Working device and electronic component presintering equipment

Abstract

The invention discloses a working device and electronic component presintering equipment, the working device comprises a rack, a radiator and a driving unit, the rack is provided with at least one layer of staddle in a working space for bearing a circuit board with a test seat, the radiator is arranged in the working space of the rack, and the driving unit is arranged in the working space of the rack. The driving unit is provided with a transferring arm capable of moving in at least one direction so as to drive one of the staddle and the radiator to move towards the other one of the staddle and the radiator, so that the radiator carries out heat dissipation operation on the electronic element in pre-sintering operation. Therefore, the cost of the testing seat and the load of the circuit board are greatly reduced, and the use efficiency of the operation device for presintering is further improved.

Description

Technical Field

[0001] The invention relates to an operating device which greatly reduces the cost of a test socket and the load of a circuit board to improve the use efficiency. Background Art

[0002] In today's world, see Figure 1 , Figure 2 After the production of multiple electronic components 11 is completed, if a longer test time and high temperature test are required, the industry will place multiple electronic components 11 in a burn-in module 12 and transport them to the burn-in equipment to perform the burn-in test operation. The burn-in module 12 includes an electrically connected circuit board 121 and a plurality of test sockets 122. The circuit board 121 is electrically connected to the electrical control connection board (not shown) of the burn-in equipment. The test socket 122 is used to place and test the electronic components 11, and is provided with an outer cover 123. When the outer cover 123 covers the test socket 122, it can limit the electronic components 11. However, the electronic components 11 will generate high temperatures during the test. In order to avoid excessive high temperatures affecting the test quality, the burn-in module 12 is provided with a plurality of heat dissipation fins 124 on the top surface of the outer cover 123, so that the electronic components 11 can be cooled by heat exchange through the outer cover 123, so that the electronic components 11 can be tested at a preset burn-in test temperature. In order to more accurately control the pre-burning test temperature of the electronic component 11, a heating element 125 is disposed on the bottom surface of the outer cover 123, and the heating element 125 is used to contact the electronic component 11 to assist in adjusting the pre-burning test temperature of the electronic component 11. In addition, the pre-burning furnace body 13 of the pre-burning equipment is provided with a plurality of layers of support frames 133 in the working space 132 of the furnace frame 131, so as to respectively support the pre-burning modules 12 with a plurality of electronic components 11. One side of the furnace frame 131 of the pre-burning furnace body 13 is provided with an air inlet channel 134 for conveying high-temperature gas into the working space 132, so that the electronic component 11 can perform the pre-burning test operation in a high-temperature environment simulating future applications. The other side of the furnace frame 131 is provided with an air outlet channel 135 for exhausting the high-temperature gas. However, if each burn-in module 12 is provided with dozens or hundreds of test sockets 122, correspondingly, dozens or hundreds of outer covers 123, heat sink fins 124 and heating elements 125 must be configured, which not only consumes considerable component costs and is complicated to assemble, but also increases the weight of the circuit board 121 due to the large number of outer covers 123, heat sink fins 124 and heating elements 125, which is not conducive to transportation. Furthermore, the electronic components 11 in the test sockets 122 that have been burn-in tested will still be attached to the high-temperature heating element 125, so that it takes time to wait for the electronic components 11 to cool down, which is not conducive to transportation to the next device, thereby reducing production efficiency. Summary of the invention

[0003] The object of the present invention is to provide an operating device and electronic component pre-burning equipment.

[0004] The present invention provides an operating device, including a mounter, at least one radiator and a driving unit. The mounter is provided with at least one operating space, and the operating space is provided with at least one layer of a support frame for supporting a circuit board with a test socket. At least one radiator is arranged in the operating space of the mounter and is provided with a heat dissipation component for performing a heat dissipation operation on the electronic components of the test socket. The driving unit is provided with at least one transfer arm, and the transfer arm can be displaced in at least one direction to drive one of the support frame and the radiator to move toward the other, so that the radiator can perform a heat dissipation operation on the electronic components in the pre-burning operation, and ensure that the electronic components are tested at a preset pre-burning test temperature; therefore, it is not necessary to configure a radiator and a heater on each test socket on each circuit board, and it is even unnecessary to configure an outer cover for accommodating the radiator and the heater, so as to greatly reduce the component configuration and effectively save costs.

[0005] The present invention also provides an operating device, whose driving unit can drive one of the support frame and the heat sink to move toward the other, so that the heat sink performs heat dissipation operations on electronic components in the pre-burning operation; thereby, there is no need to configure a heat sink and a heating element on each test socket, so as to simplify the test socket, thereby greatly reducing the load on the circuit board and achieving a use efficiency that is conducive to transportation.

[0006] The present invention also provides an operating device, whose driving unit can drive the heat sink and the test socket on the support frame to separate from each other, so that the electronic components in the test socket can quickly recover to facilitate the transportation of the circuit board with the test socket to the next device, thereby improving the use efficiency.

[0007] The present invention further provides an electronic component burn-in device, comprising a burn-in furnace body and an operating device of the present invention; the burn-in furnace body is provided with a gas supply device for conveying gas having a burn-in test temperature into the furnace; the operating device of the present invention is arranged inside the burn-in furnace body, and comprises a mount, at least one heat sink and a drive unit for supporting at least one circuit board having a test socket, so that the electronic components of the test socket perform a burn-in test operation in the burn-in furnace body, and perform heat dissipation operation on the electronic components in the test socket. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a schematic diagram of partial use of existing pre-burning equipment.

[0009] Figure 2 for Figure 1 A partial enlarged schematic diagram of .

[0010] Figure 3 It is a partial schematic diagram of the first embodiment of the working device of the present invention.

[0011] Figures 4 to 6 It is a partial schematic diagram of the use of the first embodiment of the working device of the present invention.

[0012] Figures 7 and 8 It is a partial schematic diagram of the use of the second embodiment of the working device of the present invention.

[0013] Description of reference numerals: 11-electronic component; 12-pre-burning module; 121-circuit board; 122-test seat; 123-outer cover; 124-heat sink; 125-heating element; 13-pre-burning furnace body; 131-furnace frame; 132-working space; 133-support frame; 134-air inlet channel; 135-air outlet channel; 21-mounting device; 211-first side panel; 212-second side panel; 213-working space; 214-support frame; 2141-bearing surface; 2142-mounting surface; 215-first opening; 216-second opening; 217-fixed frame; 218-movable frame; 2181-third opening; 2182-fourth opening; 219-cross frame; 221-main body; 222-heating fins; 223-joining piece; 224-heating piece; 23-transfer arm; 31-pre-burning furnace body; 311-air inlet channel; 312-air outlet channel; 41-circuit board; 42-test seat; 43-outer cover; 44-electronic component. DETAILED DESCRIPTION

[0014] In order to further understand the present invention, a preferred embodiment is given below with reference to the drawings:

[0015] See also Figure 3 The first embodiment of the working device of the present invention includes a mount 21, at least one radiator and a driving unit.

[0016] The holder 21 is provided with at least one working space, and the working space is provided with at least one layer of support frame for supporting at least one circuit board with a test socket. Furthermore, the holder 21 can be a fixed frame or a movable frame, for example, the holder 21 is a movable transport frame for moving into or out of the pre-burning furnace body (not shown). For example, the holder 21 is a fixed furnace frame for the pre-burning furnace body.

[0017] In this embodiment, the burn-in equipment includes a burn-in furnace body 31 and an operating device of the present invention. The burn-in furnace body 31 is provided with a gas supply device (not shown) for conveying gas having a burn-in test temperature into the furnace, so as to perform a burn-in test operation on electronic components. The mounting device 21 of the operating device is disposed inside the burn-in furnace body 31, and as a furnace rack, a working space 213 is defined between the first side plate 211 and the second side plate 212 of the mounting device 21, and a plurality of horizontally arranged supporting frames 214 are fixedly disposed in the working space 213. The first surface (e.g., the top surface) of each supporting frame 214 is a bearing surface 2141 for supporting a circuit board having a plurality of test sockets (not shown), and the second surface (e.g., the bottom surface) is a receiving surface 2142, which can be used to assemble a drive unit according to the operation requirements. Furthermore, at least one side of the mounter 21 is provided with at least one first opening 215 connected to the working space 213. In this embodiment, the mounter 21 has a plurality of first openings 215 connected to the working space 213 on the first side plate 211 for the inflow of gas having a pre-burning test temperature, and a plurality of second openings 216 connected to the working space 213 on the second side plate 212 for the outflow of gas.

[0018] Furthermore, at least one flow channel is provided between the pre-burning furnace body 31 and the mounting device 21, and the flow channel communicates with the working space 213 of the mounting device 21 for conveying gas. In this embodiment, an air inlet flow channel 311 is formed between the first side plate 211 of the mounting device 21 and the pre-burning furnace body 31, so that the gas of the gas supply device of the pre-burning furnace body 31 flows into the working space 213 of the mounting device 21 through the air inlet flow channel 311 and the first opening 215, and an air outlet flow channel 312 is formed between the second side plate 212 of the mounting device 21 and the pre-burning furnace body 31, so that the gas in the working space 213 flows out to the air outlet flow channel 312 through the second opening 216.

[0019] At least one heat sink is disposed in the operating space 213 of the mounting device 21 and is provided with at least one heat dissipation component for performing heat dissipation operations on the electronic components of the test socket. Furthermore, the heat dissipation component of the heat sink can be a heat dissipation fin, or include a heat dissipation channel and a fluid flowing in the heat dissipation channel.

[0020] According to the operation requirements, the heat sink is equipped with at least one temperature control unit for temperature controlling the test temperature of the electronic component. Furthermore, the temperature control unit can be a heating element, a cooling chip or a temperature control seat with a fluid.

[0021] In this embodiment, the heat sink includes a body 221, a heat dissipation component which may be a heat dissipation fin 222, a joint 223 and a temperature control unit which may be a heating unit 224. A plurality of upright heat dissipation fins 222 are provided above the body 221, and a joint 223 is provided below the body 221. The joint 223 may directly contact the electronic components in the test socket or the outer cover of the test socket according to the operation requirements. The heating unit 224 is arranged inside the joint 223 to control the test temperature of the electronic components.

[0022] According to the operation requirements, the heat sink can be equipped with a temperature control unit on the bottom surface of the body 221 and the temperature control unit can be used as a joint 223 to directly contact the electronic component or the outer cover of the test socket, which is not limited to this embodiment.

[0023] The driving unit is provided with at least one transfer arm 23 for driving one of the support frame 214 and the heat sink to move toward the other. Furthermore, the driving unit includes the transfer arm 23 and a driving source (not shown) that can drive the transfer arm 23 to move. The driving source can be a linear motor, a cylinder, or a motor and a transmission group. The transmission group can be a pulley group or a screw seat group.

[0024] According to operational requirements, the driving unit may be provided with a transfer arm 23 at the bottom of the support frame 214 of the mount 21, which can be displaced in at least one direction (e.g., the Z direction), and the transfer arm 23 may be used to drive the radiator to move toward the support frame 214; or the mount 21 may be provided with a cross frame (not shown) above the support frame 214, and the driving unit may be provided with a transfer arm 23 at the bottom of the cross frame, which can be displaced in at least one direction (e.g., the Z direction), and the transfer arm 23 may be used to drive the radiator to move toward the support frame 214.

[0025] In this embodiment, the driving unit sets a plurality of transfer arms 23 that can be driven by a driving source (not shown) to move in the Z direction on the supporting surface 2142 of the plurality of supports 214 of the mount 21. The transfer arms 23 are assembled and connected to the main body 221 of the heat sink, and can drive the heat sink to move toward the support frame 214, so that when the support frame 214 supports a circuit board with a plurality of test sockets (not shown in the figure), the heat sink can contact the outer cover of the test socket to perform heat dissipation operations.

[0026] See also Figures 4 to 6The circuit board 41 is mounted on and electrically connected to a plurality of test sockets 42 with outer covers 43. The test sockets 42 are used to mount and test electronic components 44. Since a plurality of transfer arms 23 are mounted below the support frame 214 of the mount 21, the transfer arms 23 are used to drive the heat sink and the temperature control unit to perform heat dissipation and temperature control operations on the electronic components 44 of the test sockets 42, so that each test socket 42 on each circuit board 41 does not need to be equipped with a heat sink and a temperature control unit, and even does not need to be equipped with an outer cover 43 on the test socket 42. It can be seen that the large number of circuit boards 41 can significantly reduce the number of heat sinks and temperature control units, and better yet, the large number of outer covers 43 can be reduced. Therefore, not only is the structure of the test socket 42 simplified and the cost of test components is greatly saved, but the load of the circuit board 41 can also be greatly reduced, which is convenient for transportation.

[0027] The door panel of the burn-in furnace body 31 is opened (not shown in the figure), and the plurality of circuit boards 41 with test sockets 42 are respectively placed on the bearing surfaces 2141 of the plurality of supports 214 of the mounter 21 and located in the working space 213. The circuit boards 41 are electrically connected to the electric control connection board (not shown in the figure) of the burn-in equipment by means of gold fingers or flat cables, and the plurality of test sockets 42 of the circuit boards 41 are aligned with the joint members 223 of the plurality of heat sinks. The door panel is closed, and the gas supply device of the burn-in furnace body 31 delivers gas with a burn-in test temperature to the air inlet channel 311. The gas in the air inlet channel 311 flows into the working space 213 through the first opening 215 of the first side plate 211 of the mounter 21, so that the working space 213 of the mounter 21 forms a test environment with a burn-in test temperature, so that the electronic components 44 of the test sockets 42 can perform the burn-in test operation in the burn-in furnace body 31. The driving unit drives the transfer arm 23 to move downward in the Z direction with a driving source (not shown in the figure). The transfer arm 23 drives the radiator body 221, the heat dissipation fins 222, the joint 223 and the heating element 224 to move toward the support frame 214 and the test seat 42, and the joint 223 contacts the outer cover 43 of the test seat 42, and uses a plurality of heat dissipation fins 222 to perform heat dissipation operations on the body 221 and the electronic components 44, and uses the heating element 224 to accurately control the temperature of the electronic components 44 in the test seat 42 to maintain the pre-burning test temperature to perform the test operation; the gas in the working space 213 of the mount 21 then flows out from the second opening 216 of the second side plate 212 to the air outlet channel 312 of the pre-burning furnace body 31 and is discharged.

[0028] See also Figure 7 , Figure 8The second embodiment of the working device of the present invention is substantially the same as the first embodiment, and the difference is that the mounting device 21 includes a fixed frame 217 and a movable frame 218. The fixed frame 217 is installed inside the pre-burning furnace body 31, and at least one horizontal frame 219 is set in the working space 213. The bottom of the horizontal frame 219 is used to install a body 221 connected to a plurality of heat sinks. The fixed frame 217 is provided with a first opening 215 and a second opening 216 on both sides thereof, which are connected to the working space 213, so as to allow gas to flow in and out. The movable frame 218 is located inside the fixed frame 217, and is provided with at least one support frame 214 for supporting the circuit board 41. A third opening 215 and a third opening 216 are provided on one side thereof, which are connected to the working space 213 and the first opening 215. 181, for the horizontal frame 219 to pass through and the gas to flow in, the other side of the movable frame 218 is provided with a fourth opening 2182 which is connected to the working space 213 and the second opening 216, for the horizontal frame 219 to pass through and the gas to flow out, the driving unit is connected to the movable frame 218 with a transfer arm (not shown in the figure), and can drive the movable frame 218 to move in the Z direction, the movable frame 218 drives a plurality of supporting frames 214 and a plurality of circuit boards 41 to move upward in the Z direction synchronously, so that the test seat 42 moves toward the joint 223 of the heat sink, the outer cover 43 of the test seat 42 contacts the joint 223 of the heat sink, so that the heat sink performs a heat dissipation operation on the electronic component 44, so as to ensure that the electronic component 44 performs the test operation at the preset pre-burning test temperature.

Claims

1. A working device, characterized in that: Include: The mounting device is provided with at least one operating space, and the operating space is provided with at least one layer of supporting frames for supporting at least one circuit board with a test socket; At least one heat sink is disposed in the operating space of the mount and is provided with at least one heat dissipation component for performing heat dissipation operation on the electronic components of the test socket; The driving unit is provided with at least one transfer arm for driving one of the support frame and the heat sink to move toward the other.

2. The working device according to claim 1, characterized in that: The driving unit is provided with a transfer arm capable of at least one direction displacement at the bottom of the support frame of the mounting device, and the transfer arm is used for driving the radiator to displace toward the support frame.

3. The working device according to claim 1, characterized in that: The mounting device is provided with a horizontal frame above the support frame, and the driving unit is provided with a transfer arm capable of at least one direction displacement at the bottom of the horizontal frame of the mounting device, and the transfer arm is used for driving the radiator to displace toward the support frame.

4. The working device according to claim 1, characterized in that: The mounting device is provided with a movable frame and a fixed frame, the movable frame is provided with the support frame, the fixed frame is provided with a cross frame above the support frame, the cross frame is used for assembling the radiator, and the driving unit is used for driving the movable frame and the support frame to move toward the radiator.

5. The working device according to claim 4, characterized in that: At least one first opening and at least one second opening are provided on both sides of the fixed frame, which are connected to the working space; a third opening is provided on one side of the movable frame, which is connected to the working space and the first opening; and a fourth opening is provided on the other side, which is connected to the working space and the second opening.

6. The working device according to claim 1, characterized in that: At least one side of the mounting device is provided with at least one first opening communicating with the working space.

7. The working device according to claim 1, characterized in that: The radiator comprises a body, a radiating component and a joint piece. The radiating component is arranged above the body for radiating heat, and the joint piece is arranged below the body for contacting the electronic element or the outer cover of the test seat.

8. The working device according to any one of claims 1 to 7, characterized in that: The radiator is equipped with at least one temperature control unit.

9. An electronic component pre-burning device, characterized in that: Include: The pre-burning furnace body is provided with a gas supply device to deliver gas with the pre-burning test temperature into the furnace; At least one operating device as claimed in any one of claims 1 to 7 is located inside the pre-burning furnace body, and at least one support frame of the support device supports at least one circuit board with a test socket and electronic components.

10. The electronic component burn-in device according to claim 9, characterized in that: At least one flow channel is arranged between the pre-burning furnace body and the mounting device, and the flow channel is connected to the working space of the mounting device for conveying the gas.

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