Semiconductor chamber heating device and semiconductor chamber comprising same
By designing a compact semiconductor chamber heating device, the combination of the cover and heating lamp solves the problems of complex structure and long downtime of the existing device, and achieves more efficient operation and production efficiency.
CN119694935APending Publication Date: 2025-03-25SHENGJISHENG SEMICON TECH (SHANGHAI) CO LTD
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Patent Information
- Application Number
- CN202411817508.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-11
- Publication Date
- 2025-03-25
AI Technical Summary
Technical Problem
The existing semiconductor chamber heating device has a complex structure, occupies a lot of space, and is inconvenient to replace the heating lamp tube, which has a long downtime, which affects production efficiency.
Method used
A compact semiconductor chamber heating device is designed. The cover is arranged inside the chamber wall by combining the cover and the heating lamp, and the opening is abutting on the wall. The heating lamp is inserted into the cover through the outer wall surface to achieve heating.
Benefits of technology
A compact structure and easy-to-operate semiconductor chamber heating device is realized, reducing downtime and improving production efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a semiconductor chamber heating device and a semiconductor chamber comprising the same, and the semiconductor chamber heating device is arranged on the wall part of the semiconductor chamber in a penetrating manner, and comprises a cover body which is arranged on the inner side wall surface of the wall part, and the opening part of the cover body abuts against the wall part; and the heating lamp is inserted into the cover body from the outer side wall surface of the wall part through the opening part.
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