Display panel and its manufacturing method, display device

Abstract

This application relates to a display panel, a method for manufacturing the same, and a display device. The display panel includes a display area and a non-display area surrounding the display area, the non-display area including a sealing area. The display panel includes a display substrate and a cover plate located on the display side of the display substrate, as well as a sealing structure and a support layer located between the display substrate and the cover plate. The sealing structure is located in the sealing area; the difference between the refractive index of the support layer and the refractive index of the cover plate is less than a preset value. On the inner side of the sealing structure near the center of the display panel, the upper and lower surfaces of the support layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side surface of the support layer.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) displays have advantages such as self-illumination, continuously adjustable emission color, high brightness, low power consumption, thinness and lightness, and wide viewing angle, making them a promising next-generation display technology.

[0003] OLED display substrates can be flexible or rigid. In related technologies, different encapsulation methods are generally used to fabricate OLED display films on flexible and rigid substrates: thin-film encapsulation (TFE) can be used to fabricate OLED display films on flexible substrates, while a cover plate can be placed on the display side of a rigid substrate, and glass powder laser sintering (Frit encapsulation) can be used to encapsulate both the cover plate and the OLED display substrate.

[0004] For rigid OLED display devices with cover plate encapsulation, rainbow patterns appear at oblique viewing angles but not at normal viewing angles. As the viewing angle changes, the rainbow patterns shift, affecting the user experience. Summary of the Invention

[0005] This application provides a display panel and its manufacturing method, as well as a display device, to solve the problem of rainbow patterns appearing at oblique viewing angles in display devices using cover plate encapsulation.

[0006] In a first aspect, a display panel is provided, comprising a display area and a non-display area located around the display area, the non-display area including a sealing area. The display panel includes: a display substrate and a cover plate located on the display side of the display substrate, and a sealing structure and a support layer located between the display substrate and the cover plate. The sealing structure is located in the sealing area; the difference between the refractive index of the support layer and the refractive index of the cover plate is less than a preset value. On the inner side of the sealing structure near the center of the display panel, the upper and lower surfaces of the support layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side surface of the support layer.

[0007] Secondly, a method for manufacturing a display panel is provided. The display panel includes a display area and a non-display area located around the display area, the non-display area including a sealing area. The manufacturing method includes: forming a display substrate; forming a cover plate on the display side of the display substrate; forming a sealing structure between the display substrate and the cover plate, the sealing structure being located in the sealing area; forming a support layer between the display substrate and the cover plate, the difference between the refractive index of the support layer and the refractive index of the cover plate being less than a preset value; wherein, on the inner side of the sealing structure near the center of the display panel, the upper surface and lower surface of the support layer are respectively bonded to the cover plate and the display substrate, and the sealing structure is bonded to the side surface of the support layer.

[0008] Thirdly, a display device is provided, including the display panel described above. Attached Figure Description

[0009] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0010] Figure 1 This is a partial structural diagram of the unbound area of ​​the display panel in some embodiments of this application;

[0011] Figure 2 This is a partial structural diagram of the bonding area of ​​the display panel in some embodiments of this application;

[0012] Figures 3-5 This is a schematic diagram illustrating the manufacturing process of the display substrate in some embodiments of this application;

[0013] Figure 6 This is a schematic diagram of the cover plate structure in some embodiments of this application;

[0014] Figure 7a for Figure 6 Sectional view along AA;

[0015] Figure 7b for Figure 6 Sectional view along BB;

[0016] Figure 8a and Figure 8b This is a schematic diagram of the cover plate structure in some embodiments of this application;

[0017] Figure 9a and Figure 9b A partial structural diagram of the display panel in some embodiments of this application. Detailed Implementation

[0018] The technical solutions of this application will now be clearly and thoroughly described with reference to the accompanying drawings of the embodiments of this application. Obviously, the embodiments described below are only some, not all, embodiments of this application, and are merely used to more clearly illustrate the technical solutions of this application. Therefore, they are only examples and should not be used to limit the scope of protection of this application. Based on the described embodiments of this application, all other embodiments that can be obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] Unless otherwise defined, all technical and scientific terms used herein should have the meaning commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the embodiments of this application are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary / secondary relationship of the indicated technical features. In the embodiments of this application, unless otherwise stated, "a plurality of" means two or more.

[0020] An OLED display panel comprises multiple pixel regions arranged in an array. Each pixel region includes multiple adjacent sub-pixel regions. Different colored OLEDs can be positioned within these sub-pixel regions, emitting different colors of light to achieve color display. The colors of the light emitted by the OLEDs within the multiple sub-pixel regions can include, but are not limited to, red, green, and blue, and can also include yellow, white, etc.

[0021] Understandably, multiple sub-pixel areas can also contain OLEDs of the same color, such as a white OLED. In this case, a color filter can be placed on the display side of the OLED display panel. Through the filtering effect of the color filter, the white light emitted by the white OLED can be converted into different colors of light, thereby achieving color display. In other words, when the light emitted by all sub-pixel areas of the OLED is the same color, color display can also be achieved by placing a color filter on the display side.

[0022] See Figure 1As shown, the substrate 101 of the OLED display substrate 10 can be a flexible substrate or a rigid substrate, such as a glass substrate, an organic resin substrate, a polyimide (PI) substrate, a polyethylene terephthalate (PET) substrate, a polydimethylsiloxane (PDMS) substrate, etc. The OLED may include an anode 1, an organic light-emitting layer 2, and a cathode 3 sequentially disposed on the substrate 101. A pixel defining layer 102 may be formed on the substrate 101 to define multiple sub-pixel regions. Each OLED is disposed within a sub-pixel region of the substrate 101, that is, at least the organic light-emitting layer 2 of each OLED is located within the sub-pixel region, such that the radiation range of the light emitted by the OLED is defined by the sub-pixel region, avoiding crosstalk between light from adjacent sub-pixel regions. The material of the pixel defining layer 102 may include, but is not limited to, at least one of the following: silicon oxide, silicon nitride, silicon oxynitride, polyimide, polyamide, acrylic resin, styrene-cyclobutene, and phenolic resin. The pixel defining layer 102 may be a single-layer structure or a multi-layer structure.

[0023] The OLED display substrate 10 may further include thin-film transistors (TFTs) for controlling OLED light emission, driving circuits for controlling the operating state of the TFTs, and signal lines (e.g., gate lines, data lines, etc.) for transmitting signals (not shown in the figure). The operating state of the TFTs includes the switching of the TFTs and the magnitude of the signal output from the TFTs to the anode 1 of the OLED. The driving circuit can control the switching of the TFTs by transmitting switching signals through the gate lines and control the magnitude of the signal output from the TFTs to the anode 1 by transmitting data signals through the data lines, thereby controlling the brightness of the light emitted by the OLED. The OLED display substrate 10 also includes a planarization layer 103 covering the TFTs, and a pixel defining layer 102 and the OLED are disposed on the planarization layer 103. The anode 1 of the OLED can be electrically connected to the drain electrode of the TFTs through vias in the planarization layer 103.

[0024] The OLED display substrate 10 using a flexible substrate can be encapsulated using a thin film, while the OLED display substrate 10 using a rigid substrate can have a cover plate 20 disposed on its display side, and the cover plate 20 and the OLED display substrate 10 are sealed and encapsulated by glass powder laser sintering (Frit encapsulation). The material of the cover plate 20 can be glass, polyimide (PI), polyethylene terephthalate (PET), polydimethylsiloxane (PDMS), etc.

[0025] For rigid OLED display devices encapsulated with a cover plate 20, the sealing structure 40 formed by laser sintering of glass powder creates a height difference between the cover plate 20 and the OLED display substrate 10, i.e., a gap exists between the encapsulation cover plate 20 and the OLED display substrate 10, which can be filled with inert gases such as nitrogen. Because the refractive index of the gas in the gap (around 1.0) differs significantly from the refractive index of the cover plate 20 (around 1.5), the OLED display device exhibits rainbow patterns at oblique viewing angles, while no rainbow pattern is observed at normal viewing angles. Furthermore, the rainbow pattern shifts with changes in viewing angle, affecting the user experience.

[0026] Based on this, this application provides a display panel and its manufacturing method. A support layer 30 is formed between a cover plate 20 and a display substrate 10. On the inner side of the sealing structure 40 near the center of the display panel, the entire upper and lower surfaces of the support layer 30 are respectively bonded to the cover plate 20 and the display substrate 10. The sealing structure 40 is bonded to the entire side surface of the support layer 30, meaning the support layer 30 fills the gap between the cover plate 20 and the display substrate 10. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than a preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. Furthermore, the support layer 30 also provides support, thereby improving the overall impact resistance of the device. Moreover, since the sealing structure 40 is bonded to the entire side surface of the support layer 30, the support layer 30 will not encroach on the sealing area, avoiding any impact on the encapsulation effect.

[0027] It is understood that the technical solution of this application is not limited to OLED displays, but can also be applied to other display technologies where there is a gap between the cover plate and the display substrate due to encapsulation. It can also eliminate the problem of rainbow patterns caused by gas in the gap.

[0028] The technical solution of this application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0029] Combination Figure 1 , Figure 2 and Figure 6 As shown, according to some embodiments of this application, a display panel is provided, the display panel including a display area AA and a non-display area NA located around the display area, the non-display area including a sealing area SE.

[0030] The display panel includes a display substrate 10 and a cover plate 20, as well as a sealing structure 40 and a support layer 30 located between the display substrate 10 and the cover plate 20. The cover plate 20 is located on the display side of the display substrate 10 and is used to encapsulate the display substrate 10. The sealing structure 40 is located in the sealing area and is used to seal and encapsulate the display substrate 10 and the cover plate 20.

[0031] The sealing structure 40 creates a gap between the encapsulation cover plate 20 and the display substrate 10, and the support layer 30 fills this gap between the display substrate 10 and the cover plate 20. In other words, on the inner side of the sealing structure 40 near the center of the display panel, the upper and lower surfaces of the support layer 30 are respectively attached to the cover plate 20 and the display substrate 10, and the sealing structure 40 is attached to the side surface of the support layer 30. Furthermore, the refractive index difference between the support layer 30 and the cover plate 20 is set to be less than a preset value.

[0032] Therefore, the gap between the display substrate 10 and the cover plate 20 inside the sealing structure 40 is filled by the support layer 30. The entire upper surface and the entire lower surface of the support layer 30 are attached to the cover plate 20, while the sealing structure 40 is attached to the entire side surface of the support layer 30. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than a preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. In addition, the support layer 30 also provides support, thereby improving the overall impact resistance of the device. Furthermore, since the sealing structure 40 is attached to the entire side surface of the support layer 30, the support layer 30 will not encroach on the sealing area, thus avoiding affecting the packaging effect.

[0033] The refractive index difference between the support layer 30 and the cover plate 20 can be less than 0.2, for example, which can more effectively eliminate the problem of rainbow patterns.

[0034] The display substrate 10 can be, for example, an OLED display substrate. In this case, the display substrate 10 may include a pixel defining layer 102 disposed on the substrate 101. The pixel defining layer 102 defines a plurality of pixel regions in the display area of ​​the substrate 101, and each pixel region includes a plurality of adjacent sub-pixel regions. The display substrate 10 may also include an OLED located in each sub-pixel region. The OLED includes an anode 1, an organic light-emitting layer 2, and a cathode 3 disposed sequentially on the substrate 101. Exemplarily, the anode 1 and the organic light-emitting layer 2 in adjacent sub-pixel regions may be separated by the pixel defining layer 102, and all sub-pixel regions may share the cathode 3, that is, the cathode 3 covers the entire display area.

[0035] The non-display area NA can be arranged around the display area AA. The sealing area SE of the non-display area is a ring-shaped region surrounding the display area. The sealing structure 40 formed in the sealing area SE is used to prevent moisture and other substances from entering between the cover plate 20 and the display substrate 10. For example, the sealing structure 40 can be formed by laser sintering of glass powder.

[0036] Driving circuits, etc., can be disposed in the non-display area NA. In this case, the non-display area NA on at least one side of the display area AA can be a bonding area, which has multiple conductive traces. The driving circuit is electrically connected to the pixel driving circuit of the display area AA through the conductive traces. The multiple conductive traces may include, for example, a target conductive trace 4 for connection to the cathode 3, through which the driving circuit transmits a common voltage to the cathode 3. The conductive traces may include multiple conductive layers, for example, a first conductive layer fabricated in the same layer as the source and drain electrodes of the thin-film transistor, and a second conductive layer fabricated in the same layer as the anode of the OLED, to reduce resistance. The cathode 3 can be electrically connected to the target conductive trace 4 through vias in the pixel defining layer 102.

[0037] The pixel driving circuit may include, for example, a thin-film transistor (TFT) located in each sub-pixel region. The TFT may be a low-temperature polycrystalline silicon thin-film transistor (LTPS TFT), an oxide thin-film transistor (OXDE TFT), a low-temperature polycrystalline oxide thin-film transistor (LTPO TFT), etc. Taking an LTPS TFT as an example, the TFT includes an active layer, a first gate insulating layer, a first gate electrode, a second gate insulating layer, a second gate electrode, an intermediate insulating layer, and source / drain electrodes sequentially disposed on a substrate 101. The display substrate may also include a planarization layer 103 covering the TFT. The anode 1 of the OLED is electrically connected to the drain electrode of the TFT through a via in the planarization layer 103, thereby transmitting display signals to the anode 1 to control the OLED to emit display light.

[0038] Display substrates may also include other functional film layers, or the number of functional film layers may be increased or decreased depending on the product, such as dual-source drain electrode layers, etc., which will not be elaborated here.

[0039] In some embodiments, the support layer 30 can be made of organic materials (such as photoresist, methyl methacrylate, etc.). Since the gap height between the display substrate 10 and the cover plate 20 is tens of micrometers when using Frit packaging, the support layer 30 formed of organic materials can meet the height requirements for filling the gap.

[0040] The upper surface of the support layer 30 can refer to the surface of the support layer 30 near the cover plate 20, and the lower surface can refer to the surface of the support layer 30 near the display substrate 10. The side of the support layer 30 is located between the upper surface and the lower surface.

[0041] The upper surface of the support layer 30 being attached to the cover plate 20 on the inner side of the sealing structure 40 near the center of the display panel can mean that there is no gap between the upper surface of the support layer 30 and the cover plate 20 on the inner side of the sealing structure 40 near the center of the display panel, and the entire upper surface of the support layer 30 can be in direct contact with the cover plate 20 for attachment, or a part of the upper surface of the support layer 30 can be in direct contact with the cover plate 20 for attachment, while a part of the upper surface can be indirectly in contact with the cover plate 20 through other film layers for attachment. Similarly, on the inner side of the sealing structure 40 near the center of the display panel, the lower surface of the support layer 30 being bonded to the display substrate 10 can mean that there is no gap between the lower surface of the support layer 30 and the display substrate 10, and the entire lower surface of the support layer 30 can directly contact and bond with the display substrate 10. Alternatively, a portion of the lower surface of the support layer 30 can directly contact and bond with the display substrate 10, while a portion of the lower surface can indirectly contact and bond with the display substrate 10 through other film layers. Likewise, on the inner side of the sealing structure 40 near the center of the display panel, the sealing structure 40 being bonded to the side of the support layer 30 can mean that there is no gap between the sealing structure 40 and the side of the support layer 30, and the sealing structure 40 can directly contact and bond with the entire side of the support layer 30. This avoids the problem of the support layer 30 encroaching on the sealing area and thus increasing the risk of frame failure.

[0042] The support layer 30 can be disposed on the display substrate 10 or the cover plate 20.

[0043] See Figure 3As shown, taking the support layer 30 disposed on the display substrate 10 as an example, due to the influence and limitations of the manufacturing process, the support film layer 301 is formed on the display substrate 10 through film deposition processes such as vacuum evaporation and inkjet printing. Its edge is a second uneven edge 3011 (i.e., not parallel to the cover plate 20), which causes the second uneven edge 3011 of the support film layer 301 to be unable to adhere to the cover plate 20 during encapsulation, resulting in a gap between the second uneven edge 3011 of the support film layer 301 and the cover plate 20. Since there is gas in the gap, and the refractive index of the gas differs greatly from that of the cover plate 20, this leads to the rainbow pattern problem. In this embodiment, the manufacturing method of the display panel is improved. For example, the second uneven edge 3011 of the support film layer 301 is essentially or even completely removed by a process (described in detail below) to obtain the support layer 30 in this embodiment. This allows the support layer 30 to fill the gap between the cover plate 20 and the display substrate 10, i.e., the upper and lower surfaces of the support layer 30 are respectively bonded to the cover plate 20 and the display substrate 10, while the sealing structure 40 is bonded to the side of the support layer 30. Therefore, the technical solution in this embodiment can eliminate the rainbow pattern problem caused by gas in the gap between the cover plate 20 and the display substrate 10. Furthermore, by removing at least a portion of the second uneven edge 3011 of the support film layer 301, the formed support layer 30 reduces the encroachment on the non-display area, which is beneficial for achieving a narrow bezel.

[0044] In some embodiments, the refractive index of the support layer 30 can be set to be less than that of the cover plate 20, which is beneficial to allow as much display light as possible to be emitted from the display side, thereby improving the light emission efficiency, increasing display brightness, and reducing energy consumption.

[0045] In some embodiments, the refractive index of the support layer 30 can be set to be greater than the refractive index of the outermost layer of the display substrate 10 near the display side (e.g., the cathode 3 of the OLED) and less than the refractive index of the cover plate 20, which is beneficial to allow as much display light as possible to be emitted from the display side and improve the light emission efficiency.

[0046] Taking the cover plate 20 as a glass substrate as an example, the refractive index of the support layer 30 can be 1.45 to 1.55, which can ensure that the refractive index of the support layer 30 is less than that of the cover plate 20, while ensuring that the refractive indices of the support layer 30 and the cover plate 20 are not much different, thus avoiding the formation of rainbow patterns due to the refraction and reflection of light after it passes through the support layer 30 and enters the cover plate 20.

[0047] Taking the support layer 30 disposed on the substrate 101 of the display substrate 10 as an example, due to the influence and limitations of the process, it is impossible to completely remove the second uneven edge 3011 of the support film layer 301 formed by the film deposition process, so that the resulting support layer 30 still has the first uneven edge 31. However, by removing most of the second uneven edge 3011 of the support film layer 301 in advance, the width of the first uneven edge 31 of the formed support layer 30 is smaller. In this case, the difference between the height of any point on the upper surface of the first uneven edge 31 of the support layer 30 relative to the substrate 101 and the height of the upper surface of the center area 32 of the support layer 30 (excluding the edge 31) relative to the substrate 101 is less than a preset threshold, such as 10 μm. This is beneficial for subsequent filling of the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20 through the process, so that the entire upper surface of the support layer 30 is in contact with the cover plate 20. Since the width of the first uneven edge 31 of the support layer 30 in this embodiment is smaller after the removal process, filling is easily achieved. For example, adhesive can be filled between the first uneven edge 31 of the support layer 30 and the cover plate 20. And by removing at least a portion of the second uneven edge 3011 of the support film layer 301, the formed support layer 30 reduces its encroachment on the non-display area, which is beneficial for achieving a narrow bezel.

[0048] The width of an uneven edge can refer to the length of the uneven edge extending in a direction perpendicular to the side of the display panel (the side on which the uneven edge is located).

[0049] In some embodiments, the sealant forming the sealing structure 40 can be used to fill the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20. For example, during the process of pressing the cover plate 20 onto the display side of the display substrate 10, the sealant can be squeezed under pressure between the first uneven edge 31 of the support layer 30 and the cover plate 20, filling the gap between them, and then the sealant can be cured. Thus, the inner side of the sealing structure 40 facing away from the upper surface of the display substrate 10 has a flange 401, which fills the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20, so that the first uneven edge 31 of the support layer 30 is bonded to the cover plate 20 through the flange 401.

[0050] According to some embodiments of this application, the support layer 30 may be disposed on the display substrate 10. In this case, the display substrate 10 may further include a sacrificial layer, at least a portion of which is located in the sealing region. The first uneven edge 31 of the support layer 30 overlaps with the sacrificial layer or is located on the inner side of the sacrificial layer near the center of the display substrate 10. Therefore, when fabricating the support layer 30, the sacrificial layer can be used as a marker to control whether the first uneven edge 31 of the support layer 30 overlaps with the sacrificial layer or is located on the side of the sacrificial layer near the center of the display substrate 10, thus avoiding the problem of the support layer 30 encroaching on the sealing region and increasing the risk of bezel encapsulation failure. By controlling the support layer 30 to be located inside the sealing region, the problem of the support layer 30 becoming a moisture failure path due to poor water resistance, leading to encapsulation failure, can be avoided.

[0051] In the embodiments of this application, "overlapping" can refer to one end of a structure being located on another structure.

[0052] In some embodiments, the sacrificial layer can be made of a conductive material. When forming a support film layer 301 on the outermost layer of the display substrate 10 near the display side using a film-forming process, at least a portion of the second uneven edge 3011 of the support film layer 301 can be removed using a laser, such that the first uneven edge 31 of the formed support layer 30 overlaps with the sacrificial layer or is located on the side of the sacrificial layer near the center of the display substrate 10. In this case, the characteristic of conductive materials absorbing heat quickly can be utilized to increase the difficulty of laser removal by adding a sacrificial layer. Furthermore, when the sealing structure 40 is subsequently formed using laser sintering of glass powder, the sacrificial layer can also act as a barrier to allow the laser to ablate the glass powder in that area.

[0053] The sacrificial layer can be fabricated using a separate process, or it can be a co-layer structure fabricated using the same process as other conductive film layers of the display substrate. For example, it can be a co-layer structure fabricated using the same process as the gate electrode or source / drain electrode of a thin-film transistor.

[0054] In some embodiments, the non-display area may include an unbonded area located on one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer 51 located in the unbonded area. In the unbonded area, the first uneven edge 31 of the support layer 30 overlaps with the first sacrificial conductive layer 51. Since there are no conductive traces in the unbonded area, a larger first sacrificial conductive layer 51 can be provided. At least a portion of the first sacrificial conductive layer 51 can be located in the sealing area, which can effectively control the first uneven edge 31 of the support layer 30 from overlapping with the sacrificial conductive layer, preventing the support layer 30 from encroaching on the sealing area. When using a laser to remove at least a portion of the second uneven edge 3011 of the support film layer 301, by providing the first sacrificial conductive layer 51, the characteristic of the conductive material to absorb heat quickly can be utilized to reduce the difficulty of laser removal. Furthermore, when the sealing structure 40 is subsequently formed by laser sintering of glass powder, the first sacrificial conductive layer 51 can also act as a barrier to allow the laser to ablate the glass powder in the sealing area.

[0055] Understandably, the sacrificial layer in the non-bonded area can also be made of insulating material, serving only as a marker to control the edge position of the support layer.

[0056] The first sacrificial conductive layer 51 can be disposed close to the outer edge of the display substrate 10 to form a larger first sacrificial conductive layer 51, which serves as a more conspicuous marking function.

[0057] The non-display area may also include a bonding area located on one side of the display area. Since there are conductive traces in the bonding area, a second sacrificial conductive layer may not be formed in the bonding area, or a small-sized second sacrificial conductive layer may be made, in order to avoid interfering with the signal transmitted by the conductive traces.

[0058] like Figure 4 As shown, in some embodiments, the sacrificial layer includes a second sacrificial conductive layer 52 located between two adjacent conductive traces in the bonding region. In the bonding region, the first uneven edge 31 of the support layer 30 is spaced apart from the second sacrificial conductive layer 52 and is located inside the second sacrificial conductive layer 52 near the center of the display substrate 10. When fabricating the support layer 30, the second uneven edge 3011 of the formed support film layer 301 can be controlled to overlap the second sacrificial conductive layer 52 by the film deposition process, and a portion of the second uneven edge 3011 of the support film layer 301 can be removed by the process, so that the first uneven edge 31 of the formed support layer 30 in the bonding region is located inside the second sacrificial conductive layer 52 near the center of the display panel, and the two are spaced apart to avoid the support layer 30 encroaching on the sealing area.

[0059] Understandably, the sacrificial layer in the bonding area can also be made of insulating material, serving only as a marker to control the edge position of the support layer.

[0060] It should be noted that a support layer and a sacrificial layer can also be formed on the cover plate, and the support layer can be encapsulated inside the sealing structure through the sacrificial layer. The specific implementation structure is similar to that described above.

[0061] Due to the influence and limitations of the process, the width of the uneven edge of the film increases with the increase of thickness, as shown in Table 1.

[0062] Table 1 shows the relationship between the thickness of the organic film and the width of the uneven edge.

[0063] Organic film thickness / μm Width of uneven edge / mm 12 4.6 24 5.2 36 6.0

[0064] Based on this, such as Figure 5 As shown, in some embodiments of this application, the support layer 30 may include a plurality of sub-support layers stacked sequentially. Compared to a support film layer with a large thickness formed by a single film deposition process, multiple sub-support film layers formed by multiple film deposition processes have smaller thicknesses, resulting in smaller widths of the uneven edges of each sub-support film layer. This reduces the width of the second uneven edge 3011 of the entire support film layer 301, facilitating the removal of the second uneven edge 3011 by a removal process to obtain a support layer 30 with a flat surface. This allows the support layer 30 to directly contact and adhere to the cover plate 20 and the display substrate 10, thereby eliminating the rainbow effect caused by gas in the gap between the cover plate 20 and the display substrate 10. Furthermore, removing the second uneven edge of the support film layer by a removal process helps to achieve a narrow bezel.

[0065] Taking the support layer set on the display substrate as an example, when the support layer includes multiple sub-support layers stacked in sequence, the uneven edges of the support layer can be completely removed by a pre-removal process, so that the upper surface of the support layer is flat and the entire upper surface of the support layer can directly contact and fit with the cover plate, filling the gap between the display substrate and the cover plate.

[0066] In some embodiments, the refractive index of the multiple sub-support layers increases along the direction away from the display substrate, which is beneficial to improving the light extraction efficiency.

[0067] The increasing refractive index trend of multiple sub-support layers can mean that, for any two adjacent sub-support layers, the refractive index of the sub-support layer closer to the substrate is no greater than the refractive index of the sub-support layer farther from the substrate. For example, along the direction farther from the substrate, the refractive indices of the multiple sub-support layers increase sequentially. Understandably, it is also possible to set some adjacent sub-support layers to have the same refractive index, while in other adjacent sub-support layers, the refractive index of the sub-support layer 30 closer to the substrate is less than the refractive index of the sub-support layer farther from the substrate.

[0068] In some embodiments, for a support layer formed by multiple sub-support layers, the aforementioned sacrificial layer may also be provided in the sealing area to control whether the edge of the support layer overlaps with the sacrificial layer or is located on the inner side of the sacrificial layer near the center of the display substrate, thus avoiding the risk of sealing failure of the bezel due to encroachment on the sealing area. The sacrificial layer may include a first sacrificial layer located in the non-bonding area and / or a second sacrificial layer located in the bonding area.

[0069] For example, the first sacrificial layer in the non-bonding region can be a first sacrificial conductive layer 51, and the second sacrificial layer in the bonding region can be a second sacrificial conductive layer 52. In this case, in the non-bonding region, since the size of the first sacrificial conductive layer 51 is relatively large, the edge of each sub-support film layer can be controlled to overlap with the first sacrificial conductive layer 51 during the film formation process. Subsequently, the rapid heat absorption of the first sacrificial conductive layer 51 can be utilized to effectively remove a portion of the second uneven edge 3011 of the support film layer 301 using a laser. Since the width of the uneven edge of the sub-support film layer formed by multiple film formation processes is small, the uneven edge of the outermost sub-support film layer can even be completely removed. In the bonding region, since the size of the second sacrificial conductive layer is relatively small, the edge of the outermost sub-support film layer can be controlled to overlap with the second sacrificial conductive layer during the film formation process. Subsequently, the rapid heat absorption of the second sacrificial conductive layer can be utilized to effectively remove the uneven edge of the support film layer using a laser. Since the width of the uneven edge of the support film layer formed by multiple film formation processes is small, the uneven edge of the outermost sub-support film layer can even be completely removed.

[0070] In the above embodiments, after forming the support film layer through a film-forming process, at least a portion of the uneven edges of the support film layer is removed through a removal process to obtain the support layer. This allows the upper and lower surfaces of the support layer on the inner side of the sealed structure to be bonded to the cover plate and the display substrate, respectively, meaning the gap between the cover plate and the display substrate is filled by the support layer. If the uneven edges of the support film layer cannot be completely removed, since the width of the uneven edges after the removal process is small, the gap between the uneven edges of the support film layer and the cover plate (or display substrate) can be filled by, for example, adhesive filling, thereby allowing the upper and lower surfaces of the support layer to be bonded to the cover plate and the display substrate, respectively. It is understood that other methods can also be used to achieve the same effect, where the support layer fills the gap between the cover plate and the display substrate, allowing the upper and lower surfaces of the support layer to be bonded to the cover plate and the display substrate, respectively.

[0071] See Figure 6 , Figure 7a and Figure 7b as well as Figure 8a and Figure 8bAs shown, in some embodiments of this application, a sealing structure 40 and a support layer 30 are disposed on a cover plate 20. The sealing structure 40 may include a first sealing structure 41 and a second sealing structure 42, with the second sealing structure 42 located between the support layer 30 and the first sealing structure 41. The first sealing structure 41 is an annular structure surrounding the display area, serving to block moisture. The second sealing structure 42 is located on the inner side of the first sealing structure 41 near the center of the display panel, and includes a plurality of sub-sealing structures spaced circumferentially along the first sealing structure 41. These sub-sealing structures make the adhesion between the cover plate 20 and the display substrate 10 more stable.

[0072] See Figure 9a and Figure 9b As shown, the edge 31 of the support layer 30 can be located between the first sealing structure 41 and the second sealing structure 42. Multiple sub-sealing structures are fitted to the sides of the central region 32 of the support layer 30, excluding the edge 31. Therefore, by providing the inner second sealing structure 42 with multiple spaced-apart sub-sealing structures, the flow of the first uneven edge 31 of the support layer 30 between adjacent sub-sealing structures to the space between the first and second sealing structures can be controlled. This results in the inner support layer 30 of the second sealing structure 42 having a flat surface, allowing it to fit against the display substrate 10 or the cover plate 20. Furthermore, the multiple sub-sealing structures are in contact with the sides of the central region 32 of the support layer 30. In other words, the gap between the display substrate 10 and the cover plate 20 is filled by the support layer 30, preventing the rainbow effect caused by gas in the gap between the display substrate 10 and the cover plate 20.

[0073] In some embodiments, when the sealing structure adopts the two-ring structure in the above embodiments, the support layer may also include a plurality of sub-support layers arranged sequentially. Thus, since the width of the uneven edge of each sub-support membrane layer is small, the thickness of the entire support membrane layer formed can be thinner, which facilitates the flow of the edge of the support membrane layer between two adjacent sub-sealing structures to the first sealing structure and the second sealing structure, and helps to achieve a flat surface in the inner support layer of the second sealing structure.

[0074] According to some embodiments of this application, a display device is also provided, including the display panel described above. This eliminates the problem of rainbow patterns in the display device.

[0075] The display device in the embodiments of this application may be, but is not limited to, any device with display function such as a cellular phone, smartphone, tablet computer, wearable device, desktop computer, or laptop computer.

[0076] According to some embodiments of this application, a method for manufacturing a display panel is also provided. The display panel includes a display area and a non-display area located around the display area, and the non-display area includes a sealing area.

[0077] Combination Figure 1 and Figure 2 As shown, the method for manufacturing the display panel includes:

[0078] Forming a display substrate 10;

[0079] A cover plate 20 is formed on the display side of the display substrate 10;

[0080] A sealing structure 40 is formed between the display substrate 10 and the cover plate 20, and the sealing structure 40 is located in the sealing area;

[0081] A support layer 30 is formed between the display substrate 10 and the cover plate 20, and the difference between the refractive index of the support layer 30 and the refractive index of the cover plate 20 is less than a preset value.

[0082] In this configuration, on the inner side of the sealing structure 40 near the center of the display panel, the upper and lower surfaces of the support layer 30 are respectively attached to the cover plate 20 and the display substrate 10, and the sealing structure 40 is attached to the side of the support layer 30.

[0083] Therefore, the gap between the display substrate 10 and the cover plate 20 inside the sealing structure 40 is filled by the support layer 30. The entire upper surface and the entire lower surface of the support layer 30 are attached to the cover plate 20, while the sealing structure 40 is attached to the entire side surface of the support layer 30. By setting the refractive index difference between the support layer 30 and the cover plate 20 to be less than a preset value, the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10 can be eliminated. In addition, the support layer 30 also provides support, thereby improving the overall impact resistance of the device. Furthermore, since the sealing structure 40 is attached to the entire side surface of the support layer 30, the support layer 30 will not encroach on the sealing area, thus avoiding affecting the packaging effect.

[0084] In some embodiments, a sealing structure 40 can be formed on the cover plate 20, thereby preventing the manufacturing process of the sealing structure 40 from affecting the display substrate 10. The sealing structure 40 can be, for example, but not limited to, formed by laser sintering of glass powder.

[0085] A support layer can be formed on the cover plate or the display substrate. In some embodiments, the support layer can be made of organic materials (e.g., photoresist, methyl methacrylate, etc.). Since the gap height between the display substrate and the cover plate is tens of micrometers when using Frit packaging, forming a support layer with organic materials can meet the height requirements for filling the gap.

[0086] Combination Figures 3-5 As shown, in some embodiments, a support layer 30 is formed between the display substrate 10 and the cover plate 20, comprising:

[0087] A support film layer 301 is formed on the display substrate 10 or the cover plate 20;

[0088] At least a portion of the second uneven edge 3011 of the support film layer 301 is removed to form the support layer 30.

[0089] Therefore, by removing at least a portion of the second uneven edge 3011 of the support film layer 301 in advance, the first uneven edge 31 of the support layer 30 can be reduced or even removed, thereby enabling the support layer 30 to fill the gap between the display substrate 10 and the cover plate 20 inside the sealing structure 40, eliminating the problem of rainbow patterns caused by gas in the gap between the display substrate 10 and the cover plate 20.

[0090] In some embodiments, a sacrificial layer may be formed in a non-display area of ​​the display substrate 10, with at least a portion of the sacrificial layer located in a sealing area, and then a support layer 30 is formed on the display substrate 10 using the sacrificial layer as a marker. The support layer 30 is then formed between the display substrate 10 and the cover plate 20, comprising:

[0091] A sacrificial layer is formed on the substrate 101 of the display substrate 10, and at least a portion of the sacrificial layer is located in the sealing region;

[0092] A support film layer 301 is formed on the substrate 101 of the display substrate 10, and the second uneven edge 3011 of the support film layer 301 overlaps the sacrificial layer;

[0093] At least a portion of the second uneven edge 3011 of the support film layer 301 is removed to form the support layer 30, wherein the first uneven edge 31 of the support layer 30 overlaps the sacrificial layer or is located on the side of the sacrificial layer near the center of the display panel.

[0094] Therefore, by forming a sacrificial layer as a marker, it can be ensured that the prepared support layer 30 will not flow into the sealing area, avoiding the problem of increasing the risk of frame seal failure. Furthermore, by encapsulating the support layer 30 inside the sealing area, the problem of the support layer 30 forming a moisture barrier failure path can be avoided.

[0095] At least a portion of the second uneven edge of the support film layer can be removed using a laser, but is not limited to this method. In this case, the sacrificial layer can be made of a conductive material, and the rapid heat absorption of the sacrificial layer can be utilized to reduce the difficulty of laser removal. Thus, a support layer 30 is formed on the substrate 101 of the display substrate 10, comprising:

[0096] A sacrificial conductive layer is formed on the substrate 101 of the display substrate 10, and at least a portion of the sacrificial conductive layer is located in the sealing region;

[0097] A support film layer 301 is formed on the substrate 101 of the display substrate 10 using a film deposition process, and the second uneven edge 3011 of the support film layer 301 overlaps on the sacrificial conductive layer.

[0098] At least a portion of the second uneven edge 3011 of the support film layer 301 is removed by laser to form the support layer 30, and the first uneven edge 31 of the support layer 30 overlaps with the sacrificial conductive layer or is located on the side of the sacrificial conductive layer near the center of the display panel.

[0099] Therefore, the sacrificial conductive layer not only serves as a marker to ensure that the fabricated support layer does not flow into the sealing area, but also reduces the difficulty of laser removal by utilizing the rapid heat absorption characteristic of the sacrificial conductive layer. Furthermore, when the sealant is subsequently cured by laser to form a sealed structure, the sacrificial layer can act as a barrier to the curing of the sealant in the sealing area.

[0100] The sacrificial conductive layer can be fabricated using a separate process, or it can be a co-layer structure fabricated using the same process as other conductive film layers of the display substrate. For example, it can be a co-layer structure fabricated using the same process as the gate electrode or source / drain electrode of a thin-film transistor.

[0101] Taking the support layer 30 disposed on the substrate 101 of the display substrate 10 as an example, due to process limitations, it may not be possible to completely remove the second uneven edge 3011 of the support film layer 301, but the width of the first uneven edge 31 of the formed support layer 30 can be reduced. In this case, the difference between the height of any point on the upper surface of the edge 31 of the support layer 30 relative to the substrate 101 and the height of the upper surface of the center area 32 of the support layer 30 (excluding the edge 31) relative to the substrate 101 is less than a preset threshold. Subsequently, the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20 can be filled by the process so that the entire upper surface of the support layer 30 is in contact with the cover plate 20. Since the width of the first uneven edge 31 of the support layer 30 in this embodiment is small after the removal process, filling is easy to achieve. For example, adhesive can be used to fill the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20.

[0102] In some embodiments, a sealing structure 40 is formed between the display substrate 10 and the cover plate 20, including:

[0103] Apply sealant to the sealing area of ​​cover plate 20 and pre-bake;

[0104] During the process of pressing the cover plate 20 onto the display side of the display substrate 10, the pre-baked sealant is filled between the edge 31 of the support layer 30 and the cover plate 20 to form a flange 401.

[0105] The sealant is cured to form a sealed structure 40.

[0106] Therefore, by improving the manufacturing process of the sealing structure 40, the sealant can fill the gap between the first uneven edge 31 of the support layer 30 and the cover plate 20 during the pressing process of the cover plate 20 and the display substrate 10, so that the entire upper surface of the support layer 30 is in close contact with the cover plate 20, thereby eliminating the problem of rainbow patterns.

[0107] In some embodiments, the non-display area may include an unbonded area located on one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer 51 located in the unbonded area. In the unbonded area, the edge 31 of the support layer 30 overlaps with the first sacrificial conductive layer 51. Since there are no conductive traces in the unbonded area, a larger first sacrificial conductive layer 51 can be formed. At least a portion of the first sacrificial conductive layer 51 can be located in the sealing area, which can effectively control the edge 31 of the support layer 30 from overlapping with the sacrificial conductive layer, preventing the support layer 30 from encroaching on the sealing area. When using a laser to remove at least a portion of the second uneven edge 3011 of the support film layer 301, by setting the first sacrificial conductive layer 51, the characteristic of the conductive material to absorb heat quickly can be utilized to reduce the difficulty of laser removal. Furthermore, when the sealing structure 40 is subsequently formed by laser sintering of glass powder, the first sacrificial conductive layer 51 can also act as a barrier to allow the laser to ablate the glass powder in the sealing area.

[0108] The non-display area may also include a bonding area located on one side of the display area. Since there are conductive traces in the bonding area, a second sacrificial conductive layer may not be formed in the bonding area, or a small-sized second sacrificial conductive layer may be made, in order to avoid interfering with the signal transmitted by the conductive traces.

[0109] In some embodiments, the sacrificial layer includes a second sacrificial conductive layer 52 located between two adjacent conductive traces in the bonding region. In the bonding region, the edge 31 of the support layer 30 is spaced apart from the second sacrificial conductive layer 52 and is located on the side of the second sacrificial conductive layer 52 closer to the center of the display substrate 10. When fabricating the support layer 30, the second uneven edge 3011 of the formed support film layer 301 can be controlled to overlap the second sacrificial conductive layer 52 by the film deposition process, and a portion of the second uneven edge 3011 of the support film layer 301 can be removed by the process, so that the first uneven edge 31 of the support layer 30 formed in the bonding region is located on the side of the second sacrificial conductive layer 52 closer to the center of the display panel, and the two are spaced apart to avoid the support layer 30 encroaching on the sealing region.

[0110] like Figure 5 As shown, in some embodiments of this application, a support layer 30 is formed between the display substrate 10 and the cover plate 20, comprising:

[0111] Multiple sub-support layers are formed sequentially, and the support layer is formed by these multiple sub-support layers.

[0112] Compared to forming a thicker support film layer 301 through a single film deposition process, forming multiple sub-support film layers through multiple film deposition processes results in smaller thickness for each sub-support film layer, leading to a smaller width of the uneven edge of each sub-support film layer. This reduces the width of the second uneven edge 3011 of the entire support film layer 301, facilitating the complete removal of the second uneven edge 3011 of the support film layer 301 by a removal process. This results in a flat support layer 30, allowing the support layer 30 to directly contact and adhere to the cover plate 20 and the display substrate 10, thereby eliminating the rainbow pattern problem caused by gas in the gap between the cover plate 20 and the display substrate 10.

[0113] Figure 5 In the illustrated example, support layer 30 includes two sub-support layers. It can be understood that support layer 30 may also include three or more sub-support layers.

[0114] In some embodiments, for a support layer 30 formed by multiple sub-support layers 30, the aforementioned sacrificial layer can also be formed in the sealing area. Using the sacrificial layer as a marker facilitates control over the second uneven edge 3011 of the support film layer 301 formed during the film deposition process, this second uneven edge overlaps with the sacrificial layer. After removing at least a portion of the second uneven edge 3011 of the support film layer 301, the first uneven edge 31 of the resulting support layer 30 can overlap with the sacrificial layer or be located on the side of the sacrificial layer closer to the center of the display panel, avoiding the problem of encroaching on the sealing area and increasing the risk of sealing failure at the bezel. The sacrificial layer can be made of a conductive material and may include a first sacrificial conductive layer 51 located in the non-bonding area and / or a second sacrificial conductive layer 52 located in the bonding area. Therefore, the rapid heat absorption of the sacrificial layer can be utilized to reduce the difficulty of laser removal.

[0115] In the above embodiments, after forming the support film layer through a film-forming process, at least a portion of the uneven edges of the support film layer is removed using a removal process to obtain the support layer. This allows the upper and lower surfaces of the support layer to be bonded to the cover plate and the display substrate, respectively, meaning the gap between the cover plate and the display substrate is filled by the support layer. If the uneven edges of the support film layer cannot be completely removed, since the width of the uneven edges after the removal process is small, the gap between the uneven edges of the support layer and the cover plate (or display substrate) can be filled, for example, by using adhesive filling, thereby allowing the upper and lower surfaces of the support layer to be bonded to the cover plate and the display substrate, respectively. It is understood that other methods can also be used to achieve the same effect, where the support layer fills the gap between the cover plate and the display substrate, allowing the upper and lower surfaces of the support layer to be bonded to the cover plate and the display substrate, respectively.

[0116] Combination Figure 6 , Figure 7a and Figure 7b As shown, in some embodiments of this application, a support layer 30 and a sealing structure 40 are formed on the cover plate 20, wherein forming the sealing structure 40 on the cover plate 20 includes:

[0117] A first sealing structure 41 and a second sealing structure 42 are formed in the sealing area. The second sealing structure 42 is located on the side of the first sealing structure 41 near the center of the display panel. The first sealing structure 41 is an annular structure surrounding the periphery of the display area. The second sealing structure 42 includes a plurality of sub-sealing structures spaced apart circumferentially along the first sealing structure 41.

[0118] Combination Figure 8a and Figure 8b as well as Figure 9a and Figure 9b As shown, a support layer 30 is formed on the cover plate 20, comprising:

[0119] A support film layer 301 is formed on the inner side of the second sealing structure 42 near the center of the display panel. The thickness of the support film layer 301 is greater than the thickness of the sealing structure 40 in a direction perpendicular to the cover plate 20.

[0120] After the cover plate 20 is pressed onto the display side of the display substrate 10, the support film layer 301 is cured to form a support layer 30. The edge 31 of the support layer 30 is located between the first sealing structure 41 and the second sealing structure 42. The sub-sealing structure is attached to the side of the central area 32 of the support layer 30, excluding the edge 31.

[0121] Since the thickness of the support film layer 301 is greater than the thickness of the sealing structure 40, after the cover plate 20 is pressed onto the display side of the display substrate 10, the support film layer 301 flows between the two adjacent sub-sealing structures 40 and between the first sealing structure 41 and the second sealing structure 42 due to the compression effect. This results in the edge 31 of the formed support layer 30 being located between the first sealing structure 41 and the second sealing structure 42, while the central region 32 of the support layer 30, excluding the edge 31, is encapsulated inside the second sealing structure 42. Furthermore, due to the pressing action between the cover plate 20 and the display substrate 10, the lower surface of the central region 32 of the support layer 30 is tightly adhered to the display substrate 10. As a result, the gap between the cover plate 20 and the display substrate 10 is filled by the central region 32 of the support layer 30, thereby eliminating the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10.

[0122] The first sealing structure 41 is an annular structure surrounding the display area, which can block moisture. The second sealing structure 42 is located inside the first sealing structure 41 near the center of the display panel. It includes multiple sub-sealing structures spaced circumferentially along the first sealing structure 41. These multiple sub-sealing structures can encapsulate the central area 32 of the support layer 30 within the sealed area, while the edge 31 is located between the two sealing structures. This allows the central area 32 of the support layer 30 to have a flat surface, eliminating the problem of rainbow patterns caused by gas in the gap between the cover plate 20 and the display substrate 10. It also prevents the support layer 30 from flowing into the effective sealing area (i.e., the area where the two sealing structures are located), thus increasing the risk of frame seal failure. Furthermore, the multiple sub-sealing structures make the adhesion between the cover plate 20 and the display substrate 10 more stable.

[0123] In some embodiments, when the sealing structure adopts the two-ring structure in the above embodiments, the support layer may also include a plurality of sub-support layers arranged sequentially. Thus, since the width of the uneven edge of each sub-support membrane layer is small, the thickness of the entire support membrane layer formed can be thinner, which facilitates the flow of the edge of the support membrane layer between two adjacent sub-sealing structures to the first sealing structure and the second sealing structure, and helps to achieve a flat surface in the inner support layer of the second sealing structure.

[0124] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0125] While embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the methods, systems, and devices described above are merely exemplary embodiments or examples, and the scope of the invention is not limited by these embodiments or examples, but only by the granted claims and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. Furthermore, the steps may be performed in a different order than that described in this disclosure. Further, various elements in the embodiments or examples may be combined in various ways. Importantly, as the technology evolves, many elements described herein can be replaced by equivalents that appear after this disclosure.

Claims

1. A display panel, the display panel comprising a display area and a non-display area located around the display area, the non-display area including a sealed area, characterized in that, The display panel includes: Display substrate; A cover plate is located on the display side of the display substrate; A sealing structure is located between the display substrate and the cover plate and within the sealing area; A support layer is located between the display substrate and the cover plate, and the difference between the refractive index of the support layer and the refractive index of the cover plate is less than a preset value; In this structure, on the inner side near the center of the display panel, the gap between the display substrate and the cover plate is filled by a support layer. The upper and lower surfaces of the support layer are respectively attached to the cover plate and the display substrate, and the sealing structure is attached to the side of the support layer, which can eliminate rainbow patterns caused by gas in the gap between the cover plate and the display substrate. The support layer is disposed on the substrate of the display substrate and has a first uneven edge. The first uneven edge is formed by removing at least a portion of the second uneven edge of the support film layer. The difference between the height of any point on the upper surface of the first uneven edge of the support layer relative to the substrate and the height of the upper surface of the center area of ​​the support layer (excluding the edge) relative to the substrate is less than a preset threshold. The inner side of the sealing structure away from the upper surface of the display substrate has a flange, which fills the space between the first uneven edge of the support layer and the cover plate. The support layer is disposed on the display substrate, which further includes a sacrificial layer. At least a portion of the sacrificial layer is located in the sealing area. The first uneven edge of the support layer overlaps the sacrificial layer or is located on the side of the sacrificial layer near the center of the display panel.

2. The display panel according to claim 1, characterized in that, The non-display area of ​​the display substrate includes a non-bonding area located on one side of the display area, and the sacrificial layer includes a first sacrificial conductive layer located in the non-bonding area; In the unbonded area, the first uneven edge of the support layer overlaps the first sacrificial conductive layer.

3. The display panel according to claim 1, characterized in that, The non-display area of ​​the display substrate includes a bonding area located on one side of the display area, the bonding area includes multiple conductive traces, and the sacrificial layer includes a second sacrificial conductive layer located between two adjacent conductive traces; In the bonding area, the first uneven edge of the support layer is spaced apart from the second sacrificial conductive layer.

4. A method for manufacturing a display panel as described in any one of claims 1-3, the display panel comprising a display area and a non-display area located around the display area, the non-display area comprising a sealing area, characterized in that, The manufacturing method includes: Forming a display substrate; A cover plate is formed on the display side of the display substrate; A sealing structure is formed between the display substrate and the cover plate, and the sealing structure is located in the sealing area; A support layer is formed between the display substrate and the cover plate, and the difference between the refractive index of the support layer and the refractive index of the cover plate is less than a preset value; In the sealed structure, on the inner side near the center of the display panel, the gap between the display substrate and the cover plate is filled by a support layer. The upper and lower surfaces of the support layer are respectively attached to the cover plate and the display substrate, and the sealed structure is attached to the side of the support layer, which can eliminate the rainbow pattern caused by the presence of gas in the gap between the cover plate and the display substrate. The formation of a support layer between the display substrate and the cover plate includes: A sacrificial layer is formed on the substrate of the display substrate, and at least a portion of the sacrificial layer is located in the sealing region. A support film layer is formed on the substrate of the display substrate, and the edge of the support film layer overlaps the sacrificial layer; At least a portion of the second uneven edge of the support film layer is removed to form the support layer. The first uneven edge of the support layer overlaps the sacrificial layer or is located on the side of the sacrificial layer near the center of the display panel. The difference between the height of any point on the upper surface of the first uneven edge of the support layer relative to the substrate and the height of the upper surface of the central area of ​​the support layer (excluding the edge) relative to the substrate is less than a preset threshold. The formation of a sealing structure between the display substrate and the cover plate includes: A sealant is formed in the sealing area of ​​the cover plate and pre-baked. During the process of pressing the cover plate onto the display side of the display substrate, the pre-baked sealant fills the space between the first uneven edge of the support layer and the cover plate to form a flange; The sealant is cured to form the sealing structure.

5. The manufacturing method according to claim 4, characterized in that, The sacrificial layer is made of a conductive material, and the removal of at least a portion of the second uneven edge of the support film layer to form the support layer includes: At least a portion of the second uneven edge of the support film is removed using a laser to form the support layer.

6. A display device, characterized in that, The display panel includes any one of claims 1-3.

Images