Semiconductor processing method, transport case and semiconductor processing system

Abstract

The invention discloses a semiconductor processing method, a transport case and a semiconductor processing system. The transport case is configured to accommodate a plurality of wafers for transporting the wafers. The transport case includes a plurality of slots, each configured to receive and hold a respective wafer. The transport box includes a sensor system configured to measure a position or orientation of the wafer within the slot or during loading into the slot. The transport case includes a communication system configured to transmit sensor data from the sensor system to an external control system.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor processing method, a transport box and a semiconductor processing system. Background Art

[0002] The manufacture of integrated circuits is typically accomplished by performing a large number of processing steps on a semiconductor wafer. The processing steps typically result in the formation of a large number of transistors bonded to a semiconductor substrate in a highly complex arrangement. The processing steps also result in the formation of dielectric layers, metal interconnects, plugs, and other integrated circuit structures and components.

[0003] Processing steps may be performed using a variety of tools in a semiconductor manufacturing facility. These tools may include thin film deposition tools, etching tools, ion implantation tools, annealing tools, planarization tools, cleaning tools, dicing tools, and a variety of other tools. After a wafer has been processed using a particular tool, the wafer may be stored in a storage location or transferred to another tool location for further processing. These tools and storage facilities may be located in different locations within the same manufacturing facility, in the same building of a manufacturing facility, in different buildings of a manufacturing facility, or in separate manufacturing facilities.

[0004] Wafers can be packed into shipping boxes for storage during transport or between shipments. However, storage and transportation of wafers carry various risks of damaging the wafers. If the wafers are damaged, the integrated circuits cut from the wafers may function poorly or not function at all. The yield of the wafers may be reduced, and the electronic devices using the integrated circuits may not function properly.

[0005] All topics discussed in the background section are not necessarily prior art and should not be assumed to be prior art simply because they are discussed in the background section. Along these lines, problems existing in the prior art or problems related to these topics discussed in the background section should not be considered prior art unless they are explicitly stated to be prior art. Instead, the discussion of any topic in the background section should be considered as part of the inventor's approach to solving a particular problem, which may itself be inventive. Summary of the invention

[0006] In at least one embodiment, a semiconductor processing method includes: using a robotic arm to load wafers into slots of a transport box; using a sensor system in the transport box to measure the orientation of the wafers in the slots; and transmitting orientation data indicating the orientation of the wafers from the transport box to a control system remote from the transport box.

[0007] In at least one embodiment, a transport box includes a plurality of slots, a loading surface, a sensor system, and a communication system. The plurality of slots are each configured to receive and hold a corresponding wafer. The loading surface is configured to enable loading and unloading of wafers from the plurality of slots. The sensor system is configured to measure, for each slot, the position of the wafer within the slot. The communication system is configured to transmit position data indicating the position of the wafer within each slot from the transport box to a control system remote from the transport box.

[0008] In at least one embodiment, a semiconductor processing system includes a transport box and a control system. The transport box includes a plurality of slots, a plurality of sensors, and a communication system. The plurality of slots are each configured to receive and hold a wafer. The plurality of sensors are each configured to generate sensor data. The communication system is configured to transmit the sensor data. The control system is configured to receive the sensor data and control the adjustment of the orientation of the transport box in response to the sensor data. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The various aspects of the present disclosure may be better understood by reading the following detailed description in conjunction with the accompanying drawings. It should be noted that, in accordance with industry standard practice, various features are not drawn to scale. In fact, for ease of discussion, the size of various features may be arbitrarily increased or decreased.

[0010] Figure 1 is a block diagram of a semiconductor processing system according to some embodiments;

[0011] Figure 2 is a schematic diagram of a wafer shipping box made according to some embodiments;

[0012] Figure 3A is a schematic diagram of a wafer shipping box according to some embodiments;

[0013] Figure 3B is a side view of a portion of a wafer shipping box according to some embodiments;

[0014] Figure 4 is a side view of a portion of a wafer shipping box according to some embodiments;

[0015] Figure 5 is a top view of a portion of a wafer shipping box according to some embodiments;

[0016] Figure 6 is a side view of a portion of a wafer shipping box according to some embodiments;

[0017] Fig. 7A and Figure 7B is a schematic diagram of a shipping box at an unloading / loading port according to some embodiments;

[0018] Figure 8 is a block diagram of a semiconductor processing system according to some embodiments;

[0019] Fig. 9 is a flow chart of a method of operating a semiconductor processing system according to some embodiments;

[0020] Fig.10 is a flow chart of a method of operating a semiconductor processing system according to some embodiments.

[0021]

Explanation of symbols

[0022] 100:Semiconductor processing systems

[0023] 101: Networking

[0024] 102: Transport box

[0025] 104: Control System

[0026] 106: Loading / unloading system

[0027] 108: Slot

[0028] 110: Wafer

[0029] 112:Sensor system

[0030] 114: Sensor

[0031] 116: Control System

[0032] 118: Communication System

[0033] 120,122,124,126: Sensors

[0034] 121: Front opening

[0035] 123:Laser Beam

[0036] 125:Sensor

[0037] 130:Frame

[0038] 132: Bottom surface

[0039] 134: Side surface

[0040] 136: Top surface

[0041] 138: Side edge

[0042] 139:Robotic Arm

[0043] 140: Image sensor

[0044] 150: Loading / unloading port

[0045] 152: Front cover removal device

[0046] 154: Pin

[0047] 156:Front cover

[0048] 158: Pin slot

[0049] 172:Craft Tools

[0050] 176: Batch Storage

[0051] 178: Elevated rail transport

[0052] 900: Method

[0053] 902,904,906,908,910,912,914,916,918: Steps

[0054] 1000:Method

[0055] 1002,1004,1006: Steps

[0056] D: Vertical distance

[0057] D1,D2: distance DETAILED DESCRIPTION

[0058] The following disclosure provides many different implementations or embodiments for realizing the different features of the provided subject matter. Specific examples of components and arrangements are described below to simplify the disclosure. Of course, these are merely embodiments and are not intended to be limiting. For example, forming a first feature on or above a second feature in the following description may include an implementation in which the first feature and the second feature are formed in direct contact, and may also include an implementation in which additional features may be formed between the first feature and the second feature, so that the first and second features may not be in direct contact. In addition, the disclosure may repeat the figure symbols and / or letters in various embodiments. This repetition is for the purpose of simplicity and clarity, and does not itself dictate the relationship between the various implementations and / or configurations discussed.

[0059] Additionally, for ease of description, spatially relative terms such as "below," "beneath," "lower," "above," "upper," etc. may be used herein to describe one element or feature relative to another element or feature as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein should likewise be interpreted accordingly.

[0060] In the following description, some specific details are set forth to provide a thorough understanding of the various embodiments of the present disclosure. However, those skilled in the art will appreciate that the present disclosure may be practiced without these specific details. In other cases, the known structures associated with electronic components and manufacturing techniques are not described in detail to avoid unnecessarily obscuring the description of the embodiments of the present disclosure.

[0061] Unless the context requires otherwise, throughout this specification and the claims that follow, the word "comprise" and variations such as "include" and "including" are to be interpreted in an open, inclusive sense, that is, as meaning "including, but not limited to."

[0062] The use of ordinal numbers such as first, second, and third does not necessarily imply a sense of order in order, but may simply distinguish multiple instances of an action or structure.

[0063] References throughout this specification to "some embodiments" or "one embodiment" mean that a particular feature, structure, or characteristic described in connection with that embodiment is incorporated into at least some embodiments. Thus, the phrases "in some embodiments" or "in one embodiment" appearing in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0064] As used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the content clearly dictates otherwise. It should also be noted that the term "or" is generally employed in its sense including "and / or" unless the content clearly dictates otherwise.

[0065] Embodiments of the present disclosure help ensure that semiconductor wafers or other sensitive semiconductor processing equipment or materials are not damaged during transportation, loading and unloading. Embodiments of the present disclosure provide a wafer transport box, commonly referred to as a front-opening wafer transport box (FOUP), having a sensor system including multiple sensors installed in the transport box. The transport box includes multiple slots, each slot is configured to receive and hold a wafer. The sensor can detect whether the wafer is tilted in the slot, whether the wafer is centered in the slot, whether the wafer collides with the frame of the slot, the position of the door removal pin at the load / unload port, whether the box is tilted during transportation, or various other factors related to loading, unloading and storing wafers with the transport box. The transport box also includes a communication system that can transmit sensor data or other alarms to an external control system so that the external control system can take action based on the sensor data to prevent damage to the wafer.

[0066] The wafer transport box according to the embodiments of the present disclosure provides multiple benefits. The sensor system can detect the position of the wafer, which may cause damage if not addressed. The sensor system can detect misalignment or other risk factors that occur during the loading and unloading of wafers. The wafer transport box can transmit sensor data to an external control system so that the external control system can take steps to correct alignment or positioning problems before transporting the transport box, unloading wafers, or loading wafers. This ensures that semiconductor wafers and other sensitive devices are not damaged during transportation, loading or unloading. The result is better integrated circuit performance and higher wafer yields.

[0067] Figure 1 is a block diagram of a semiconductor processing system 100 according to some embodiments. The semiconductor processing system 100 includes a shipping box 102, a control system 104, and a loading / unloading system 106. As will be described in more detail below, the components of the semiconductor processing system 100 cooperate to ensure that semiconductor wafers are safely stored, transported, loaded, and unloaded with the shipping box 102.

[0068] In some embodiments, the shipping box 102 is a wafer shipping box configured to hold semiconductor wafers 110 before, after, or between semiconductor processes. The shipping box 102 includes a plurality of slots 108. Each slot 108 is configured to receive and hold a wafer 110. The wafers 110 can be loaded into or unloaded from the shipping box 102. The wafers 110 can be transported in the shipping box 102, as will be described in detail below.

[0069] In some embodiments, the transport box 102 is a FOUP. The FOUP includes a front cover that can be removed to expose the slots 108. When the front cover is removed, the wafers 110 can be loaded into or unloaded from the slots 108. After unloading / loading, the front cover can be replaced. As will be explained in more detail below, the front cover can include pin slots configured to receive pins from the loading / unloading system 106. The loading / unloading system 106 removes or replaces the front cover with the pins positioned in the pin slots.

[0070] The semiconductor processing system 100 processes a semiconductor wafer 110. The semiconductor wafer 110 undergoes a large number of semiconductor processes to form integrated circuits within the semiconductor wafer. The semiconductor process may include forming transistors on a semiconductor substrate within the semiconductor wafer, forming a dielectric layer on the semiconductor wafer, forming metal interconnects on the semiconductor wafer, and other processes to form structures and parts within the semiconductor wafer. Some processes associated with forming features may include epitaxial growth processes, thin film deposition processes, etching processes, polarization processes, chemical mechanical planarization (CMP) processes, annealing processes, ion implantation processes, cleaning processes, cutting processes, and various other processes.

[0071] Semiconductor processing system 100 may include a plurality of processing tools (not shown) for performing semiconductor processing on wafer 110. Examples of tools may include imaging tools, thin film deposition tools, etching tools, alignment tools, annealing tools, ion implantation tools, CMP tools, or other types of tools.

[0072] During a processing cycle of wafer 110, the wafer may be loaded into transport box 102. Transport box 102 may then be transported to a processing tool for a first processing step. The processing tool includes or is coupled to a loading / unloading system 106. Transport box 102 is positioned at a loading / unloading port of loading / unloading system 106. Loading / unloading system 106 removes a front cover from transport box 102. A robotic arm of loading / unloading system 106 then removes wafer 110 and places wafer 110 in a first processing tool. The processing tool then performs a first semiconductor process on the wafer.

[0073] After the first semiconductor process is performed on the wafer 110, the loading / unloading system 106 loads the wafer 110 back into the transport box 102. In fact, the loading / unloading system 106 can load the wafer 110 into different transport boxes 102. The transport box 102 can then be transported to the second semiconductor tool for the next processing step. Alternatively, the transport box 102 can be transported to a batch storage location and the wafer 110 can be loaded into a storage. Subsequently, the wafer 110 is unloaded from the stocker into the transport box and transported to the next semiconductor processing tool.

[0074] Due to the sensitivity of wafers 110, it is very beneficial to ensure that no damage or contamination occurs. Damage may occur during loading of wafers into shipping crates 102, during transport of wafers 110 within shipping crates 102, or during unloading of wafers 110 from shipping crates 102.

[0075] To reduce or prevent the risk of damaging wafers 110, shipping crate 102 includes sensor system 112. Sensor system 112 monitors loading of wafers into shipping crate 102, monitors the orientation of wafers in shipping crate 102, monitors unloading of wafers from shipping crate 102, and monitors the orientation of the shipping crate itself.

[0076] In some embodiments, the sensor system 112 includes a plurality of sensors 114 within or on the transport box 102. The sensors 114 may perform a variety of functions, as will be described in more detail below. The sensors 114 may monitor the tilt of the wafer 110 within the slot 108. The sensors 114 may monitor whether the edge of the wafer 110 has collided with the frame of the slot 108. The sensors 114 may monitor whether the wafer 110 is centered within the slot 108. The sensors 114 may monitor whether the wafer is on a trajectory to collide with the frame of the slot 108 during loading. The sensors 114 may monitor whether the transport box 102 itself is tilted before or during transport or loading / unloading. The sensors 114 may monitor the position and orientation of the door removal pins of the loading / unloading system 106 before or during removal of the front cover of the transport box 102. The sensors 114 may perform other types of functions in addition to the functions described above without departing from the scope of the present disclosure.

[0077] In some embodiments, the shipping box 102 includes a control system 116. The control system 116 may include one or more processors in one or more memories. The control system 116 may control the sensor system 112. The control system 116 may receive sensor data from the sensor system 112 and may process the sensor data to determine whether the sensor data indicates a collision, poor orientation, tilt, or other issues related to the shipping box 102 and the wafers 110 within the shipping box 102. Although the control system 116 is shown as being separate from the sensor system 112, in reality, the control system 116 may be part of the sensor system 112.

[0078] In some embodiments, the transport case 102 includes a communication system 118. The communication system 118 may include one or more wireless transceivers configured to transmit data from the transport case 102. The communication system may also include a wired communication system for transmitting data. The control system 116 may control the transmission of data from the communication system 118. The control system 116 may also control or monitor the reception of data via the communication system 118.

[0079] The control system 104 may correspond to a control system associated with the semiconductor processing system 100. The control system 104 may include a processor, a memory, and a communication system. The control system 104 may be associated with a specific semiconductor processing tool and may control functions of the semiconductor processing tool, including controlling functions of a loading / unloading system 106 associated with the semiconductor processing tool. The control system 104 may be associated with a transport system that carries the transport boxes 102 between processing tools or storage locations. The control system 104 may correspond to a general control system that controls multiple processing tools or a transport system of the semiconductor processing system 100.

[0080] The control system 104 may correspond to a distributed control system. Portions of the control system may be located at various locations within the semiconductor processing system 100. Portions of the control system 104 may be virtual resources or cloud-based resources external to a physical processing facility associated with the semiconductor processing system 100. Thus, resources, memory resources, and communication resources of the processing control system 104 may be distributed within the semiconductor processing system 100.

[0081] The control system 116 of the transport box 102 can control the communication system 118 to transmit data related to the transport box 102 to the control system 104. The communication system 118 can continuously transmit data related to the status of the transport box 102 or the wafers 110 carried by the transport box 102 during transportation, loading or unloading of wafers 110.

[0082] In some embodiments, the communication system 118 can send data to the control system 104 when an alarm or warning is to be issued to the control system 104. For example, the control system 116 of the transport box 102 can send an alarm to the control system 104 when the sensor data indicates that the wafer 110 is tilted, the edge of the wafer 110 has collided with the frame of the slot 108, the wafer 110 is not centered within the slot 108, the transport box 102 is tilted, indicating that the pins of the loading / unloading system 106 are not aligned with the corresponding pin slots in the door of the transport box 102, or other types of alarms.

[0083] The control system 104 can control or adjust aspects of the shipping box 102 in response to data or alerts received from the shipping box 102. For example, the control system 104 can control a robotic arm to remove tilted wafers, to adjust the position of tilted or poorly centered wafers, to remove wafers that have experienced collisions, to adjust the position of tilted shipping boxes 102, to stop the transport of the shipping box 102, to transfer the shipping box 102 to an analysis tool so that the wafers can be analyzed for possible damage. The control system 104 can issue alerts to a technician to manually check or adjust various aspects of the shipping box 102. Thus, the control system 104 can take various actions in response to alerts or data received from the shipping box 102.

[0084] Transport box 102, control system 104, and loading / unloading system 106 may be communicatively coupled together via network 101. Network 101 may include a wireless network, a wired network, a combination of wireless and wired networks, or other types of networks that may facilitate communications between elements of semiconductor processing system 100.

[0085] Figure 2 is a diagram of a shipping case 102 according to some embodiments. Figure 2 The transport box 102 is Figure 1 The transport box 102 includes a front opening 121. Figure 2 Although not shown in the drawings, the transport box 102 may include a removable cover or door placed in the front opening 121. When a wafer is loaded into the transport box 102 or a wafer is unloaded from the transport box 102, the removable cover or door may be temporarily removed. Then, when the loading / unloading is complete, the removable door cover may be replaced. Further details regarding the removable door aspect will be provided below.

[0086] The shipping box 102 includes a plurality of slots 108. Figure 2 In the embodiment of the present invention, each slot 108 includes a first portion and a first lateral side of the shipping box 102 and a second portion and a second lateral side of the shipping box 102. When the wafer 110 is placed in the slot 108, the wafer 110 rests on the first portion and the second portion of the slot 108.

[0087] Figure 2 A single wafer 110 in one of the slots 108 is shown. However, in practice, multiple wafers 110 can be stored in the shipping box 102. Each wafer 110 can be positioned in a corresponding slot 108. For example, multiple wafers can be loaded into the slots 108. The shipping box 102 can be transported to the next processing tool via an overhead rail or other transportation system. The loading / unloading system of the processing tool can then remove the front cover, and the robotic arm can unload the wafer 110 from the shipping box 102 into the processing tool.

[0088] exist Figure 2 In the embodiment of the present invention, the transport box 102 includes a plurality of sensors. Specifically, the transport box 102 includes sensors 120, 122, 124 and 126. These sensors are Figure 1 1 is an embodiment of a sensor 114 of a sensor system 112 in FIG. In practice, other sensors may be positioned in the shipping box 102. The sensors may be positioned in a manner similar to that of FIG. Figure 2 Different than shown.

[0089] In some embodiments, the sensors 120 correspond to distance sensors. Each distance sensor can be configured to measure a vertical distance between the surface of the wafer 110 and the corresponding sensor 120. The three distance measurements can be used to determine the tilt of the wafer 110, see Figure 3A .

[0090] In some embodiments, sensor 122 may correspond to an inertial sensor. The inertial sensor may include a multi-axis accelerometer, a multi-axis gyroscope, or other types of inertial sensors. The inertial sensor may sense whether wafer 110 hits the frame of slot 108 through vibration or acceleration. The position of the inertial sensor may be related to Figure 2In addition, the transport box 102 may include a large number of inertial sensors. Each sensor is coupled to a corresponding slot 108 or a portion of a slot 108. This can help detect whether a particular wafer has hit the frame of a particular slot 108.

[0091] The sensor 124 may correspond to a camera or other type of image sensor. The sensor 124 may include a charge coupled device. The sensor 124 may capture an image of the wafer 110 within the slot 108. The sensor 124 may generate a sensor signal indicating the degree of centering of the wafer 110 within the slot 108, as will be described in more detail below. In some embodiments, the sensor 124 may capture an image of the wafer 110 each time the wafer 110 is loaded into the slot 108. The sensor 124 may be mounted within the transport box 102. The transport box 102 may include a different number of sensors 124.

[0092] In some embodiments, the sensor 126 may correspond to a horizontal sensor. The horizontal sensor 126 can detect whether the transport box 102 is tilted. The horizontal sensor can be one or more inertial sensors or gravity sensors for detecting whether the horizontal X-axis and the horizontal Y-axis or both are orthogonal to the vertical Z-axis. If the X-axis and the Y-axis are not orthogonal to the gravity orientation (Z-axis), the transport box is tilted. The tilt of the transport box during transportation or at the loading / unloading port of the loading / unloading system 106 may cause damage to the wafer 110. Therefore, the control system 116 can control the communication system 118 to output an alarm that the transport box 102 is tilted. The control system 104 can then take steps to solve the tilt problem. This can include stopping the transportation, loading or unloading of the wafer 110. The control system 104 can also output an alarm to a technician to adjust or check the transport box 102.

[0093] Various other types of sensors or various other arrangements of sensors may be implemented within the shipping case 102 without departing from the scope of the present disclosure.

[0094] In some embodiments, the control system 116 and the communication system 118 are located near the bottom of the transport case 102. The control system 116 can receive sensor data from various sensors. The control system 116 can receive sensor data from the sensors via a wired connection (not shown) or via a wireless connection. The control system 116 can process the sensor data and can control the communication system 118 to output the data to the external control system 104, as previously described. The control system 116 and the communication system 118 can be located or arranged in other ways without departing from the scope of the present disclosure.

[0095] Figure 3A is a diagram of a shipping case 102 according to some embodiments. Figure 3A The transport box 102 is Figure 1 and Figure 2 An embodiment of a transport box 102. Figure 3A In the embodiment of the present invention, the sensors 120 each measure the vertical distance between the sensor 120 and a specific point x on the surface of the wafer 110. The three vertical distances can be used to determine the tilt of the wafer 110. If the three vertical distances are the same, the wafer is not tilted. As used herein, no tilt corresponds to the top surface of the wafer 110 lying in the horizontal XY plane and having no vertical (Z) component. If the three vertical distances are not exactly the same, the wafer is tilted.

[0096] Each time a wafer 110 is loaded into a slot 108, it is beneficial to monitor the wafer 110 for tilt. Tilt can be problematic because the wafer 110 may not be in a stable position and may slide or tilt. Otherwise, it may collide with the frame of the slot 108. Tilt may indicate that there is debris on the bottom surface of the wafer 110 or on the frame of the slot 108 where the wafer 110 is located. Tilt may also indicate that the wafer 110 is not properly loaded into the slot 108.

[0097] Advantageously, the sensor system 112 monitors each wafer 110 as it is loaded into the slot 108 using a sensor 120 to determine if there is tilt. If there is tilt, or if the tilt exceeds a threshold tilt, the control system 116 can control the communication system 118 to output an alert of wafer tilt to the control system 104. The control system 104 can then stop the loading, unloading, or transport operation so that the tilt can be corrected or otherwise addressed. This can include alerting a technician to manually inspect the transport box 102 and the wafer 110. This can include moving the transport box 102 to an inspection tool that can inspect the wafer surface or the slot 108 to determine if there is debris, damage, or if the wafer 110 is not properly loaded into the slot 108.

[0098] In some embodiments, the wafers 110 are loaded one at a time in an ascending manner into the slots 108. In other words, if a first wafer is loaded into a first slot 108, the next wafer is loaded into a second slot 108 that is higher than the first slot. If the sensor 120 is located above the wafers 110, this ascending loading enables the sensor 120 to measure the tilt of each wafer 110 as the wafers are loaded into the slots 108.

[0099] In some embodiments, the sensor 120 may be located at the bottom of the slot port shipping box 102. In this case, the wafers 110 may be loaded in a descending manner, so that when the wafers are loaded into the shipping box 102, the sensor 120 may measure the tilt of the bottom surface of each wafer 110.

[0100] Figure 3B1 is a side view of a portion of a transport box 102 according to some embodiments. Only a single slot 108 and a single sensor 120 of a single wafer 110 are shown. Wafer 110 is placed on the frame of slot 108. In the intersection portion of sensor 120, a laser beam 123 is emitted to a point x on the top surface of wafer 110. Laser beam 123 is reflected from the top surface and received by the sensing portion of sensor 120. Sensor 120 measures a vertical distance D based on the emitted and reflected laser beam 123. Each of the three sensors 120 can be used in this manner to determine the corresponding vertical distance D. In an embodiment, sensor 120 is a laser sensor. Sensor 120 can correspond to other types of ranging sensors without departing from the scope of the present disclosure.

[0101] Figure 4 1 is a side view of a portion of a shipping box 102 according to some embodiments. Only a single slot 108 for a single wafer 110 is shown. The slot 108 includes a frame 130. The frame includes a bottom surface 132, side surfaces 134, and a top surface 136. In practice, the top surface 136 may correspond to the bottom portion of the next higher slot 108. The wafer 110 includes a side edge 138.

[0102] The inertial sensor 122 is coupled to the frame 130 of the tank 108. In practice, the inertial sensor 122 may be coupled to the frame 130 of the tank 108. Figure 4 The inertial sensor 122 can detect whether the side edge 138 of the wafer 110 hits the side surface 134 of the frame 130. Figure 4 In the example of FIG. 1 , the side edge 138 of the wafer 110 has contacted or collided with the side surface 134 of the frame 130 of the slot 108. The left inertial sensor 122 generates sensor data indicating a collision. The sensor system 112 or the control system 116 determines that a collision is present based on the sensor data. The control system 116 can then control the communication system 118 to output an alarm indicating that a collision has occurred.

[0103] The control system 104 receives the collision alert and can take action in response to the collision alert. The control system 104 can immediately stop the transportation of the transport box 102, can stop loading or unloading the wafer 110, or can cause the robot arm of the loading / unloading system 106 to adjust the position of the wafer 110. In some embodiments, the control system 104 can cause the transportation system to transport the transport box 102 to an inspection station inspection tool to determine whether the wafer 110 is damaged. The control system 104 sends an alert to the technician to manually inspect the wafer 110. This can help ensure that a damage control check is performed before the next processing step. If damage is detected, the wafer can be scrapped before wasting additional processing steps.

[0104] Figure 5is a top view of a portion of shipping box 102 during loading of wafers 110 into shipping box 102 according to some embodiments. Figure 5 A portion of a single frame 130 is shown. Specifically, Figure 5 A portion of the frame 130 is shown, including a top portion of the frame 130. The robot arm 139 of the loading / unloading system 106 is carrying the wafer 110 into the slot 108.

[0105] The sensor 125 is positioned within the transport box 102. The sensor 125 monitors the trajectory of the wafer 110 during loading. The sensor 125 can detect whether the trajectory of the loading process is aligned to cause a collision of the side edge 138 with the frame 130. If the alignment corresponds to a collision trajectory, the control system 116 can control the communication system 118 to output an alarm to the control system 104. The control system 104 can control the robot arm 139 to adjust its position or alignment to avoid the collision. The loading process can then continue safely.

[0106] The sensor 125 may include an image sensor that captures an image or otherwise monitors the position of the wafer 110 during loading. The sensor 125 may be different from Figure 5 In some embodiments, the sensor 125 may include an arrangement sensor or other type of sensor. In some implementations, as additional wafers 110 are loaded into the shipping box 102, the sensor 125 may be moved vertically so that the sensor is in place to measure the alignment or trajectory or orientation of each wafer 110 as the wafers are loaded. Various other configurations or sensor types may be utilized without departing from the scope of the present disclosure.

[0107] Figure 6 is a side view of a portion of a shipping case 102 according to one embodiment. Figure 6 , a single slot 108 is shown. Wafer 110 is placed on frame 130 of slot 108. Shipping box 102 includes image sensor 140 that measures the orientation of wafer 110 within slot 108. Image sensor 140 may include an image sensor that captures an image of side edge 138 of the wafer. Wafer 110 is adjacent to the side surface of frame 130 of slot 108.

[0108] exist Figure 6In an embodiment of the present invention, the first image sensor 140 is located on the left side of the wafer 110 and the second image sensor 140 is located on the right side of the wafer 110. The first image sensor 140 measures a distance D1 between the side edge 138 of the wafer 110 and the left side of the frame 130. The second image sensor 140 measures a distance D2 between the side edge 138 of the wafer 110 and the right side of the frame 130. The sensor system 112 or the control system 116 can determine the degree of centering of the wafer 110 in the slot 108 based on the difference between the distances D1 and D2. If D1 and D2 are equal, the wafer 110 is completely centered. The greater the difference between D1 and D2, the less centered the wafer 110 is in the slot 108.

[0109] If the difference between D1 and D2 is greater than a threshold difference, the control system 116 may determine that the wafer 110 is unacceptably off-center. The control system 116 may control the communication system 118 to output an alarm to the control system 104 indicating that the wafer 110 is not centered. The control system 104 may then take action to correct or otherwise address the centering issue of the wafer 110. The action may include controlling the robotic arm 139 to adjust the position of the wafer 110. The action may include stopping a transport or loading / unloading operation so that the position of the wafer 110 can be adjusted so that a collision or other damage does not occur. The action may include outputting an alarm to a technician so that an inspection or adjustment can be made. The image sensor 140 may be the same as the sensor 125. In other words, the monitoring of the wafer 110 may be performed by the same sensor. Figure 5 and Figure 6 Describe the monitoring.

[0110] Fig. 7A is a side view of a wafer transport box 102 at a load / unload port 150 of a load / unload system 106 according to some embodiments. The load / unload port 150 may be a load / unload port at a semiconductor processing tool, as previously described.

[0111] When the transport box 102 reaches the loading / unloading port 150, the transport box 102 is located in front of the loading / unloading port 150. A front cover 156 is located at the front of the transport box 102. The front cover 156 includes a pin slot 158 ​​that enables the front cover 156 to be removed.

[0112] The loading / unloading port 150 includes a front cover removal device 152. The front cover removal device 152 is configured to remove a front cover 156 of the transport box 102. Specifically, the front cover removal device 152 includes a pin 154. The pin 154 is configured to be positioned in a pin slot 158 ​​of the front cover 156. The pin 154 cooperates with the pin slot 158. The front cover removal device 152 then removes the front cover 156 of the transport box 102 so that the wafer 110 can be unloaded from the transport box 102 (or loaded into the transport box 102, as the case may be) by the robot arm 139.

[0113] The shipping box 102 includes a sensor 160 that monitors the alignment of the pins 154 with the pin slots 158. If the alignment is incorrect, the removal of the front cover 156 may fail. Alternatively, if the alignment is incorrect, the removal of the front cover 156 may cause a vibration of the shipping box 102, which may damage the wafers 110.

[0114] Therefore, the sensor 160 can measure or detect the positioning or alignment of the pin 154 relative to the pin slot 158. If misalignment occurs, the control system 116 can control the communication system 118 to output an alarm or alignment data to the control system 104. Then, the control system 104 can adjust the position of the transport box 102 relative to the loading / unloading port 150, or adjust the position of the front cover removal device 152, so that the pin 154 is better aligned with the pin slot 158.

[0115] In some embodiments, the sensor 160 can assist in the calibration process of the load / unload port 150. Based on the measured alignment, the control system 104 can automatically adjust the position of the next shipping box 102 or lid. This calibration data can be passed to other loading / unloading systems 106 of the semiconductor processing system 100 so that proper pin alignment can be automatically performed each time a shipping box 102 is brought to the load / unload port 150.

[0116] In some embodiments, the sensor 160 corresponds to an image sensor or other type of range-finding sensor that can sense the alignment or position of the pin 154 in the pin slot 158. When the shipping box 102 arrives at the loading / unloading port 150, the sensor 160 can be moved into position to sense the alignment of the pin. Other types of sensors can also be used without departing from the scope of the present disclosure.

[0117] exist Figure 7B , the front cover 156 has been removed by the front cover removal device 152. The robot arm 139 is unloading the wafers 110 from the transport box 102. The sensor 160 has moved so that the robot arm 139 can freely access the wafers 110. After all wafers 110 are loaded, the front cover removal device 152 can put the front cover 156 back into the transport box 102.

[0118] Figure 8 is a block diagram of a semiconductor processing system 100 according to some embodiments. Figure 8 The semiconductor processing system 100 is Figure 1 An embodiment of a semiconductor processing system 100 is provided. Figure 8 Two semiconductor process tools 172 are shown. A load / unload port 150 of the load / unload system 106 is coupled to or is part of each process tool 172. Figure 8Also shown is a bulk storage 176. The bulk storage 176 may include a wafer storage or other type of memory that can store both the shipping crates 102 and the wafers 110 that are unloaded from the shipping crates 102 prior to the next semiconductor process.

[0119] Figure 8 An overhead rail conveyor 178 is shown. The overhead rail conveyor 178 is configured to carry the transport box 102 between process tools 172 or between the batch storage 176 and the process tool 172. In an illustrative embodiment, the transport box 102 is transported by the overhead rail conveyor 178 to the load / unload port 150 and the left side of the process tool 172. The transport box 102 is lowered and positioned at the load / unload port 150. The front cover is removed, and the wafer 110 is unloaded from the transport box 102 into the process tool 172. The process tool 172 performs a first semiconductor process on the wafer 110.

[0120] The loading / unloading port 150 then loads the wafer 110 from the process tool 172 into the transport box 102. This can be the same transport box as before or a different transport box. The overhead track conveyor 178 then carries the transport box 102 to the batch storage 176. The wafer 110 is unloaded from the transport box 102 into the wafer stocker of the batch storage 176. When the wafer 110 is ready for the next semiconductor process, the overhead track conveyor 178 carries the transport box 102 to the batch storage 176 and loads the wafer into the transport box 102. The overhead track conveyor 178 then carries the transport box 102 to the loading / unloading port 150 of the process tool 172 located on the right. The wafer 110 is then unloaded and a second semiconductor process is performed on the wafer.

[0121] The sensor system 112 of the transport box 102 performs the aforementioned measurements, detections, and monitoring during loading / unloading and transportation of the wafers 110 with the transport box 102. The control system 104 can control components of the semiconductor processing system 100 to process or adjust various aspects of the transport box 102 in response to alarms generated by the transport box 102 based on the sensor system 112. Other types of transport systems may also be used without departing from the scope of the present disclosure.

[0122] Fig. 9 is a flow chart of a method 900 for operating a semiconductor processing system 100 according to some embodiments. The method 900 may utilize Figures 1 to 8The systems, components and processes described herein are described herein. At step 902, wafer monitoring is initiated by the sensor system 112 of the transport box 102. At step 904, the method 900 includes utilizing the sensor system to detect improper alignment or orientation of the wafer 110 and the transport box 102. Step 904 may include the following steps 908 to 918. Specifically, at step 908, the wafer 110 is transferred to the aligner. At step 910, the wafer is loaded back into the transport box 102. At steps 912 / 918, the sensor 114 of the sensor system 112 of the transport box 102 detects flatness, pin alignment, centering gap, vibration, etc., as described above. At step 914, the sensor monitors the wafer 110 on the robot arm 139 at the load / unload port 150, as described above. At step 916, the control system 116 of the transport box 102 notifies the control system 104 of the semiconductor processing system 100 of any alarms or abnormal data, as previously described. The control system 104 may then take corrective action, as previously described.

[0123] Fig.10 is a flow chart of a method 1000 for operating a semiconductor processing system according to some embodiments. The method 1000 may utilize Figures 1 to 9 According to some embodiments, at step 1002, a wafer is loaded into a slot of a shipping box using a robotic arm. An example of a wafer is Figure 1 of the wafer 110. An example of a groove is Figure 1 An example of a transport box is Figure 1 A transport box 102. An example of a robotic arm is a robot Figure 7B At step 1004, method 1000 includes measuring the position of the wafer in the slot using a sensor system in the shipping box. An example of a sensor system is Figure 1 At step 1006, method 1000 includes transmitting position data indicating the position of the wafer from the shipping box to a control system remote from the shipping box. An example of a control system is Figure 1 A control system 104 is provided.

[0124] Embodiments of the present disclosure help ensure that semiconductor wafers or other sensitive semiconductor processing equipment or materials are not damaged during transportation, loading and unloading. Embodiments of the present disclosure provide a wafer transport box, commonly referred to as a front-opening wafer transport box (FOUP), having a sensor system including multiple sensors installed in the transport box. The transport box includes multiple slots, each slot is configured to receive and hold a wafer. The sensor can detect whether the wafer is tilted in the slot, whether the wafer is centered in the slot, whether the wafer collides with the frame of the slot, the position of the door removal pin at the load / unload port, whether the box is tilted during transportation, or various other factors related to loading, unloading and storing wafers with the transport box. The transport box also includes a communication system that can transmit sensor data or other alarms to an external control system so that the external control system can take action based on the sensor data to prevent damage to the wafer.

[0125] The wafer transport box according to the embodiments of the present disclosure provides multiple benefits. The sensor system can detect the position of the wafer, which may cause damage if not addressed. The sensor system can detect misalignment or other risk factors that occur during the loading and unloading of wafers. The wafer transport box can transmit sensor data to an external control system so that the external control system can take steps to correct alignment or positioning problems before transporting the transport box, unloading wafers, or loading wafers. This ensures that semiconductor wafers and other sensitive devices are not damaged during transportation, loading or unloading. The result is better integrated circuit performance and higher wafer yields.

[0126] In one embodiment, a method includes loading a wafer into a slot of a transport box with a robot, measuring the orientation of the wafer in the slot with a sensor system in the transport box, and transferring the orientation of the wafer from the transport box. The transport box is transferred to a control system remote from the transport box, and the orientation data indicates the orientation of the wafer. In one embodiment, wherein the measured orientation includes the tilt of the wafer, including measuring a first vertical distance to a first point on the wafer, measuring a second vertical distance to a second point on the wafer, and measuring a third vertical distance to a third point on the wafer. In one embodiment, further includes measuring the first vertical distance using a first laser sensor of the sensor system in the transport box. Measuring the second vertical distance using a second laser sensor of the sensor system in the transport box. Measuring the third vertical distance using a third laser sensor of the sensor system in the transport box. And calculating the tilt of the wafer based on the first vertical distance, the second vertical distance, and the third vertical distance. In one embodiment, further includes detecting whether the edge of the wafer is aligned to collide with the frame of the slot while loading the wafer into the slot using the sensor system. In one embodiment, further comprising transmitting to a control system an indication that the edge of the wafer is aligned to collide with the frame of the slot in response to detecting that the wafer is aligned to collide with the edge of the slot. In one embodiment, further comprising using the control system to control the robot arm in response to the indication to adjust the alignment of the wafer to avoid the edge of the wafer from colliding with the frame of the slot. In one embodiment, wherein measuring the orientation comprises measuring the degree of centering of the wafer in the slot, comprising capturing an image of the edge of the wafer in the slot using a camera of the sensor system. And determining the degree of centering of the wafer in the slot based on the image using the sensor system. In one embodiment, further comprising using the sensor system to measure the inclination of the transport box. And transmitting to the control system transport box inclination data indicating the inclination of the transport box. In one embodiment, further comprising using a horizontal sensor of the sensor system to measure the inclination of the transport box. In one embodiment, further comprising comparing the inclination of the transport box with a tilt threshold. And if the inclination of the transport box is greater than the tilt threshold, outputting an alarm of the tilt of the transport box using the control system. In one embodiment, further comprising using the sensor system to detect the position of the door transfer pin of the load / unload port before removing the door of the transport box using the door transfer pin.

[0127] In one embodiment, a transport box includes a plurality of slots and a loading surface, each slot being configured to receive and hold a corresponding wafer, and the loading surface being configured to be able to load and unload wafers from the slot. The transport box includes a sensor system configured to measure the orientation of the wafer in the slot for each slot and a communication system configured to transmit orientation data indicating the orientation of the wafer in the slot from the transport box to a control system remote from the transport box. In one embodiment, wherein the orientation of the wafer corresponds to the inclination of the wafer, wherein the sensor system is configured to measure the inclination of the wafer in the slot for each slot, the sensor system includes a first distance sensor, a second distance sensor, and a third distance sensor. The first distance sensor is configured to measure a first distance of a first point on the wafer in the slot. The second distance sensor is configured to measure a second distance of a second point on the wafer in the slot. The third distance sensor is configured to measure a third distance of a third point on the wafer in the slot, wherein the sensor system is configured to measure the inclination based on the first distance, the second distance, and the third distance. In one embodiment, the sensor system is configured to detect, for each slot, whether the edge of the wafer is aligned to collide with the frame of the slot when loaded into the slot by the robot arm. In one embodiment, the sensor system includes an edge alignment sensor that moves within the transport box to perform edge detection at the slot currently receiving the wafer. In one embodiment, the orientation of the wafer corresponds to the degree of centering of the wafer within the slot, and the sensor system includes one or more cameras, the one or more cameras configured to capture, for each slot, an image of the relative position of the edge of the wafer within the slot. In one embodiment, the sensor system includes a level sensor configured to detect the tilt of the transport box.

[0128] In one embodiment, a system includes a transport box. The transport box includes a plurality of slots, each slot configured to receive and hold a wafer; a plurality of sensors, each configured to generate sensor data; and a communication system configured to transmit the sensor data. The system includes a control system configured to receive the sensor data and control adjustments to the orientation of the transport box in response to the sensor data. In one embodiment, further includes a robot communicatively coupled to the control system, wherein the robot is configured to adjust the orientation of the transport box in response to the sensor data under control of the control system. In one embodiment, further includes an overhead rail transport system configured to carry the transport box.

[0129] The features of several embodiments are summarized above so that those skilled in the art can better understand the various aspects of the present disclosure. Those skilled in the art will appreciate that they can easily use the present disclosure as a basis for designing or modifying other processes and structures to achieve the same purposes and / or achieve the same advantages as the embodiments described herein. Those skilled in the art will also appreciate that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they can make various changes, substitutions, and modifications without departing from the spirit and scope of the present disclosure.

Claims

1. A semiconductor processing method, characterized in that: Include: Using a robotic arm to load a wafer into a slot of a transport box; measuring an orientation of the wafer in the slot using a sensor system within the shipping box; and Position data indicative of the position of the wafer is transmitted from the transport box to a control system remote from the transport box.

2. The semiconductor processing method according to claim 1, wherein: Measuring the orientation includes a tilt of the wafer, including measuring a first vertical distance to a first point on the wafer, measuring a second vertical distance to a second point on the wafer, and measuring a third vertical distance to a third point on the wafer.

3. The semiconductor processing method according to claim 2, wherein: Further including: Measuring the first vertical distance using a first laser sensor of the sensor system in the transport box; measuring the second vertical distance using a second laser sensor of the sensor system in the transport box; measuring the third vertical distance using a third laser sensor of the sensor system in the transport box; and The tilt of the wafer is calculated based on the first vertical distance, the second vertical distance, and the third vertical distance.

4. The semiconductor processing method according to claim 1, wherein: The method further includes loading the wafer into the slot while detecting, using the sensor system, whether an edge of the wafer is aligned to collide with a frame of the slot.

5. The semiconductor processing method according to claim 1, wherein: Measuring the orientation includes measuring the degree of centering of the wafer within the slot, including: capturing an image of an edge of the wafer in the slot using a camera of the sensor system; and The sensor system is used to determine the degree of centering of the wafer within the slot based on the image.

6. A transport box, characterized in that: Include: a plurality of slots, each configured to receive and hold a corresponding one of the wafers; a loading surface configured to enable loading and unloading of the wafer from the plurality of slots; a sensor system configured to measure, for each of the plurality of slots, an orientation of the wafer within the slot; and A communication system is configured to transmit position data indicating the position of the wafer within the slot from the transport box to a control system remote from the transport box.

7. The transport box according to claim 6, characterized in that: The orientation of the wafer corresponds to a tilt of the wafer, wherein the sensor system is configured to measure the tilt of the wafer within the slot for each of the plurality of slots, the sensor system comprising: a first distance sensor configured to measure a first distance of a first point on the wafer in the slot; a second distance sensor configured to measure a second distance of a second point on the wafer within the slot; as well as A third distance sensor is configured to measure a third distance of a third point on the wafer in the slot, wherein the sensor system is configured to measure the tilt based on the first distance, the second distance, and the third distance.

8. The transport box according to claim 6, characterized in that: The orientation of the wafer corresponds to a degree of centering of the wafer within the slot, wherein the sensor system includes one or more cameras configured to capture an image of a relative position of an edge of the wafer within the slot for each of the plurality of slots.

9. A semiconductor processing system, characterized in that: Include: One transport box, containing: a plurality of slots, each configured to receive and hold a wafer; a plurality of sensors, each configured to generate sensor data; and a communication system configured to transmit the sensor data; as well as A control system is configured to receive the sensor data and control adjustment of an orientation of the transport box in response to the sensor data.

10. The semiconductor processing system of claim 9, wherein: Further included is a robot communicatively coupled to the control system, wherein the robot is configured to adjust the position of the transport box in response to the sensor data under control of the control system.

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