Wafer transfer arm, wafer transfer device and wafer transfer method

By designing a wafer transfer arm with annular covering cavity and position adjustment components, the chip problem caused by the insolid grasping of wafers during pick-up and drop-up and transmission is solved, and wafer contamination is prevented, achieving safe transfer of ultra-thin or large warped wafers.

CN119725189AActive Publication Date: 2025-03-28HANGZHOU FULLSEMI SEMICON CO LTD
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Patent Information

Application Number
CN202411825057.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-11
Publication Date
2025-03-28
Estimated Expiration
2044-12-11

AI Technical Summary

Technical Problem

During semiconductor manufacturing, thinner wafers are prone to fragmentation due to insolid gripping during pick-up and delivery, and there is a risk of contamination.

Method used

A wafer conveying arm is designed, including an annular covering cavity and position adjustment assembly. The annular covering cavity covers the wafer through an arc-shaped covering structure, and the position adjustment component dynamically adjusts the suspension force using the distance sensor and the suspension force providing part to ensure that the wafer is suspended and fixed.

Benefits of technology

It effectively avoids the problem of wafer breaking due to insolid gripping during transmission, and prevents wafer contamination. It is suitable for the transmission of ultra-thin or large warped wafers.

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Abstract

The invention discloses a wafer transfer arm, a wafer transfer device and a wafer transfer method. The wafer transfer arm comprises a wafer coating cavity and a position adjusting assembly. The wafer coating cavity comprises an annular lower wall body and an annular side wall, and the annular side wall extends upwards from the outer edge of the annular lower wall body in the direction perpendicular to the annular lower wall body to form an annular coating structure. The annular coating structure comprises at least two arc-shaped coating structures, and the at least two arc-shaped coating structures can move close to or away from each other. The position adjusting assemblies are arranged on the annular lower wall body and / or the annular side wall, each position adjusting assembly comprises a distance sensor and a suspension force providing part, the distance sensors and the suspension force providing parts are arranged at intervals, and the suspension force providing parts adjust the wafer suspension force based on wafer position information measured by the distance sensors. Therefore, the distance from the wafer to the inner wall body of the wafer coating cavity is controlled. Therefore, the problem that the wafer cannot be sucked due to the existence of the warping degree of the wafer, and the wafer is broken can be avoided.
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