Defect detection method and device based on fracture area and storage medium

Abstract

The invention provides a defect detection method and device based on a fracture area and a storage medium, and the method comprises the steps: obtaining a defect image set of a to-be-detected material, a defect image carries coordinate information, and determining a defect image subset of the fracture area from the defect image set of the to-be-detected material based on the coordinate information; preferentially displaying the defect image in the subset, and re-confirming the binding relationship between the defect image in the subset and the Pcs on the to-be-detected material; and on the basis of a preset Pcs acceptance condition and the reconfirmed binding relationship between the defect image and the Pcs, generating a detection result of whether all the Pcs bound with the defect image are scrapped or not. According to the technical scheme provided by the invention, the image subset belonging to the defect of the fracture area is screened out through the coordinate information carried by the defect image and is preferentially displayed and judged, and the defect image of the fracture area is rebound with the Pcs and is preferentially displayed and judged, so that missing detection, missing judgment and misjudgment of other Pcs are avoided.

Description

Technical Field

[0001] The present application relates to the field of defect detection, and in particular to a defect detection method, device and storage medium based on a break zone. Background Art

[0002] Printed Circuit Board (PCB), also often referred to as printed circuit board, is an important electronic component that provides electrical connection and physical support for electronic components. Visual inspection technology has been widely used in the yield inspection of circuit boards to detect defects on circuit boards and output images containing defects. The defect review system is used to review defective images to determine the scrapped individual units (PCs) on the material or to determine the scrapped entire strip.

[0003] The inventors found that in the application scenario of PCB defect review, the defect image is bound to the Pcs one-to-one, and the defect review system will give priority to reviewing the defects that cause the Pcs to be scrapped (NG), while the defects in the broken area may cause multiple adjacent Pcs to be scrapped, and then lead to the missed scrapping or erroneous scrapping of related Pcs. In view of this, a defect detection method based on the broken area is urgently needed. Summary of the invention

[0004] In view of this, the present application provides a defect detection method, device and storage medium based on the broken area to solve the problems of missed detection and false detection in PCB defect detection in the prior art.

[0005] In a first aspect, the present application provides a defect detection method based on a break zone, the method comprising:

[0006] Acquire a defect image set of the material to be inspected, wherein the defect image carries coordinate information, and determine a defect image subset of the fracture area from the defect image set of the material to be inspected based on the coordinate information;

[0007] Prioritize displaying the defect images in the subset, and reconfirm the binding relationship between the defect images in the subset and the PCs on the material to be inspected;

[0008] Based on the preset PCs acceptance conditions and the reconfirmed binding relationship between the defective image and the PCs, the detection results of whether all PCs bound to the defective image are scrapped or not are generated.

[0009] Preferably, the reconfirming the binding relationship between the defect images in the subset and the PCs on the material to be inspected includes:

[0010] All PCs actually covered by defects in the defective images in the subset are determined as target PCs for rebinding.

[0011] Preferably, the defect detection method based on the broken area further comprises:

[0012] Display the Pcs panorama of the material to be inspected, display the current defect image in the subset, and mark the location of the current defect image and the initially bound Pcs in the Pcs panorama of the material to be inspected;

[0013] After reconfirming the binding relationship of the Pcs of the current defect image, all rebound Pcs are marked in the Pcs panorama of the material to be inspected.

[0014] Preferably, the defect detection method based on the broken area further comprises:

[0015] After the triggering of the scrapping event of the current defective image is monitored, a pop-up window interface is generated, in which all Pcs corresponding to the current defective image are displayed, wherein the rebound Pcs is selected by default.

[0016] Preferably, the defect detection method based on the broken area further comprises:

[0017] In the pop-up window interface, after the triggering of the current defect image confirmation scrapping event is monitored, it is determined that the detection results of all selected PCs in the pop-up window interface are scrapped.

[0018] Preferably, if the broken area corresponding to the current defect image is a part of a single broken line, all Pcs corresponding to the current defect image are two Pcs on both sides of the single broken line.

[0019] Preferably, if the broken area to which the current defect image corresponds is the intersection area of ​​two broken lines, then all Pcs corresponding to the current defect image are four Pcs adjacent to the intersection area.

[0020] In a second aspect, the present application provides a defect detection device based on a break zone, the device comprising:

[0021] A screening module, used to obtain a set of defect images of the material to be inspected, wherein the defect images carry coordinate information, and determine a subset of defect images of the broken area from the set of defect images of the material to be inspected based on the coordinate information;

[0022] A binding module, used for preferentially displaying the defect images in the subset and reconfirming the binding relationship between the defect images in the subset and the PCs on the material to be inspected;

[0023] The detection module is used to generate a detection result of whether all PCs bound to the defective image are scrapped or not based on the preset PCs acceptance conditions and the binding relationship between the defective image and the PCs after reconfirmation.

[0024] In a third aspect, the present application provides a computer device, comprising: a memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor implements the defect detection method based on the broken zone described in the first aspect by executing the computer instructions.

[0025] In a fourth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the defect detection method based on the broken zone described in the first aspect is implemented.

[0026] The defect detection method, device and storage medium based on the fracture zone provided by the present application have at least the following beneficial effects:

[0027] The technical solution provided by the present application uses the coordinate information carried by the defect image to filter out the image subset belonging to the broken area defect and display and judge it first, thereby avoiding the missed display and missed judgment of the broken area defect during re-inspection, and avoiding the missed detection and missed judgment of other PCs. By rebinding the defect image of the broken area to the PCs and displaying and judging it first, the missed detection, missed judgment and misjudgment of other PCs can be avoided. This improves the accuracy and effectiveness of the PCB defect detection results and improves the efficiency of PCB defect detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific implementation methods or the prior art descriptions. Obviously, the drawings described below are some implementation methods of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. It should be noted that the drawings described below are schematic and should not be understood as any limitation to the present application. In the drawings:

[0029] Figure 1 A schematic diagram of a defect detection method based on a break zone in one embodiment of the present application is shown;

[0030] Figure 2 A schematic diagram showing the relationship between the fracture area defect image and the Pcs position of the present application;

[0031] Figure 3 A schematic diagram showing the relationship between another fracture area defect image and Pcs position of the present application;

[0032] Figure 4 A schematic diagram showing the relationship between the fracture area defect image and the Pcs position of another embodiment of the present invention;

[0033] Figure 5 A schematic diagram of a defect detection device based on a broken zone in one embodiment of the present application is shown;

[0034] Figure 6 A schematic diagram of a computer device in one embodiment of the present application is shown. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0036] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0037] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, it can also be the internal connection of two components, it can be a wireless connection, or it can be a wired connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0038] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0039] Although the processes described below include multiple operations that appear in a specific order, it should be clearly understood that these processes may also include more or fewer operations, and these operations may be performed sequentially or in parallel.

[0040] Example 1

[0041] The defect detection method based on the break zone provided in the present application can be applied to the application scenario of PCB defect detection. In this scenario, multiple units (Pcs) are printed on the whole piece of PCB material, and a break zone is set between the Pcs. The break zone is for subsequent cutting, so as to remove unnecessary parts so that a single Pcs conforms to the actual use form of the final product. In the visual inspection scenario of PCB, it identifies defects on the whole PCB material through visual inspection technology, and determines whether the corresponding Pcs is scrapped by binding a single Pcs with a defective image. The defective image is usually bound to the Pcs one-to-one, and defects in the break zone may cause multiple adjacent Pcs to be scrapped. Existing visual inspection schemes are prone to missed scrapping or mistaken scrapping of related Pcs.

[0042] For example, suppose that the optical point p in the break zone is surrounded by Pcs1, Pcs2, Pcs3, and Pcs4, and the first inspection system detects that the optical point p has a defect report point Bp, and Pcs1 has a defect report point B1. According to the inspection requirements, if there is a defect Bp on the optical point p, Pcs1, Pcs2, Pcs3, and Pcs4 need to be scrapped. If Bp is actually a real point, but Pcs1 is deemed scrapped by the first inspection machine because of B1. In this case, when the re-inspection machine obtains the information of the first inspection machine at the previous station, the optical point defect Bp will be filtered and cannot be re-inspected separately, resulting in the omission of Pcs2, Pcs3, and Pcs4. Even if Pcs1 is not deemed scrapped due to other defects, when the re-inspection system re-inspects the optical point defect Bp, Pcs1 is deemed scrapped. However, due to the one-to-one binding relationship between the optical point defect Bp and Pcs1, Pcs2, Pcs3, and Pcs4 will be missed and scrapped. If the optical point defect Bp is not bound to Pcs1 in a one-to-one relationship, but is a one-to-four default binding relationship with Pcs1, Pcs2, Pcs3, and Pcs4, when Bp is actually a false point and Pcs1 is deemed scrapped due to Bp, pcs1, pcs2, pcs3, and pcs4 will be automatically scrapped, resulting in erroneous scrapping.

[0043] In view of this, a defect detection method based on the fracture zone is urgently needed to solve the problems of missed detection and false detection.

[0044] See also Figure 1 , a defect detection method based on the broken zone provided in one embodiment of the present application may include the following steps.

[0045] S101. Acquire a set of defect images of a material to be inspected, wherein the defect images carry coordinate information, and determine a defect image subset of a break area from the set of defect images of the material to be inspected based on the coordinate information.

[0046] Specifically, this workstation is a defect re-inspection system for PCB visual inspection. The defect image is the result detected by the first inspection system. The defect image carries coordinate information, which is used to indicate the positional relationship of the defect on the material to be inspected. The break area and the specific area on the material, PCBs of different specifications and different printed contents have different break areas. By judging whether the coordinate information carried by the image falls in the break area, it is judged whether the defect belongs to the break area, which facilitates the subsequent defect detection and discrimination of the defect image in the break area. The set of defect images in the break area is a subset of the set of all defect images of the material to be inspected. By screening out the image subset, it is convenient to give priority to the subsequent judgment of the defect images in the break area and prevent missed inspections of the break area.

[0047] S102, preferentially displaying the defect images in the subset, and reconfirming the binding relationship between the defect images in the subset and the Pcs on the material to be inspected.

[0048] Specifically, defect images with defects located in the broken area are displayed first so that the corresponding PCs can be judged whether they are scrapped based on the defects in the broken area. This can avoid the scrapping of other PCs caused by the scrapping of PCs due to defects in other non-broken areas. By reconfirming the binding relationship between the defect image and the PCs, missed reporting fees caused by the default one-to-one binding, or missed reporting fees and erroneous scrapping caused by the default one-to-multiple binding, are avoided. Reconfirming the binding relationship between the defect image and the PCs is based on the positional relationship between the actual defect and the PCs. In simple terms, the actual defect covers which PCs or which PCs, and then accurately binds them to avoid missed detection and false detection caused by default binding.

[0049] S103: Based on the preset PCs acceptance conditions and the reconfirmed binding relationship between the defective image and the PCs, a detection result of whether all PCs bound to the defective image are scrapped or not is generated.

[0050] Specifically, when it is confirmed that the defects in the broken area require the corresponding Pcs to be scrapped, they are scrapped according to the rebound Pcs to avoid missed reporting fees and erroneous scrapping, making the generated test results more accurate and improving the test efficiency.

[0051] In this embodiment, for example, see Figure 2As shown in the figure, the defect image of the broken area is in the middle of the four Pcs. Pcs1 and Pcs4 covered by the defect shape like "lightning" need to be scrapped, and Pcs2 and Pcs3 have no effect. In practical applications, the defect image is an image in a subset, and the subset is screened and determined from the defect image set of the material to be inspected through the coordinate information carried by the defect image. The defect image is displayed first on the display interface of the re-inspection system, and the defect image is reconfirmed to be bound to Pcs1 and Pcs4. According to the preset Pcs acceptance conditions, the inspection results of the re-bound Pcs1 and Pcs4 are now determined to be scrapped.

[0052] In this embodiment, the image subset belonging to the broken area defect is screened out through the coordinate information carried by the defect image and is displayed and judged first, thereby avoiding the missed display and missed judgment of the broken area defect during re-inspection, and avoiding the missed detection and missed judgment of other PCs. By rebinding the defect image of the broken area to the PCs and displaying and judging it first, the missed detection, missed judgment and misjudgment of other PCs are avoided. In this way, the accuracy and effectiveness of the PCB defect detection results are improved, and the efficiency of PCB defect detection is improved.

[0053] Preferably, the reconfirming the binding relationship between the defect images in the subset and the PCs on the material to be inspected includes:

[0054] All PCs actually covered by defects in the defective images in the subset are determined as target PCs for rebinding.

[0055] In this embodiment, the PCs actually covered by the defect are determined as the target PCs for rebinding, which can avoid missed judgments and misjudgments caused by one-to-one binding between defect images and PCs, and can also avoid misjudgments caused by the default one-to-many binding between defect images and PCs. The binding relationship between the defect image and PCs is confirmed by the actual position relationship between the defect and PCs, which facilitates the subsequent accurate scrapping of all PCs that need to be scrapped according to the actual situation, avoids missed judgments and misjudgments, improves the accuracy and effectiveness of PCB defect detection results, and improves the efficiency of PCB defect detection.

[0056] Preferably, the defect detection method based on the broken area further comprises:

[0057] Display the Pcs panorama of the material to be inspected, display the current defect image in the subset, and mark the location of the current defect image and the initially bound Pcs in the Pcs panorama of the material to be inspected;

[0058] After reconfirming the binding relationship of the Pcs of the current defect image, all rebound Pcs are marked in the Pcs panorama of the material to be inspected.

[0059] In this embodiment, displaying the panoramic view of the Pcs of the material to be inspected enables the re-inspection personnel to clearly understand the overall picture of the entire material to be inspected, the distribution of each Pcs, and the relationship between the current defect image and the Pcs. Marking the initially bound Pcs and all re-bound Pcs in the panoramic view makes it easier for the re-inspection personnel to clearly understand the before and after changes in the Pcs bound to the current defect image, and to find the difference between the re-bound Pcs and the initially bound Pcs. At the same time, it is easy to find whether there is a missing situation in the re-bound Pcs, further avoiding missed judgments and misjudgments, and improving the accuracy and effectiveness of PCB defect detection results. The interactive re-inspection display interface further improves the efficiency of PCB defect detection.

[0060] Preferably, the defect detection method based on the broken area further comprises:

[0061] After the triggering of the scrapping event of the current defective image is monitored, a pop-up window interface is generated, in which all Pcs corresponding to the current defective image are displayed, wherein the rebound Pcs is selected by default.

[0062] In this embodiment, the scrapping event can be understood as the re-inspection personnel pressing the relevant scrapping button, that is, waiting to confirm the PCs that need to be scrapped for the currently selected defective image. Once the scrapping event is triggered, the pop-up window interface generated immediately allows relevant staff to quickly focus their attention on the PCs corresponding to the current defective image. The rebound PCs are selected by default, which is convenient for subsequent confirmation of scrapping and no manual selection is required. There is no need to search laboriously in the complicated panoramic view, and you can clearly see which PCs need to be selected for scrapping directly in the pop-up window, simplifying the processing flow of PCs scrapping. Further improve the efficiency of PCB defect detection.

[0063] Preferably, the defect detection method based on the broken area further comprises:

[0064] In the pop-up window interface, after the triggering of the current defect image confirmation scrapping event is monitored, it is determined that the detection results of all selected PCs in the pop-up window interface are scrapped.

[0065] In this embodiment, the confirmation of the scrapping event is different from the pending confirmation state of the knocking scrapping event. The confirmation of the scrapping event is to immediately scrap the PCs that need to be scrapped. In the pop-up window interface, the rebound PCs are selected by default. Of course, other situations are not excluded. At this time, the re-inspection personnel need to manually modify the selection of the PCs that need to be scrapped in the end, or unselect the PCs that do not need to be scrapped, and then confirm that the selected PCs are scrapped. The actual operability of PCs scrapping is improved, the accuracy and effectiveness of PCB defect detection results are improved, and the efficiency of PCB defect detection is further improved.

[0066] Preferably, see Figure 3 or Figure 4 As shown, if the broken area corresponding to the current defect image is a part of a single broken line, all Pcs corresponding to the current defect image are two Pcs on both sides of the single broken line.

[0067] Preferably, see Figure 2 As shown, if the broken area corresponding to the current defect image is the intersection area of ​​two broken lines, then all Pcs corresponding to the current defect image are four Pcs adjacent to the intersection area.

[0068] Example 2

[0069] This embodiment provides a defect detection device based on a broken area, which is described by applying the defect detection method based on a broken area provided in the above embodiment 1. Figure 5 As shown, a defect detection device based on a broken zone provided in one embodiment of the present application may include the following multiple modules.

[0070] A screening module, used to obtain a set of defect images of the material to be inspected, wherein the defect images carry coordinate information, and determine a subset of defect images of the broken area from the set of defect images of the material to be inspected based on the coordinate information;

[0071] A binding module, used for preferentially displaying the defect images in the subset and reconfirming the binding relationship between the defect images in the subset and the PCs on the material to be inspected;

[0072] The detection module is used to generate a detection result of whether all PCs bound to the defective image are scrapped or not based on the preset PCs acceptance conditions and the binding relationship between the defective image and the PCs after reconfirmation.

[0073] The defect detection device based on the broken zone provided in the embodiment of the present application can be applied to the defect detection method based on the broken zone provided in the above-mentioned embodiment 1. For relevant details, refer to the above-mentioned method embodiment. The implementation principle and technical effect are similar and will not be repeated here.

[0074] It should be noted that: the defect detection device based on the broken area provided in the embodiment of the present application only uses the division of the above-mentioned functional modules / functional units as an example when performing defect detection based on the broken area. In actual applications, the above-mentioned functions can be assigned to different functional modules / functional units as needed, that is, the internal structure of the defect detection device based on the broken area is divided into different functional modules / functional units to complete all or part of the functions described above. In addition, the implementation method of the defect detection method based on the broken area provided in the above-mentioned method embodiment 1 and the implementation method of the defect detection device based on the broken area provided in this embodiment 2 belong to the same concept. The specific implementation process of the defect detection device based on the broken area provided in this embodiment 2 is detailed in the above-mentioned method embodiment 1, and will not be repeated here.

[0075] Example 3

[0076] See also Figure 6 As shown, one embodiment of the present application further provides a computer device, which may be a desktop computer, a laptop computer, a PDA, a cloud server, or other computer devices. The computer device may include, but is not limited to, a processor and a memory. The processor and the memory may be connected via a bus or other means.

[0077] The processor may be a central processing unit (CPU). The processor may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, graphics processing units (GPU), embedded neural network processors (NPU) or other dedicated deep learning coprocessors, discrete gate or transistor logic devices, discrete hardware components and other chips, or a combination of the above chips.

[0078] As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs, non-transitory computer executable programs and modules, such as program instructions / modules corresponding to the methods in the above-mentioned embodiments of the present application. The processor executes various functional applications and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, that is, implementing the methods in the above-mentioned method embodiments.

[0079] The memory may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created by the processor, etc. In addition, the memory may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one disk storage device, a flash memory device, or other non-transitory solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0080] One embodiment of the present application further provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store a computer program. When the computer program is executed by a processor, the method in the above method embodiment is implemented.

[0081] Those skilled in the art can understand that the implementation of all or part of the processes in the above-mentioned implementation methods of the present application can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium, and when the program is executed, it can include the processes of the implementation methods of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM), a random access memory (RAM), a flash memory, a hard disk (HDD) or a solid-state drive (SSD), etc.; the storage medium can also include a combination of the above-mentioned types of memory.

[0082] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0083] Although the embodiments of the present application are described in conjunction with the accompanying drawings, they cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, other different forms of changes or modifications can be made on the basis of the above description without departing from the concept of the present application. It is not necessary and impossible to list all the embodiments here. The obvious changes or modifications derived from this are still within the scope of protection created by the present application. Therefore, the scope of protection of the patent application shall be based on the attached claims.

Claims

1. A defect detection method based on a fracture zone, characterized in that: The method comprises: Acquire a defect image set of the material to be inspected, wherein the defect image carries coordinate information, and determine a defect image subset of the fracture area from the defect image set of the material to be inspected based on the coordinate information; Prioritize displaying the defect images in the subset, and reconfirm the binding relationship between the defect images in the subset and the PCs on the material to be inspected; Based on the preset PCs acceptance conditions and the reconfirmed binding relationship between the defective image and the PCs, the detection results of whether all PCs bound to the defective image are scrapped or not are generated.

2. The defect detection method based on the broken area according to claim 1 is characterized in that: The reconfirming the binding relationship between the defect image in the subset and the PCs on the material to be inspected includes: All PCs actually covered by defects in the defective images in the subset are determined as target PCs for rebinding.

3. The defect detection method based on the broken area according to claim 1 or 2, characterized in that: Also includes: Display the Pcs panorama of the material to be inspected, display the current defect image in the subset, and mark the location of the current defect image and the initially bound Pcs in the Pcs panorama of the material to be inspected; After reconfirming the binding relationship of the Pcs of the current defect image, all rebound Pcs are marked in the Pcs panorama of the material to be inspected.

4. The defect detection method based on the broken area according to claim 3 is characterized in that: Also includes: After monitoring the triggering of the scrapping event of the current defective image, a pop-up window interface is generated, in which all Pcs corresponding to the current defective image are displayed, wherein the rebound Pcs is selected by default.

5. The defect detection method based on the broken area according to claim 4 is characterized in that: Also includes: In the pop-up window interface, after the triggering of the current defect image confirmation scrapping event is monitored, it is determined that the detection results of all selected PCs in the pop-up window interface are scrapped.

6. The defect detection method based on the broken area according to claim 3 is characterized in that: If the broken area corresponding to the current defect image is a part of a single broken line, then all Pcs corresponding to the current defect image are two Pcs on both sides of the single broken line.

7. The defect detection method based on the broken area according to claim 3 is characterized in that: If the broken area to which the current defect image corresponds is the intersection area of ​​two broken lines, then all Pcs corresponding to the current defect image are four Pcs adjacent to the intersection area.

8. A defect detection device based on a broken zone, characterized in that: include: A screening module, used to obtain a set of defect images of the material to be inspected, wherein the defect images carry coordinate information, and determine a subset of defect images of the broken area from the set of defect images of the material to be inspected based on the coordinate information; A binding module, used for preferentially displaying the defect images in the subset and reconfirming the binding relationship between the defect images in the subset and the PCs on the material to be inspected; The detection module is used to generate a detection result of whether all PCs bound to the defective image are scrapped or not based on the preset PCs acceptance conditions and the binding relationship between the defective image and the PCs after reconfirmation.

9. A computer device, characterized in that: include: A memory and a processor, wherein the memory and the processor are communicatively connected to each other, the memory stores computer instructions, and the processor implements the defect detection method based on the broken zone as described in any one of claims 1 to 7 by executing the computer instructions.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer instructions, and when the computer instructions are executed by a processor, the defect detection method based on the broken zone according to any one of claims 1 to 7 is implemented.

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