Chip electrical property detection device and manufacturing method thereof

By designing a chip electrical detection device including a flexible circuit substrate and a movable carrier substrate, the problem of slow lighting test speed of micro LED grains or mini LED grains in the prior art is solved, and a more efficient detection speed and lower production costs are achieved.

CN119716463APending Publication Date: 2025-03-28ASTI GLOBAL INC
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Patent Information

Application Number
CN202411013335.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-09-26
Filing Date
2024-07-26
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

In the prior art, micro LED grains or mini LED grains are slower in lighting tests, resulting in high production costs and low production efficiency.

Method used

A chip electrical properties detection device is provided, including a circuit control module and an electrical properties detection module. The circuit control module consists of a flexible circuit substrate and a plurality of electrical conduction structures, and the electrical detection module consists of a plurality of movable bearing substrates, an electrical detection structure and an electrical connection structure. These modules cooperate with each other, allowing each movable carrier substrate and electrical detection structure to adjust the position through the flexible circuit substrate to increase the detection speed.

Benefits of technology

Through the chip electrical properties detection device, the lighting test speed of micro LED grains or mini LED grains can be significantly improved, production costs can be reduced, and production efficiency can be improved.

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Abstract

The invention provides a chip electrical property detection device and a manufacturing method thereof. The chip electrical detection device comprises a circuit control module and an electrical detection module. The circuit control module comprises a flexible circuit substrate and a plurality of electrical conduction structures. The electrical detection module comprises a plurality of movable bearing substrates, a plurality of electrical detection structures and a plurality of electrical connection structures. The plurality of movable bearing substrates are separated from each other and are arranged on the flexible circuit substrate. The plurality of electrical detection structures are respectively arranged on the plurality of movable bearing substrates and are respectively electrically connected with the plurality of electrical connection structures. The plurality of electrical connection structures respectively penetrate through the plurality of movable bearing substrates and are respectively electrically connected to the plurality of electrical conduction structures. Each movable bearing substrate is configured to be allowed to be slightly adjusted in position through flexible bearing of the flexible circuit substrate, so that each electrical detection structure is configured to be allowed to follow the corresponding movable bearing substrate to be in a state of being allowed to be slightly adjusted in position.
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