Heat dissipation structure and electronic equipment

By adopting a design of a first heat dissipation assembly with high elasticity and a second heat dissipation assembly with fluidity in the heat dissipation structure, the problem of instability of the thermal interface material after vibration impact is solved, and a stable heat channel is achieved and the heat dissipation effect is improved.

CN119730152APending Publication Date: 2025-03-28XIAN YIPU COMM TECH
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Patent Information

Application Number
CN202411772565.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-04
Publication Date
2025-03-28

AI Technical Summary

Technical Problem

After the heat dissipation member is impacted by vibration, it is easy to make the thermal interface material unstable, resulting in abnormal local temperature of the heat dissipation member and affecting the heat dissipation effect.

Method used

A heat dissipation structure is adopted, including a first heat dissipation assembly and a second heat dissipation assembly, the second heat dissipation assembly is arranged around and connected to the circumference of the first heat dissipation assembly, the first heat dissipation assembly has high elasticity to provide a stable heat channel, and the second heat dissipation assembly provides support and has fluidity to fill the local gap when vibrating.

Benefits of technology

After vibration impact, the first heat dissipation assembly interacts with the second heat dissipation assembly to prevent large deviations between the two, provide a stable heat channel, and fill local voids through the fluidity of the second heat dissipation assembly to improve the area of ​​heat transfer and the heat dissipation effect.

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Abstract

The invention provides a heat dissipation structure and electronic equipment, and relates to the field of heat dissipation. The structure comprises a first heat dissipation assembly and a second heat dissipation assembly, the second heat dissipation assembly is arranged on the peripheral side of the first heat dissipation assembly in a surrounding mode and connected with the first heat dissipation assembly, the first heat dissipation assembly and the second heat dissipation assembly are each provided with a first surface and a second surface which are opposite, the first surface is used for covering a heating part, and the second surface is used for being connected with a part to be subjected to heat dissipation; during heat conduction, the fluidity of the second heat dissipation assembly is larger than that of the first heat dissipation assembly. A stable heat channel is provided through the first heat dissipation assembly, the mobility of the second heat dissipation assembly is high, when the first heat dissipation assembly is subjected to single-side extrusion, the second heat dissipation assembly provides supporting and has the mobility, local gaps caused by impact can be filled, and the first surface and the second surface of the first heat dissipation assembly and the second heat dissipation assembly can not be damaged when vibrating or after vibrating. In addition, the heat-dissipating sheet can be in full contact with the surface of a heat-dissipating piece or a heating piece, thereby increasing the heat transfer area and improving the heat-dissipating effect.
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