Glass-based copper-clad plate glue and preparation method thereof, and transparent glass-based circuit board and preparation method thereof

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By using glass-based copper clad glue with components such as epoxy resin, nano-vapor silica, carboxylic acid resin, etc., the existing glass base circuit board has been solved, and a glass base circuit board with high transparency and high bonding properties has been achieved.

CN119709070APending Publication Date: 2025-03-28GUANGDONG HONGWANGDA NEW MATERIAL CO LTD

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Patent Information

Application Number: CN202411878403.6
Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner
Filing Date: 2024-12-19
Publication Date: 2025-03-28

Application Information

Patent Timeline

19 Dec 2024

Application

CN202411878403.6

28 Mar 2025

Publication

CN119709070A

IPC: C09J163/00; C09J135/06; C09J11/00; C09J11/04; H05K1/02; H05K3/06; B32B15/20; B32B17/06; B32B37/10; B32B37/06; B32B38/00

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Application Domain

Lamination ancillary operations Non-macromolecular adhesive additives

Technology Topics

Epoxy Polymer science

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AI Technical Summary

Technical Problem

The existing glass baseline circuit board has low light transmittance and poor bonding strength, which cannot meet the application needs that require high light transmittance and high bonding.

Method used

A glass-based copper clad glue including epoxy resin, nano-vapor silica, carboxylic acid resin, leveling agent and diluent is used to prepare a glass base circuit board with high transparency and strong adhesion through cross-linking reaction and staged diluent addition.

Benefits of technology

It realizes the characteristics of high transparency, large refractive index, strong adhesion, high pulling force, and temperature resistance of glass baseline circuit board, meeting the application needs of high light transmission and high adhesion.

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Abstract

The invention discloses a glass-based copper-clad plate glue and a preparation method thereof, and a transparent glass-based circuit board and a preparation method thereof. The invention relates to the technical field of glass-based circuit boards. The glass-based copper-clad plate glue comprises epoxy resin, silicon dioxide, carboxylic acid resin, a flatting agent and a diluent, the diluent can disperse the epoxy resin with high refractive index and high temperature resistance, and nano fumed silica is added to prepare a high-transparency semi-finished product. And carboxyl groups in the carboxylic acid resin and epoxy groups in the epoxy resin are subjected to a cross-linking reaction to obtain the glass-based copper-clad plate glue with high transparency, and the glass-based copper-clad plate glue is applied to the prepared glass-based circuit board, so that the circuit board has the characteristics of high transparency, large refractive index, strong cohesiveness, high drawing force, temperature resistance, no yellowing and the like.

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