Power module, switching power supply and power module manufacturing method

By adding a high thermal conductivity layer to the TSC-SMD power device, the thermal resistance problem caused by the small heat dissipation area of ​​the power device is solved, and more efficient heat dissipation effect and lower temperature rise are achieved, and the cost is controllable.

CN119697875APending Publication Date: 2025-03-25DELTA ELECTRONICS (THAILAND) PUBLIC CO LTD
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Patent Information

Application Number
CN202411966584.8
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-27
Publication Date
2025-03-25

AI Technical Summary

Technical Problem

The existing TSC-SMD power devices have a small heat dissipation area of ​​exposed metal due to the packaging form, which in turn affects the thermal resistance. Especially when power consumption is high, they will face serious heat dissipation problems, and the existing solutions are relatively expensive.

Method used

By adding a high thermal conductivity layer directly in contact with the power device and having a high thermal conductivity in the power module, the heat dissipation area of ​​the power device is increased, thereby reducing the thermal resistance of the overall power module.

Benefits of technology

It effectively improves the heat dissipation effect, reduces the temperature during the module operation, and solves the heat dissipation problem without increasing costs.

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Abstract

The invention provides a power module, a switching power supply and a power module manufacturing method. The power module comprises a power device, a high heat conduction layer, an easy-to-plastic heat conduction insulating layer, a heat dissipation structure and a circuit board. The power device comprises a first surface and a second surface which are oppositely arranged. The first surface of the power device is arranged on the circuit board in a surface-mounted manner. The high heat conduction layer comprises a third face and a fourth face which are oppositely arranged, the third face is directly arranged on the second face, and the area of the third face and the area of the fourth face are larger than the area of the first face and the area of the second face. The easy-to-plastic heat-conducting insulating layer comprises a fifth surface and a sixth surface which are oppositely arranged, and the fifth surface is arranged on the fourth surface. And the heat dissipation structure is arranged on the sixth surface. Wherein the heat conductivity coefficient of the high heat conduction layer is greater than that of the easy-to-plastic heat conduction insulating layer. The power module has the advantages of low thermal resistance and high heat dissipation efficiency.
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