Detection system and method of pressure sensor

Abstract

The invention discloses a detection system and method for a pressure sensor. The detection system comprises a detection table and an upper computer which are in communication connection with each other, a plurality of sensor sockets are arranged on the upper surface of the detection table, and the sensor sockets are connected with pressure sensor cores in an MEMS processing stage or a primary packaging stage; a detection circuit is arranged in the detection table, supplies power to the sensor socket and collects parameter signals of a pressure sensor core connected to the sensor socket; and the upper computer issues a detection instruction to the detection table, receives a parameter signal of the pressure sensor core collected by the detection table, and judges the quality of the pressure sensor core. According to the pressure sensor, quality detection of the pressure sensor is carried out in an MEMS processing stage or a primary packaging stage, specific manufacturing defects are judged and analyzed by detecting core parameters such as a bridge of the pressure sensor and a temperature measurement thermal resistance signal, and the defective pressure sensor is returned to a furnace for remanufacturing, so that the quality is improved, the cost is reduced, the loss is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of sensor detection technology, and in particular to a detection system and method for a pressure sensor. Background Art

[0002] With the development of miniaturized sensor technology, more and more domestic instrument manufacturers have realized independent research and development of miniaturized pressure sensors, and have the research and development capabilities from principle design to primary packaging of MEMS pressure sensors and then to secondary packaging. The process of sensor production has become mature. And after mass production and sufficient field applications, it has rich experience in design, production and debugging. In addition to winning a large part of user recognition and market share, it has greatly accelerated the process of localization substitution of pressure sensors and improved the competitiveness of independent brands in the field of pressure sensors. In the whole process, the testing of pressure sensors is a very important link. Through testing, it is verified whether the performance indicators of pressure sensors meet the requirements, so as to make a qualified judgment on the quality of pressure sensors. At present, the detection of pressure sensors mainly includes: automated equipment that detects the key dimensions of sensors; automated equipment that changes the sensor state and output by applying pressure; or automated equipment that collects and analyzes sensor output signal data. However, these types of detection methods are all performed after the pressure sensor is processed into a finished product. After the detection at this stage, the finished products that do not meet the quality standards can only be scrapped and cannot be re-melted. The loss cost of the sensor is high and the scrapping of the pressure sensor will affect the actual production efficiency.

[0003] The "A detection system and detection method for the pressure detection accuracy of a pressure sensor" disclosed in the Chinese patent literature has a publication number of CN117686139A and a publication date of 2024-03-12. The system includes: a detection box, which is respectively provided with an air inlet and an air outlet with a valve, and an installation port for installing the pressure sensor to be detected; a pressure regulating device, which is connected to the detection box through the air inlet, and is used to increase or decrease the pressure in the detection box; a standard pressure sensor, which is installed in the detection box, and is used to monitor the air pressure in the detection box to obtain the real air pressure in the detection box; a data processing module; used to send a control signal; a data acquisition module, which collects the data detected by the standard pressure sensor and the pressure sensor to be detected; a control module, which is electrically connected to the valve and the pressure regulating device, respectively, to control the valve or the pressure regulating device. The present invention solves the problem of low efficiency in the pressure detection of the pressure sensor in the prior art. However, this technology still requires testing after the pressure sensor is processed into a finished product. Finished products that fail the test can only be scrapped and cannot be re-melted. The loss cost of the sensor is high and the scrapping of the pressure sensor will affect the actual production efficiency. Summary of the invention

[0004] The present invention aims to overcome the problems in the prior art that the pressure sensor is tested after it is processed into a finished product, and the finished products with unqualified test quality can only be scrapped and cannot be re-melted, the loss cost of the sensor is high, and the scrapping of the pressure sensor will affect the actual production efficiency. A pressure sensor detection system and method are provided.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A pressure sensor detection system includes a detection platform and a host computer that are communicatively connected to each other; A plurality of sensor sockets are arranged on the upper surface of the detection table, and the sensor sockets are connected to the pressure sensor cores in the MEMS processing stage or the primary packaging stage; The detection platform is provided with a detection circuit inside, the detection circuit supplies power to the sensor socket and collects parameter signals of the pressure sensor core connected to the sensor socket; The host computer issues a detection instruction to the detection platform, receives parameter signals of the pressure sensor core collected by the detection platform, and determines the quality of the pressure sensor core.

[0006] In the present invention, the pressure sensor is quality inspected during the MEMS processing stage or the primary packaging stage. The quality of the pressure sensor is judged by detecting core parameters such as the pressure sensor bridge and the temperature measuring thermistor signal, and the specific manufacturing defects of the pressure sensor are analyzed, so as to timely discover and avoid problems in the early stage of the production and manufacturing of the pressure sensor, and the pressure sensor with problems can be re-melted. Compared with the prior art that the finished pressure sensor cannot be re-melted for re-manufacturing after the pressure sensor with problems is inspected, the quality can be effectively improved, the cost can be reduced, the loss can be reduced, and the production efficiency of the pressure sensor can be improved.

[0007] Preferably, the detection circuit comprises a control chip and a latch displacement unit connected to each other, the latch displacement unit is connected to a relay switch unit, and the relay switch unit is connected to a sensor socket; The detection circuit also includes a power management unit, which converts the external power supply and provides it to the control chip and the latch displacement unit, and supplies power to the corresponding sensor socket through the relay switch unit.

[0008] Preferably, the detection circuit further comprises a communication unit which is communicatively connected to the control chip, and the communication unit is communicatively connected to the host computer; The signal acquisition port of the sensor socket is correspondingly connected to the signal acquisition pin of the control chip. The parameter signal of the pressure sensor core is fed back to the control chip through the sensor socket and then sent to the host computer through the communication unit.

[0009] Preferably, the signal acquisition port of the sensor socket comprises: The first signal terminal is connected to the positive voltage output terminal of the bridge of the pressure sensor to collect the positive voltage signal of the bridge; The second signal terminal is connected to the negative voltage output terminal of the bridge of the pressure sensor to collect the negative voltage signal of the bridge; The third signal terminal is connected to the temperature resistance voltage output terminal of the pressure sensor to collect the temperature voltage signal.

[0010] Preferably, the relay switch unit is an optocoupler relay switch, and one sensor socket is connected to two optocoupler relay switches; One optocoupler relay switch corresponds to the first signal terminal and the second signal terminal of the sensor socket; the other optocoupler relay switch corresponds to the third signal terminal of the sensor socket.

[0011] Preferably, the detection circuit further comprises a reset unit, which is powered by a power management unit and connected to the control chip.

[0012] A method for detecting a pressure sensor, comprising: Select the pressure sensor core at the MEMS processing stage or the primary packaging stage and connect it to the sensor socket; The host computer issues sensor detection instructions and receives parameter signals of the pressure sensor core collected by the detection platform; The parameter signal is compared with a preset parameter threshold to determine the quality of the pressure sensor core.

[0013] Preferably, the host computer sends the sensor detection instruction including: The host computer sends a power switch instruction to the control chip for the pressure sensor on the selected sensor socket; The control chip supplies power to the corresponding sensor socket by controlling the relay switch and sends a response to the host computer; After receiving the response, the host computer sends a signal acquisition instruction to the control chip to collect parameter signals of the pressure sensor core.

[0014] Preferably, the parameter signal of the pressure sensor core includes: a bridge positive voltage signal and a bridge negative voltage signal, which are compared with a preset voltage threshold to detect the quality or welding condition of the bridge in the pressure sensor core; The temperature voltage signal is converted into a resistance value and compared with the preset resistance threshold to detect the quality of the temperature resistor or the welding condition.

[0015] Preferably, the quality of the pressure sensor core is determined, the defective object is determined, the pressure sensor core is remelted and remanufactured, and the pressure sensor core is retested after the defective object is replaced.

[0016] The present invention has the following beneficial effects: quality inspection of the pressure sensor is performed during the MEMS processing stage or the primary packaging stage of the pressure sensor, the quality of the pressure sensor is judged by detecting core parameters such as the pressure sensor bridge and the temperature measuring resistance signal, and specific manufacturing defects of the pressure sensor are analyzed, so as to timely discover and avoid problems in the early stage of the production and manufacturing of the pressure sensor, and the pressure sensor with problems is re-melted and remanufactured, thereby improving quality, reducing costs and losses, and improving the production efficiency of the pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of a detection circuit in a pressure sensor detection system of the present invention.

[0018] Figure 2 It is a schematic diagram of the upper surface of a detection table in the pressure sensor detection system of the present invention.

[0019] Figure 3 It is a connection diagram of the pressure sensor core in the present invention.

[0020] Figure 4 This is a flow chart of the sensor detection in the present invention.

[0021] In the figure: 1. test bench; 11. sensor socket; 2. pressure sensor core. DETAILED DESCRIPTION

[0022] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0023] At present, the detection of pressure sensors mainly includes: automated equipment that detects the key dimensions of sensors; automated equipment that changes the sensor state and output by applying pressure; or automated equipment that collects and analyzes sensor output signal data.

[0024] The first type of automated equipment is used to detect the key dimensions of sensors. The purpose of this type of equipment is to detect the key dimensions that affect the quality of the sensor (such as the inner diameter of the sensor). This type of detection method generally starts after the sensor is basically installed as a whole, and the parameters related to the mechanical structure are detected, and the core parameters cannot be touched. In case of a fault inside the sensor and the structural dimensions are qualified, the fault can only be discovered in the next few production links, and it must basically be treated as a defective product. This type of equipment is conducive to controlling the stability of the mechanical structure parameters of the sensor and ensuring that the sensor can be correctly installed and matched, but it cannot fundamentally guarantee the performance and stability of the sensor.

[0025] The second type is automated equipment that uses pressure to change the state and output of the sensor as a detection method. The function of this type of equipment is to pressurize the pressure sensor in advance and feedback data, and then analyze the quality of the sensor by identifying the data. This detection method can identify the performance of the sensor earlier in the production process, and can be promptly re-melted after problems occur. However, the sensor feedback data that can be collected is limited, and it can only be judged that the sensor is abnormal, but the root cause of the abnormality still needs manual analysis and verification, which is also time-consuming and labor-intensive.

[0026] The third type of automated equipment is to collect and analyze sensor output signal data as a detection method. This type of equipment can perform batch detection and data analysis on sensors during the basic formation stage of the sensor. By establishing a standard sensor database and comparing the inspection data with the standard data to generate a difference, the performance of the pressure sensor is judged by analyzing the difference in sensor data in each detection cycle. The detection method is more scientific and well-founded than the first two types of automated equipment. The large amount of sensor data generated is conducive to the later analysis of sensor characteristics, improvement of defects and unification of evaluation standards, but it is not significantly helpful in improving production quality and efficiency, nor can it shorten production time or reduce loss costs.

[0027] In order to solve the problem that unqualified finished products in the above three existing technologies can only be scrapped and cannot be re-melted, the present invention provides a Figure 1-3 A pressure sensor detection system shown includes a detection platform and a host computer that are communicatively connected to each other; A plurality of sensor sockets 11 are arranged on the upper surface of the test platform 1, and the sensor sockets 11 are connected to the pressure sensor core 2 in the MEMS processing stage or the primary packaging stage; The detection platform 1 is provided with a detection circuit inside, the detection circuit supplies power to the sensor socket 11 and collects parameter signals of the pressure sensor core 2 connected to the sensor socket 11; The host computer issues a detection instruction to the detection platform, receives the parameter signal of the pressure sensor core collected by the detection platform, and determines the quality of the pressure sensor core.

[0028] It should be noted that the pressure sensor in the present invention is quality inspected during the MEMS processing stage or the primary packaging stage. The quality of the pressure sensor is judged by detecting core parameters such as the pressure sensor bridge and the temperature measuring thermistor signal, and the specific manufacturing defects of the pressure sensor are analyzed, so as to timely discover and avoid problems in the early stage of the production and manufacturing of the pressure sensor, and the pressure sensor with problems can be re-melted. Compared with the prior art that the finished pressure sensor cannot be re-melted for re-manufacturing after the finished pressure sensor is inspected, this can effectively improve the quality, reduce costs, and reduce losses, and improve the production efficiency of the pressure sensor.

[0029] It is worth mentioning that in the production process of pressure sensors, some key process detection methods are needed to judge the quality of production. These tests usually occur in several different production stages, such as raw material preparation, MEMS processing stage, primary packaging stage, secondary packaging stage, etc. Generally speaking, in the production process, the earlier the problems are detected, the less waste of resources will be involved in the subsequent process, which is conducive to reducing the defective rate and rework rate of production to a certain extent. In the manufacturing process of pressure sensors, the cost of raw material testing is relatively expensive and complicated, and it is relatively easy to detect after processing into the core body, so the detection of the pressure sensor core body is essential, and it is also the best time to confirm and adjust the original parameters of the sensor.

[0030] As a specific embodiment, the detection circuit includes a control chip and a latch displacement unit connected to each other, the latch displacement unit is connected to a relay switch unit, and the relay switch unit is connected to a sensor socket; The detection circuit also includes a power management unit, which converts the external power supply and provides it to the control chip and the latch displacement unit, and supplies power to the corresponding sensor socket through the relay switch unit.

[0031] The detection circuit also includes a communication unit connected to the control chip for communication, and the communication unit is connected to the host computer for communication; The signal acquisition port of the sensor socket is connected to the signal acquisition pin of the control chip. The parameter signal of the pressure sensor core is fed back to the control chip through the sensor socket and then sent to the host computer through the communication unit.

[0032] It should be noted that if Figure 1 As shown, the detection circuit is composed of a control chip (MCU microprocessor), a 10MHz external clock, a communication unit (UART-232 serial communication chip), a latch shift unit (eight-bit latch shift chip), a relay switch unit (optocoupler relay switch), a power management unit, a power circuit, a sensor socket and a power supply circuit. The external power supply supplies power to the entire detection circuit and inputs it into the power management unit. The power management unit converts the external power supply and supplies power to the sensor socket, the control chip (MCU microprocessor) and other components (providing 24VDC, 5VDC and 3.3VDC power). Specifically, the external power supply provides 220V AC power, the power management unit provides 3.3V DC power to the control chip (MCU microprocessor), the latch shift unit (eight-bit latch shift chip) and the communication unit (UART-232 serial communication chip), and provides 5V DC power to the sensor socket through the relay switch unit (optocoupler relay switch).

[0033] Furthermore, the detection circuit also includes a reset unit, which is powered by the power management unit and connected to the control chip.

[0034] Specifically, the power management unit provides 3.3V direct current to the reset unit. When the response of each unit of the detection system times out, the reset unit resets, initializes the system, and restarts the detection.

[0035] As an optional embodiment, the signal acquisition port of the sensor socket includes: The first signal terminal DP+ is connected to the positive voltage output terminal of the bridge of the pressure sensor to collect the positive voltage signal of the bridge; The second signal terminal DP- is connected to the negative voltage output terminal of the bridge of the pressure sensor to collect the negative voltage signal of the bridge; The third signal terminal DOUT is connected to the temperature resistance voltage output terminal of the pressure sensor to collect the temperature voltage signal.

[0036] The relay switch unit is an optocoupler relay switch, and one sensor socket is connected to two optocoupler relay switches; One optocoupler relay switch corresponds to the first signal terminal and the second signal terminal of the sensor socket; the other optocoupler relay switch corresponds to the third signal terminal of the sensor socket.

[0037] It should be noted that the test bench of the pressure sensor detection system of the present invention includes a base of the test bench and an upper cover of the test bench. The base is used to receive the detection circuit, install a DC power supply, a power cord and a communication line. The upper cover is used to seal and protect the detection base plate to avoid damage caused by human operating errors. However, this part of the structure belongs to the more common content, so it is not described in detail. The present invention only specifically describes the key core technical part of realizing the function, that is, the sensor socket connected to the pressure sensor core, the detection circuit connected to the sensor socket, and the host computer connected to the detection circuit.

[0038] It is worth noting that from Figure 2 It can be seen in the example of a detection station of the present invention that the maximum number of sensor core body batch detections supported by it can reach 30, that is, 30 sensor sockets are provided. During specific operation, the control chip (MCU microprocessor) is provided with a clock source by a 10MHz external clock to control the eight-bit latch shift chip. The 8 ports of the eight-bit latch shift chip are respectively connected to the relay switch units (optical coupler relay switches) of each road, controlling the conduction of the transistor and then controlling the switch of the relay; the optical coupler relay switch is connected to a 5VDC power supply, and when the switch is turned on, the corresponding socket will provide a 5V power supply, which can power the sensor core body. In an embodiment of the present invention, the first signal terminal DP+, the second signal terminal DP-, and the third signal terminal DOUT on the 30-way sensor socket are respectively connected in parallel, and connected to the signal acquisition pins of the MCU, namely M-DP+, M-DP- and M-DOUT pins, for signal acquisition.

[0039] Specifically, since the eight ports of the eight-bit latch shift chip are respectively connected to the relay switch units (optocoupler relay switches), each eight-bit latch shift chip can control eight optocoupler relay switches, and since each sensor socket is correspondingly connected to two optocoupler relay switches, each eight-bit latch shift chip can control the power supply of four sensor sockets. On a sensor socket, the first signal terminal and the second signal terminal are respectively connected to the two ends of the output end of the optocoupler relay, and the input end of the optocoupler relay forms a power supply circuit by connecting a transistor, and controls whether the photoelectric conversion device at the input end emits light by the conduction of the transistor, thereby generating a corresponding electrical signal output at the output end.

[0040] For the host computer, it can be a computer terminal or other terminal device with an interactive interface. On its interactive interface, there are functions such as inspector login, production label management, sensor testing, real-time status UI diagram of each test point of the test bench, and setting of various test indicators and test quantity. The relevant detection functions include the setting of detection parameters, automatic detection process design, and real-time detection status display of sensors. The detection parameter setting function includes the setting of resistance value, bridge positive voltage, bridge negative voltage, bridge pressure difference and other indicators. The automatic detection process realizes sensor socket power control, sensor sampling start, data reception and processing and related interactive interface design. After the data is processed, it is displayed in the real-time detection status diagram of the sensor, which can show the detection results more intuitively and locate the position of the faulty sensor. In addition, it can also be used in the supporting QR code scanning equipment. By recording the QR code label number of the scanned pressure sensor, the detected data can be associated with the label number, and it can be archived locally after the detection is completed. At the same time, it is also uploaded to the server in batches. These data will be used for regular data summary analysis and quality problem tracing.

[0041] The detection steps of the detection system of the pressure sensor of the present invention may include: (1) checking the working status of the detection system, including the power supply, the sensor socket and the host computer; (2) logging into the tester account on the host computer and setting the test indicators and quantity; (3) installing the pressure sensor core on each sensor socket of the detection table, and ensuring that the pins of the pressure sensor core are in good contact with the signal end of the sensor socket; (4) entering the label information on the pressure sensor core into the host computer through a scanner; (5) checking the pressure sensor cores that need to be batch tested in the host computer and starting automatic testing; (6) waiting for the test to be completed, saving the relevant data obtained, identifying defective and good products and marking them.

[0042] The present invention is based on a pressure sensor detection system, and further provides Figure 4 A pressure sensor detection method shown includes: selecting a pressure sensor core in a MEMS processing stage or a primary packaging stage to connect to a sensor socket; a host computer issues a sensor detection instruction and receives a parameter signal of the pressure sensor core collected by a detection station; The parameter signal is compared with a preset parameter threshold to determine the quality of the pressure sensor core.

[0043] Furthermore, the quality of the pressure sensor core is judged, and after the defective object is determined, the pressure sensor core is remelted and remanufactured, and the pressure sensor core is retested after the defective object is replaced.

[0044] It should be noted that the pressure sensor core detection system and method of the present invention can detect the quality of the welding of the internal bridge gold wire of the pressure sensor core, as well as the measurement performance of the temperature sensor (by measuring its resistance value). The internal bridge and temperature measuring resistor of the core are detected during the MEMS processing stage of the pressure sensor or when the first packaging is completed to ensure its performance. When a defect is found, the fault point is determined based on the diagnostic information such as the disconnection of the bridge and the large resistance value, and then the core is disassembled (the core of the first packaging is easy to disassemble, and the pressure sensor after the subsequent packaging is completed is not easy to disassemble and the cost is extremely high), and the pressure chip or temperature measuring resistor is re-welded or replaced.

[0045] The sensor detection instructions sent by the host computer include: The host computer sends a power switch instruction to the control chip for the pressure sensor on the selected sensor socket; The control chip supplies power to the corresponding sensor socket by controlling the relay switch and sends a response to the host computer; After receiving the response, the host computer sends a signal acquisition instruction to the control chip to collect parameter signals of the pressure sensor core.

[0046] It should be noted that when the detection circuit starts to receive the instruction sent by the external host computer through the communication unit (UART-232 serial communication chip), the relevant data will be forwarded to the UART serial port on the MCU microprocessor through the UART serial port of the UART-232 serial port chip, and then the MCU microprocessor will parse the instruction to implement the action corresponding to the instruction, such as the power switch instruction and the signal acquisition instruction. After receiving the power switch instruction, the MCU microprocessor controls the corresponding eight-bit latch shift chip, and the eight-bit latch shift chip controls the optocoupler relay switch, and the optocoupler relay switch further controls the power switch of the sensor socket, thereby realizing the switch control of the power supply of the 30-way sensor socket. Then, after turning on the power supply containing the specific channel number (specific sensor socket number) in the instruction, the MCU microprocessor replies to the external host computer through the UART serial port. At this time, after receiving the response, the host computer automatically sends a signal acquisition instruction to the MCU microprocessor. The MCU microprocessor receives the instruction and parses it, starts the signal acquisition of the pressure sensor core, and finally feeds back the collected data to the host computer after the acquisition is completed.

[0047] It is worth noting that the detection method of the present invention mainly includes the MCU microprocessor's power control of the sensor socket, UART serial port communication, and sensor signal acquisition and processing.

[0048] The MCU microprocessor controls the power supply of the sensor socket: according to the parsed host computer instructions, it outputs high / low levels to the eight-bit latch shift chip bit by bit and latches them, correspondingly controlling the optocoupler relay switches of the first signal terminal DP+, the second signal terminal DP-, and the third signal terminal DOUT of a certain sensor socket, thereby realizing the power switch of the three measurement ports.

[0049] UART serial communication: First set the serial port parameters, communication baud rate 76800bps, data bit 8 bits, 1 stop bit, data odd check, data packet CRC8 check. Receive and send command data through serial port interrupt. There are two types of communication commands: one is the power switch command, which can quickly turn off the power of all sensor sockets or turn on the power of a certain sensor socket. The other is the signal acquisition command, which can start the MCU microprocessor to sample the signal of the pressure sensor core and upload the sampled data after the sampling is completed.

[0050] The signal acquisition of the pressure sensor core uses the 12-bit ADC module inside the MCU microprocessor. Three sampling channels M-DP+, M-DP- and M-DOUT pins are designed to sample the electrical levels of the first signal terminal DP+, the second signal terminal DP- and the third signal terminal DOUT respectively. By comparing the preset parameter threshold, it is determined whether the port status is overflow, disconnection or normal. After the data is processed, the three port status values ​​are sent to the host computer.

[0051] The host computer determines whether the bridge of the pressure sensor core is well welded and whether the sensor chip itself is intact by judging the collected parameter signals. In specific detection, according to the actual composition of the pressure sensor chip, there will be specific indicator thresholds for the theoretical ideal bridge positive voltage, bridge negative voltage, and temperature resistance value. For example, the resistance value fluctuates by 50 ohms around 1000 ohms, the upper limit of the voltage is 2.5V and the lower limit is 0.5V, etc. Compare the voltage sampling values ​​of the first signal terminal DP+ and the second signal terminal DP- with the preset voltage threshold, and upload the corresponding voltage value. If it exceeds the upper voltage limit (such as 2.5V), it is defined as overflow, if it is less than the lower voltage limit (such as 0.5V), it is defined as disconnection, and the others are normal. Convert the DOUT voltage value into the temperature resistance value according to the calculation formula of the thermal resistor and upload it to determine whether it is within the preset resistance threshold range.

[0052] As a specific embodiment, the parameter signal of the pressure sensor core includes: a bridge positive voltage signal and a bridge negative voltage signal, which are compared with a preset voltage threshold to detect the quality or welding condition of the bridge in the pressure sensor core; The temperature voltage signal is converted into a resistance value and compared with the preset resistance threshold to detect the quality of the temperature resistor or the welding condition.

[0053] It should be noted that the core parameters of the pressure sensor core actually only include two parts, one is the Wheatstone bridge, which is used to measure pressure, and the other is the temperature resistor, which is used to measure the medium temperature. The core measurement parameter or state of the pressure sensor core is the welding or working state of the bridge. The positive voltage of the bridge, the negative voltage of the bridge, the voltage difference between the two, and the resistance of the temperature resistor on the pressure sensor core are detected to determine whether the sensor core is good. The acquisition results of the parameter signal will be uploaded to the host computer through communication data, and the pressure sensor core will be judged to be qualified according to the preset voltage threshold and resistance threshold.

[0054] A complete test is implemented through the following steps: First, the host computer sends a power switch command to turn on the power of a sensor socket on the test bench, the corresponding socket light turns on, and the test bench replies with the power switch feedback command; secondly, after receiving the power switch feedback command of the test bench, the host computer automatically sends a signal acquisition command to control the test bench to start sampling. The test bench successively collects the positive bridge voltage, negative bridge voltage and temperature resistance voltage of the pressure sensor core (if there is a sensor on the socket, a certain voltage data is generated, if not, the data is 0), saves the parameter signal data and replies to the host computer after the sampling is completed. These parameter signal data are the collected feedback parameters of the pressure sensor core or the working status; finally, the host computer receives the parameter signal data for analysis, identifies the status of the pressure sensor core according to the preset parameter threshold, and finally determines whether the performance is qualified.

[0055] The above embodiments are further elaborations and illustrations of the present invention for ease of understanding, and are not limitations of the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A pressure sensor detection system, characterized in that: It includes a testing platform and a host computer that are connected to each other for communication; A plurality of sensor sockets are arranged on the upper surface of the detection table, and the sensor sockets are connected to the pressure sensor cores in the MEMS processing stage or the primary packaging stage; The detection platform is provided with a detection circuit inside, the detection circuit supplies power to the sensor socket and collects parameter signals of the pressure sensor core connected to the sensor socket; The host computer issues a detection instruction to the detection platform, receives parameter signals of the pressure sensor core collected by the detection platform, and determines the quality of the pressure sensor core.

2. A pressure sensor detection system according to claim 1, characterized in that: The detection circuit comprises a control chip and a latch displacement unit connected to each other, the latch displacement unit is connected to a relay switch unit, and the relay switch unit is connected to a sensor socket; The detection circuit also includes a power management unit, which converts the external power supply and provides it to the control chip and the latch displacement unit, and supplies power to the corresponding sensor socket through the relay switch unit.

3. A pressure sensor detection system according to claim 1 or 2, characterized in that: The detection circuit also includes a communication unit that is communicatively connected to the control chip, and the communication unit is communicatively connected to the host computer; The signal acquisition port of the sensor socket is correspondingly connected to the signal acquisition pin of the control chip. The parameter signal of the pressure sensor core is fed back to the control chip through the sensor socket and then sent to the host computer through the communication unit.

4. A pressure sensor detection system according to claim 3, characterized in that: The signal acquisition port of the sensor socket includes: The first signal terminal is connected to the positive voltage output terminal of the bridge of the pressure sensor to collect the positive voltage signal of the bridge; The second signal terminal is connected to the negative voltage output terminal of the bridge of the pressure sensor to collect the negative voltage signal of the bridge; The third signal terminal is connected to the temperature resistance voltage output terminal of the pressure sensor to collect the temperature voltage signal.

5. A pressure sensor detection system according to claim 4, characterized in that: The relay switch unit is an optocoupler relay switch, and one sensor socket is connected to two optocoupler relay switches; One optocoupler relay switch corresponds to the first signal terminal and the second signal terminal of the sensor socket; the other optocoupler relay switch corresponds to the third signal terminal of the sensor socket.

6. A pressure sensor detection system according to claim 2, 4 or 5, characterized in that: The detection circuit also includes a reset unit, which is powered by the power management unit and connected to the control chip.

7. A method for detecting a pressure sensor, applicable to the detection system according to any one of claims 1 to 6, characterized in that: include: Select the pressure sensor core in the MEMS processing stage or the primary packaging stage and connect it to the sensor socket; the host computer issues a sensor detection instruction and receives the parameter signal of the pressure sensor core collected by the detection platform; The parameter signal is compared with a preset parameter threshold to determine the quality of the pressure sensor core.

8. A method for detecting a pressure sensor according to claim 7, characterized in that: The host computer sends the sensor detection instruction including: The host computer sends a power switch instruction to the control chip for the pressure sensor on the selected sensor socket; The control chip supplies power to the corresponding sensor socket by controlling the relay switch and sends a response to the host computer; After receiving the response, the host computer sends a signal acquisition instruction to the control chip to collect parameter signals of the pressure sensor core.

9. A method for detecting a pressure sensor according to claim 7 or 8, characterized in that: The parameter signals of the pressure sensor core include: a bridge positive voltage signal and a bridge negative voltage signal, which are compared with a preset voltage threshold to detect the quality or welding condition of the bridge in the pressure sensor core; The temperature voltage signal is converted into a resistance value and compared with the preset resistance threshold to detect the quality or welding condition of the temperature resistor.

10. A method for detecting a pressure sensor according to claim 9, characterized in that: Determine the quality of the pressure sensor core, determine the defective object, remelt the pressure sensor core, replace the defective object and re-test the pressure sensor core.

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