Intelligent surface structure, processing method of intelligent surface structure, electronic equipment and vehicle

Abstract

The invention relates to an intelligent surface structure, a processing method of the intelligent surface structure, electronic equipment and a vehicle, the intelligent surface structure comprises a decoration layer, a base material layer and a functional layer which are sequentially arranged in a stacked mode, the functional layer is provided with a light-emitting element, the decoration layer is provided with a light-equalizing membrane, and the light-equalizing membrane is provided with a light-emitting element. And emergent light of the light-emitting element uniformly acts on the decorative layer through the base material layer and the light equalizing film. According to the intelligent surface structure provided by the invention, the light uniformizing film is additionally arranged in the decorative layer, so that the problem of light channeling can be improved, the light guide uniformity of the light-emitting elements in the functional layer can be improved, the light penetration effect can be improved, and good light uniformity can be formed.

Description

Technical Field

[0001] The present disclosure relates to the technical field of smart surfaces, and in particular to a smart surface structure, a processing method of the smart surface structure, an electronic device, and a vehicle. Background Art

[0002] IME (In-Mold-Electronics) is a process that directly integrates patterns, conductive circuits, and electronic components such as LED lights, resistors, capacitors, and touch electrodes into injection molded products during the injection molding process. It is an intelligent surface technology that displays specific patterns and realizes certain functions. It is widely used in automobiles, home appliances, medical devices, portable electronic devices, aviation, and other fields.

[0003] In the related technology, the pattern layer, electronic components, circuits, etc. are concentrated on the same film layer. The distance between the LED lamp and the pattern surface is relatively close, and light guiding treatment cannot be performed. There is a problem of uneven product light emission, the light cannot be isolated, and light leakage is easy to cause poor light emission. Summary of the invention

[0004] The purpose of the present disclosure is to provide a smart surface structure, a processing method of the smart surface structure, an electronic device and a vehicle, so as to solve the problem of uneven light emission of the smart surface structure in the related art.

[0005] In order to achieve the above-mentioned purpose, the present disclosure provides a smart surface structure, which includes a decorative layer, a substrate layer and a functional layer which are stacked in sequence, wherein the functional layer is provided with a light-emitting element, and the decorative layer is provided with a light-distributing film, and the emitted light of the light-emitting element is uniformly applied to the decorative layer through the substrate layer and the light-distributing film.

[0006] Optionally, the decoration layer includes a first film and a pattern unit provided on the first film; and / or The functional layer includes a second membrane and an electronic component disposed on the second membrane.

[0007] Optionally, the pattern unit is configured as a separate pattern layer, and the pattern layer is disposed between the first film and the light-homogenizing film.

[0008] Optionally, the electronic component is configured as a separate electronic component layer, and the electronic component layer is disposed between the second film and the substrate layer.

[0009] Optionally, the light-homogenizing film comprises a first atomizing film, a polarizing brightness enhancement film, and a second atomizing film which are sequentially stacked, and the first atomizing film is attached to a surface of the decorative layer close to the substrate layer.

[0010] Optionally, a surface of the first atomized film facing the polarized brightness enhancement film and / or a surface of the second atomized film facing the polarized brightness enhancement film is provided with an atomized layer.

[0011] Optionally, the atomization layer is a bulge structure protruding from the corresponding surface, and the bulge structure is multiple and arranged side by side. The sizes of the multiple bulge structures are different and the sizes are arranged in a staggered manner.

[0012] Optionally, a surface of the substrate layer facing the functional layer is provided with a groove for avoiding the electronic component.

[0013] Optionally, the pattern unit is an information mark provided on the first film or the light-homogenizing film, and the information mark has: In the off state, the information mark is not displayed, and the decorative layer is consistent with the surface to be installed of the smart surface structure; In the awake state, the information mark is lit, and touching the information mark can trigger a preset action.

[0014] Optionally, the decoration layer has an inner surface and an outer surface, the information mark on the inner surface is printed by light-transmitting ink, and other areas on the inner surface except the information mark are printed with light-shielding ink.

[0015] Optionally, the outer surface of the decorative layer is provided with a texture consistent with the surface to be installed of the smart surface structure.

[0016] According to a second aspect of the present disclosure, a method for processing a smart surface structure is provided. The method is used to manufacture the above-mentioned smart surface structure. The method comprises: Forming a decorative layer with a light-homogenizing film; forming a functional layer; and The decorative layer and the functional layer are integrally formed by low-pressure injection molding.

[0017] Optionally, the step of forming a decorative layer with a light-homogenizing film comprises: The light-homogenizing film is pasted and fixed on the first surface of the pattern layer. The second surface of the pattern layer is printed and fixed on the first film, and the first surface and the second surface are arranged opposite to each other.

[0018] Optionally, the step of forming the functional layer includes: Fixing the electronic components on the second film to form a film to be packaged; The film to be packaged is packaged.

[0019] Optionally, the step of packaging the film to be packaged includes: Placing the film to be packaged in a first low-pressure injection mold, injecting a light-isolating packaging plastic material to form a light-isolating area on the second film; and The film to be packaged is placed in a second low-pressure injection mold, and a light-transmitting packaging plastic material is injected to form a light-transmitting area on the second film.

[0020] Optionally, the order of the step of forming the light-isolating area and the step of forming the light-transmitting area can be exchanged.

[0021] Optionally, the step of low-pressure integrally injection-molding the decorative layer and the functional layer comprises: placing the decorative layer on the first mold; placing the functional layer on a second mold; The first mold and the second mold are buckled together, and low-pressure injection molding is performed from the injection port of the first mold.

[0022] According to a third aspect of the present disclosure, an electronic device is provided, comprising the above-mentioned smart surface structure.

[0023] According to a fourth aspect of the present disclosure, a vehicle is provided, comprising the above-mentioned smart surface structure or the above-mentioned electronic device.

[0024] Through the above technical solution, in the smart surface structure provided by the present invention, a light-uniformizing film is added to the decorative layer, which can improve the light channeling problem, increase the light guiding uniformity of the light-emitting elements in the functional layer, enhance the light penetration effect, and form good light uniformity performance.

[0025] Other features and advantages of the present disclosure will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present disclosure but do not constitute a limitation of the present disclosure. In the accompanying drawings: Figure 1 Schematic diagram of a smart surface structure provided by an embodiment of the present disclosure.

[0027] Figures 2 to 8 is a structural diagram of a seat controller provided by an exemplary embodiment of the present disclosure; wherein, Figure 2 is a top view of a seat controller provided by an exemplary embodiment of the present disclosure; Figure 3 is a front view of a seat controller provided by an exemplary embodiment of the present disclosure (the information mark is off); Figure 4is a main view of a seat controller provided by an exemplary embodiment of the present disclosure (the information mark is in an awake state); Figure 5 is an exploded view of a seat controller provided by an exemplary embodiment of the present disclosure; Figure 6 is a schematic diagram of a second surface of a substrate layer in a seat controller provided by an exemplary embodiment of the present disclosure; Figure 7 is an exploded view of a seat controller provided by another exemplary embodiment of the present disclosure; Figure 8 It is a schematic diagram of the second surface of the substrate layer in the seat controller provided by another exemplary embodiment of the present disclosure.

[0028] Figures 9 to 15 is a schematic diagram of the structure of a sunroof controller provided by an exemplary embodiment of the present disclosure; wherein, Fig. 9 is a perspective view of a sunroof controller provided by an exemplary embodiment of the present disclosure; Fig.10 is an exploded view of a sunroof controller provided by an exemplary embodiment of the present disclosure; Fig.11 is a perspective view of a sunroof controller provided by an exemplary embodiment of the present disclosure from another perspective; Fig.12 is a cross-sectional view of a sunroof controller provided by an exemplary embodiment of the present disclosure; Fig.13 is a schematic diagram of functional layers in a sunroof controller provided by an exemplary embodiment of the present disclosure; Fig.14 is a front view of a sunroof controller provided by an exemplary embodiment of the present disclosure (the information mark is off); Fig.15 2 is a main view of a sunroof controller provided by an exemplary embodiment of the present disclosure (the information mark is in an awake state).

[0029] Figures 16 to 18 is a schematic diagram of a smart surface structure provided by an exemplary embodiment of the present disclosure; Fig.16 is a cross-sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure; Fig.17 is an exploded view of a smart surface structure provided by an exemplary embodiment of the present disclosure; Fig.18 is a cross-sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure; Fig.19 is an exploded view of a smart surface structure provided by an exemplary embodiment of the present disclosure; Fig. 20It is a schematic diagram of the structure of the functional layer in the smart surface structure provided by the exemplary embodiment of the present disclosure.

[0030] Fig.21 It is a schematic diagram of the structure of a light-homogenizing film in a smart surface structure provided by an exemplary embodiment of the present disclosure.

[0031] Fig. 22 and Fig.23 is a flow chart of a smart surface structure processing method provided by an exemplary embodiment of the present disclosure.

[0032] Fig.24 is an exploded view of a smart surface structure provided by an exemplary embodiment of the present disclosure.

[0033] Fig.25 Schematic diagram of a smart surface packaging structure provided by an exemplary embodiment of the present disclosure.

[0034] Fig.26 is a cross-sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure.

[0035] Fig. 27 is a cross-sectional view of a smart surface structure provided by an exemplary embodiment of the present disclosure.

[0036] Description of Reference Numerals 1, 1'-substrate layer; 10-groove; 11-first surface; 12-second surface; 121-accommodating groove; 122-limiting structure; 123-installing groove; 124-contact column.

[0037] 2, 2'-decoration layer; 20-information mark; 21-first film; 22-pattern layer; 220-pattern unit.

[0038] 3, 3'-functional layer; 30-electronic component; 31-circuit board; 32-packaging part; 33-second diaphragm; 34-electronic component layer; 311-light-emitting element; 312-connector; 313-vibration element; 314-touch sensor element; 315-capacitor element; 316-silver paste circuit; 35-mounting hole; 36-mounting seat; 37-diaphragm; 371-positioning hole; 372-opening, 38-conductive circuit layer.

[0039] 4-light-homogenizing film; 40-atomizing layer; 41-first atomizing film; 42-second atomizing film; 43-polarizing brightness enhancement film.

[0040] 5-encapsulating plastic material; 50-dam; 51-light-transmitting area; 52-light-isolating area; 53-non-luminous element; 60-substrate film. DETAILED DESCRIPTION

[0041] The specific implementation of the present disclosure is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described herein is only used to illustrate and explain the present disclosure, and is not used to limit the present disclosure.

[0042] In the present disclosure, unless otherwise stated, the directional words such as "upper, lower, top, and bottom" used are generally defined when the smart surface structure provided by the present disclosure is normally installed. Figure 1 and Fig.16 In the drawing direction, "inside" and "outside" may refer to the inside and outside of the corresponding component outline or the inside or outside of the environment in which it is located, depending on the specific context. In addition, when the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The terms "first", "second", etc. used in this disclosure are to distinguish one element from another element and do not have order and importance.

[0043] Taking the application of intelligent surface structure in the automotive field as an example, the entertainment and comfort of automotive interiors are constantly developing, and large screens, lights, and touch buttons are everywhere, which brings convenience but also causes more and more factors to be controlled, lack of design sense, integrity, distraction and other defects. The application of IME can realize the invisible backlight and hidden touch button technology with high integration of various material surfaces, which can not only meet the needs of interaction, but also be invisible at any time, reduce driving distraction, make it safer, and have a high degree of overall shape and design; at the same time, the structural parts are integrated with the circuit, which is lightweight and has high space utilization.

[0044] In this disclosure, Figures 2 to 20 As shown, the present disclosure provides a smart surface structure, which includes a decorative layer 2, a substrate layer 1 and a functional layer 3 arranged in a stacked manner. The present disclosure provides different embodiments of the smart surface structure. Before introducing multiple embodiments, the decorative layer 2, the substrate layer 1 and the functional layer 3 are relatedly introduced.

[0045] Regarding the substrate layer 1, the substrate layer 1 is generally made of a material with good light transmittance, such as PC (polycarbonate), PMMA (polymethyl methacrylate), acrylic acid, ABS (acrylonitrile-styrene-butadiene copolymer), AES (sodium polyoxyethylene fatty alcohol ether sulfate), PI (polyimide), PPA (polyphthalamide), etc., which will not affect the light emitted by the light-emitting element 311 of the functional layer 3 to pass through the substrate layer 1 to the decorative layer 2. The substrate layer 1 can be formed in the process of injection molding the decorative layer 2, or it can be manufactured separately, both of which belong to the protection scope of the present disclosure.

[0046] Regarding the decorative layer 2, Figure 4 and Fig.15 As shown, the decorative layer 2 is provided with information marks 20. Figure 4In the seat controller embodiment shown, the information mark 20 includes the position adjustment of the headrest, backrest and seat cushion, and also includes the adjustment of the seat working mode, H represents the heating mode, V represents the ventilation mode, and M represents the massage mode. Fig.15 In the embodiment of the sunroof controller shown, the information mark 20 includes the light-emitting positions of two reading lights and the control and emergency help marks of the sunroof. Of course, the above information mark 20 is not limited to the contents provided in the embodiment and can be designed as needed.

[0047] The above-mentioned information mark 20 has an off state and an awake state. In the off state, the information mark 20 is not displayed, and the outer surface of the decorative layer 2 is consistent with the surface to be installed of the intelligent surface mounting structure, and is integrated with the surrounding interior to achieve a hidden effect. The shape is more integrated, will not distract the driver's attention, and is safer and more reliable. When the driver needs it, he touches the information mark 20 lightly, switches to the awake state, and the information mark 20 is displayed. Touching the information mark 20 can trigger a preset action. The preset action here is performed by the drive inside the seat or sunroof, which can be an action to drive the seat back to adjust forward or backward, or it can be performed by the heater, which can be an action to heat the backrest, etc., without specific restrictions. Just press the corresponding information mark 20 with your finger, and the information mark 20 will make corresponding actions and feedback under pressure, so that the seat and sunroof can be adjusted. By pressing the circle position on both sides of the sunroof controller for a long time, the brightness of the reading light will change, which can be adjusted according to user needs. In addition, only the information mark of the reading light can be displayed in the sunroof controller. The information mark of the sunroof adjustment will be extinguished within the set time. When the reading light function is not needed, double-click the information mark of the reading light to turn off the reading light. The interactive method of the information mark 20 can be designed differently according to needs.

[0048] exist Figure 5 , Figure 7 and Fig.10 In the embodiment shown, the decorative layer 2 has an inner surface and an outer surface, and the information mark 20 is arranged on the inner surface. To achieve a better hiding effect, the outer surface of the decorative layer 2 can be printed with a texture consistent with the surface to be installed on the smart surface structure or covered with light-transmitting fabric, leather, etc. to achieve a hiding effect, and the information mark 20 can be hidden under the light-transmitting texture or light-transmitting fabric. Of course, the outer surface of the decorative layer 2 can have the same material, pattern, shape design, etc. as the surface to be installed on the smart surface structure to improve the overall consistency.

[0049] The information mark 20 on the inner surface of the decorative layer 2 is printed with light-transmitting ink, and the other areas on the inner surface except the information mark 20 are printed with light-shielding ink. In this way, the light-emitting element 311 in the functional layer 3 can pass through the information mark 20 to display the information mark 20 or display a hidden backlight, or be used as a reading light. The other areas on the decorative layer 2 except the information mark 20 are printed with light-shielding ink to block the light of the light-emitting element 311 from being transmitted from other positions except the information mark 20, so as to ensure the overall visual effect and the use of passengers.

[0050] Regarding the functional layer 3, the functional layer 3 is provided with a light-emitting element 311, which can be an LED lamp. The light-emitting element 311 can be multiple and correspond to the position of the information mark 20 of the decorative layer 2, can provide backlight, realize the lighting and display of the information mark 20, and is more conducive to the light-emitting element 311 to make the information mark 20 brighter and more uniform. The position, quantity and arrangement of the light-emitting element 311 can be designed according to the number and position of the information mark 20. In order to realize the sensing of the touch action, a touch sensing element 314 is provided in the functional layer 3 to detect the pressure acting on the surface. The functional layer 3 can also be provided with a capacitor element 315, an inductor element, a silver paste circuit 316, a sensor chip, etc. The capacitor element 315 can correspond to the position of the information mark 20 of the decorative layer 2, and effectively identify and monitor the position of the user's pressing action. When the information mark 20 triggers a certain action, such as when adjusting the seat back forward, a vibration element 313, such as a vibration motor, is provided in the functional layer 3 to provide feedback through vibration to remind the user that the action has been performed. In other embodiments, feedback may also be provided by flashing the information mark 20, and the specific form is not limited.

[0051] In existing IME technologies, such as Figure 1 As shown, the decorative layer 2', electronic components, circuits, etc. (functional layer 3') are integrated in the same film layer (substrate layer 1'), which has various problems introduced in the background technology section. In order to solve the above problems, in the smart surface structure provided by the present disclosure, the decorative layer 2 and the functional layer 3 are respectively arranged on two opposite surfaces of the substrate layer 1, and the decorative layer 2 and the functional layer 3 are separately arranged and manufactured separately, which reduces the impact on the decorative layer 2, reduces the scrap rate, directly reduces the number of printing processes of a single film, and reduces costs. By adjusting the thickness of the substrate layer 1, the light-emitting element 311 in the functional layer 3 can be away from the decorative layer 2, and the distance between the light-emitting element 311 and the decorative layer 2 is increased, and light guiding processing can be performed to avoid the phenomenon of light channeling. The structure will be described in detail below in combination with different embodiments.

[0052] It should be noted here that the intelligent surface structure can be applied to the fields of automobiles, home appliances, portable electronic devices, aviation, etc. When applied to automobiles, it can be an intelligent central control display, seat controller, air conditioning controller, sunroof controller, steering wheel sensor control, door handle light display control, seat belt fabric surface control, auxiliary instrument panel intelligent display and other interior surface structures, all of which fall within the protection scope of the present disclosure.

[0053] Taking the seat controller as an example, in an exemplary embodiment of the present disclosure, Figures 2 to 8 As shown, the functional layer 3 includes a circuit board 31, and the substrate layer 1 has a first surface 11 for fixing the decorative layer 2 and a second surface 12 for fixing the functional layer 3. Figure 6 and Figure 8 As shown, the second surface 12 is provided with a limiting structure 122 for positioning the circuit board 31. The limiting structure 122 can be a positioning column provided on the second surface 12, and the circuit board 31 is provided with a positioning hole that matches the positioning column. There can be two limiting structures 122 and they are arranged at diagonally opposite positions. In other embodiments, the limiting structure 122 can also be a stopper, a clamping protrusion, etc.

[0054] In another exemplary embodiment of the seat controller, Figure 5 As shown, the functional layer 3 further includes a diaphragm 37 provided on the second surface 12 of the substrate layer 1, and a touch sensor element 314 is provided on the diaphragm 37. The circuit board 31 can be connected to the diaphragm 37 through the connector 312 to be fixed on the second surface 12 of the substrate layer 1. The diaphragm 37 is provided with a touch sensor element 314, and the diaphragm 37 can be glued and fixed on the second surface 12. The second surface 12 of the substrate layer 1 is provided with a receiving groove 121, and the touch sensor element 314 is located in the receiving groove 121, so that the touch sensor element 314 can be attached to the substrate layer 1 to avoid protruding from the second surface 12 of the substrate layer 1. The touch sensor element 314 is closer to the decorative layer 2 and is easier to receive the user's touch signal, so as to monitor the change of the surface pressure of the decorative layer 2 and realize the corresponding function. The number of touch sensor elements 314 can be selected as needed.

[0055] exist Figure 7 In the embodiment shown, the touch sensor element 314 is directly disposed on the circuit board 31, and the connector 312 can be omitted. Figure 8 As shown, a contact column 124 is disposed on the second surface 12 of the substrate layer 1 to abut against the touch sensing element 314. The pressure of the user pressing the information mark 20 can be transmitted to the touch sensing element 314 through the contact column 124 for signal transmission, thereby monitoring the user's intention.

[0056] In order to fix the vibration element 313, a mounting groove 123 is provided on the second surface 12 of the substrate layer 1, and a vibration element 313 is provided on the circuit board 31, and the vibration element 313 is installed in the mounting groove 123. Figure 5 In the illustrated embodiment, the diaphragm 37 is provided with a positioning hole 371 for the limiting structure 122 to pass through and an opening 372 for avoiding the vibration element 313 , which will not affect the positioning installation of the circuit board 31 and the installation of the vibration element 313 .

[0057] The connector 312 may be disposed at the edge of the circuit board 31 to connect with the membrane 37. The connector 312 may be a flexible member that can transmit the signal of the touch sensor element 314 to the circuit board 31, and then to the vehicle controller to control the seat or sunroof, etc. The light emitting element 311, the capacitor element 315, etc. described above may all be disposed on the circuit board 31.

[0058] exist Figure 5 In the embodiment of the seat controller shown, the decorative layer 2 and the substrate layer 1 are first formed into an integral part by means of intramolecular injection molding, transfer printing or lamination, and then the diaphragm 37 with the touch sensor element 314 is laminated on the second surface 12 of the substrate layer 1. During the lamination process, the touch sensor element 314 is placed in the receiving groove 121, and then the vibration element 313 is placed in the mounting groove 123. Finally, the circuit board 31 is connected to the diaphragm 37 through the connecting piece 312, and the circuit board 31 is limited and fixed by the limiting structure 122 to complete the assembly of the smart surface structure.

[0059] In another exemplary embodiment of the present disclosure, Figures 9 to 15 As shown, a smart surface structure is provided, which includes a substrate layer 1 and a decorative layer 2 and a functional layer 3 respectively arranged on two opposite surfaces of the substrate layer 1, wherein the decorative layer 2, the substrate layer 1 and the functional layer 3 are an integrated structure. The decorative layer 2 and the functional layer 3 can be placed on the front and rear molds of the injection mold respectively, and low-pressure injection molding is performed between the front and rear molds to form an integrated structure.

[0060] The decorative layer 2 and the functional layer 3 are located on both sides of the substrate layer 1, which effectively increases the light-guiding distance of the light-emitting element 311 in the functional layer 3, allowing the light to be more evenly distributed on the decorative layer 2, making the brightness of the information mark 20 on the decorative layer 2 more uniform and clear. The three are designed as an integrated structure, which can effectively ensure the waterproof and dustproof function of the parts, improve the anti-oxidation ability, avoid the phenomenon of loose fixation after pasting and oxidation, reduce assembly steps, and improve assembly efficiency. The use of low-pressure injection molding technology can effectively reduce the impact of the substrate layer 1 on the electronic components 30 in the functional layer 3 during the molding process, and improve the yield of the molded product.

[0061] In this embodiment, taking the sunroof controller as an example, Fig.12As shown, the functional layer 3 has an electronic component 30 and a packaging portion 32 for covering the electronic component 30. The electronic component 30 can be at least one of the light-emitting element 311, the capacitor element 315, the resistor element, the inductor element, the touch sensor element 314, the sensor chip, and the silver paste circuit 316 introduced above. In order to avoid the base material from impacting the electronic component 30 in the functional layer 3 during the one-piece injection molding process, resulting in the risk of the electronic component 30 being deflected, the electronic component 30 in the functional layer 3 is first packaged before the injection molding. The electronic component 30 can be packaged by low-pressure injection molding or liquid silicone molding to avoid damage to the electronic component during the later injection molding process. Since the amount of base material used in the packaging process is significantly less than the amount of base material used in the three-in-one injection molding process, the early packaging process can effectively reduce the damage to the electronic component 30.

[0062] The light emitting element 311, the capacitor element 315, the sensor chip and the silver paste circuit 316 are designed in the functional layer 3, which can reduce the layout area of ​​the circuit board and the usage of the electronic components 30, and reduce the weight of the parts. The position and quantity of the multiple electronic components 30 in the functional layer 3 are not limited. Fig.13 As shown, the functional layer 3 has a capacitor element 315. There can be multiple capacitor elements 315 corresponding to the positions of the information marks 20 of the decorative layer 2. The multiple capacitor elements 315 can be arranged in a matrix, and a capacitor element 315 is provided between two adjacent light-emitting elements 311. Light-emitting elements 311 and capacitor elements 315 are provided on both sides of the touch sensing element 314. The specific arrangement and design can be carried out according to needs.

[0063] like Fig.12 As shown, the second surface 12 of the substrate layer 1 facing the functional layer 3 is provided with a groove 10 for avoiding the encapsulation part 32, which can ensure the integrity of the smart surface structure. The encapsulation part 32 will protrude from the surface of the functional layer 3, and during the integral injection molding, the second surface 12 of the substrate layer 1 will automatically form a groove 10 structure to ensure the integrity of the structure.

[0064] The functional layer 3 is provided with a mounting hole 35 for mounting the vibration element 313, and a mounting seat 36 is provided in the mounting hole 35, and the vibration element 313 can be fixed on the mounting seat 36. During the integral injection molding, the mounting position of the vibration element 313 can be avoided, the mounting hole 35 is reserved, and the mounting seat 36 is provided in the mounting hole 35, and then the vibration element 313 can be directly fixed on the mounting seat 36.

[0065] exist Figures 9 to 11 In the embodiment shown, the plurality of electronic components 30 in the functional layer 3 are first packaged to form Fig.13The functional layer 3 shown is then placed on the front and rear molds of the injection mold, and low-pressure injection molding is performed between the front and rear molds to form an integrated structure. Finally, the vibration element 313 is installed to complete the molding process of the smart surface structure.

[0066] In the above embodiment, the decorative layer 2 and the functional layer 3 may be separate patch layers. Fig.16 and Fig.17 , Fig.24 As shown, a smart surface structure is provided, which includes a decorative layer 2, a substrate layer 1 and a functional layer 3 which are sequentially stacked, wherein the decorative layer 2 includes a first film 21 and a pattern unit 220 disposed on the first film 21, and the functional layer 3 includes a second film 33 and an electronic component 30 fixed on the second film 33. The pattern unit 220 can be formed into a layer with the first film 21, and the pattern unit 220 can be printed on the first film 21, and formed into a desired shape by heating, pressurizing and vacuum adsorption, and then cut to form the decorative layer 2. In other embodiments, such as Fig.24 As shown, the pattern unit 220 can be formed as a separate layer to form the pattern layer 22, and the pattern unit 220 can be transferred and pasted on the first film 21 to form the decoration layer 2. Fig.24 As shown, a plurality of electronic components 30 can be welded and fixed on the second diaphragm 33 in sequence to form a functional layer 3. In other embodiments, as shown in FIG. Fig.17 As shown, multiple electronic components 30 can also form an electronic component layer 34, and the electronic component layer 34 can be a film layer with multiple electronic components 30 and fixed on the second film 33 through processes such as solder paste printing, patching, and welding to form a functional layer 3. The first film 21 and the second film 33 can be PMMA+PC films, PET films, PPA films, etc. Here, the pattern layer 22 can be understood as the inner surface of the decorative layer 2 introduced above, and the information mark 20 is set on the pattern layer 22. The information mark 20 is formed by printing with light-transmitting ink, and light-shielding ink is printed at other positions. The first film 21 can be the outer surface of the decorative layer 2, and the outer surface is coated with a texture or fabric consistent with the surface to be installed of the smart surface structure. The electronic component 30 can also be at least one of the light-emitting element 311, capacitor element 315, resistor element, inductor element, touch sensor element 314, sensor chip, and silver paste circuit 316 introduced above, which will not be repeated here. Whether the decorative layer 2 and the functional layer 3 are separately pasted or printed on the corresponding film, they are applicable to the technical solution of separately pasting the functional layer 3 described above, and also to the technical solution of pre-encapsulating the functional layer 3 and then integrally injecting the decorative layer 2.

[0067] like Fig.16As shown, the pattern layer 22 is located between the first film 21 and the substrate layer 1, and the electronic component layer 34 is located between the second film 33 and the substrate layer 1. The first film 21 of the pattern layer can be a uniform light film, which is conducive to the light of the light emitting element 311 being uniformly irradiated to the pattern layer 22.

[0068] Some electronic components 30 are protruding from the electronic component layer 34, and a groove 10 for avoiding the electronic components 30 is provided on the surface of the substrate layer 1 facing the functional layer 3. The substrate layer 1 performs air avoidance treatment on the electronic components 30 in the functional layer 3, which can reduce the impact on the electronic components 30 in the functional layer 3. At the same time, the thickness and shape of the substrate layer 1 are controllable, which can reduce the difficulty of arranging multiple electronic components 30 in the functional layer 3.

[0069] In another exemplary embodiment of the present disclosure, Fig.19 As shown, a smart surface structure is provided, which includes a decorative layer 2, a substrate layer 1 and a functional layer 3 which are sequentially stacked, wherein the functional layer 3 is provided with a light-emitting element 311, and the decorative layer 2 is provided with a light-distributing film 4, and the emitted light of the light-emitting element 311 is uniformly applied to the decorative layer 2 through the substrate layer 1 and the light-distributing film 4. Here, it should be noted that "uniform" means that the multiple information marks 20 on the decorative layer 2 can be clearly displayed, and there will be no problem of highlighting at a certain position and being dark or blurred at another position, and the brightness of each information mark 20 is consistent. The present disclosure includes an embodiment in which the decorative layer 2 and the functional layer 3 are separate patch layers, and also includes an embodiment described below in which the decorative layer 2 includes a first film 21 and a pattern unit 220 arranged on the first film 21, and the functional layer 3 includes a second film 33 and an electronic component 30 arranged on the second film 33. In this embodiment, the decorative layer 2 and the functional layer 3 can be sealed by integrated low-pressure injection molding, and the molten plastic is filled into the cavity of the IME structural injection molding bracket by a low-pressure injection molding machine at a very low injection pressure (1.5-40 bar), and the molten plastic is solidified to form a low-pressure injection molding block (5-50 seconds), and the low-pressure injection molding block completely fills the empty cavity inside the IME injection molding bracket, thereby achieving waterproof sealing of the gap between the low-pressure injection molding block (i.e., the substrate layer 1), the functional layer 3 and the decorative layer 2. In other embodiments, the decorative layer 2 can be injection molded with the substrate layer 1, and the functional layer 3 is fixed by post-pasting, which all belong to the protection scope of the present disclosure.

[0070] In the smart surface structure provided in the present disclosure, adding a light-homogenizing film 4 in the decorative layer 2 can improve the light-channeling problem, increase the light-guiding uniformity of the light-emitting element 311 in the functional layer 3, enhance the light penetration effect, and form good light uniformity performance.

[0071] like Fig.19As shown, the decorative layer 2 includes a first film 21 and a pattern unit 220 disposed on the first film 21. The pattern unit 220 can be a separate pattern layer 22 or printed on the first film 21. In the embodiment mentioned above, the pattern layer 22 is disposed between the first film 21 and the substrate layer 1, and the light-distributing film 4 is disposed on the pattern layer 22. The functional layer 3 includes a second film 33 and an electronic component 30 disposed on the second film 33. In the embodiment in which the electronic component 30 forms a separate electronic component layer 34, the electronic component layer 34 is disposed between the second film 33 and the substrate layer 1, and the light-emitting element 311 is disposed on the electronic component layer 34. Here, the light-distributing film 4 can be disposed inside the pattern layer 22. Both can be formed by injection molding or can be glued and fixed to the bottom surface of the pattern layer 22. The present disclosure does not limit this. The electronic component 30 can be placed on the second film 33 and fixed on the second film 33 by processes such as solder paste printing, patching, and welding.

[0072] The light-homogenizing film 4 may be of any appropriate structure. It may be a separate film with a uniform light-guiding function. Fig.21 As shown, in the present disclosure, the light-homogenizing film 4 includes a first atomized film 41, a polarized brightness enhancement film 43, and a second atomized film 42 which are sequentially stacked, and the first atomized film 41 is attached to the surface of the pattern layer 22 away from the first film 21. The first atomized film 41 and the second atomized film 42 can be atomized PC films. Adding two layers of atomized PC films and embedding the polarized brightness enhancement film 43 between the two layers of atomized PC films can improve the light channeling problem and increase the light guiding uniformity of the light-emitting element 311 in the functional layer 3. The first atomized film 41 can be arranged on the light-emitting side of the second atomized film 42. The polarized brightness enhancement film 43 can adopt a reflective polarized brightness enhancement film, which can continuously repeat the S-wave reflection and the P-wave penetration to enhance the brightness. The reflective polarizing brightening film 43 is located between the light emitting element 311 and the substrate layer 1. When light passes through the polarizing brightening film 43, the P polarized light can directly penetrate the polarizing brightening film 43, while most of the S polarized light is reflected back to the light emitting element 311 by the polarizing brightening film 43. During the reflection process, the S polarized light will pass through the various layers of materials between the polarizing brightening film and the light emitting element 311, thereby being depolarized and becoming fully polarized light (P polarized light + S polarized light) and then re-emitted from the light emitting element 311, so as to be recycled to achieve the effect of increasing the brightness.

[0073] A haze layer 40 is disposed on the surface of the first haze film 41 facing the polarized brightness enhancement film 43 and / or on the surface of the second haze film 42 facing the polarized brightness enhancement film 43. That is, a haze layer 40 may be disposed on the light incident side of the first haze film 41 and the light emitting side of the second haze film 42.

[0074] like Fig.21As shown, the atomized layer 40 can be a bulge structure protruding on the corresponding surface, and the bulge structure can be a plurality of bulge structures arranged side by side, and the inner diameters of the plurality of bulge structures are different and the sizes are arranged in a staggered manner. The atomized layer 40 includes bulge structures of different sizes, and the larger bulge structure and the smaller bulge structure are staggered on the two layers of atomized PC film. This structure can be made of a protruding bulge structure using a liquid optical resin with a low refractive index, and then cured by ultraviolet light. When light passes through the bulge structure, it will scatter to produce an atomization effect, making the light distribution more uniform. The surface roughness of the bulge structure is Ra0.8-2.0, forming an atomization effect and achieving optical haze.

[0075] like Fig. 20 As shown, the electronic components 30 of the electronic component layer 34, such as the light emitting component 311, the vibration component 313 and the silver paste circuit 316, are protrudingly arranged, and the surface of the substrate layer 1 facing the functional layer 3 is provided with a groove 10 for avoiding the electronic components. The number, shape and position of the groove 10 can be designed according to the shape and position of the electronic components to be avoided, and can be rectangular, circular, etc., and the depth of the groove 10 can be different. The substrate layer 1 is formed during low-pressure injection molding, so the groove 10 for avoiding is also formed during low-pressure injection molding.

[0076] In addition, in this embodiment, the information mark 20 mentioned above can be arranged on the pattern layer 22, or on the light-distributing film 4, which can also achieve the hidden effect of the information mark 20. No repeated introduction is made here.

[0077] In an exemplary embodiment of the present disclosure, a method for processing a smart surface structure is provided, such as Fig. 22 As shown, the processing method includes: step 401, forming a decorative layer 2 with a light-homogenizing film 4; step 402, forming a functional layer 3; and step 403, low-pressure injection molding the decorative layer 2 and the functional layer 3 into one piece.

[0078] In the processing method provided in the present disclosure, a low-pressure injection molding integrated molding process is adopted to improve the overall waterproof performance. During the injection molding process, the injection thickness of the substrate layer 1 is controlled by controlling the injection pressure, hot melt adhesive material, etc. to achieve distance control, which is convenient for designing the light guiding structure and light guiding method to avoid the light channeling phenomenon common in the IME process.

[0079] In this disclosure, Fig.23As shown, step 401 includes: step 4011, pasting and fixing the light-distributing film 4 on the first surface of the pattern layer 22, step 4012, printing and fixing the second surface of the pattern layer 22 on the first film 21, and the first surface and the second surface are arranged relative to each other. The light-distributing film 4 is fixed on the pattern layer 22 by pasting, and the pattern layer 22 is fixed on the first film 21 by printing, so as to form the decorative layer 2 with the light-distributing film 4. In the embodiment where the decorative layer 2 is a separate patch layer, the light-distributing film 4 can be directly pasted and fixed on the inner surface of the decorative layer 2.

[0080] Step 402 includes, step 4021, fixing the electronic component 30 on the second diaphragm 33, and the electronic component 30 can be fixed on the second diaphragm 33 by pasting or welding. The electronic component 30 can also be at least one of the light-emitting element 311, the capacitor element 315, the resistor element, the inductor element, the touch sensor element 314, the sensor chip, and the silver paste circuit 316 introduced above, and the present disclosure does not limit this.

[0081] Step 403 includes: placing the decorative layer 2 on the first mold; placing the functional layer 3 on the second mold; and step 4033, buckling the first mold and the second mold together, and performing low-pressure injection molding from the injection port of the first mold. The low-pressure injection molding process is a packaging method that uses a very low injection pressure, usually 1.5-40 bar, to inject the packaging material into the mold and quickly solidify and mold (5-50 seconds). It can avoid electronic components such as the light-emitting element 311 from being offset during high-pressure injection molding, and the substrate layer 1 from impacting the light-emitting element 311, causing uneven light conductivity and a decrease in yield. The injection pressure of low-pressure injection molding will not damage the electronic components 30, and the electronic components 30 are not easily displaced or damaged during the injection molding process, thereby improving production efficiency and reducing product failure rate; the outer surface after molding and injection molding is not affected by the electronic circuit and the original device, and will not cause embossing of the circuit and component pins; the heat is also more uniform, avoiding surface shrinkage.

[0082] In the existing IME, it includes: step 1, first print the pattern layer and the circuit on the film or plate; step 2, print or use a dispenser to dispense low-temperature solder paste or conductive glue, patch, furnace welding and other SMT patch processes; step 3, heat, pressurize and vacuum adsorb to form the film into the required shape; step 4, cut the shape required by the design; step 5, manually or mechanically put the film into the mold cavity; step 6, inject the resin into the mold and thermoform it with the film. In step 2, since the diaphragm is not resistant to high temperature and is easy to deform at high temperature, it is necessary to use low-temperature solder paste or conductive glue to weld the components. The furnace temperature is usually controlled below 150°C during welding, which causes the components to be not firm enough after welding and easy to fall off, resulting in a decrease in yield. In step 6, during the injection molding process, the components are often displaced or fall off due to the large injection shear stress. In addition, due to the use of one-piece injection molding, the luminous components cannot be made into light-guiding or light-isolating structures, resulting in uneven luminescence and light leakage.

[0083] To solve the problem that some components are easily displaced and not firmly fixed, such as Fig.25 As shown, the present disclosure provides a smart surface packaging structure, which includes a diaphragm (not shown in the figure), an electronic component 30 arranged on the diaphragm, and a packaging plastic material 5 for fixing the electronic component 30 on the diaphragm, a dam 50 is provided on the periphery of the electronic component 30, and the packaging plastic material 5 is filled to the outside of the dam 50 and is divided into a light-transmitting area 51 and a light-isolating area 52.

[0084] It should be noted here that the electronic component 30 here can be the various electronic components in the functional layer 3 introduced above, and can be a light-emitting element 311, a capacitor element 315, a resistor element, an inductor element, a touch sensor element 314, a vibration element 313, a sensor chip, etc., and can be any appropriate component pre-fixed on the diaphragm to be packaged, and the electronic component 30 can be pre-welded and fixed on the diaphragm.

[0085] The dam 50 is constructed around the electronic component 30 . Before packaging, a circle of dam glue is first applied around the electronic component 30 to form the dam 50 . The dam 50 can effectively protect the electronic component 30 in the dam 50 from being affected by the packaging plastic material 5 during packaging.

[0086] When encapsulating, the diaphragm to be encapsulated can be placed in the first low-pressure injection mold, and the low-pressure injection molding machine is started. The light-isolating low-pressure injection molding encapsulation plastic material is injected into the first low-pressure injection mold and filled to the predetermined position. After the light-isolating plastic material is solidified in the mold, the diaphragm is taken out. At this time, a light-isolating area 52 is formed at a part of the diaphragm. Afterwards, the diaphragm is placed in the second low-pressure injection mold, and the low-pressure injection molding machine is started. The light-transmitting low-pressure injection molding encapsulation plastic material is injected into the second low-pressure injection mold and filled to at least the light-emitting surface of the light-emitting element 311. The light-transmitting plastic material is solidified in the mold, and the diaphragm is taken out. The diaphragm encapsulation is completed. Of course, the light-transmitting encapsulation plastic material can also be injected first, and then the light-isolating encapsulation plastic material can be injected. That is, there is no restriction on the order of encapsulation to form the light-isolating area 52 and the light-transmitting area 51. The encapsulation steps here are for Fig.23 The specific definition of step 4021 shown is that after the electronic component is fixed on the second film, before the final low-pressure injection molding step, the packaging step described above can be performed. In addition, the position and number of the light-isolating area 52 and the light-transmitting area 51 formed on the outer side of the dam 50 are not limited, and can be specifically designed according to the shape of the dam 50 and the light-guiding requirements. Taking the outer contour of the dam 50 as a rectangle as an example, any one or more sides can be filled with the light-transmitting area 51, and the remaining sides can be filled with the light-isolating area 52.

[0087] In the smart surface packaging structure provided by the present disclosure, the electronic component 30 can be pre-fixed on the diaphragm by welding with low-temperature solder paste or conductive glue, and then encapsulated and fixed by the encapsulating plastic material 5, which can play a reinforcing role, so that the electronic component will not be displaced or fall off during the injection molding process of the last step of IME. Before encapsulation, a dam 50 is set around the periphery of the electronic component 30 to avoid the influence of the encapsulating plastic material 5 on the electronic component 30 in the dam 50. During encapsulation, the light-isolating encapsulating plastic material and the light-transmitting encapsulating plastic material are encapsulated separately, and the light-transmitting area 51 and the light-isolating area 52 are formed at the predetermined position, which can play the role of light guiding and light isolating, solve the problem of light crosstalk, and ensure that the light output is more uniform.

[0088] In the present disclosure, the electronic component 30 may include a light-emitting element 311 and a non-light-emitting element 53. The non-light-emitting element 53 may be the inductor element, resistor element, capacitor element 315, vibration element 313, etc. mentioned above. At least a light-transmitting area 51 is provided corresponding to the light-emitting surface of the light-emitting element 311 to ensure that the emitted light of the light-emitting element 311 can be emitted outward through the light-transmitting area 51. The light-isolating area 52 may be filled to the periphery of the non-light-emitting element 53, the non-light-emitting surface of the light-emitting element 311, and the non-light-transmitting position. The light-transmitting area 51 may be filled to the light-emitting surface and other light-transmitting positions of the light-emitting element 311. Taking the light-emitting element 311 as an example, the cross section is a square. Fig.25 As shown, only one side may be a light-emitting surface, the light-emitting surface is filled with a light-transmitting area 51, and the other three sides are filled with light-isolating areas 52. Fig.26and Fig. 27 As shown, the non-luminous element 53 is surrounded by the light-isolating area 52, and the surface of the luminous element 311 opposite to the light-isolating area 52 is filled with the light-transmitting area 51. The first low-pressure injection mold and the second low-pressure injection mold can be designed according to the requirements of light transmission and light isolation, and the light-transmitting area 51 and the light-isolating area 52 are formed at corresponding positions respectively. In the embodiment provided by the present disclosure, the luminous surface of the luminous element 311 can be the surface facing the pattern unit in the decorative layer, and the surface of the luminous element 311 away from the pattern unit can be the non-luminous surface, so as to ensure that the light beam of the luminous element 311 can be irradiated onto the pattern unit, so as to realize the display function of the information mark 20.

[0089] The packaging plastic material 5 can be made of polyamide (PA), polyolefin (PO), polyurethane (PU), polycarbonate (PC) and the like. The packaging plastic material 5 corresponding to the light-transmitting area 51 contains scattering particles to form a light-transmitting low-pressure injection molding packaging plastic material. The packaging thickness of the packaging plastic material 5 can be 0.5-1.5 mm.

[0090] Correspondingly, if Fig.26 and Fig. 27 As shown, the present disclosure provides a smart surface structure, which includes a decorative layer 2, a substrate layer 1 and a functional layer 3 which are stacked, and the functional layer 3 includes the smart surface packaging structure provided by the present disclosure.

[0091] In an exemplary embodiment of the present disclosure, Fig.26 As shown, the pattern unit of the decorative layer 2 and the electronic component 30 of the functional layer 3 can be located on a substrate film 60, and the smart surface structure includes the substrate film 60 and the pattern unit, the conductive circuit and the electronic component 30 arranged on the substrate film 60. In this embodiment, the pattern unit, the conductive circuit and the electronic component can be configured as a separate pattern layer 22, a conductive circuit layer 38 and an electronic component layer 34, respectively, and the pattern layer 22, the conductive circuit layer 38 and the electronic component layer 34 are stacked in sequence and located between the substrate film 60 and the substrate layer 1. The conductive circuit layer 38 described here and below can include a conductive circuit, a touch electrode and a pad. The pattern layer 22, the conductive circuits of the conductive circuit layer 38, the touch electrodes, and the pads can be printed on the substrate film 60, and the electronic components 30 are fixed by conductive silver glue or low-temperature solder paste welding. The film after patching is placed in a forming and punching machine for forming and punching to form the film to be packaged mentioned above, which is placed in the first low-pressure injection mold and the second low-pressure injection mold in turn. The low-pressure injection molding machine is used to inject the low-pressure injection packaging plastic material into the mold and quickly solidify it, and the light-transmitting area 51 and the light-isolating area 52 are encapsulated to complete the reinforcement of the electronic components 30, etc. Finally, the packaged film is placed in the inner cavity of the injection mold, and the molten plastic material is injected into the mold to form the substrate layer 1, and the IME product is completed.

[0092] In another exemplary embodiment of the present disclosure, Fig. 27 As shown, the decorative layer 2 includes a first film 21 and a pattern unit disposed on the first film 21, and / or the functional layer 3 includes a second film 33 and a conductive circuit and an electronic component 30 disposed on the second film 33. In this embodiment, the pattern unit is configured as a separate pattern layer 22, and the pattern layer 22 is located between the first film 21 and the substrate layer 1. The conductive circuit and the electronic component 30 are respectively configured as separate conductive circuit layers 38 and electronic component layers 34, which are stacked in sequence and located between the substrate layer 1 and the second film 33. The pattern layer 22 can be printed on the first film 21, and the decorative layer 2 can be placed in a molding and punching machine for molding and punching to form the decorative layer 2; the conductive circuit layer 38 can be printed on the second film 33, and the electronic components 30 can be soldered using conductive silver glue or low-temperature solder paste. The film after mounting can be placed in a molding and punching machine for molding and punching, and then placed in the inner cavities of the first low-pressure injection mold and the second low-pressure injection mold in turn. The low-pressure injection molding machine can be used to inject the low-pressure injection packaging plastic material into the mold and quickly solidify it to form the functional layer 3. Finally, the decorative layer 2 and the functional layer 3 are placed in the inner cavity of the injection mold, and the molten plastic material is injected into the mold to complete the IME product. About Fig.26 and Fig. 27 In the two embodiments, the decorative layer 2 and the functional layer 3 are in the form of a single-layer patch layer or in the form of a pattern layer 22 and an electronic component layer 34 are separately arranged on the film. Fig.16 and Fig.17 The embodiments mentioned in are similar and will not be repeated here.

[0093] In the present disclosure, a light-isolating area 52 is provided between the light-transmitting areas 51 of two adjacent light-emitting elements 311 in the functional layer 3, which can effectively solve the problem of light crosstalk. By arranging and adjusting the light-transmitting area 51 and the light-isolating area 52, a uniform light-emitting effect can be achieved.

[0094] In addition, in the present disclosure, a low-pressure injection molding process is used to encapsulate the diaphragm, and the encapsulation plastic material is injected into the mold at a very low injection pressure, usually 1.5-40 bar, and quickly solidified (5-50 seconds). Low-pressure injection molding is a process between potting and high-pressure injection molding. Compared with other potting processes, low-pressure injection molding can improve the performance of terminal products. The pressure during injection is extremely low, and it will not cause damage to components. It has low temperature and low defective rate, and has the advantages of sealing, waterproof, moisture-proof, shock-absorbing, insulation and flame retardancy.

[0095] According to an embodiment of the present disclosure, a vehicle is provided, the vehicle comprising the smart surface structure described above or the smart surface structure formed by the processing method of the smart surface structure described above. The smart surface structure can be any appropriate functional surface structure in the vehicle interior, not limited to the seat controller and the sunroof controller. The vehicle has all the beneficial effects of the above-mentioned smart surface structure and processing method, which will not be described in detail here.

[0096] According to an embodiment of the present disclosure, an electronic device is provided, the electronic device comprising the smart surface structure described above. Here, the electronic device can be an electronic device in other fields besides the vehicle field, such as a television, a mobile phone, a watch, a computer, a headset, etc., and can also be an electronic device on a vehicle, such as a central control display screen, etc., to achieve the hidden effect of a physical button. The electronic device has all the beneficial effects of the above-mentioned smart surface structure and processing method, and no further elaboration is made here.

[0097] The preferred embodiments of the present disclosure are described in detail above in conjunction with the accompanying drawings; however, the present disclosure is not limited to the specific details in the above embodiments. Within the technical concept of the present disclosure, a variety of simple modifications can be made to the technical solution of the present disclosure, and these simple modifications all fall within the protection scope of the present disclosure.

[0098] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable manner without contradiction. In order to avoid unnecessary repetition, the present disclosure will not further describe various possible combinations.

[0099] In addition, various embodiments of the present disclosure may be arbitrarily combined, and as long as they do not violate the concept of the present disclosure, they should also be regarded as the contents disclosed by the present disclosure.

Claims

1. A smart surface structure, characterized in that: The smart surface structure comprises a decorative layer, a substrate layer and a functional layer which are stacked in sequence, wherein the functional layer is provided with a light-emitting element, and the decorative layer is provided with a light-distributing film. The emitted light of the light-emitting element is uniformly applied to the decorative layer via the substrate layer and the light-distributing film.

2. The smart surface structure according to claim 1, characterized in that: The decorative layer includes a first film and a pattern unit provided on the first film; and / or The functional layer includes a second membrane and an electronic component disposed on the second membrane.

3. The smart surface structure according to claim 2, characterized in that: The pattern unit is configured as a separate pattern layer, and the pattern layer is disposed between the first film and the light-homogenizing film.

4. The smart surface structure according to claim 2, characterized in that: The electronic component is configured as a separate electronic component layer, and the electronic component layer is disposed between the second film and the substrate layer.

5. The smart surface structure according to any one of claims 1 to 4, characterized in that: The light-homogenizing film comprises a first atomizing film, a polarizing brightness enhancement film, and a second atomizing film which are sequentially stacked, and the first atomizing film is attached to the surface of the decorative layer close to the substrate layer.

6. The smart surface structure according to claim 5, characterized in that: A surface of the first atomized film facing the polarized brightness enhancement film and / or a surface of the second atomized film facing the polarized brightness enhancement film are provided with an atomized layer.

7. The smart surface structure according to claim 6, characterized in that: The atomization layer is a bulge structure protruding from the corresponding surface. There are multiple bulge structures arranged side by side. The sizes of the multiple bulge structures are different and the sizes are arranged in a staggered manner.

8. The smart surface structure according to claim 2, characterized in that: A surface of the substrate layer facing the functional layer is provided with a groove for avoiding the electronic component.

9. The smart surface structure according to claim 2, characterized in that: The pattern unit is an information mark provided on the first film or the light-homogenizing film, and the information mark has: In the off state, the information mark is not displayed, and the decorative layer is consistent with the surface to be installed of the smart surface structure; In the awake state, the information mark is lit, and touching the information mark can trigger a preset action.

10. The smart surface structure according to claim 9, characterized in that: The decoration layer has an inner surface and an outer surface. The information mark on the inner surface is printed by light-transmitting ink, and other areas on the inner surface except the information mark are printed with light-shielding ink.

11. The smart surface structure according to claim 10, characterized in that: The outer surface of the decorative layer is provided with a texture consistent with the surface to be installed of the smart surface structure.

12. A method for processing a smart surface structure, characterized in that: The processing method is used to manufacture the smart surface structure according to any one of claims 1 to 11, and the processing method comprises: Forming a decorative layer with a light-homogenizing film; forming a functional layer; and The decorative layer and the functional layer are integrally formed by low-pressure injection molding.

13. The method for processing the smart surface structure according to claim 12, characterized in that: The step of forming a decorative layer with a light-homogenizing film comprises: The light-homogenizing film is adhered and fixed on the first surface of the pattern layer; The second surface of the pattern layer is printed and fixed on the first film, and the first surface and the second surface are arranged opposite to each other.

14. The method for processing the smart surface structure according to claim 12, characterized in that: The step of forming the functional layer comprises: Fixing the electronic components on the second film to form a film to be packaged; The film to be packaged is packaged.

15. The method for processing the smart surface structure according to claim 14, characterized in that: The step of packaging the film to be packaged comprises: Placing the film to be packaged in a first low-pressure injection mold, injecting a light-isolating packaging plastic material to form a light-isolating area on the second film; and The film to be packaged is placed in a second low-pressure injection mold, and a light-transmitting packaging plastic material is injected to form a light-transmitting area on the second film.

16. The method for processing the smart surface structure according to claim 15, characterized in that: The order of the step of forming the light-isolating area and the step of forming the light-transmitting area may be interchanged.

17. The method for processing the smart surface structure according to claim 14, characterized in that: The step of low-pressure integral injection molding of the decorative layer and the functional layer comprises: placing the decorative layer on the first mold; placing the functional layer on a second mold; The first mold and the second mold are buckled together, and low-pressure injection molding is performed from the injection port of the first mold.

18. An electronic device, characterized in that: The smart surface structure comprises the smart surface structure described in any one of claims 1 to 11.

19. A vehicle, characterized in that: The invention comprises the smart surface structure according to any one of claims 1 to 11, or the electronic device according to claim 18.

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