Flexible circuit board and smart glasses
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGZHOU SHIXIANG TECH CO LTD
- Filing Date
- 2025-06-16
- Publication Date
- 2026-08-07
AI Technical Summary
[0004]本申请实施例提供一种柔性电路板及智能眼镜，以解决相关技术中柔性电路板结构本身可接受的弯折次数有限，无法接受频繁的往复式弯折，影响了智能可穿戴眼镜的使用寿命的技术问题，可提高柔性电路板的可弯折次数，提升智能可穿戴眼镜的使用寿命
[0021] In a second aspect, embodiments of this application provide smart glasses, including a frame, temples, and a flexible circuit board as described in any of the first aspects, wherein the frame and the temples are connected by a pivot, and the flexible circuit board is disposed at a position corresponding to the pivot.
Smart Images
Figure CN224610980U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic device technology, and more particularly to a flexible circuit board and smart glasses. Background Technology
[0002] With the development of electronic device and display technologies, smart wearable glasses are becoming increasingly widely used. Smart wearable glasses integrate circuit board structures within existing eyeglass frame structures, allowing them to incorporate functions such as headphones, cameras, and displays.
[0003] Due to the limited size of smart wearable glasses, circuit boards need to be placed in both the frame and temples. A flexible printed circuit (FPC) is also placed at the hinge to connect the circuit boards in the frame and temples, enabling communication between them. Since the temples and frame of smart wearable glasses require frequent reciprocating bending, while the flexible circuit board can be bent, the existing structure has a limited number of bends it can withstand, thus affecting the lifespan of the smart wearable glasses. Utility Model Content
[0004] This application provides a flexible circuit board and smart glasses to solve the technical problem in the related art that the flexible circuit board structure itself has a limited number of acceptable bending times and cannot accept frequent reciprocating bending, which affects the service life of smart wearable glasses. It can increase the number of bending times of the flexible circuit board and improve the service life of smart wearable glasses.
[0005] In a first aspect, embodiments of this application provide a flexible circuit board, including a flexible circuit board body, the flexible circuit board body including one or more hollow circuit layers, the hollow circuit layers having hollow structures in a predetermined bending area of the flexible circuit board.
[0006] This application embodiment improves the bending resistance of the flexible circuit board in the preset bending area by setting one or more hollow circuit layers in the flexible circuit board body, and the hollow circuit layers are set as hollow structures in the preset bending area of the flexible circuit board. This increases the number of times the flexible circuit board can be bent and extends the service life of smart wearable glasses.
[0007] Furthermore, the flexible circuit board body also includes a signal circuit layer, which is disposed between the plurality of hollow circuit layers.
[0008] As described above, the signal circuit layer is placed between multiple cutout circuit layers, which makes the multiple cutout circuit layers staggered and more evenly distributed, effectively improving the structural stability of the flexible circuit board.
[0009] Furthermore, the hollow structure is one or more of the following: a triangular mesh hollow structure, a semi-circular mesh hollow structure, and a rhomboid mesh hollow structure.
[0010] As mentioned above, by configuring a suitable hollow shape in the hollow circuit layer, the bending count of the flexible circuit board can be effectively increased, thereby extending the service life of smart glasses.
[0011] Furthermore, the wire diameter of the hollowed-out circuit layer in the preset bending area is greater than the wire diameter outside the preset bending area.
[0012] As mentioned above, the wire diameter at the preset bending area is greater than the wire diameter outside the preset bending area. This increases the wire diameter at the hollow structure, ensures the impedance requirements of the circuit at the hollow structure, reduces the degradation of circuit performance caused by the hollow structure, and improves the circuit performance of the flexible circuit board.
[0013] Furthermore, the hollow structure is disposed in the hollow circuit of the hollow circuit layer, and the wire diameter of the hollow circuit is greater than or equal to a preset wire diameter width threshold.
[0014] The above-mentioned method ensures that the wire diameter of the hollowed-out circuit is greater than or equal to the preset wire diameter width threshold. By hollowing out the circuit while ensuring that the wire diameter width is sufficient, the circuit performance is reduced due to the hollowed-out structure, thus ensuring the normal operation of the circuit.
[0015] Furthermore, the hollow circuit layer is provided with multiple hollow lines and solid lines, and the hollow lines and solid lines are arranged alternately.
[0016] As mentioned above, by interlacing multiple hollow and solid lines, the distribution of multiple hollow circuit layers is more uniform, effectively improving the structural stability of the flexible circuit board.
[0017] Furthermore, the cutout circuit layer includes one or more combinations of a power supply circuit layer, a ground circuit layer, and a reference circuit layer.
[0018] As described above, by setting a hollow structure in the circuit layer that does not need to transmit signals, the number of times the flexible circuit board can be bent can be flexibly increased without affecting the transmission of circuit signals, thereby improving the service life of the equipment.
[0019] Furthermore, the cutout structures between adjacent cutout circuit layers are staggered.
[0020] As described above, by setting the hollow structure between adjacent hollow circuit layers in a staggered manner, the distribution of hollow structures on multiple hollow circuit layers is more uniform, which effectively improves the structural stability of the flexible circuit board and effectively increases the number of times the flexible circuit board can be bent.
[0021] In a second aspect, embodiments of this application provide smart glasses, including a frame, temples, and a flexible circuit board as described in any of the first aspects, wherein the frame and the temples are connected by a pivot, and the flexible circuit board is disposed at a position corresponding to the pivot.
[0022] This application embodiment, by placing the flexible circuit board at the position corresponding to the rotating shaft, and setting one or more hollow circuit layers in the body of the flexible circuit board, and setting the hollow circuit layers as hollow structures in the preset bending area of the flexible circuit board, can effectively improve the bending resistance of the flexible circuit board in the preset bending area, increase the number of times the flexible circuit board can be bent, and extend the service life of the smart glasses.
[0023] Furthermore, it also includes a first circuit board and a second circuit board, the first circuit board being disposed in the frame and the second circuit board being disposed in the temple, the first circuit board and the second circuit board being connected to the flexible circuit board.
[0024] As described above, by connecting the first circuit board and the second circuit board with a flexible circuit board, the normal electrical connection between the first circuit board and the second circuit board can be ensured, while increasing the number of times the smart glasses can be bent at the hinge, thereby increasing the service life of the smart glasses. Attached Figure Description
[0025] Figure 1 This is a schematic diagram of the structure of a flexible circuit board provided in an embodiment of this application;
[0026] Figure 2 This is a schematic diagram of the structure of a flexible circuit board in the first bending state provided in an embodiment of this application;
[0027] Figure 3 This is a schematic diagram of the structure of a flexible circuit board in a second bent state according to an embodiment of this application;
[0028] Figure 4 This is a schematic diagram of the layer structure of a flexible circuit board provided in an embodiment of this application;
[0029] Figure 5 This is a schematic diagram of a hollowed-out circuit layer provided in an embodiment of this application;
[0030] Figure 6 This is a schematic diagram of an adjacent hollowed-out circuit layer provided in an embodiment of this application;
[0031] Figure 7This is a schematic diagram of the structure of a smart glasses provided in an embodiment of this application.
[0032] Reference numerals: 100, flexible circuit board body; 110, hollow circuit layer; 120, solid circuit layer; 200, frame; 300, temple; 400, hinge; 500, first circuit board; 600, second circuit board. Detailed Implementation
[0033] To make the objectives, technical solutions, and advantages of this application clearer, specific embodiments of this application will be described in further detail below with reference to the accompanying drawings. It is understood that the specific embodiments described herein are merely for explaining this application and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not all of them. In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0034] Existing smart wearable glasses primarily integrate circuit boards within existing eyeglass frame structures to allow for the integration of functions such as headphones, cameras, and displays. Due to the limited size of the glasses themselves, circuit boards must be placed in both the frame and temples, with a flexible circuit board positioned at the hinge connecting the frame and temples to enable communication between the circuit boards. Since the temples of smart wearable glasses require frequent reciprocating bending, existing flexible circuit boards, while capable of bending, cannot withstand such frequent reciprocating bending. The limited number of bends that existing flexible circuit board structures can withstand significantly reduces the lifespan of smart wearable glasses. Therefore, this application provides a flexible circuit board and smart glasses according to embodiments of the present application, addressing the technical problem that the limited number of bends that existing flexible circuit board structures can withstand, and their inability to withstand frequent reciprocating bending, negatively impacts the lifespan of smart wearable glasses.
[0035] Figure 1 A schematic diagram of a flexible circuit board provided in an embodiment of this application is given, with reference to... Figure 1 The flexible circuit board includes a flexible circuit board body 100. Figure 1The diagram shows an exploded view of the flexible circuit board body 100, which includes one or more hollow circuit layers 110 and one or more solid circuit layers 120 (i.e., non-hollow circuit layers). The hollow circuit layers 110 have hollow structures in the preset bending area of the flexible circuit board.
[0036] The pre-set bending area of the flexible circuit board can be understood as the area where the flexible circuit board bends as the device bends during use after it is installed and fixed on the device. For example, when the flexible circuit board is installed on smart glasses, the pre-set bending area of the flexible circuit board is set at the connection position between the frame and the temple of the smart glasses, and bends as the temple and frame rotate, ensuring smooth bending between the temple and the frame.
[0037] like Figure 1 As shown in the diagram, the areas are divided according to the dotted lines. Area A is the preset bending area of the flexible circuit board, and areas B1 and B2 are the areas of the flexible circuit board outside the preset bending area. The areas of the flexible circuit board outside the preset bending area can also be bent. When the flexible circuit board bends along with the bending of the installed equipment, the areas outside the preset bending area may not bend, or the bending amplitude may be smaller than that of the preset bending area.
[0038] In one embodiment, after the flexible circuit board is installed on the device, the flexible circuit board is in different working states corresponding to different states of the device (e.g., in use state and in storage state). Figure 2 This is a schematic diagram of the structure of a flexible circuit board in its first bent state, according to an embodiment of this application. Figure 3 This is a schematic diagram of the structure of a flexible circuit board in a second bent state according to an embodiment of this application, as shown below. Figure 2 and Figure 3 As shown, when the flexible circuit board is installed on the device and the device is bent into a usable state, the flexible circuit board is in a first bent state, and when the device is bent into a stored state, the flexible circuit board is in a second bent state. For example, when the flexible circuit board is installed on smart glasses, when the temples are unfolded to wear the smart glasses, the flexible circuit board will be bent into the first bent state, and when the temples are folded to store the smart glasses, the flexible circuit board will be bent into the second bent state.
[0039] Optionally, the perforated structure provided in this application can be a combination of one or more of the following: a triangular mesh perforated structure, a semi-circular mesh perforated structure, and a rhomboid mesh perforated structure. Optionally, the perforated positions on the perforated structure can be arranged in a matrix or staggered.
[0040] like Figure 4A schematic diagram of the layer structure of a flexible circuit board is provided, wherein the cutout structure corresponding to the cutout circuit layer L1 is a triangular mesh cutout structure, the cutout structure corresponding to the cutout circuit layer L2 is a semi-circular mesh cutout structure, and the cutout structure corresponding to the cutout circuit layer L3 is a diamond mesh cutout structure. Optionally, one or more different cutout structures can be provided in a cutout circuit layer 110, and different types of cutout structures can be staggered. The cutout shape and arrangement can be configured according to the bending strength requirements of the flexible circuit board. By configuring a suitable cutout shape in the cutout circuit layer 110, this application can effectively increase the bending count of the flexible circuit board and improve the service life of smart glasses.
[0041] In one possible embodiment, the flexible circuit board body 100 provided in this application includes a plurality of hollow circuit layers 110. The solid circuit layer 120 in the flexible circuit board body 100 includes a signal circuit layer, and the signal circuit layer is disposed between the plurality of hollow circuit layers 110, so that the plurality of hollow circuit layers 110 are staggered and the distribution of the plurality of hollow circuit layers 110 is more uniform, effectively improving the structural stability of the flexible circuit board.
[0042] In one possible embodiment, the hollow circuit layer 110 provided in this application includes one or more combinations of a power supply circuit layer, a ground circuit layer, and a reference circuit layer. By setting a hollow structure in the circuit layer that does not need to transmit signals, the number of bends of the flexible circuit board can be flexibly increased without affecting the transmission of circuit signals, thereby improving the service life of the equipment.
[0043] Optionally, multiple cutout lines and multiple solid lines can be provided on the cutout circuit layer 110, and the cutout lines and solid lines can be staggered. For example... Figure 5 A schematic diagram of a cutout circuit layer is provided. Figure 5 The diagram illustrates two cutout lines and three solid lines (shaded areas) on the cutout circuit layer 110, with the two cutout lines and three solid lines arranged alternately. This application achieves a more uniform distribution of the multiple cutout circuit layers 110 through the alternating arrangement of multiple cutout lines and solid lines, effectively improving the structural stability of the flexible circuit board.
[0044] In one possible embodiment, the wire diameter width of the cutout circuit layer 110 provided in this application is greater in the preset bending region than in the region outside the preset bending region. For example, in the cutout circuit layer 110, the wire diameter width of the circuit is increased at the location where the circuit passes through the preset bending region, so that the wire diameter width at the preset bending region is greater than that outside the region. This effectively increases the wire diameter width at the cutout structure, ensures the impedance requirements of the circuit at the cutout structure, reduces the degradation of circuit performance caused by the cutout structure, and improves the circuit performance of the flexible circuit board.
[0045] In one possible embodiment, the hollow structure provided in this application is disposed in the hollow lines of the hollow circuit layer 110. The circuit lines outside the hollow lines of the hollow circuit layer 110 are solid lines (i.e., lines without hollowing). The wire diameter width of the hollow lines is greater than or equal to a preset wire diameter width threshold. Circuit lines in the hollow circuit layer 110 with a wire diameter width less than the preset wire diameter width threshold can be set as solid lines. The preset wire diameter width threshold can be understood as a wire diameter width that can ensure that the circuit impedance requirements are met. By hollowing out the circuit lines only when the wire diameter width is sufficient, the performance degradation of the circuit due to the hollow structure is reduced, ensuring normal circuit operation.
[0046] In one embodiment, a plurality of cutout circuit layers 110 are provided on the flexible circuit board body 100, and the cutout structures between adjacent cutout circuit layers 110 are staggered. For example... Figure 6 A schematic diagram of adjacent cutout circuit layers is provided, wherein the cutout structures on the upper and lower cutout circuit layers 110 are staggered. In this case, on the vertical projection images of the upper and lower cutout circuit layers 110, the cutout positions are offset, meaning the cutout positions on the upper cutout layer 110 correspond to the uncutout positions on the lower cutout layer 110, and vice versa. This application, by staggering the cutout structures between adjacent cutout circuit layers 110, achieves a more uniform distribution of cutout structures across multiple cutout circuit layers 110, effectively improving the structural stability of the flexible circuit board and increasing its bendability.
[0047] As described above, by providing one or more hollow circuit layers 110 in the flexible circuit board body 100, and setting the hollow circuit layers 110 as hollow structures in the preset bending area of the flexible circuit board, the bending resistance of the flexible circuit board in the preset bending area can be effectively improved, the number of times the flexible circuit board can be bent can be increased, and the service life of smart wearable glasses can be extended.
[0048] Based on the above embodiments, Figure 7 A schematic diagram of the structure of a smart glasses according to an embodiment of this application is provided, with reference to... Figure 7 The smart glasses include a frame 200, temples 300, and a flexible circuit board as provided in any of the above embodiments. The frame 200 and temples 300 are connected by a pivot 400, and the flexible circuit board body 100 of the flexible circuit board is disposed at a position corresponding to the pivot 400.
[0049] The pre-defined bending area of the flexible circuit board is located in the area corresponding to the pivot 400. One of the flexible circuit boards, located outside the pre-defined bending area, is located inside the frame 200, and the other, located outside the pre-defined bending area, is located inside the temple 300. In one embodiment, the smart glasses have a frame 200 and two temples 300. The two temples 300 are respectively connected to the two ends of the frame 200 via pivots 400. A flexible circuit board is located at each of the two pivots 400, and the two flexible circuit boards are respectively connected to the corresponding first circuit board 500 and second circuit board 600.
[0050] In one embodiment, the smart glasses provided by this application further include a first circuit board 500 and a second circuit board 600. The first circuit board 500 is disposed in the frame 200, and the second circuit board 600 is disposed in the temple 300. The first circuit board 500 and the second circuit board 600 are electrically connected to a flexible circuit board. Connecting the first circuit board 500 and the second circuit board 600 via the flexible circuit board ensures normal electrical connection between the two circuit boards while increasing the number of bends the smart glasses can withstand at the pivot 400, thereby extending the lifespan of the smart glasses.
[0051] As described above, by setting the flexible circuit board at the position corresponding to the rotating shaft 400, setting one or more hollow circuit layers in the flexible circuit board body 100, and setting the hollow circuit layer as a hollow structure in the preset bending area of the flexible circuit board, the bending resistance of the flexible circuit board in the preset bending area can be effectively improved, the number of times the flexible circuit board can be bent can be increased, and the service life of the smart glasses can be extended.
[0052] The above description is merely a preferred embodiment and the technical principles employed in this application. This application is not limited to the specific embodiments provided herein, and various obvious changes, readjustments, and substitutions that can be made by those skilled in the art will not depart from the scope of protection of this application. Therefore, although this application has been described in detail through the above embodiments, this application is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of this application, the scope of which is determined by the scope of the claims.
Claims
1. A flexible circuit board, characterized in that, The device includes a flexible circuit board body, which includes one or more hollow circuit layers, wherein the hollow circuit layers have hollow structures in a predetermined bending area of the flexible circuit board.
2. The flexible circuit board according to claim 1, characterized in that, The flexible circuit board body also includes a signal circuit layer, which is disposed between the plurality of hollow circuit layers.
3. The flexible circuit board according to claim 1, characterized in that, The hollow structure is one or more of the following: triangular mesh hollow structure, semi-circular mesh hollow structure, and rhomboid mesh hollow structure.
4. The flexible circuit board according to claim 1, characterized in that, The wire diameter of the hollowed-out circuit layer in the preset bending area is greater than the wire diameter outside the preset bending area.
5. The flexible circuit board according to claim 1, characterized in that, The hollow structure is disposed in the hollow circuit of the hollow circuit layer, and the wire diameter of the hollow circuit is greater than or equal to a preset wire diameter width threshold.
6. The flexible circuit board according to claim 1, characterized in that, The hollow circuit layer has multiple hollow lines and solid lines, which are arranged alternately.
7. The flexible circuit board according to claim 1, characterized in that, The cutout circuit layer includes one or more combinations of power supply circuit layer, ground circuit layer and reference circuit layer.
8. The flexible circuit board according to claim 1, characterized in that, The cutout structures between adjacent cutout circuit layers are staggered.
9. A type of smart glasses, characterized in that, The device includes a frame, temples, and a flexible circuit board as described in any one of claims 1-8, wherein the frame and temples are connected by a pivot, and the flexible circuit board is disposed at a position corresponding to the pivot.
10. The smart glasses according to claim 9, characterized in that, It also includes a first circuit board and a second circuit board, the first circuit board being disposed in the frame and the second circuit board being disposed in the temple, and the first circuit board and the second circuit board being connected to the flexible circuit board.