Inductor based on low-voltage plastic package molding and preparation method thereof
The preparation of inductors through low-voltage plastic sealing molding process solves the problems of large internal stress and poor soft magnetic performance during the preparation process of existing inductors, and achieves inductor preparation with high density, low internal stress and high electromagnetic performance.
Patent Information
- Application Number
- CN202411647239.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-18
- Publication Date
- 2025-03-28
AI Technical Summary
During the preparation process, existing inductors have problems such as large internal stress, poor soft magnetic performance, poor shielding effect, low product reliability and high loss, which is difficult to meet the needs of miniaturization, high frequency, high power and modularization.
The inductor is prepared by low-voltage plastic sealing molding process, and the iron-based alloy magnetic powder is prepared by aerosolization method, and the double-layer coating is carried out. After the magnetic core is sintered and prepared and wound, the coated powder particles are placed into the magnetic core by using the low-voltage plastic sealing molding method to achieve integrated molding.
It realizes high density and low internal stress of the inductor, improves effective magnetic permeability, strength and reduces high-frequency losses, and improves the reliability and comprehensive electromagnetic performance of the inductor.