Epoxy heat-conducting structural adhesive resistant to damp-heat aging as well as preparation method and application of epoxy heat-conducting structural adhesive
By combining the modified epoxy resin and the composite thermal conductivity filler, the problem of the degradation of traditional epoxy thermal conductivity glue in high humidity and heat environments is solved, and high humidity and heat stability of thermal conductivity and bonding performance are achieved.
CN119709077AActive Publication Date: 2025-03-28WESTERN BAODE TECH CO LTD
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Patent Information
- Application Number
- CN202411491870.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2044-10-24
AI Technical Summary
Technical Problem
After long-term use of traditional epoxy thermal adhesive in high humidity and heat environments, its insulation and bonding properties will significantly decrease, affecting the stability and life of electronic components.
Method used
By modifying the epoxy resin, heat-resistant and moisture-resistant groups are introduced, and the second phase enhancement effect of the composite thermal filler is used to improve thermal conductivity and bonding properties, while preventing the absorption and diffusion of water molecules.
Benefits of technology
The stable performance of epoxy thermally conductive structural adhesive in high humidity and heat environment is achieved, and the stability and life of electronic components are significantly improved.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides an epoxy heat-conducting structural adhesive resistant to damp-heat aging. The epoxy heat-conducting structural adhesive comprises the following raw material components in parts by weight: a component A: 18-25 parts of composite epoxy resin, 2-5 parts of a diluent and 120-180 parts of composite heat-conducting filler; the component B comprises the following components in parts by weight: 15-20 parts of a curing agent, 5-12 parts of an accelerant and 156-225 parts of composite heat-conducting filler; wherein the composite epoxy resin is obtained by blending and reacting raw materials including bisphenol A type epoxy resin, novolac epoxy resin, naphthalene type epoxy resin and a toughening agent; the invention also provides a preparation method of the damp-heat aging-resistant epoxy heat-conducting structural adhesive and application of the damp-heat aging-resistant epoxy heat-conducting structural adhesive in the fields of electronic devices, new energy automobile batteries, energy storage and the like. The damp-heat aging resistant epoxy heat-conducting structural adhesive disclosed by the invention has excellent heat-conducting property, adhesive property, electrical insulation property and damp-heat resistance stability.
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