Electrostatic chuck, plasma processing method, and plasma processing apparatus

By providing a temperature holding layer composed of phase change material in the base plate of the electrostatic chuck, the problem of difficult substrate temperature control during plasma processing is solved, and the stability of substrate temperature is achieved.

CN119694965APending Publication Date: 2025-03-25SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
CN202311647574.3
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-22
Filing Date
2023-12-04
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

During semiconductor manufacturing, the temperature of the substrate is prone to drastically change due to performance deviations of refrigerant and heater during plasma processing, making it difficult to effectively control the temperature.

Method used

An electrostatic chuck is designed, including a positioning disk and a bottom plate. The positioning disk has a built-in heater, a cooling flow path is formed in the bottom plate, and a temperature holding layer composed of phase change material is provided inside the bottom plate to absorb or release heat and stabilize the substrate temperature.

Benefits of technology

By absorbing and releasing heat from the phase change material, the drastic temperature changes of the substrate are effectively prevented and the temperature stability of the substrate is ensured during plasma treatment.

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Abstract

The invention provides an electrostatic chuck, a plasma processing method and a plasma processing apparatus which can prevent severe temperature change of a substrate and maintain a certain temperature. An electrostatic chuck for supporting a substrate in a plasma processing apparatus according to the present invention comprises: a positioning plate on which a substrate for plasma processing is placed and which has a built-in heater; and a bottom plate located below the positioning plate and having a cooling flow path formed therein, the cooling flow path allowing a fluid for cooling to flow therethrough. A temperature maintaining layer made of a phase change material is formed on the inner portion of the base plate, and a temperature maintaining layer made of a phase change material is formed on the inner portion of the base plate.
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