Stacked double-layer PCB antenna and wireless microphone
By adding branches and circuit boards to the double-layer PCB structure of the wireless microphone antenna to form an additional radiation path, the problem of insufficient radiation performance of existing antennas in limited space is solved, and more efficient radiation performance is achieved.
Patent Information
- Application Number
- CN202411965092.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2044-12-30
AI Technical Summary
Existing wireless microphone antennas are difficult to achieve better radiation performance when space is limited, resulting in insufficient radiation length or area.
A stacked double-layer PCB antenna is used to form an additional radiation path by adding two branch circuit boards between the two PCB substrates, thereby improving the radiation performance of the antenna.
Under the condition of small space occupation, the radiation performance of the antenna is improved, making it suitable for devices such as wireless microphones with limited antenna space.
Smart Images
Figure CN119695472A_ABST
Abstract
Description
Technical Field
[0001] The embodiments of the present invention relate to the field of antenna technology, and in particular to a stacked double-layer PCB antenna and a wireless microphone. Background Art
[0002] As users have an increasing demand for wireless microphones that are not noticeable when worn, miniaturization and lightweight design of wireless microphones are important research directions to improve user experience. However, miniaturization brings severe challenges to the antenna design of wireless microphones. The antenna of wireless microphones needs to adopt a more complex structure to provide a radiation part with sufficient length or area.
[0003] In current wireless microphones, antennas are usually in the form of traditional antennas, which are difficult to achieve good radiation performance when the antenna space is limited. Therefore, there is an urgent need for a miniaturized antenna suitable for wireless microphones. Summary of the invention
[0004] The invention provides a stacked double-layer PCB antenna and a wireless microphone, providing a miniaturized and high-performance antenna.
[0005] In a first aspect, an embodiment of the present invention provides a stacked double-layer PCB antenna, comprising: a first PCB substrate, a second PCB substrate, a first branch circuit board, and a second branch circuit board;
[0006] Partial areas of at least one side of the first PCB substrate and the second PCB substrate are copper-clad, the first PCB substrate and the second PCB substrate are parallel and have a first interval, the first PCB substrate and the second PCB substrate are fixedly connected to each other on opposite first and second sides respectively through a first metal connection seat and a second metal connection seat, the first metal connection seat and the second metal connection seat are electrically connected to the copper-clad surfaces of the first PCB substrate and the second PCB substrate and are grounded;
[0007] A feeding point is provided on a third side of the second PCB substrate that is perpendicular to the first side and the second side, and the feeding point is electrically connected to the copper clad on the second PCB substrate;
[0008] The first branch circuit board is located on the first side, and the second branch circuit board is located on the second side. The first branch circuit board and the second branch circuit board are respectively connected to the first PCB substrate or the second PCB substrate at a position close to the feeding point. Part of the area of at least one side of the first branch circuit and the second branch circuit board is copper-clad, and the copper cladding of the first branch circuit and the second branch circuit board is electrically connected to the copper cladding on the connected first PCB substrate or the second PCB substrate. The first branch circuit board and the second branch circuit board are connected to different PCB substrates.
[0009] In a possible implementation manner of the first aspect, a first radiation path is formed between the first metal connection base and the second metal connection base through the feeding point;
[0010] The first metal connection base and the open circuit end of the first branch circuit board form a second radiation path;
[0011] The open end from the second metal connection base to the second branch circuit board forms a third radiation path.
[0012] In a possible implementation of the first aspect, the first PCB substrate, the second PCB substrate, the first branch circuit board, and the second branch circuit board are all partially copper-clad on one side, and the areas of the first PCB substrate, the second PCB substrate, the first branch circuit board, and the second branch circuit board that are not copper-clad are used to set other devices and connection lines connecting the devices;
[0013] Connectors are respectively provided on the first PCB substrate and the second PCB substrate, and the connectors connect the connection wires without copper clad layers on the first PCB substrate and the second PCB substrate. The connectors are arranged at a position close to the first metal connection seat or the second metal connection seat.
[0014] In a possible implementation manner of the first aspect, a portion of an opposite side of the first PCB substrate and the second PCB substrate is clad with copper.
[0015] In a possible implementation manner of the first aspect, the first branch circuit board and the second branch circuit board are perpendicular to the first PCB substrate and the second PCB substrate.
[0016] In a possible implementation manner of the first aspect, the first branch circuit board and the second branch circuit board are perpendicular to the first PCB substrate and the second PCB substrate.
[0017] In a possible implementation manner of the first aspect, the first branch circuit board and the second branch circuit board are FPCs.
[0018] In a possible implementation of the first aspect, the first interval is greater than 1.5 mm.
[0019] In a possible implementation manner of the first aspect, a feeding connector is provided between the first PCB substrate and the second PCB substrate at the feeding point.
[0020] In a possible implementation manner of the first aspect, the feeding connector is a Pogo pin.
[0021] In a second aspect, an embodiment of the present invention provides a wireless microphone, comprising a stacked double-layer PCB antenna, a sound receiving module, a processing module, and a radio frequency module according to any implementation of the first aspect;
[0022] The components in the radio receiving module, the processing module and the radio frequency module are arranged on the first PCB substrate, the second PCB substrate, the first branch circuit board and the second branch circuit board of the stacked double-layer PCB antenna.
[0023] The stacked double-layer PCB antenna and wireless microphone provided in the embodiments of the present invention add two branch circuit boards as additional open-circuit branches on the basis of the basic stacked double-layer PCB antenna composed of two PCB substrates, thereby providing two additional radiation paths on the basis of the one radiation path originally provided by the stacked double-layer PCB antenna. This improves the radiation performance of the antenna while the stacked double-layer PCB antenna occupies a small space, making the antenna suitable for devices with limited antenna space such as wireless microphones. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 and Figure 2 A schematic diagram of the structure of a stacked double-layer PCB antenna provided by an embodiment of the present invention;
[0025] Figure 3 and Figure 4 for Figure 1 and Figure 2 A simplified structural diagram of a stacked double-layer PCB antenna is shown;
[0026] Figure 5 for Figure 1 and Figure 2 Schematic diagram of current path of stacked double-layer PCB antenna shown;
[0027] Figure 6A-6D A schematic diagram of specific dimensions of a stacked double-layer PCB antenna provided in an embodiment of the present application;
[0028] Figure 7 for Figure 1 and Figure 2 The E-plane radiation pattern of the stacked double-layer PCB antenna shown;
[0029] Figure 8 for Figure 1 and Figure 2 Frequency response diagram of the stacked double-layer PCB antenna shown. DETAILED DESCRIPTION
[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.
[0031] Figure 1 and Figure 2 A schematic diagram of the structure of a stacked double-layer PCB antenna provided by an embodiment of the present invention is shown in FIG. Figure 1 and Figure 2 As shown, the stacked double-layer printed circuit board (PCB) antenna provided in the embodiment of the present invention includes:
[0032] The first PCB substrate 100 , the second PCB substrate 110 , the first branch circuit board 101 and the second branch circuit board 115 .
[0033] Partial areas of at least one side of the first PCB substrate 100 and the second PCB substrate 110 are clad with copper. The first PCB substrate 100 and the second PCB substrate 110 are parallel and have a first interval. The first PCB substrate 100 and the second PCB substrate 110 are fixedly connected to each other on opposite first and second sides respectively through a first metal connection seat 111 and a second metal connection seat 112. The first metal connection seat 111 and the second metal connection seat 112 are electrically connected to the copper clad on the first PCB substrate 100 and the second PCB substrate 110 and are grounded.
[0034] A feeding point 103 is provided on a third side of the second PCB substrate 110 that is perpendicular to the first side and the second side. Since the feeding point 103, the first metal connection seat 111 and the second metal connection seat 112 are respectively located on the first side, the second side and the third side that are different from the first PCB substrate 100 and the second PCB substrate 110, the feeding point 103, the first metal connection seat 111 and the second metal connection seat 112 are in a triangular relationship, and the feeding point 103 is electrically connected to the copper clad on the second PCB substrate 110.
[0035] The area where the feeding point 103 is located may be a clearance area 102 of the stacked double-layer PCB antenna. In the clearance area 102 , neither the first PCB substrate 100 nor the second PCB substrate 110 is copper-clad, and there is no other grounding point.
[0036] The first PCB substrate 100 and the second PCB substrate 110 have similar sizes. The first PCB substrate 100 and the second PCB substrate 110 are arranged parallel to each other, and most areas of the first PCB substrate 100 and the second PCB substrate 110 overlap in the vertical direction. The first PCB substrate 100 and the second PCB substrate 110 may be rectangular or approximately rectangular. The first PCB substrate 100 and the second PCB substrate are fixedly connected to each other through the first metal connection seat 111 and the second metal connection seat 112 arranged on the first side and the second side opposite to each other of the first PCB substrate 100 and the second PCB substrate 110. The first metal connection seat 111 and the second metal connection seat 112 have the same height to ensure that the first PCB substrate 100 and the second PCB substrate 110 are parallel to each other. The first PCB substrate 100 and the second PCB substrate 110 may be copper-clad in partial areas on both sides or copper-clad in partial areas on only one side. The copper-clad areas on the first PCB substrate 100 and the second PCB substrate 110 overlap or substantially overlap, and the first metal connection seat 111 and the second metal connection seat 112 are electrically connected to the copper-clad areas on the first PCB substrate 100 and the second PCB substrate 110 and are grounded. A feeding point 103 is disposed on the third side of the second PCB substrate 110. The third side of the second PCB substrate 110 is a side other than the first side and the second side. Generally, the third side is a side perpendicular to the first side and the second side. The feeding point 103 is electrically connected to the copper clad on the second PCB substrate 110. The first interval between the first PCB substrate 100 and the second PCB substrate 110 is the clear space of the stacked PCB antenna.
[0037] The first PCB substrate 100, the second PCB substrate 110 and the feeding point 103 constitute a double-layer stacked PCB antenna. Since the grounded first metal connection seat 111 and the second metal connection seat 112 are located on different sides of the feeding point 103, the three form a triangular structure. The current flows from the first metal connection seat 111 to the second metal connection seat 112 through the feeding point 103. The first metal connection seat 111 and the second metal connection seat 112 form a first radiation path 20 through the feeding point 103. The first radiation path 20 is a groove radiation. The first radiation path 20 is a closed-loop radiation path. By adjusting the positions of the first metal connection seat 111 and the second metal connection seat 112, the equivalent electrical length of the first radiation path 20 can be adjusted. The equivalent electrical length of the first radiation path 20 is 1 / 4 or 1 / 2 of the wavelength corresponding to the required working frequency band. The stacked PCB antenna composed of the first PCB substrate 100 and the second PCB substrate 110 makes effective use of space in the vertical direction, which is conducive to reducing the volume occupied by the antenna. However, when the antenna space is limited and the size of the first PCB substrate 100 and the second PCB substrate 110 is limited, the radiation performance of the stacked antenna composed of the first PCB substrate 100 and the second PCB substrate 110 is still limited, for example, the bandwidth is narrow. Therefore, in the embodiment of the present application, on the basis of the stacked antenna composed of the first PCB substrate 100 and the second PCB substrate 110, the first branch circuit board 101 and the second branch circuit board 115 are added. In order to achieve a better radiation effect, the first interval between the first PCB substrate 100 and the second PCB substrate 110 can be greater than 1.5 mm.
[0038] In addition, a feeding connector may be provided at the feeding point 103 between the first PCB substrate 100 and the second PCB substrate 110, and the feeding connector is used to feed the entire antenna. The feeding connector may be any form of connector, and in the embodiment of the present application, due to limited space, the feeding connector may be a Pogo pin or a spring.
[0039] The first metal connection base 111 and the second metal connection base 112 may be screws penetrating from the second PCB substrate 110 to the first PCB substrate 100 .
[0040] The first branch circuit board 101 is located on the first side, and the second branch circuit board 115 is located on the second side. The first branch circuit board 101 is connected to the first PCB substrate 100 at a position close to the feeding point 103, and the second branch circuit board 115 is connected to the second PCB substrate 110 at a position close to the feeding point 103. Part of the area on at least one side of the first branch circuit 101 and the second branch circuit board 115 is copper-clad, and the copper cladding of the first branch circuit 101 and the second branch circuit board 115 is electrically connected to the copper cladding on the connected first PCB substrate 100 or the second PCB substrate 100. It should be noted that, in one embodiment, the first branch circuit board 101 can also be connected to the second PCB substrate 110 at a position close to the feeding point 103, and the second branch circuit board 115 can also be connected to the first PCB substrate 100 at a position close to the feeding point 103, as long as the PCB substrates to which the first branch circuit board 101 and the second branch circuit board 115 are connected are different. In the figure, the first branch circuit 101 can be connected to the first PCB substrate 100 through a connection socket 104 .
[0041] After adding the first branch circuit board 101 and the second branch circuit board 115, it is equivalent to adding two open-circuit branches to the stacked antenna composed of the first PCB substrate 100 and the second PCB substrate 110. Among them, the open-circuit end from the first metal connection seat 111 to the first branch circuit board 101 constitutes a second radiation path 10, and the open-circuit end from the second metal connection seat 112 to the second branch circuit board 115 constitutes a third radiation path 30. In the second radiation path 10, the current flows from the first metal connection seat 111 through the open-circuit end of the first branch circuit board 101, and in the third radiation path 30, the current flows from the second metal connection seat 112 through the open-circuit end of the second branch circuit board 115. The second radiation path 10 and the third radiation path 30 are both open-loop radiation paths. The equivalent electrical length of the second radiation path 10 and the third radiation path 30 is 1 / 4 or 1 / 2 of the wavelength corresponding to the required working frequency band. If the operating frequency bands of the second radiation path 10 and the third radiation path 30 are set to be the same as the operating frequency band of the first radiation path 10, the radiation performance of the entire antenna in its own operating frequency band can be enhanced. If the operating frequency bands of the second radiation path 10 and the third radiation path 30 are set to be next to the operating frequency band of the first radiation path 10, the operating bandwidth of the entire antenna can be effectively expanded.
[0042] The stacked double-layer PCB antenna provided in the embodiment of the present application adds two branch circuit boards as additional open-circuit branches on the basis of the basic stacked double-layer PCB antenna composed of two PCB substrates, thereby providing two additional radiation paths on the basis of the one radiation path originally provided by the stacked double-layer PCB antenna. This improves the radiation performance of the antenna while the stacked double-layer PCB antenna occupies a small space, making the antenna suitable for devices with limited antenna space such as wireless microphones.
[0043] In addition, in the stacked double-layer PCB antenna provided in the embodiment of the present application, the first PCB substrate 100, the second PCB substrate 110, the first branch circuit board 101, and the second branch circuit board 115 can all be copper-clad in only part of one side, and the areas of the first PCB substrate 100, the second PCB substrate 110, the first branch circuit board 101, and the second branch circuit board 115 that are not copper-clad are used to set other devices and connecting wires connecting the devices. In other words, the first PCB substrate 100, the second PCB substrate 110, the first branch circuit board 101, and the second branch circuit board 115 not only serve as the radiator of the antenna, but also arrange various devices and connecting wires connecting the devices in the area that is not copper-clad, that is, as the function of an ordinary PCB, so the space required for the antenna and the functional device can be reused, and there is no need to set up additional space for the antenna, so the stacked double-layer PCB antenna provided in the embodiment of the present application can be applied to scenes or devices with limited antenna space. For example, scenes with limited space such as wireless microphones and wireless headphones. The first PCB substrate 100 , the second PCB substrate 110 , the first branch circuit board 101 , and the second branch circuit board 115 can be provided with components and connection lines at required positions.
[0044] In one embodiment, in order to achieve a better radiation effect and prevent the antenna radiation from affecting the normal operation of other devices, the first PCB substrate 100 and the second PCB substrate 110 may be copper-clad in partial areas of opposite sides respectively.
[0045] Generally, since the first PCB substrate 100 and the second PCB substrate 110 have a large area, the main components are arranged on the first PCB substrate 100 and the second PCB substrate 110, then the first PCB substrate 100 and the second PCB substrate 110 can be respectively provided with connectors, for example, in the figure, the second PCB substrate 110 is provided with a connector 113, and the first PCB substrate 100 is provided with a connector 105, and the connector 113 and the connector 105 are connected to the connection lines of the non-copper-clad areas on the first PCB substrate 100 and the second PCB substrate 110 through the connection line 114, and the connector 113 and the connector 105 are arranged at a position close to the second metal connection seat 112. In one embodiment, the connector 113 and the connector 105 can also be arranged at a position close to the first metal connection seat 111.
[0046] In order to further reduce the space occupied by the entire stacked double-layer PCB antenna, the first branch circuit board 101 and the second branch circuit board 115 can also be bent, for example, the first branch circuit board 101 and the second branch circuit board 115 are perpendicular to the first PCB substrate 100 and the second PCB substrate 110. In this way, the space occupied by the entire antenna in the plane where the first PCB substrate 100 and the second PCB substrate 110 are located can be reduced, which is conducive to the miniaturization of the entire antenna. In one embodiment, the first branch circuit board 101 and the second branch circuit board 115 can also take other forms, for example, at least one of the first branch circuit board 101 and the second branch circuit board 115 is a section of a metal casing of a device using a stacked double-layer PCB antenna or a metal trace on the casing.
[0047] In order to improve the adjustable performance of the first branch circuit board 101 and the second branch circuit board 115, the first branch circuit board 101 and the second branch circuit board 115 can be flexible printed circuits (Flexible Printed Circuit, FPC), which are made of flexible materials and can be bent to the required angle and shape as needed.
[0048] Figure 3 and Figure 4 for Figure 1 and Figure 2 The simplified structural diagram of the stacked double-layer PCB antenna is shown in FIG. Figure 3 and Figure 4As shown, the first metal connection base 111 is at the grounding point 111' on the first PCB substrate 100, and the second metal connection base 112 is at the grounding point 112' on the first PCB substrate 100. The connector on the second PCB substrate 110 can be set at the position of the connector 113, and correspondingly, the connector on the first PCB substrate 100 can be set at the position of the connector 105. Alternatively, the connector on the second PCB substrate 110 can be set at the position of the connector 116, and correspondingly, the connector on the first PCB substrate 100 can be set at the position of the connector 106. The corresponding position of the feeding point 103 on the first PCB substrate 100 is the position 103'.
[0049] Figure 5 for Figure 1 and Figure 2 The current path diagram of the stacked double-layer PCB antenna is shown in Figure 1. Figure 5 As can be seen in the figure, the second radiation path 10 starts from the grounding point 111' of the first PCB substrate 100 and reaches the open-circuit end of the first branch circuit board 101. The first radiation path 20 also starts from the grounding point 111', passes through the feeding point 103, reaches the ground 112' and then reaches the second metal connection base 112 of the second PCB substrate 110. The third radiation path 30 starts from the second metal connection base 112 of the second PCB substrate 110 and reaches the open-circuit end of the second branch circuit board 115.
[0050] Figure 6A-6D A schematic diagram of a specific size of a stacked double-layer PCB antenna provided in an embodiment of the present application, such as Figure 6A-6D As shown, the units of the dimensions marked in the figure are all millimeters. The dimensions between the first metal connection seat 111, the second metal connection seat 112 and the feeding point 103 are shown in the figure, that is, the straight-line distance between the first metal connection seat 111 and the second metal connection seat 112 is 21.8 mm, the straight-line distance between the first metal connection seat 111 and the feeding point 103 is 27.9 mm, and the straight-line distance between the second metal connection seat 112 and the feeding point 103 is 24.5 mm. The distance between the second metal connection seat 112 and the connection point of the second branch circuit board 115 on the second PCB board is 16.3 mm, the distance between the feeding point 103 and the connection seat 104 of the first branch circuit board 101 on the first PCB substrate 100 is 5.8 mm, and the distance between the feeding point 103 and the connection point of the second branch circuit board 115 on the second PCB board is 10.2 mm. The size of the first branch circuit board 101 is 22.6 mm×8 mm, and the size of the second branch circuit board 115 is 20 mm×8.2 mm. The distance between the first branch circuit board 101 and the first PCB substrate 100 is 1.8 mm, and the distance between the second branch circuit board 115 and the second PCB substrate 110 is 3.2 mm.
[0051] Figure 7 for Figure 6A-6D The E-plane radiation pattern of the stacked double-layer PCB antenna of the size shown, curve 40 is Figure 1 and Figure 2 The E-plane radiation pattern of the stacked double-layer PCB antenna is shown, and curve 50 is the E-plane radiation pattern of a traditional dipole antenna. It can be seen from the figure that compared with the traditional dipole antenna, the antenna provided in the embodiment of the present application has one less recessed position.
[0052] Figure 8 for Figure 6A-6D Frequency response diagram of a stacked double-layer PCB antenna of the size shown. Figure 8 In the figure, the resonant frequency f1 is generated by the first radiation path 10, the resonant frequency f2 and the resonant frequency f4 are generated by the second radiation path 20, and the resonant frequency f3 is generated by the third radiation path 30. Curve 60 shows the effect of not optimizing the position of the feeding point 103, that is, the resonant impedance of the resonant frequency f2 deviates greatly from 50 ohm. Curve 70 shows the broadband effect achieved after fine-tuning the position of the feeding point 103. At this size, the operating frequency band of the stacked double-layer PCB antenna is in the 2.4 GHz band. It can be seen that the stacked double-layer PCB antenna provided in the embodiment of the present application has a wider operating bandwidth.
[0053] To sum up, the double-layer stacked PCB antenna provided in the embodiment of the present application greatly saves product space, combines the antenna with the hard board PCB and the flexible FPC for analysis, has the flexibility of impedance and frequency adjustment, and the radiation pattern of the first resonant frequency has one less notch point than the radiation pattern of the traditional dipole, which helps to improve the usage distance experience of the wireless microphone.
[0054] An embodiment of the present application also provides a wireless microphone, comprising a stacked double-layer PCB antenna, a receiving module, a processing module and a radio frequency module as shown in any of the above embodiments; the devices in the receiving module, the processing module and the radio frequency module are arranged on the first PCB substrate, the second PCB substrate, the first branch circuit board and the second branch circuit board of the stacked double-layer PCB antenna.
[0055] Note that the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims
1. A stacked double-layer PCB antenna, characterized in that: include: A first printed circuit board (PCB) substrate, a second PCB substrate, a first branch circuit board and a second branch circuit board; Partial areas of at least one side of the first PCB substrate and the second PCB substrate are copper-clad, the first PCB substrate and the second PCB substrate are parallel and have a first interval, the first PCB substrate and the second PCB substrate are fixedly connected to each other on opposite first and second sides respectively through a first metal connection seat and a second metal connection seat, the first metal connection seat and the second metal connection seat are electrically connected to the copper-clad surfaces of the first PCB substrate and the second PCB substrate and are grounded; A feeding point is provided on a third side of the second PCB substrate which is perpendicular to the first side and the second side, and the feeding point is electrically connected to the copper clad on the second PCB substrate; The first branch circuit board is located on the first side, and the second branch circuit board is located on the second side. The first branch circuit board and the second branch circuit board are respectively connected to the first PCB substrate or the second PCB substrate at a position close to the feeding point. Part of the area of at least one side of the first branch circuit and the second branch circuit board is copper-clad, and the copper cladding of the first branch circuit and the second branch circuit board is electrically connected to the copper cladding on the connected first PCB substrate or the second PCB substrate. The first branch circuit board and the second branch circuit board are connected to different PCB substrates.
2. The stacked double-layer PCB antenna according to claim 1, characterized in that: A first radiation path is formed between the first metal connection base and the second metal connection base through the feeding point; The first metal connection base and the open circuit end of the first branch circuit board form a second radiation path; The open-circuit end of the second metal connection base to the second branch circuit board forms a third radiation path.
3. The stacked double-layer PCB antenna according to claim 1, characterized in that: The first PCB substrate, the second PCB substrate, the first branch circuit board, and the second branch circuit board are all partially copper-clad on one side, and the areas of the first PCB substrate, the second PCB substrate, the first branch circuit board, and the second branch circuit board that are not copper-clad are used to set other devices and connection lines connecting the devices; Connectors are respectively provided on the first PCB substrate and the second PCB substrate, and the connectors connect the connection wires without copper clad layers on the first PCB substrate and the second PCB substrate. The connectors are arranged at a position close to the first metal connection seat or the second metal connection seat.
4. The stacked double-layer PCB antenna according to claim 3, characterized in that: Part of the area on one side opposite to the first PCB substrate and the second PCB substrate is covered with copper.
5. The stacked double-layer PCB antenna according to any one of claims 1 to 4, characterized in that: The first branch circuit board and the second branch circuit board are perpendicular to the first PCB substrate and the second PCB substrate.
6. The stacked double-layer PCB antenna according to any one of claims 1 to 4, characterized in that: The first branch circuit board and the second branch circuit board are flexible circuit boards (FPC).
7. The stacked double-layer PCB antenna according to any one of claims 1 to 4, characterized in that: The first interval is greater than 1.5 mm.
8. The stacked double-layer PCB antenna according to any one of claims 1 to 4, characterized in that: A feeding connector is arranged between the first PCB substrate and the second PCB substrate at the feeding point.
9. The stacked double-layer PCB antenna according to claim 8, characterized in that: The feeding connector is a Pogopin.
10. A wireless microphone, characterized in that: It comprises a stacked double-layer PCB antenna, a radio module, a processing module and a radio frequency module as shown in any one of claims 1 to 9; The components in the radio receiving module, the processing module and the radio frequency module are arranged on the first PCB substrate, the second PCB substrate, the first branch circuit board and the second branch circuit board of the stacked double-layer PCB antenna.