Wireless communication device

Abstract

A wireless communication device of the present disclosure includes a substrate, a housing, a wireless communication circuit, and a shield case. At least a portion of a top surface of the housing is open, the top surface facing a second surface of the substrate, the second surface being opposite to the first surface on which the terminal is formed. Wireless communication circuitry is disposed on the second surface. The shield case has a third surface having a height substantially the same as a height of a surface forming the opening of the top surface and shielding the wireless communication circuit.

Description

Technical Field

[0001] The present disclosure relates to a wireless communication device. Background Art

[0002] There is known a technique for providing a card-type device with a communication function by mounting a communication circuit on a thin card-type device (for example, Patent Document 1). In the case where the card-type device has a communication function, the communication circuit is covered by a shield.

[0003] Citation List

[0004] Patent Literature

[0005] Patent Document 1: JP 2011-154642A Summary of the invention

[0006] Technical issues

[0007] There are cases where, in a card-type device, the dimensions including the thickness are predefined by a standard, etc., such as an SD card. In addition, even in a card-type device whose dimensions are not set, it is desirable to mold the device as thinly as possible.

[0008] On the other hand, as described above, in the case where a thin device such as a card-type device has a communication function, a communication circuit, a shield, etc. are additionally installed on the device. Therefore, since the number of components mounted on the thin device increases, the size of the device, particularly the thickness, may increase in order to ensure a space for mounting the components.

[0009] Thus, the present disclosure provides a wireless communication device capable of suppressing an increase in thickness.

[0010] Note that the above disadvantages or purposes are only one of the disadvantages or purposes that can be solved or achieved by the various embodiments disclosed herein.

[0011] Solution to the problem

[0012] The wireless communication device of the present disclosure includes a substrate, a housing, a wireless communication circuit and a shielding cover. At least a portion of the top surface of the housing is open, and the top surface faces the second surface of the substrate, and the second surface is opposite to the first surface on which the terminal is formed. The wireless communication circuit is arranged on the second surface. The shielding cover has a third surface and shields the wireless communication circuit, and the third surface has a height substantially the same as the height of the surface on which the opening of the top surface is formed. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device according to the first embodiment of the present disclosure.

[0014] Figure 2 is a cross-sectional view illustrating an example of a schematic configuration of a card-type device.

[0015] Figure 3 : is a diagram for explaining the thickness of the wireless communication device according to the first embodiment of the present disclosure.

[0016] Figure 4 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device according to a second embodiment of the present disclosure.

[0017] Figure 5 is a top view illustrating an example of a schematic configuration of a wireless communication device according to the second embodiment of the present disclosure.

[0018] Figure 6 is a bottom view illustrating an example of a schematic configuration of a wireless communication device according to the second embodiment of the present disclosure.

[0019] Figure 7 is an exploded perspective view illustrating an example of a schematic configuration of a wireless communication device according to a second embodiment of the present disclosure.

[0020] Figure 8 : is a diagram for explaining an example of a coating area of ​​an adhesive according to the second embodiment of the present disclosure.

[0021] Fig. 9 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device according to a modification example of the second embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. Note that in this specification and the accompanying drawings, substantially the same components are denoted by the same reference numerals, and redundant descriptions are omitted.

[0023] One or more embodiments (including examples and variations) described below can be implemented independently of each other. At the same time, at least a portion of the multiple embodiments described below can be appropriately combined with at least a portion of another embodiment and implemented together. Multiple embodiments may include novel features that are different from each other. Thus, multiple embodiments may help solve different goals or shortcomings, or achieve different effects.

[0024] <<1. First embodiment>>

[0025] Figure 11 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device 10 according to the first embodiment of the present disclosure. In the present embodiment, as an example, a case where a thin device (wireless communication device 10) having a wireless communication function is an SD card or a multimedia card will be described; however, the wireless communication device 10 is not limited thereto. The wireless communication device 10 may be, for example, a card-type device, etc., and may be a memory stick, a USB memory, etc.

[0026] Note that in the following figures, in order to facilitate understanding of the description, the X-axis direction, the Y-axis direction, and the Z-axis direction that are orthogonal to each other are defined. In this orthogonal coordinate system, the XY plane is parallel to the plane of the wireless communication device 10. The positive direction of the Y axis is the direction in which the wireless communication device 10, which is an SD card, is inserted into the slot. The positive direction of the Z axis is the direction vertically upward relative to the direction in which the wireless communication device 10 is inserted into the slot. The X-axis direction is orthogonal to the Y axis and the Z axis.

[0027] Figure 1 The wireless communication device 10 illustrated in FIG. 4 includes a substrate 100 , a housing 200 , a shield case 300 , a wireless communication circuit 410 , a circuit 420 , a front sheet 500 , and a rear sheet 600 .

[0028] The substrate 100 is formed of, for example, a resin such as glass fiber reinforced epoxy resin, a copper pattern, etc. A terminal (contact terminal) 110 is provided in an end region of a rear surface 100a (an example of a first surface) of the substrate 100. The terminal 110 is used for communication with an external device (not shown) into which the wireless communication device 10 is inserted.

[0029] The end region 120 of the substrate 100 on the opposite side to the end region where the terminal 110 is provided is an antenna region (hereinafter, also referred to as antenna region 120) in which an antenna (not shown) is formed. The antenna is formed on, for example, the front surface 100b (an example of the second surface) of the substrate 100 as part of the wiring pattern.

[0030] The housing 200 is formed of, for example, a thermoplastic resin such as polycarbonate or acrylonitrile butadiene styrene (ABS). Note that the material of the housing 200 is not limited to the thermoplastic resin.

[0031] The housing 200 has an opening on the bottom surface and a part of the upper surface. The opening included in the upper surface of the housing 200 is also referred to as an opening 210. In addition, on the upper surface of the housing 200, a recess is included to prevent the front sheet 500 from protruding when the front sheet 500 is attached, that is, so that there is almost no step between the front sheet 500 and the upper surface of the housing 200. The flat part of the recess is also referred to as a top surface 200a to distinguish it from the upper surface. The top surface 200a is the surface on which the opening 210 is formed.

[0032] The wireless communication circuit 410 is arranged, for example, on the front surface 100b side of the substrate 100. The wireless communication circuit 410 is arranged so that a part thereof is located in the opening 210 of the housing 200, for example.

[0033] The wireless communication circuit 410, for example, performs wireless communication with other wireless communication devices (not shown) via an antenna (not shown) when the wireless communication device 10 is inserted into the SD card slot. The wireless communication circuit 410 performs wireless communication based on, for example, Long Term Evolution (LTE). Note that the communication method adopted by the wireless communication circuit 410 is not limited to LTE. The wireless communication circuit 410 can perform wireless communication with other mobile communication systems such as the fifth generation mobile communication system (5G). Alternatively, in addition to the mobile communication system, the wireless communication circuit 410 can also perform wireless communication according to a wireless communication scheme such as Wi-Fi (registered trademark) or Bluetooth (registered trademark).

[0034] The circuit 420 is arranged, for example, on the rear surface 100 a side of the substrate 100 .

[0035] The shield case 300 suppresses electrical interference between the wireless communication circuit 410 and the antenna. The shield case 300 is formed of metal such as stainless steel. The shield case 300 is arranged on the front surface 100b side of the substrate 100 in such a manner as to cover the wireless communication circuit 410.

[0036] like Figure 1 As shown in the diagram, the shield cover 300 has an upper surface 300a (an example of a third surface) at a height substantially the same as that of the top surface 200a of the housing 200. That is, the distance from the substrate 100 to the upper surface 300a is substantially the same as the distance from the substrate 100 to the opening 210 (or the top surface 200a). In addition, the side surface of the shield cover 300 is bonded to the side surface 200b of the opening 210 of the housing 200 by an adhesive 700.

[0037] The front sheet 500 (an example of a sheet) is, for example, a label of an SD card and is bonded to the top surface 200 a of the housing 200 and the upper surface 300 a of the shield case 300 so as to close the opening 210 of the housing 200 .

[0038] The rear sheet 600 (an example of a second sheet) is attached to the rear surface 100a of the substrate 100 in a manner covering the circuit 420. The rear sheet 600 includes a first sheet 610 and a second sheet 620. The first sheet 610 is attached to the rear surface 100a of the substrate 100. The first sheet 610 has an opening 630 in at least a portion thereof. The circuit 420 described above is arranged in the opening 630 of the first sheet 610.

[0039] The second sheet 620 is attached to the first sheet 610 in such a manner as to close the opening 630 of the first sheet 610 .

[0040] With the rear sheet 600 attached to the rear surface 100 a of the substrate 100 , the bottom surface (rear surface) of the wireless communication device 10 is closed by the rear sheet 600 .

[0041] Note that it is desirable that the opening 630 is not included in the region of the first sheet 610 corresponding to the antenna region 120 of the substrate 100. That is, it is desirable that the circuit 420 is arranged in the region of the substrate 100 other than the antenna region 120. This is to suppress electrical interference between the circuit 420 and the antenna.

[0042] The rear sheet 600 is attached to the rear surface 100 a of the substrate 100 such that the terminals 110 disposed on the rear surface 100 a of the substrate 100 are exposed.

[0043] As described above, the wireless communication device 10 according to the present embodiment includes a substrate 100, a housing 200, a wireless communication circuit 410, and a shielding cover 300. In the housing 200, at least a portion of a top surface 200a is open, and the top surface 200a faces a front surface 100b opposite to a rear surface 100a on which a terminal 110 is formed. The wireless communication circuit 410 is arranged on the front surface 100b of the substrate 100. The shielding cover 300 has an upper surface 300a having a height substantially the same as that of the top surface 200a of the housing 200, and shields the wireless communication circuit 410.

[0044] As a result, in the wireless communication device 10, an increase in the thickness of the housing 200 can be suppressed. For example, even in the case where the wireless communication device 10 has the shield case 300 and the circuit 420 arranged on the rear surface 100a of the substrate 100, the housing 200 can be made thinner to prevent the housing 200 from becoming thicker.

[0045] Note that although Figure 1 An example is illustrated in which the wireless communication circuit 410 is arranged in the shield case 300, but the circuit arranged in the shield case 300 is not limited to the wireless communication circuit 410. For example, a memory circuit (storage medium), an arithmetic circuit, etc. may be arranged in the shield case 300.

[0046] In addition, Figure 1 In the embodiment, on the front surface 100 b of the substrate 100 , no circuit is arranged outside the shield case 300 ; however, a circuit (eg, a memory circuit, an arithmetic circuit, etc.) may be arranged outside the shield case 300 .

[0047] Next, we will refer to Figure 2 and Figure 3 The reason why the increase in thickness of the housing 200 can be suppressed is described.

[0048] Figure 2 is a cross-sectional view illustrating an example of a schematic configuration of the card-type device 10a. Figure 2 The card device 10a shown in the diagram is, for example, an SD card. Figure 1 The same components in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

[0049] like Figure 2 As shown in the diagram, the card device 10 a includes a substrate 100 , a first housing 220 , a second housing 230 , a circuit 430 , and a front sheet 500 .

[0050] The circuit 430 is arranged on the front surface 100b of the substrate 100. The circuit 430 is, for example, a memory circuit or the like.

[0051] The first housing 220 and the second housing 230 serve as the outer shell of the card device 10a. The inner surface of the first housing 220 and the inner surface of the second housing 230 are bonded together when facing each other. The substrate 100 and the circuit 430 are accommodated in the inner space of the outer shell formed thereby. The second housing includes an opening so that the terminal 110 is exposed from the opening.

[0052] The wireless communication function is added by mounting the wireless communication circuit 410 and the antenna on the card device 10a formed in this way. In this case, in addition to the wireless communication circuit 410 and the antenna, the shield case 300 for suppressing electrical interference therebetween is mounted on the card device 10a.

[0053] When the number of components mounted on the card device 10a increases, the size of the card device 10a becomes larger. Figure 3 to describe.

[0054] Figure 3 1 is a diagram for explaining the thickness of the wireless communication device 10 according to the first embodiment of the present disclosure. Figure 3 In order to enhance the visibility of the drawing, some reference numerals are omitted.

[0055] exist Figure 3 In (a), the diagram illustrates Figure 2 The card-type device 10a is shown in the diagram. Figure 3 Illustrated in (b) is a wireless communication device 10b obtained by installing a wireless communication function on the card-type device 10a. Figure 3 Diagrammatically shown in (c) is a wireless communication device 10 according to the first embodiment of the present disclosure.

[0056] Figure 3The wireless communication device 10b illustrated in (b) is different from the card-type device 10a in that a wireless communication circuit 410 is included instead of the circuit 430. The wireless communication device 10b further includes a shielding case 300 and a circuit 420. The circuit 420 may be, for example, a circuit that cannot be arranged on the front surface 100b of the substrate 100 due to the installation of the wireless communication circuit 410. The circuit 420 is arranged on the rear surface 100a of the substrate 100.

[0057] like Figure 3 As shown in the diagram in (b), the thickness (height) of the wireless communication device 10b is smaller than that of the rear surface 100a due to the shield case 300 and the circuit 420 arranged on the rear surface 100a. Figure 3 The thickness of the card type device 10a illustrated in (a) is greater than h2. For example, in the case where the thickness of the card type device 10a is h1, the thickness of the wireless communication device 10b is h1+h2.

[0058] In this case, when the card device 10a and the wireless communication device 10b are SD cards, their dimensions including thickness are defined by the standard. Therefore, since the shield case 300 and the circuit 420 arranged on the rear surface 100a increase the thickness, the wireless communication device 10b may not meet the standard.

[0059] So, if Figure 3 As illustrated in (c), the wireless communication device 10 according to the present embodiment includes an opening 210 on the upper surface of the housing 200. The wireless communication device 10 also has an opening on the bottom surface of the housing 200.

[0060] In the wireless communication device 10, the shield case 300 and a part of the wireless communication circuit 410 are arranged in the opening 210 on the upper surface. As a result, in the wireless communication device 10, the increase in thickness of the wireless communication device 10 due to the shield case 300 or the circuit 420 provided therein can be suppressed.

[0061] In addition, in the wireless communication device 10, the rear sheet 600 is provided in the opening of the bottom surface of the housing 200, and the circuit 420 is arranged in the opening 630 of the rear sheet 600. As a result, in the wireless communication device 10, an increase in the thickness of the wireless communication device 10 due to the shield case 300 or the circuit 420 provided therein can be suppressed.

[0062] As described above, the wireless communication device 10 according to the present embodiment is less likely to become thicker due to the increase in the number of components, thereby Figure 3As a result, the wireless communication device 10 according to this embodiment can be thinned while having a wireless communication function and can meet the standards of, for example, SD cards.

[0063] In addition, in the wireless communication device 10, at least a portion of the shield case 300 is arranged in the opening 210 of the housing 200. The upper surface 300a of the shield case 300 is arranged at a height substantially the same as that of the top surface 200a of the housing 200. The shield case 300 is made of metal as described above. As a result, even when the opening 210 is formed in the housing 200, the wireless communication device 10 can maintain its strength.

[0064] In addition, the housing 200 and the shield case 300 are bonded to each other by the adhesive 700. As a result, for example, even in the case where a twisting force is applied to the wireless communication device 10, damage to the wireless communication device can be further suppressed.

[0065] In this manner, the wireless communication device 10 can increase its strength while enabling more circuits to be mounted thereon.

[0066] <<2. Second embodiment>>

[0067] Figure 4 2 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device 10A according to a second embodiment of the present disclosure. Figure 1 In addition to the configuration of the wireless communication device 10 shown in the diagram, Figure 4 The radio communication device 10A illustrated in FIG. 1 further includes an antenna 800 and an antenna sheet 900. Note that the radio communication device 10A and Figure 1 The wireless communication device 10 illustrated in FIG. 1 is different in the shape of the housing 200A and the shape of the shield case 300A.

[0068] like Figure 4 As shown in the diagram, the shield case 300A has a step surface 300b (an example of a fourth surface) lower than the upper surface 300A (an example of a third surface). The shield case 300A and the housing 200A are bonded to each other by an adhesive 700 at least in a portion of the step surface 300b.

[0069] As described above, the shield case 300A has a stepped shape. The stepped surface 300b constituting the stepped shape is formed on, for example, at least a portion of the outer periphery of the shield case 300A (see the later-described Figure 7 ).

[0070] In addition, the wireless communication device 10A includes an antenna 800 as a pattern wiring on the substrate 100. The wireless communication circuit 410 of the wireless communication device 10A performs wireless communication with other wireless communication devices (not shown) via the antenna 800.

[0071] exist Figure 4 In the example of FIG. 1 , the antenna sheet 900 is arranged on the antenna 800 and on the front surface 100b of the substrate 100. The antenna sheet 900 may have a function of protecting the antenna 800. The antenna sheet 900 is bonded to the housing 200A by the adhesive 700. Thus, the housing 200A and the substrate 100 are bonded to each other.

[0072] The housing 200A has a stepped shape in its interior. For example, the housing 200A has a first adhesive surface 200c and a second adhesive surface 200d.

[0073] The first bonding surface 200c is, for example, a surface located on the opposite side of the top surface 200a to which the front sheet 500 is bonded. The first bonding surface 200c is formed at a position facing the step surface 300b of the shield case 300A. The housing 200A is bonded to the step surface 300b of the shield case 300A via the adhesive 700 at the first bonding surface 200c.

[0074] The second bonding surface 200d is, for example, a surface located on the opposite side of the upper surface of the housing 200A and in the antenna region 120 of the substrate 100. The second bonding surface 200d is formed at a position facing the antenna sheet 900. The housing 200A is bonded to the antenna sheet 900 via the adhesive 700 at the second bonding surface 200d.

[0075] As described above, the shield case 300A of the wireless communication device 10A according to the present embodiment has a stepped shape. As a result, in the wireless communication device 10A, the internal space of the shield case 300A can be further expanded. Thus, the wireless communication device 10A allows more circuits to be arranged in the shield case 300A compared to the first embodiment.

[0076] Figure 5 1 is a top view illustrating an example of a schematic configuration of a wireless communication device 10A according to the second embodiment of the present disclosure. Figure 6 1 is a bottom view illustrating an example of a schematic configuration of a wireless communication device 10A according to the second embodiment of the present disclosure.

[0077] Figure 5 is a diagram illustrating the wireless communication device 10A viewed from above (in the positive direction of the Z axis). Figure 5As shown in the diagram, the opening 210 of the housing 200A has a shape including a plurality of recessed portions and protruding portions. The shape of the opening 210 may vary, such as a quadrilateral, a circle, or a polygon. The opening 210 has a shape corresponding to the shape of the upper surface 300a of the shielding case 300a, that is, the number, shape or size of the circuits (e.g., the wireless communication circuit 410) installed in the shielding case 300B, the arrangement of the circuits, etc.

[0078] The front sheet 500 is attached to the housing 200A and the shield case 300A in such a manner as to cover the opening 210. In this way, with the housing 200A and the shield case 300A also being fixed by the front sheet 500, the strength of the wireless communication device 10A is enhanced.

[0079] Figure 6 is a diagram illustrating the wireless communication device 10A viewed from below (in the negative direction of the Z axis). Figure 6 As shown in the diagram, the second sheet 620 of the rear sheet 600 is attached to the substrate 100 such that the terminals 110 of the substrate 100 are exposed.

[0080] Attaching the rear sheet 600 to the substrate 100 in this manner eliminates the need for using the second housing 230 (see Figure 2 ) covers the need for the rear surface side of the wireless communication device 10A. This allows circuits to be mounted on the rear surface 100a of the substrate 100, so that more circuits can be mounted on the wireless communication device 10A.

[0081] Figure 7 is an exploded perspective view illustrating an example of a schematic configuration of a wireless communication device 10A according to the second embodiment of the present disclosure.

[0082] like Figure 7 As shown in the diagram, the shielding case 300A has a stepped shape on at least a portion of the outer peripheral portion. In this way, the step surface 300b may not be provided on the entire outer peripheral portion of the shielding case 300A. The shape of the shielding case 300A has a shape corresponding to the number, shape or size of the circuits (e.g., the wireless communication circuit 410) installed inside, the arrangement of the circuits, etc.

[0083] like Figure 7 As shown in the diagram, on the substrate 100, a circuit 430 is further arranged outside the shielding case 300A. The shape of the shielding case 300A is determined according to the number, shape or size of the circuit 430, the arrangement of the circuit 430, and the like.

[0084] A plurality of openings 630 are formed in the rear sheet 600. The number or shape of the openings 630 is determined according to the number, shape or size of the circuits 420 arranged on the rear surface 100a of the substrate 100, the arrangement of the circuits, and the like.

[0085] In the above example, the housing 200A and the shield case 300 are adhered to each other by the adhesive 700 at the first adhesive surface 200c of the housing 200A and the step surface 300b of the shield case 300A; however, the position where the adhesive 700 is applied is not limited thereto.

[0086] Figure 8 2 is a diagram for explaining an example of a coating area of ​​an adhesive 700 according to the second embodiment of the present disclosure.

[0087] like Figure 8 As shown in the diagram, the adhesive 700 is applied to the first coating area 241, which is at least a portion of the first bonding surface 200c of the housing 200A. In addition, the adhesive 700 is applied to the second coating area 242, which is at least a portion of the side surface 200b of the housing 200A. The housing 200A and the shielding cover 300A are bonded to each other by the adhesive 700 applied to the first coating area 241 and the second coating area 242.

[0088] like Figure 8 As shown in the diagram in FIG. 2 , the adhesive 700 is applied to the third coating region 243 on the lower side (Y-axis negative direction) of the housing 200A. The housing 200A and the substrate 100 are bonded by the adhesive 700 applied to the third coating region 243 .

[0089] In addition, if Figure 8 As shown in the diagram, the adhesive 700 is applied to the fourth coating area 244 on the lower side (Y-axis negative direction) of the housing 200A. The fourth coating area 244 corresponds to the antenna area 120 of the substrate 100. The housing 200A and the antenna sheet 900 are bonded to each other by the adhesive 700 applied to the fourth coating area 244.

[0090] As described above, the antenna sheet 900 is attached to the antenna region 120 of the substrate 100. Then, the housing 200A and the substrate 100 are bonded to each other by the adhesive 700 applied to the fourth coating region 244 and the antenna sheet 900.

[0091] Notice, Figure 8 The coating area shown in the diagram is an example, and the adhesive 700 may be coated on other areas, and the adhesive 700 may not be coated on Figure 8 The adhesive 700 is only required to be applied to bond the housing 200A and the shield cover 300A and the housing 200A and the substrate 100. The application area of ​​the adhesive 700 can be appropriately modified according to the size of the housing 200A, the shape of the shield cover 300A, the circuit arranged on the substrate 100, etc.

[0092] <<3. Modifications>>

[0093] In the above-described second embodiment, a case where the corners of the shield case 300A are at right angles is described; however, the shape of the shield case 300A is not limited thereto.

[0094] Fig. 9 is a cross-sectional view illustrating an example of a schematic configuration of a wireless communication device 10B according to a modification example of the second embodiment of the present disclosure.

[0095] exist Fig. 9 In the wireless communication device 10B shown in the diagram, the shapes of the housing 200B and the shield cover 300B are similar to those of the wireless communication device 10B. Figure 4 1 is different from the radio communication device 10A illustrated in FIG.

[0096] For example, in the shield case 300B, a surface connecting the upper surface 300 a and the step surface 300B is inclined with respect to the upper surface 300 a and the step surface 300B.

[0097] In this manner, each surface of the shield case 300B may not be orthogonal or parallel to the substrate 100, for example, and may be formed obliquely with respect to the substrate 100. Fig. 9 In the embodiment, the step surface 300 b of the first adhesive surface 200 c facing the housing 200B is formed in parallel with the substrate 100 ; however, the step surface 300 b may be formed obliquely with respect to the substrate 100 .

[0098] In addition, the corners of the shield cover 300B have a curved shape with rounded corners. In addition, the end of the shield cover 300B (the side in contact with the substrate 100) has an outwardly curved shape. As described above, the corners or ends of the shield cover 300B may be formed in a curved shape.

[0099] The housing 200B has a shape corresponding to that of the shield case 300B. For example, the housing 200B is formed such that the inner surface faces the side surface (surface other than the upper surface 300a) of the shield case 300B with a predetermined gap therebetween.

[0100] As described above, since the housing 200B has a shape corresponding to the shape of the shield case 300B, the shield case 300B and the housing 200B are bonded together by the adhesive 700 ( Fig. 9 As a result, the strength of the wireless communication device 10B can be further enhanced.

[0101] In the second embodiment, the case where the number of steps of the shield case 300A is 1, that is, there is a single step surface 300b, is described; however, the number of steps of the shield case 300A may be 2 or more. That is, a plurality of step surfaces 300b having different heights may be formed in the shield case 300A.

[0102] Furthermore, in this example, a modification of the wireless communication device 10A according to the second embodiment is described; however, the wireless communication device 10 according to the first embodiment may also be similarly modified.

[0103] As described above, the wireless communication devices 10, 10A, and 10B according to the technology of the present disclosure are formed so that the shielding cases 300, 300A, and 300B are located in at least a portion of the openings 210 of the housings 200, 200A, and 200B, respectively. On the other hand, the shapes of the housings 200, 200A, and 200B, the shielding cases 300, 300A, and 300B, etc. may be any shapes.

[0104] <<4. Conclusion>>

[0105] Although the embodiments of the present disclosure have been described above, the technical scope of the present disclosure is not limited to the above embodiments as they are, but various modifications can be made without departing from the gist of the present disclosure. In addition, components of different embodiments and modifications can be appropriately combined.

[0106] For example, the technology disclosed in the present invention is not necessarily limited to thin types such as card-type, and can be applied to types with three-dimensional shapes. For example, despite having a three-dimensional shape, the technology disclosed in the present invention is applicable to a case where the thickness (length in the Z-axis direction) is limited.

[0107] Furthermore, the effects of the embodiments described herein are merely examples and are not restrictive, and other effects may be achieved.

[0108] Note that the present technology may also have the following configurations.

[0109] (1) A wireless communication device comprising:

[0110] substrate;

[0111] a housing, wherein at least a portion of a top surface is open, the top surface facing a second surface of the substrate, the second surface being opposite to a first surface of the substrate on which terminals are formed;

[0112] wireless communications circuitry disposed on the second surface; and

[0113] A shield case for shielding the wireless communication circuit has a third surface having a height substantially the same as a height of a surface where the opening of the top surface is formed.

[0114] (2) The wireless communication device according to (1), wherein

[0115] The shield has a fourth surface lower than the third surface, and

[0116] The shield case and the housing are bonded to each other via an adhesive on at least a portion of the fourth surface.

[0117] (3) The wireless communication device according to (1) or (2), further including a sheet attached to the top surface of the housing and the third surface of the shield case.

[0118] (4) The wireless communication device according to any one of (1) to (3), further comprising an antenna used by the wireless communication circuit to perform communication.

[0119] (5) The wireless communication device according to (4), wherein the antenna is provided in an end region of the substrate, the end region being on an opposite side to a region of the substrate where the terminal is provided.

[0120] (6) The wireless communication device according to any one of (1) to (5), further including a circuit arranged on the first surface of the substrate.

[0121] (7) The wireless communication device according to (6), further comprising:

[0122] an antenna, the wireless communication circuit uses the antenna for communication, the antenna is arranged on the substrate, wherein

[0123] The circuit is arranged on a first surface of the substrate where the antenna is not arranged.

[0124] (8) The wireless communication device according to (6) or (7), further comprising a second sheet attached to the first surface of the substrate and covering the circuit.

[0125] (9) The wireless communication device according to any one of (1) to (8), further including a storage medium arranged on the substrate.

[0126] (10) The wireless communication device according to any one of (1) to (9), wherein the wireless communication circuit performs wireless communication in a state where the wireless communication device is inserted into an SD card slot.

[0127] Reference numerals list

[0128] 10,10A,10B wireless communication equipment

[0129] 100 substrates

[0130] 110 terminal

[0131] 200,200A,200B housing

[0132] 300,300A,300B shielding cover

[0133] 410 Wireless Communication Circuit

[0134] 420 Circuit

[0135] 500 front sheet

[0136] 600 rear sheet

[0137] 610 First Sheet

[0138] 620 Second sheet

[0139] 700 Adhesive

[0140] 800 Antenna

[0141] 900 Antenna Sheet

Claims

1. A wireless communication device, comprising: substrate; a housing, wherein at least a portion of a top surface is open, the top surface facing a second surface of the substrate, the second surface being opposite to a first surface of the substrate on which terminals are formed; wireless communication circuitry disposed on the second surface; and A shield case for shielding the wireless communication circuit has a third surface having a height substantially the same as a height of a surface where the opening of the top surface is formed.

2. The wireless communication device according to claim 1, wherein The shield has a fourth surface lower than the third surface, and The shield case and the housing are bonded to each other via an adhesive on at least a portion of the fourth surface.

3. The wireless communication device according to claim 1, further comprising a sheet attached to the top surface of the housing and the third surface of the shield cover.

4. The wireless communication device of claim 1, further comprising an antenna for communicating with the wireless communication circuit. 5 . The wireless communication device according to claim 4 , wherein the antenna is provided in an end region of the substrate, the end region being on an opposite side of a region of the substrate where the terminal is provided.

6. The wireless communication device of claim 1, further comprising a circuit disposed on the first surface of the substrate.

7. The wireless communication device according to claim 6, further comprising: an antenna, the wireless communication circuit uses the antenna for communication, the antenna is arranged on the substrate, wherein The circuit is arranged on a first surface of the substrate where the antenna is not arranged.

8. The wireless communication device of claim 6, further comprising a second sheet attached to the first surface of the substrate and covering the circuit.

9. The wireless communication device of claim 1, further comprising a storage medium disposed on the substrate.

10. The wireless communication device according to claim 1, wherein the wireless communication circuit performs wireless communication in a state where the wireless communication device is inserted into an SD card slot.

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