Turnover device for double-sided coating in vacuum system and coating method
By designing a double-sided coating flip device in a vacuum system, using clamping components and gates to achieve independent control of the flip and vacuum environment of the sample, the problems of sample pollution and low production efficiency in the prior art are solved, and an efficient and clean coating process is achieved.
Patent Information
- Application Number
- CN202411757922.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-03
- Publication Date
- 2025-03-28
AI Technical Summary
The existing semiconductor wafer double-sided coating process is prone to contamination during the handling and switching of internal and external vacuum systems, and the removal of the flip during the coating process may damage the film layer and reduce production efficiency.
A flip device for double-sided coating in a vacuum system is designed, including a box, a gate, a track assembly and a clamping assembly. By moving the clamping assembly between the coating cavity and the flip cavity, the flip of the sample is realized, and the coating cavity and the flip cavity are separated by the gate, and the vacuum environment is independently controlled.
It effectively avoids contamination of samples during coating, improves product reliability and performance, reduces the size of the coating cavity, improves vacuum degree and the filling efficiency of coating gas, and improves production efficiency.