Long through hole trapezoidal structure, manufacturing method and electronic equipment

By making trapezoidal openings with different upper and lower apertures on the multi-layered belt of electronic components, the contact area between the long through holes and the magnet is increased, the problem of insufficient adhesion of the pad is solved and the reliability of the product is improved.

CN119730014APending Publication Date: 2025-03-28SHENZHEN SUNLORD MULTILAYER CHIP ELECTRONICS CO LTD
0 Cites 0 Cited by

Patent Information

Application Number
CN202411929020.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-25
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

In the prior art, the contact area between the long through holes of electronic components and the magnets is insufficient, resulting in insufficient adhesion of the pads, and it is easy to cause the long through holes to be pulled out, causing the risk of product opening.

Method used

A multi-layered superposition structure is adopted, and trapezoidal openings with different upper and lower apertures are formed on the growing belt, which are formed by laser or mechanical openings to increase the contact area between the long through holes and the magnets.

Benefits of technology

The bonding force between the long through hole and the magnet is improved, the adhesion of the pad is enhanced, the risk of long through holes fall off, and the reliability of electronic equipment is improved.

✦ Generated by Eureka AI based on patent content.
Patent Text Reader

Abstract

The invention discloses a long-through-hole trapezoidal structure, a manufacturing method and electronic equipment, the long-through-hole trapezoidal structure comprises a plurality of layers of raw belts, the raw belts are provided with non-cylindrical open holes, the open holes comprise an upper aperture dn1 and a lower aperture dn2, and the upper aperture dn1 is larger than the lower aperture dn2; the multiple layers of raw tapes are distributed in a stacked mode in the vertical direction, the multiple open holes form a non-cylindrical long through hole to be embedded into the raw tape block, the inner wall of the long through hole fluctuates in a concave-convex mode, the bottom of the long through hole is located in the raw tape block, and the openings are exposed out of the surface of the raw tape block and make contact with a bonding pad. The ceramic slurry is prepared into the non-cylindrical long through hole structure, so that the contact area between the long through hole and the magnet is increased, and the problem that the shrinkage of the hole filling slurry is larger than that of a raw belt after a product is sintered and molded is solved; the problem that the long through hole falls off due to the fact that the long through hole and the magnet are loosened when the hole filling slurry in the long through hole is subjected to large pulling force of the bonding pad and the binding force between the long through hole and the magnet is insufficient is solved, the adhesive force of the product bonding pad is improved, and the reliability of the electronic equipment is improved.
Need to check novelty before this filing date? Find Prior Art