Manufacturing method for improving flatness of BGA (Ball Grid Array) area of glass embedded outer circuit board

Through the glass embedded outer circuit board manufacturing method, the shortcomings of traditional circuit boards in BGA area are solved, and the flatness improvement of the BGA area and the welding quality are improved, which significantly enhances the overall performance and reliability of the circuit board.

CN119730083AActive Publication Date: 2025-03-28WUS PRINTED CIRCUIT (KUNSHAN) CO LTD
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Patent Information

Application Number
CN202411900715.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-23
Publication Date
2025-03-28
Estimated Expiration
2044-12-23

AI Technical Summary

Technical Problem

Traditional circuit boards have defects in BGA area flatness control, resulting in poor soldering quality, unstable component connections, and affecting the overall performance and reliability of the circuit board.

Method used

The glass embedded outer circuit board manufacturing method is adopted, and the flatness of the BGA area is ensured through specially designed copper clad plates, resins with low dielectric constant and low thermal expansion coefficient, deep cleaning treatment, graphic etching and deep-controlled milling, resin coating and glass burial, hole drilling, cleaning and silver plating treatment, pressing and subsequent treatment.

Benefits of technology

It significantly improves the flatness of the BGA area, enhances the welding quality and stability of component connections, reduces the risk of poor welding, short circuit or open circuit, and improves the overall performance and reliability of the circuit board.

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Abstract

The invention relates to the technical field of electronic circuit board manufacturing, and discloses a manufacturing method for improving the flatness of a BGA (Ball Grid Array) area of a glass embedded outer-layer circuit board, which comprises the following steps of: preparing and pretreating materials, selecting two or three layers of copper-clad plates, specially designing a second layer as a ground layer, flexibly designing a third layer, and simultaneously, manufacturing a glass embedded outer-layer circuit board. Preparing a glass sheet with an accurate size and resin with low DK and low CTE characteristics, and deeply cleaning the copper-clad plate and the glass to ensure no dirt and oxide residues; performing pattern etching and depth-controlled milling and fishing, removing a copper layer at a specified position on the second layer of copper-clad plate through pattern etching, reserving a space for embedding glass, meanwhile, reserving a third layer design, and then performing depth-controlled milling and fishing to accurately control the milling and fishing depth. The manufacturing method for improving the flatness of the BGA area of the glass embedded type outer layer circuit board aims at overcoming the defects of a traditional circuit board in the aspect of controlling the flatness of the BGA area.
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