivers 30 are fixed to the substrate 10 by the fixing mechanism 40 provided for each side 10c of the substrate 10. The fixing mechanism 40 is provided for each of the four sides 10c, that is, a total of four, and is shared by the plurality of (eight in this embodiment as an example) optical transceivers 30 arranged along each side 10c. In this way, by sharing the fixing mechanism 40 for the plurality of optical transceivers 30, for example, compared with the case where the optical transceivers 30 are fixed to the substrate 10 by the fixing mechanism, the following advantages can be obtained: the mounting structure of the fixing mechanism 40 to the substrate 10 can be further simplified, or the number of components can be further reduced, and the time and cost of manufacturing the switch device 100 can be suppressed.

[0055] like Figure 1 , Figure 2As shown in FIG. 1 , the switch ASIC 20 is mounted on the substrate 10 at a position farther from each side 10 c of the substrate 10 than the optical transceiver 30 (in the present embodiment, as an example, the substantially central portion of the substrate 10 ). Figure 4 As shown, the switch ASIC 20 is mounted on the surface 10a by, for example, flip chip mounting. The switch ASIC 20 controls the operation of each optical transceiver 30. The switch ASIC 20 is an example of a semiconductor integrated circuit.

[0056] like Figure 4 As shown in FIG. 1 , the heat sink 21 is provided to be in contact with the switch ASIC 20 on the side opposite to the substrate 10. The heat sink 21 is in contact with the top surface of the switch ASIC 20 and includes: a base 21a; and a plurality of fins 21b in an array and in a pin shape protruding from the base 21a in the Z direction. In addition, the heat sink 21 is made of a material having a relatively high thermal conductivity such as an aluminum-based metal material. According to such a structure, the heat generated in the switch ASIC 20 is transferred to the Z direction in the heat sink 21, and is transferred to the surrounding gas through heat exchange between the fin 21b and the gas around the fin 21b, that is, released to the surrounding gas.

[0057] like Figure 3 , Figure 4 As shown in FIG. 1 , in the present embodiment, as an example, the fixing mechanism 40 includes an upper member 41, an intermediate member 42, and a socket 43. The components of the fixing mechanism 40 are integrated by a fixing member 46 such as a screw. In addition, the intermediate member 42 and the socket 43 among the components of the fixing mechanism 40 are common to all the optical transceivers 30 in the group of the plurality of optical transceivers 30 along each side 10c of the substrate 10. Figure 4 As shown, the fixing mechanism 40 fixes the optical transceiver 30 located near the side 10 c of the substrate 10 to the substrate 10 in a state of sandwiching the optical transceiver 30 in the thickness direction of the substrate 10 .

[0058] In addition, since the optical transceiver 30 can be replaced after being equipped, the fixing mechanism 40 fixes the optical transceiver 30 to the substrate 10 in a detachable manner. To achieve this, in the present embodiment, the components of the fixing mechanism 40 include components that are fixed to the substrate 10 and components that can be detached from the substrate 10. In the present embodiment, the intermediate member 42 and the socket 43 are configured to be fixed to the substrate 10, and the upper member 41 is configured to be detachable from the intermediate member 42, that is, from the substrate 10. Specifically, as Figure 4 As shown, the upper member 41 is attached to the intermediate member 42 by means of a fixing member 46 configured as a detachable screw.

[0059] Figure 51 is a top view showing a state S1 before the optical transceiver 30 is mounted, a state S2 after the optical transceiver 30 is mounted, and a state S3 after the optical transceiver 30 is mounted. Figure 5 As shown in the state S3 of , in the present embodiment, the upper member 41 is not shared by all of the plurality of optical transceivers 30 along the side 10c, but is shared only by two adjacent optical transceivers 30 along the side 10c. Thus, for example, the following advantages can be obtained: the ease of disassembly of each optical transceiver 30 and the sharing of components can be taken into account; or the influence of manufacturing deviations of the deflection of the fixing mechanism 40, the components of the fixing mechanism 40, the optical transceiver 30, etc. can be reduced, thereby further improving the positioning accuracy. However, such a structure is an example, and the upper member 41 can also be shared by all of the plurality of optical transceivers 30 along the side 10c.

[0060] like Figure 4 As shown, the socket 43, the intermediate member 42, and the upper member 41 are mounted in this order on the substrate 10. In addition, the optical transceiver 30 is provided offset in the Z direction with respect to the substrate 10.

[0061] The upper member 41 presses the main body 31 of the optical transceiver 30 toward the substrate 10 and the socket 43 in the opposite direction of the Z direction. Figure 4 , Figure 5 As shown, the upper member 41 is provided with an opening 41a as a notch that penetrates the upper member 41 in the Z direction. A part of the main body 31 is accommodated in the opening 41a.

[0062] The intermediate member 42 is provided with an opening 42a as a through hole extending in the Z direction. The side surface of the opening 42a has a function of roughly guiding the main body 31 of the optical transceiver 30 in the X direction and the Y direction when the main body 31 of the optical transceiver 30 is assembled.

[0063] The socket 43 is mounted on the surface 10a of the substrate 10 and supports the main body 31 of the optical transceiver 30. The socket 43 is provided with an electrical interface 43a and an opening 43b. At least the electrical interface 43a of the socket 43 is located between the substrate 10 and the optical transceiver 30.

[0064] The conductor of the electrical interface 43 a is electrically connected to the conductor of the electrical interface provided on the substrate 33 of the optical transceiver 30 .

[0065] The opening 43b exposes the lower surface 31a4 of the main body 31 of the optical transceiver 30 in the opposite direction of the Z direction. The opening 43b is provided as a through hole or a notch penetrating the socket 43 in the Z direction, for example.

[0066] The heat dissipation mechanism 50 dissipates heat generated in the optical transceiver 30. The heat dissipation mechanism 50 includes a heat conduction member 51 and a heat sink 52. In addition, at least the heat conduction member 51 of the heat dissipation mechanism 50 is configured to function as a part of the fixing mechanism 40.

[0067] The heat conduction member 51 and the optical transceiver 30 are arranged side by side in the Z direction. The heat conduction member 51 includes a portion 51a housed in the opening 43b of the socket 43 and the opening 10d of the substrate 10, and a portion 51b located on the opposite side of the optical transceiver 30 with respect to the portion 51a. The heat conduction member 51 is thermally connected to the lower surface 31a4 of the optical transceiver 30 to transfer heat generated in the optical transceiver 30. The heat conduction member 51 is made of a material with a relatively high thermal conductivity such as an aluminum-based metal material. In addition, the heat conduction member 51 is fixed to the substrate 10 or the fixing mechanism 40 by a fixing member such as a screw, an adhesive, or the like.

[0068] The portion 51a is adjacent to the lower surface 31a4 via a flexible heat sink 47 and is thermally connected to the lower surface 31a4. The heat sink 47 is made of a synthetic resin material having relatively high thermal conductivity, flexibility and softness, such as a thermosetting synthetic resin material having high heat dissipation. By providing the heat sink 47, the following advantages can be obtained: the gap between the lower surface 31a4 and the portion 51a due to manufacturing deviation, the difference in thermal expansion coefficient between components, etc., can be suppressed, thereby reducing the heat conduction efficiency from the lower surface 31a4 to the portion 51a; and the excessive pressing force between the lower surface 31a4 and the portion 51a can be suppressed.

[0069] The portion 51b is integrally provided with the portion 51a and is thermally connected to the portion 51a. The portion 51b extends from the portion 51a in the direction opposite to the Z direction, that is, in the thickness direction of the substrate 10, and extends in a direction intersecting the Z direction on the side opposite to the optical transceiver 30 relative to the substrate 10.

[0070] In addition, the heat conduction member 51 is in contact with the heat sink 52 on the side opposite to the lower surface 31a4 relative to the substrate 10, and is thermally connected to the heat sink 52. The heat sink 52 has: a base 52a; and a plurality of fins 52b in an array and in a pin shape protruding from the base 52a in the opposite direction of the Z direction. In addition, the heat sink 52 is made of a material with a relatively high thermal conductivity such as an aluminum-based metal material. In addition, the heat sink 52 is fixed to the heat conduction member 51 by a fixing member such as a screw, brazing, bonding, etc. In addition, the heat conduction member 51 and the heat sink 52 may be integrated as one member. The heat sink 52 may also be called a heat dissipation member.

[0071] By means of the heat conducting member 51 and the heat sink 52 of such a structure, the heat generated in the optical transceiver 30 is transferred from the lower surface 31a4 in the heat conducting member 51 and the heat sink 52 in the opposite direction of the Z direction, and the heat is transferred or released to the surrounding gas by heat exchange with the fin 52b and the surrounding gas of the fin 52b. In addition, the switch device 100 is provided with an electric fan, and is configured so that the air flow generated by the operation of the electric fan acts on the heat sink 52.

[0072] In addition, if Figure 4 As clearly shown, the lower surface 31a4 and the portion 51a are located on the opposite side of the switch ASIC 20 with respect to the electrical interface 43a. In addition, the electrical interface 43a is provided at a position closer to the switch ASIC 20 than the center line C extending in the Z direction of the main body 31 of the optical transceiver 30. With such an arrangement, the following advantages can be obtained: it is easy to ensure the required transmission characteristics of the electrical signal in accordance with the ability to shorten the length of the conductor between the electrical interface 43a and the switch ASIC 20; or it is easy to obtain the required heat dissipation performance from the optical transceiver 30 in accordance with the ability to avoid interference between the heat conduction member 51 and the conductor.

[0073] [Optical transceiver]

[0074] Figure 6 is a perspective view of the optical transceiver 30 . Figure 7 3 is an exploded perspective view of the optical transceiver 30. Figure 8 yes Figure 5 VIII-VIII cross-section diagram. Figure 6 to Figure 8 Shown in Figure 5 The directions (X direction to Z direction) in the state where the optical transceiver 30 ( S2 ) is equipped are shown.

[0075] like Figure 6 , Figure 7 As shown, the optical transceiver 30 includes a main body 31, a substrate 33, a connector 34, a positioning pin 35, and a fixing member 36. The optical fiber 32 extends from the optical transceiver 30 in the Z direction. The first member 31A, the substrate 33, and the second member 31B constituting the main body 31 are arranged in this order in the Z direction and integrated by the fixing member 36. The fixing member 36 is, for example, a screw. The fixing member 36 is an example of a coupling member. The main body 31 can also be called a housing.

[0076] The peripheral edge portion 33e of the substrate 33 is exposed between the first member 31A and the second member 31B constituting the main body 31, and together with the first member 31A and the second member 31B, constitutes a part of the outer surface of the optical transceiver 30. With such a structure, the size of the optical transceiver 30 can be made smaller than when the substrate 33 is accommodated in the main body 31.

[0077] like Figure 7 , Figure 8 As shown, a lens assembly 37 is installed adjacent to the connector 34 in the opposite direction of the Z direction. The lens assembly 37 includes a fixture 37a and a lens array such as a collimating lens array and a focusing lens array installed on the fixture 37a. The positioning pin 35 positions the connector 34 and the lens assembly 37 in a direction intersecting the Z direction.

[0078] The second member 31B has a substantially rectangular parallelepiped shape. The second member 31B has an opening 31b3 in the middle portion in the X direction. The opening 31b3 penetrates the second member 31B in the Z direction. The connector 34 and at least a portion of the lens assembly 37 are accommodated in the opening 31b3 of the second member 31B.

[0079] In addition, the second member 31B is provided with through holes 31b1 penetrating in the Z direction at multiple locations. The substrate 33 is provided with a through hole 33c1 penetrating in the Z direction so as to be aligned with the through hole 31b1 in the Z direction, and the first member 31A is provided with an internal threaded hole 31a1. The fixing member 36 penetrates the through hole 31b1 and the through hole 33c1 and is fixed to the internal threaded hole 31a1.

[0080] The substrate 33 is, for example, a printed wiring board. The substrate 33 has a substantially constant thickness in the Z direction, and intersects and is orthogonal to the Z direction. The substrate 33 has a surface 33a and a surface 33b.

[0081] The surface 33a faces the Z direction and intersects and is orthogonal to the Z direction. An optical element 301, an electronic component 302, etc. are mounted on the surface 33a. The optical element 301 is, for example, a light receiving unit such as a photodiode array, or a light emitting unit such as a VCSEL array. In addition, the electronic component 302 is, for example, an IC that works corresponding to the light receiving unit and the light emitting unit.

[0082] The surface 33b faces the direction opposite to the Z direction and intersects and is orthogonal to the Z direction. The surface 33b faces the electrical interface 43a of the socket 43. The substrate 33 is an example of a second substrate, and the surface 33b is an example of a second surface.

[0083] In addition, if Figure 8 As shown in the figure, a recessed portion concave in the Z direction is provided in a portion of the second member 31B facing the mounting area of ​​the optical element 301 and the electronic component 302 among the ends in the opposite direction of the Z direction. According to such a structure, a storage chamber R for components such as the optical element 301 and the electronic component 302 is provided between the substrate 33 and the second member 31B. In addition, a recessed portion may be provided in a portion of the substrate 33 facing the second member 31B.

[0084] The electronic component 302 generates heat in response to operation. The electronic component 302 is an example of a heat generating body. In order to dissipate the heat generated in the electronic component 302, two heat dissipation paths are provided in this embodiment.

[0085] One of the heat dissipation paths is a path for dissipating heat from the first member 31A to the heat conduction member 51 of the heat dissipation mechanism 50. In this case, the heat generated in the electronic component 302 is transferred from the surface 33b of the substrate 33 to the first member 31A. A heat conduction member such as a via hole or an insert of a ground potential that transfers the heat generated in the electronic component 302 mounted on the surface 33a to the surface 33b may be provided in the substrate 33. The heat conduction member is made of a material having a higher thermal conductivity than the insulator of the substrate 33, such as a copper-based metal material. In addition, the first member 31A is made of a material having a relatively high thermal conductivity, such as an aluminum-based metal material, which is higher than the insulator of the substrate 33.

[0086] The other heat dissipation path is a path for dissipating heat from the electronic component 302 to the second member 31B via the heat sink 303 provided between the electronic component 302 and the second member 31B. The heat sink 303 is made of a heat-conducting sheet (such as a graphite sheet) having relatively high thermal conductivity and flexibility, or a synthetic material mainly composed of silicone. The heat sink 303 is an example of a heat-conducting member. In addition, the second member 31B is also made of a material having relatively high thermal conductivity, such as an aluminum-based metal material, which is higher than the thermal conductivity of the insulator of the substrate 33.

[0087] The heat transferred to the first member 31A or the second member 31B through these heat dissipation paths is dissipated to the outside of the switch device 100 through the heat dissipation mechanism 50 , the fixing mechanism 40 , and the like.

[0088] In addition, if Figure 7 , Figure 8 As shown, the first member 31A has a substantially constant thickness in the Z direction, and intersects and is perpendicular to the Z direction. The first member 31A has an opening 31a3 penetrating in the Z direction at a middle portion in the X direction.

[0089] like Figure 8As shown, the electrical interface 43a of the socket 43 passes through the opening 31a3. The socket 43 has an insulator 43c and a plurality of connection conductors 43d. The insulator 43c supports the plurality of connection conductors 43d. The connection conductors 43d pass through the socket 43 in the Z direction at the electrical interface 43a, respectively, and electrically connect the conductors of the substrate 33 and the conductors of the substrate 10. The connection conductor 43d can be configured as a contact terminal having elastic and retractable pins in the Z direction, for example. In such a structure, the conductors of the electronic component 302 are electrically connected to the conductors of the switch ASIC 20 via the conductors of the substrate 33 of the optical transceiver 30, the connection conductors 43d, and the conductors of the substrate 10. By providing the socket 43 with the electrical interface 43a, for example, compared with the case where the electrical interface is directly provided on the substrate 10, the following advantage can be obtained, that is, it is easier to construct a structure that can ensure the required positioning accuracy between the conductors of the substrate 33 of the detachable optical transceiver 30 and the conductors of the substrate 10. In addition, by configuring the connecting conductor 43d as a contact terminal having a retractable pin, the following advantages can be obtained: it is easy to ensure the required surface pressure and the required contact area between the conductor of the substrate 33 and the connecting conductor 43d, and between the conductor of the substrate 10 and the connecting conductor 43d, thereby suppressing the increase in contact resistance.

[0090] Fig. 9 FIG. 3 is a top view of the lower surface 31a4 of the optical transceiver 30 located in the opposite direction to the Z direction. Fig. 9 In the figure, the equipment is shown Figure 5 Directions (X direction to Z direction) in the state of the optical transceiver 30 ( S2 ) shown.

[0091] like Fig. 9 As shown in FIG. 1 , at the end of the optical transceiver 30 in the opposite direction of the Z direction, the region where the electrical interface 33d is provided is exposed through the opening 31a3 provided in the first member 31A in the surface 33b of the substrate 33. The electrical interface 33d includes a plurality of connection pads 33d1 and an insulator 33d2. The connection pads 33d1 are respectively in contact with the connection conductors 43d of the socket 43 in the Z direction and are electrically connected. The connection pads 33d1 are an example of a conductor.

[0092] Here, if Fig. 9 As shown in FIG. 1 , a plurality of connection pads 33d1 constitute a grid array package. Fig. 9In the illustrated grid array package, a plurality of connection pads 33d1 are arranged side by side at a fixed interval in the Y direction, and the rows of the connection pads 33d1 are arranged side by side at a substantially fixed interval in the X direction. In addition, the positions of the rows of two adjacent connection pads 33d1 in the X direction are offset, for example, by approximately half of the interval between the connection pads 33d1 in the Y direction. That is, the grid array package arranges the plurality of connection pads 33d1 in a diamond lattice shape. With such an arrangement, more connection pads 33d1 can be arranged more densely, and therefore, the optical transceiver 30 can be constructed to be more compact. In this way, the arrangement of the plurality of connection pads 33d1 as a grid array package is preferably carried out when the interval between the connection pads 33d1 is less than 0.6 [mm], and more preferably when it is less than 0.3 [mm].

[0093] In addition, if Figure 5 As shown in the socket 43 ( S1 ), the plurality of connection conductors 43 d that are in contact with and electrically connected to the plurality of lands 33 d 1 also constitute a grid array package similarly to the plurality of lands 33 d 1 .

[0094] In order to ensure electrical connection between the plurality of conductors of the substrate 10 arranged at such narrow intervals and the plurality of conductor lands 33 d 1 of the substrate 33 , the substrate 10 , the socket 43 , and the substrate 33 need to be accurately positioned in a direction intersecting the Z direction.

[0095] Therefore, in this embodiment, if Figure 8 As shown, the substrate 10 , the socket 43 , and the substrate 33 are positioned in a direction intersecting the Z direction by the positioning pins 11 extending in the Z direction.

[0096] Specifically, the substrate 10 is provided with a through hole 10e that penetrates in the Z direction. The socket 43 is provided with a through hole 43e that penetrates in the Z direction. The substrate 33 is provided with a through hole 33c2 that penetrates in the Z direction. The through hole 10e, the through hole 43e and the through hole 33c2 are arranged side by side in the Z direction and extend in the Z direction with approximately the same diameter. In addition, the first component 31A is provided with a through hole 31a2 that penetrates in the Z direction, which is arranged side by side with the through holes 10e, 43e, and 33c2 in the Z direction. In addition, the positioning pin 11 penetrates the through hole 43e and the through hole 31a2, and extends between the through hole 10e and the through hole 33c2. The matching of the positioning pin 11 and the through holes 10e, 43e, 31a2, and 33c2 is set to be, for example, an intermediate match or a clearance match. According to such a structure, the substrate 10, the socket 43, the first member 31A, and the substrate 33 are positioned in a direction intersecting the Z direction by the positioning pins 11. In addition, when the optical transceiver 30 is positioned in the through hole 33c2 provided in the substrate 33 by the positioning pins 11, it is not necessary for the through hole 31a2 of the first member 31A to be positioned with the positioning pins 11. In this case, the through hole 31a2 may be a through hole or a notch that has a larger clearance with the positioning pin 11, in other words, is not positioned with the positioning pin 11. The through hole 31a2 is an example of a first opening, and the through hole 33c2 is an example of a second opening. In addition, the through holes 10e, 43e, 31a2, and 33c2 are examples of positioning openings.

[0097] Furthermore, in this embodiment, if Figure 8 As shown in FIG. 1 , the second member 31B is provided with a bottomed hole 31b2 extending in the Z direction from a position where the second member 31B contacts the substrate 33. The bottomed hole 31b2 is arranged side by side with the through holes 31a2 and 33c2 in the Z direction, and extends in the Z direction with a diameter substantially the same as that of the through holes 31a2 and 33c2. In this case, when the optical transceiver 30 is assembled, the first member 31A, the substrate 33, and the second member 31B can be fixed in a direction intersecting the Z direction by using a positioning pin that passes through the through holes 31a2 and 33c2 and is inserted into the bottomed hole 31b2. The bottomed hole 31b2 is an example of the third opening. In addition, the third opening is not limited to the bottomed hole 31b2, and may also be a through hole.

[0098] In addition, if Figure 5 , Fig. 9As shown in the figure, in this embodiment, the positioning pin 11 and the through holes 10e, 43e, 31a2, 33c2 passing through the positioning pin 11 are provided at multiple locations separated from each other in a direction intersecting the Z direction. Then, in a top view observed in the Z direction, the electrical interfaces 43a, 33d, that is, the multiple connection conductors 43d and the multiple connection pads 33d1 are provided at positions between the multiple locations. Thus, the multiple connection conductors 43d and the multiple connection pads 33d1 can be positioned with further good accuracy.

[0099] As described above, according to the present embodiment, it is possible to obtain an improved new switch device 100 and optical transceiver 30 that can more reliably ensure electrical connection between the substrate 10 of the switch device 100 (optical device) and the optical transceiver 30 .

[0100] The above examples illustrate the embodiments of the present invention, but the above embodiments are examples and are not intended to limit the scope of the invention. The above embodiments can be implemented in various other forms, and various omissions, substitutions, combinations, and changes can be made without departing from the gist of the invention. In addition, various structures, shapes, and other specifications (structure, type, direction, type, size, length, width, thickness, height, number, configuration, position, material, etc.) can be implemented in accordance with appropriate changes.

[0101] For example, the optical transceiver and the positioning pins may be positioned at a portion other than the second substrate of the optical transceiver, such as the first opening.

[0102] Furthermore, in the above embodiment, the peripheral portion of the second substrate of the optical transceiver is exposed as a part of the outer surface of the optical transceiver, but the present invention is not limited thereto. The second substrate may be housed in the main body (housing) of the optical transceiver and the peripheral portion may not be exposed on the outer surface.

[0103] Industrial Applicability

[0104] The present invention can be used in optical devices and optical transceivers.

[0105] Explanation of symbols

[0106] 10…Substrate (first substrate)

[0107] 10a…side (first side)

[0108] 10b…noodle

[0109] 10c…side

[0110] 10d…Opening

[0111] 10e…Through hole (positioning opening)

[0112] 11…Location pin

[0113] 20…Switch ASIC (semiconductor integrated circuit)

[0114] 21…Heat sink

[0115] 21a…base

[0116] 21b…Fin

[0117] 30…Optical transceiver

[0118] 31…Main body

[0119] 31A…First component

[0120] 1B…Second component

[0121] 31a1…Internal thread hole

[0122] 31a2…through hole (first opening, positioning opening)

[0123] 31a3…Opening

[0124] 31a4…lower surface

[0125] 31b1…Through hole

[0126] 31b2…Hole with bottom (third opening)

[0127] 31b3…Opening

[0128] 32…Fiber Optic

[0129] 33…Substrate (second substrate)

[0130] 33a…face

[0131] 33b…side (side 2)

[0132] 33c1…Through hole

[0133] 33c2…Through hole (second opening, positioning opening)

[0134] 33d…Electrical interface

[0135] 33d1…Connection plate (conductor)

[0136] 33d2…Insulator

[0137] 33e…periphery

[0138] 34…Connector

[0139] 35…Location pin

[0140] 36…Fixer (joint)

[0141] 37…Lens assembly

[0142] 37a…fixture

[0143] 40…Fixed mechanism

[0144] 41…Upper side member

[0145] 41a…Opening

[0146] 42…Intermediate components

[0147] 42a…Opening

[0148] 43…Socket

[0149] 43a…Electrical interface

[0150] 43b…Open

[0151] 43c…Insulator

[0152] 43d…Connecting conductor

[0153] 43e…Through hole (positioning opening)

[0154] 46…Fixtures

[0155] 47…Heat sink

[0156] 50…Heat dissipation mechanism

[0157] 1…Heat conduction member

[0158] 1a… Location

[0159] 51b…

[0160] 52…Heat sink

[0161] 52a…base

[0162] 52b…Fin

[0163] 100…Switching device (optical device)

[0164] 200…Motherboard

[0165] 301…Optical components

[0166] 302…Electronic components (heat generating elements)

[0167] 303…Heat dissipation element (heat conduction component)

[0168] C…Center Line

[0169] R…Containment Chamber

[0170] X…direction

[0171] Y...direction

[0172] Z…direction (first direction).

Claims

1. An optical device comprising: A first substrate having a first surface facing a first direction and intersecting the first direction; an optical transceiver, which is offset relative to the first substrate in the first direction; a socket located between the first substrate and the optical transceiver, having a plurality of connection conductors for electrically connecting the conductors of the first substrate and the conductors of the optical transceiver, and an insulator for supporting the plurality of connection conductors; and A positioning pin extends between the first substrate and the optical transceiver in the first direction and penetrates the socket to position the first substrate, the optical transceiver, and the socket in a direction intersecting the first direction.

2. The optical device according to claim 1, wherein: The optical transceiver has: a second substrate having a plurality of conductors and an insulator; and The first component is disposed between the first substrate and the second substrate and is provided with a first opening for inserting the positioning pin.

3. The optical device according to claim 2, wherein: The first opening passes through the first member, The positioning pin passes through the first opening, The second substrate is provided with a second opening for inserting the positioning pin. The optical transceiver is positioned at the second opening with the positioning pin.

4. The optical device according to claim 3, wherein: The optical transceiver includes a second member that covers the second substrate on a side opposite to the first member with respect to the second substrate.

5. The optical device according to claim 4, wherein: The second member is provided with a third opening arranged side by side with the second opening in the first direction.

6. The optical device according to claim 4 or 5, wherein: The optical transceiver includes a coupling member that integrates the first member and the second member.

7. The optical device according to claim 4, wherein: The optical transceiver has: a heating element disposed on the second substrate; and A heat conduction member is interposed between the heat generating element and the first member or the second member.

8. The optical device according to claim 7, wherein: The heat conduction member has flexibility.

9. The optical device according to claim 2, wherein: The second substrate has: a second surface facing the opposite direction of the first direction and facing the socket, On the second surface, the plurality of conductors of the second substrate form a grid array package.

10. The optical device according to claim 9, wherein: On the second surface, the plurality of conductors of the second substrate are arranged in a rhombus lattice pattern.

11. The optical device according to claim 9 or 10, wherein: On the second surface, the plurality of conductors of the second substrate are arranged at intervals of 0.6 [mm] or less.

12. The optical device according to claim 1 or 2, wherein: The optical device includes a plurality of optical transceivers as the optical transceivers.

13. The optical device according to claim 12, wherein: The plurality of optical transceivers are arranged along a side of the first substrate.

14. The optical device according to claim 13, wherein: The plurality of optical transceivers are arranged along four sides of the first substrate. A semiconductor integrated circuit is mounted on the first surface at a position farther from the sides than the optical transceiver.

15. The optical device according to claim 14, wherein: The plurality of connection conductors are provided at positions closer to the semiconductor integrated circuit than to the center of the optical transceiver when viewed in the first direction.

16. The optical device according to any one of claims 1 to 3, wherein: The optical device includes an optical fiber extending from the optical transceiver in the first direction.

17. An optical transceiver, used in an optical device, The optical device comprises: A first substrate having a first surface facing a first direction and intersecting the first direction; an optical transceiver, which is offset relative to the first substrate in the first direction; a socket located between the first substrate and the optical transceiver, having a plurality of connection conductors for electrically connecting the conductors of the first substrate and the conductors of the optical transceiver, and an insulator for supporting the plurality of connection conductors; and a positioning pin extending between the first substrate and the optical transceiver in the first direction and penetrating the socket to position the first substrate, the optical transceiver and the socket in a direction intersecting the first direction; The optical transceiver is provided with a positioning opening for positioning the positioning pin.

18. The optical transceiver according to claim 17, wherein: The optical transceiver has: a second substrate having a plurality of conductors and an insulator; and The first component is disposed between the first substrate and the second substrate and is provided with a first opening for inserting the positioning pin.

19. The optical transceiver according to claim 18, wherein: The first opening passes through the first member, The positioning pin passes through the first opening, A second opening is provided on the second substrate as the positioning opening.

20. The optical transceiver according to claim 18 or 19, wherein: The optical transceiver includes: a second member covering the second substrate on a side opposite to the first member with respect to the second substrate; The first member, the second member, and the second substrate constitute a portion of an outer surface of the optical transceiver.

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