Chip testing method and device, electronic equipment and readable storage medium

Abstract

The invention discloses a chip testing method and device based on a program package, electronic equipment and a readable storage medium, and particularly relates to the technical field of chip production. A plurality of selectable identifications are displayed on a program package configuration interface of the program package calling system, the selectable identifications are in one-to-one correspondence with the program packages, and different program packages are used for testing different functions of the to-be-tested chip. Determining a plurality of selected target identifiers based on the selection operation instruction, and determining a target program package based on the target identifiers; determining a selected sequence of the target identifiers based on the selection operation instruction to obtain a target execution process of the target program package; and controlling the multiple target program packages to run based on the target execution process. Thus, related personnel only need to operate the program package configuration interface and generate the selection operation instruction before the test is started so as to obtain the target execution process, manual operation is not needed in the subsequent test process, the multiple target program packages are automatically controlled to run based on the target execution process, and the test efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of chip production technology, and in particular to a chip testing method, device, electronic device and readable storage medium based on a program package. Background Art

[0002] After the production of electronic chips is completed, the chips need to be functionally tested. Usually, the chip to be tested is connected to the host computer. The relevant personnel operate the host computer to run the corresponding program package through the host computer to send the test code to the chip to be tested. After the chip runs the test code, it sends the operation result to the host computer to verify whether the chip is qualified based on the operation result. In this way, since different functional tests require the host computer to run different program packages, the host computer needs to run multiple program packages. Each test requires manual operation of the host computer to run a program package first. After the program package is completed, the host computer needs to be manually operated to run the next program package. The operation is cumbersome and inefficient. Summary of the invention

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a chip testing method, device, electronic device and readable storage medium based on a program package, which can automatically run the program package after obtaining the target execution process, without the need for frequent manual operation of the host computer, and can improve the testing efficiency.

[0004] According to the first aspect of the present application, a chip testing method based on a program package is applied to a host computer, and the host computer is deployed with a program package calling system. The method includes:

[0005] Displaying a plurality of optional identifiers on a program package configuration interface of the program package calling system, each of the optional identifiers corresponding to a program package, the program package being used to test the chip to be tested connected to the host computer;

[0006] In response to a selection operation instruction for the program package configuration interface, determining a plurality of selected target identifiers based on the selection operation instruction, and determining a target program package based on the target identifiers;

[0007] Determining the selection order of the target identifiers based on the selection operation instruction to obtain the target execution process of the target program package;

[0008] Based on the target execution process, the execution of the plurality of target program packages is controlled.

[0009] According to the chip testing method based on the program package of the embodiment of the present application, there are at least the following beneficial effects: the chip testing method of the embodiment of the present application first displays multiple optional identifiers on the program package configuration interface of the program package calling system, the optional identifiers correspond to the program packages one by one, and different program packages are used to test different functions of the chip to be tested. In response to the selection operation instruction for the program package configuration interface, the selected multiple target identifiers are determined based on the selection operation instruction, and the target program package is determined based on the target identifier; the selected order of the target identifier is determined based on the selection operation instruction, and the target execution process of the target program package is obtained; based on the target execution process, the operation of multiple target program packages is controlled. In this way, the relevant personnel only need to operate the program package configuration interface before the test starts, generate the selection operation instruction, and thus obtain the target execution process. The subsequent test process does not require manual operation, and the operation of multiple target program packages is automatically controlled based on the target execution process. In this way, the automatic operation of the program package is realized, and there is no need for frequent manual operation of the host computer, which can improve the test efficiency.

[0010] According to some embodiments of the first aspect of the present application, controlling the execution of multiple target program packages based on the target execution process includes:

[0011] In response to receiving a test start instruction, starting to run the first target program package in the target execution flow;

[0012] After the first target program package is finished running, generating a first execution end instruction;

[0013] In response to detecting the i-1th execution end instruction, starting to run the i-th target program package in the target execution process; wherein i is a positive integer, and 2≤i≤N, N is the number of the target program packages in the target execution process.

[0014] According to some embodiments of the first aspect of the present application, before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes:

[0015] Obtaining the storage path of the executable file of each of the program packages;

[0016] Based on the corresponding relationship between the optional identifier and the program package, a mapping relationship between the optional identifier and the storage path is constructed.

[0017] According to some embodiments of the first aspect of the present application, the starting to run the i-th target program package in the target execution process includes:

[0018] Based on the target identifier corresponding to the i-th target program package, determining a target storage path from the mapping relationship;

[0019] Based on the target storage path, the executable file of the i-th target program package is started.

[0020] According to some embodiments of the first aspect of the present application, the program package calling system is provided with a functional interface, and the functional interface is provided with a loop functional component;

[0021] Before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes:

[0022] In response to a first configuration operation instruction for the loop function component, determining a number of loops based on the first configuration operation instruction;

[0023] The step of controlling the execution of a plurality of target program packages based on the target execution process includes:

[0024] Based on the number of cycles and the target execution process, the execution of a plurality of target program packages is repeatedly controlled.

[0025] According to some embodiments of the first aspect of the present application, the functional interface is further provided with an interval setting functional component;

[0026] Before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes:

[0027] In response to a second configuration operation instruction for the interval setting functional component, determining a fixed interval duration corresponding to each of the target program packages based on the second configuration operation instruction;

[0028] The step of controlling the execution of a plurality of target program packages based on the target execution process includes:

[0029] In response to receiving a test start instruction, starting to run the first target program package in the target execution flow;

[0030] After the first target program package is finished running, generating a first execution end instruction;

[0031] In response to detecting the i-1th execution end instruction, starting to run the i-th target program package in the target execution process after the i-th interval duration; wherein i is a positive integer, and 2≤i≤N, N is the number of the target program packages in the target execution process.

[0032] According to some embodiments of the first aspect of the present application, the plurality of optional identifiers include at least a first optional identifier and a second optional identifier; the program package calling system is provided with a configured interface;

[0033] The step of determining the selected order of the target identifiers based on the selection operation instruction to obtain the target execution process of the target program package includes:

[0034] In response to a click operation on the first selectable identifier and a click operation on the second selectable identifier, recording a first click time when the first selectable identifier is clicked, and recording a second click time when the second selectable identifier is clicked;

[0035] In the case where it is detected that the first click time is earlier than the second click time, constructing a mapping connection from the first optional identifier to the second optional identifier in the configured interface, obtaining the selected order based on the mapping connection, and obtaining the target execution process based on the selected order;

[0036] When it is detected that the first click time is later than the second click time, a mapping connection is constructed in the configured interface from the second optional identifier to the first optional identifier, the selected order is obtained based on the mapping connection, and the target execution process is obtained based on the selected order.

[0037] The second aspect of the present application provides a chip testing device based on a program package, which is applied to a host computer, and the host computer is deployed with a program package calling system, and the device includes:

[0038] A display module, configured to display a plurality of optional identifiers on a program package configuration interface of the program package calling system, each of the optional identifiers corresponding to a program package, and the program package is used to test the chip to be tested connected to the host computer;

[0039] a determination module configured to respond to a selection operation instruction for the program package configuration interface, determine a plurality of selected target identifiers based on the selection operation instruction, and determine a target program package based on the target identifier;

[0040] A process obtaining module is configured to determine the selection order of the target identifiers based on the selection operation instruction, and obtain the target execution process of the target program package;

[0041] The running module is configured to control the running of the plurality of target program packages based on the target execution process.

[0042] A third aspect of the present application provides an electronic device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, the program package-based chip testing method described in any one of the first aspect embodiments is implemented.

[0043] The fourth aspect of the present application provides a computer-readable storage medium, wherein the storage medium stores a computer program. When the computer program is executed by a processor, the program package-based chip testing method described in any one of the first aspect embodiments is implemented.

[0044] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0046] Figure 1 A schematic flow chart of the steps of the chip testing method based on the program package implemented in this application;

[0047] Figure 2 A schematic diagram of a program package configuration interface of a program package calling system according to an embodiment of the present application;

[0048] Figure 3 for Figure 1 A specific flow chart of step S140;

[0049] Figure 4 A schematic diagram of a sub-flow chart of a chip testing method based on a program package according to an embodiment of the present application;

[0050] Figure 5 for Figure 3 A specific flow chart of step S330;

[0051] Figure 6 A schematic diagram of a functional interface of a program package calling system according to an embodiment of the present application;

[0052] Figure 7 A schematic diagram of the structure of a chip testing device according to an embodiment of the present application;

[0053] Figure 8 A schematic diagram of the hardware structure of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0054] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0055] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0056] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0057] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0058] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0059] During the test of the electronic chip, the host computer is connected to a plurality of test boards, and the chip to be tested is placed in the test board. The host computer runs the program package, sends instructions or codes to the chip to be tested through the test board, so that the chip to be tested executes the instructions or codes, and sends the running results to the host computer through the test board. The host computer determines whether the chip to be tested is qualified by the running results. In the related art, during the test, the host computer is manually controlled to make the host computer run the program package. However, each chip to be tested has multiple functions, so multiple functional tests need to be performed, and each functional test corresponds to a program package. In addition, the program packages used for different types of chips to be tested may be completely different, or may be partially the same and partially different. The running order of the program packages of different types of chips to be tested is also different. The method of manually controlling the host computer requires manual clicking of the executable files of the program packages in sequence, and requires clicking the executable files of the next program package after the previous program package is executed. The process is very cumbersome, inefficient, and wastes manpower. Due to human limitations, the running order of the program packages is prone to errors.

[0060] Based on this, the present application proposes a chip testing method, device, electronic device and readable storage medium based on a program package, which can automatically run the program package after obtaining the target execution process, without the need for frequent manual operation of the host computer, thereby improving testing efficiency and reducing the probability of errors.

[0061] The chip testing method based on the program package of the embodiment of the present application can be applied to a host computer, which can be a terminal or a server. In some embodiments, the terminal can be a smart phone, a tablet computer, a laptop computer, a desktop computer, etc.; the server can be configured as an independent physical server, or a server cluster or distributed system composed of multiple physical servers, and can also be configured as a cloud server that provides basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application that implements the chip testing method, etc., but is not limited to the above forms.

[0062] The present application can be used in many general or special computer system environments or configurations. For example: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, distributed computing environments including any of the above systems or devices, etc. The present application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform specific tasks or implement specific abstract data types. The present application can also be practiced in distributed computing environments, in which tasks are performed by remote processing devices connected through a communication network. In a distributed computing environment, program modules can be located in local and remote computer storage media including storage devices.

[0063] The first embodiment of the present application provides a chip testing method based on a program package, which is applied to a host computer, and the host computer is deployed with a program package calling system. Figure 1 , Figure 1 The following is a schematic diagram of the steps of the chip testing method based on the program package implemented in this application. The chip testing method based on the program package of the embodiment of this application may include but is not limited to the following steps:

[0064] Step S110, displaying a plurality of optional identifiers on a program package configuration interface of the program package calling system, each optional identifier corresponding to a program package, and the program package is used to test the chip to be tested connected to the host computer;

[0065] It is worth noting that when the host computer runs the program package, it sends the relevant test code to the chip under test through the test board, so that the chip under test runs the test code and feeds back the running results to the host computer. The host computer can determine whether the chip under test is qualified based on the running results. It should be noted that the program package is a pre-set program for testing the function of the chip under test. The program package can be an application on a mobile phone or a computer software. This application does not make specific restrictions on the test program. Different types of chips and program packages corresponding to different functions are different.

[0066] A test board, also known as a test carrier or test fixture, is a circuit board that can fix and connect the device under test (DUT) and connect to the test system through a specific test interface. Its main function is to provide a stable test environment for the chip to ensure the accuracy and reliability of the test results. During the test process, the test board can simulate the actual working environment of the chip and conduct a comprehensive test of the various performance indicators of the chip.

[0067] It should be noted that the operation result includes a parameter set, and the parameter set includes the data fed back to the host computer when the chip to be tested runs the test code and the parameters of the chip to be tested. For example, the operation result includes the power consumption and temperature of the chip to be tested, and also includes the quality of the signal fed back to the host computer, etc. The operation result is compared with the preset range of the parameter set to obtain whether the test result of the chip to be tested is qualified. This application does not limit the specific parameter set of the operation result. The parameter sets of different types of chips to be tested are different. Those skilled in the art can set the parameter set according to actual conditions.

[0068] In one embodiment, referring to Figure 2 , Figure 2 This is a schematic diagram of the package configuration interface of the package calling system of the embodiment of the present application. Figure 2 , a program package configuration interface is illustrated. In the program package configuration interface, A1, A2, ..., AM are optional identifiers, and the optional identifiers correspond to program packages one by one.

[0069] Step S120, in response to a selection operation instruction for the program package configuration interface, determining a plurality of selected target identifiers based on the selection operation instruction, and determining a target program package based on the target identifiers;

[0070] In one embodiment, the user selects the optional identifier in the program package configuration interface through a device such as a mouse or a touch screen, thereby generating a selection operation instruction, and the optional identifier selected by the user is used as the target identifier. Since the optional identifiers correspond to the program packages one by one, the program package corresponding to the target identifier is used as the target program package.

[0071] Step S130, determining the selection order of the target identifiers based on the selection operation instruction, and obtaining the target execution process of the target program package;

[0072] In one embodiment, when a user selects an optional identifier in a program package configuration interface through a device such as a mouse or touch screen, the selected order is obtained based on the order in which the user clicks the optional identifiers, and the selected order is used as the execution order of each target program package, that is, the target execution process.

[0073] Step S140, based on the target execution process, controlling the execution of multiple target program packages.

[0074] In one embodiment, multiple target program packages are executed sequentially according to the order in the target execution process.

[0075] The chip testing method based on the program package of the embodiment of the present application, through the above steps S110 to S140, first displays multiple optional identifiers on the program package configuration interface of the program package calling system, the optional identifiers correspond to the program packages one by one, and different program packages are used to test different functions of the chip to be tested. In response to the selection operation instruction for the program package configuration interface, the selected multiple target identifiers are determined based on the selection operation instruction, and the target program package is determined based on the target identifier; the selected order of the target identifier is determined based on the selection operation instruction, and the target execution process of the target program package is obtained; based on the target execution process, the operation of multiple target program packages is controlled. In this way, the relevant personnel only need to operate the program package configuration interface before the test starts, generate the selection operation instruction, and thus obtain the target execution process. The subsequent test process does not require manual operation, and the operation of multiple target program packages is automatically controlled based on the target execution process. In this way, the automatic operation of the program package is realized, and there is no need for frequent manual operation of the host computer, which can improve the test efficiency.

[0076] In one embodiment, referring to Figure 3 , Figure 3 for Figure 1 A specific flow chart of step S140 in FIG. 1 is shown in FIG. 140. Step S140 may include but is not limited to the following steps:

[0077] Step S310, in response to receiving the test start instruction, starting to run the first target program package in the target execution process;

[0078] In one embodiment, the user manipulates the host computer to generate a test start instruction. In another embodiment, the host computer is in communication with a preset terminal, and the preset terminal sends the test start instruction to the host computer so that the host computer can execute step S310.

[0079] Step S320, after the first target program package is finished running, generating a first execution end instruction;

[0080] Step S330, in response to detecting the i-1th execution end instruction, start running the i-th target program package in the target execution process; wherein i is a positive integer, and 2≤i≤N, N is the number of target program packages in the target execution process.

[0081] It is worth noting that after executing step S310 and step S320, step S330 is repeatedly executed, and each time step S330 is executed, i=i+1 is set until the Nth execution end instruction is detected. In this way, each target program package can be executed in sequence according to the order in the target execution process.

[0082] It is worth noting that each target program package generates an execution end instruction after the operation is completed. For example, after the operation of the i-th target program package is completed, the i-th execution end instruction is generated. When i is less than N, the i-th execution end instruction is used to indicate the operation of the i+1-th target program package.

[0083] In one embodiment, referring to Figure 4 , Figure 4 This is a schematic diagram of a sub-flow chart of a chip testing method based on a program package according to an embodiment of the present application. Before step S140, the following steps may be included:

[0084] Step S410, obtaining the storage path of the executable file of each program package;

[0085] It is worth noting that each program package is stored in the host computer, and each program package is configured with an executable file, through which the program package can be started to run. Therefore, the storage path of the executable file of each program package is obtained to facilitate the subsequent startup of the program package.

[0086] Step S420: construct a mapping relationship between the optional identifier and the storage path based on the corresponding relationship between the optional identifier and the program package.

[0087] It is worth noting that the mapping relationship between the optional identifier and the storage path is constructed to facilitate the subsequent determination of the corresponding storage path according to the optional identifier, so as to run the executable file based on the storage path and start the corresponding program package. Figure 2 , used to click A4, A1, AM, A2 in sequence, so A4, A1, AM, A2 are target identifiers, and a mapping line from A4 to A1 is generated, a mapping line from A1 to AM is generated, and a mapping line from A2 to A1 is generated.

[0088] In one embodiment, referring to Figure 5 , Figure 5 for Figure 3 A specific flow chart of step S330 in FIG. 1 is shown in FIG. 1 . Step S330 may include but is not limited to the following steps:

[0089] Step S510, determining a target storage path from a mapping relationship based on a target identifier corresponding to the i-th target program package;

[0090] Step S520: start the executable file of the i-th target program package based on the target storage path.

[0091] It is worth noting that when the i-th target package is to be run, the target storage path is determined from the mapping relationship based on the target identifier corresponding to the i-th target package. The target storage path is the storage path of the executable file of the i-th target package. Therefore, the executable path of the i-th target package can be started through the target storage path, thereby running the i-th target package.

[0092] In one embodiment, referring to Figure 6 , Figure 6 This is a schematic diagram of the functional interface of the program package calling system of the embodiment of the present application. The functional interface is provided with a loop function component.

[0093] In step S140, before controlling the execution of multiple target program packages based on the target execution process, the following steps are also included:

[0094] In response to a first configuration operation instruction for the loop functional component, a loop number is determined based on the first configuration operation instruction.

[0095] Correspondingly, in this embodiment, step S140 specifically includes: repeatedly controlling the execution of multiple target program packages based on the number of loops and the target execution process.

[0096] Specifically, refer to Figure 6 A number input text box is provided in the loop function component, and a related prompt and a first confirmation button are provided on one side of the number input text box. The related prompt is used to remind the user to enter the number of cycles in the number input text box.

[0097] For example, during the testing process of some chips, stress testing is required, that is, multiple program packages need to be repeatedly run in a certain order. In an embodiment of the present application, after determining the target execution process, the user can enter the number of loops in the number input text box through the keyboard. After the input is completed, the user clicks the first confirmation button to generate a first configuration operation instruction, so that the number of loops can be obtained from the first configuration operation instruction. After obtaining the number of loops, in step S140, the target execution process is repeatedly executed based on the number of loops, and the number of repetitions of the target execution process is equal to the number of loops. For example, referring to Figure 6 , the target execution process is to run A4, A1, AM and A2 in sequence. If the number of loops entered by the user is 500, the target execution process will be repeated 500 times.

[0098] In one embodiment, referring to Figure 6 The function interface is also provided with an interval setting function component. Before step S140, the following steps are also included:

[0099] In response to a second configuration operation instruction for the interval setting functional component, determining the interval duration based on the second configuration operation instruction;

[0100] Correspondingly, in this embodiment, step S140 specifically includes:

[0101] In response to receiving the test start instruction, starting to run the first target program package in the target execution flow;

[0102] After the first target package is finished running, the first execution end instruction is generated;

[0103] In response to detecting the i-1th execution end instruction, start running the i-th target program package in the target execution process after the i-th interval time; where i is a positive integer, and 2≤i≤N, N is the number of target program packages in the target execution process. Repeat this step until the Nth execution end instruction is detected.

[0104] Specifically, refer to Figure 6 , a duration input text box is provided on the function interface for prompting the user to input the interval duration. The number of duration input text boxes is N-1, and the interval duration corresponding to the first target package is 0. The interval duration corresponding to the i-th target package is the value in the i-1-th duration input text box. The user enters a value in each duration input text box and presses the second confirmation button to generate a second configuration operation instruction. Therefore, N-1 interval durations can be obtained from the second configuration operation instruction, and the N-1 interval durations correspond to the second to N target packages one by one.

[0105] The second aspect of the present application provides a chip testing device based on a program package, which is applied to a host computer, and the host computer is deployed with a program package calling system. Figure 7 , Figure 7 The chip testing device of the embodiment of the present application is a schematic diagram of the structure of the chip testing device. The chip testing device includes:

[0106] The display module 710 is configured to display a plurality of optional identifiers on a package configuration interface of the package calling system, each optional identifier corresponding to a package, and the package is used to test the chip to be tested connected to the host computer;

[0107] The determination module 720 is configured to respond to a selection operation instruction for the program package configuration interface, determine a plurality of selected target identifiers based on the selection operation instruction, and determine a target program package based on the target identifier;

[0108] The process obtaining module 730 is configured to determine the selected order of the target identifiers based on the selected operation instruction, and obtain the target execution process of the target program package;

[0109] The running module 740 is configured to control the running of multiple target program packages based on the target execution process.

[0110] The chip testing device based on the program package of the embodiment of the present application is used to execute the chip testing method based on the program package of the embodiment of the first aspect of the present application. When executing the method, multiple optional identifiers are first displayed on the program package configuration interface of the program package calling system. The optional identifiers correspond to the program packages one by one, and different program packages are used to test different functions of the chip to be tested. In response to the selection operation instruction for the program package configuration interface, multiple target identifiers selected are determined based on the selection operation instruction, and the target program package is determined based on the target identifier; the selected order of the target identifier is determined based on the selection operation instruction, and the target execution process of the target program package is obtained; based on the target execution process, multiple target program packages are controlled to run. In this way, the relevant personnel only need to operate the program package configuration interface before the test starts, generate the selection operation instruction, and thus obtain the target execution process. The subsequent test process does not require manual operation, and the operation of multiple target program packages is automatically controlled based on the target execution process. In this way, the automatic operation of the program package is realized, and there is no need for manual frequent operation of the host computer, which can improve the test efficiency.

[0111] It should be noted that the specific implementation of the chip testing device based on the program package is basically the same as the specific implementation of the chip testing method based on the program package in the above-mentioned embodiment, and will not be repeated here. On the premise of meeting the requirements of the embodiments of the present application, the chip testing device based on the program package can also be provided with other functional modules to implement the chip testing method based on the program package in the above-mentioned embodiment.

[0112] The third aspect of the present application provides an electronic device, the electronic device includes a memory and a processor, the memory stores a computer program, and the processor implements the chip testing method based on the program package of the above embodiment when executing the computer program. The electronic device can be any intelligent terminal including a tablet computer, a car computer, etc.

[0113] In one embodiment, referring to Figure 8 , Figure 8 The hardware structure of the electronic device of the embodiment of the present application is illustrated, and the electronic device includes:

[0114] The processor 801 may be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application;

[0115] The memory 802 can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 802 can store an operating system and other application programs. When the technical solution provided in the embodiment of this specification is implemented by software or firmware, the relevant program code is stored in the memory 802, and the processor 801 calls and executes the chip testing method based on the program package in the embodiment of this application;

[0116] Input / output interface 803, used to implement information input and output;

[0117] The communication interface 804 is used to realize the communication interaction between the device and other devices. The communication can be realized through a wired manner (such as USB, network cable, etc.) or a wireless manner (such as mobile network, WIFI, Bluetooth, etc.);

[0118] A bus 805 that transmits information between the various components of the device (e.g., the processor 801, the memory 802, the input / output interface 803, and the communication interface 804);

[0119] The processor 801 , the memory 802 , the input / output interface 803 and the communication interface 804 are connected to each other in communication within the device via a bus 805 .

[0120] The fourth aspect of the present application is a computer-readable storage medium, which stores a computer program. When the computer program is executed by a processor, the program package-based chip testing method of the first aspect is implemented.

[0121] The memory, as a non-transient computer-readable storage medium, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory may optionally include a memory remotely disposed relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0122] The embodiments described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

[0123] Those skilled in the art will appreciate that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0124] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0125] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0126] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0127] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0128] In the several embodiments provided in the present application, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are merely schematic. For example, the division of the above units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0129] The units described above as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0130] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0131] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including multiple instructions to enable a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (Read-Only Memory, referred to as ROM), random access memory (Random Access Memory, referred to as RAM), disk or optical disk and other media that can store programs.

[0132] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A chip testing method based on a program package, characterized in that: Applied to a host computer, the host computer is deployed with a program package calling system, and the method includes: Displaying a plurality of optional identifiers on a program package configuration interface of the program package calling system, each of the optional identifiers corresponding to a program package, the program package being used to test the chip to be tested connected to the host computer; In response to a selection operation instruction for the program package configuration interface, determining a plurality of selected target identifiers based on the selection operation instruction, and determining a target program package based on the target identifiers; Determining the selection order of the target identifiers based on the selection operation instruction to obtain the target execution process of the target program package; Based on the target execution process, the execution of the plurality of target program packages is controlled.

2. The chip testing method based on program package according to claim 1, characterized in that: The step of controlling the execution of a plurality of target program packages based on the target execution process includes: In response to receiving a test start instruction, starting to run the first target program package in the target execution flow; After the first target program package is finished running, generating a first execution end instruction; In response to detecting the i-1th execution end instruction, starting to run the i-th target program package in the target execution process; wherein i is a positive integer, and 2≤i≤N, N is the number of the target program packages in the target execution process.

3. The chip testing method based on program package according to claim 2, characterized in that: Before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes: Obtaining the storage path of the executable file of each program package; Based on the corresponding relationship between the optional identifier and the program package, a mapping relationship between the optional identifier and the storage path is constructed.

4. The chip testing method based on program package according to claim 3, characterized in that: The starting to run the i-th target program package in the target execution process includes: Based on the target identifier corresponding to the i-th target program package, determining a target storage path from the mapping relationship; Based on the target storage path, the executable file of the i-th target program package is started.

5. The chip testing method based on program package according to claim 1, characterized in that: The program package calling system is provided with a functional interface, and the functional interface is provided with a cyclic functional component; Before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes: In response to a first configuration operation instruction for the loop function component, determining a number of loops based on the first configuration operation instruction; The step of controlling the execution of a plurality of target program packages based on the target execution process includes: Based on the number of cycles and the target execution process, the execution of a plurality of target program packages is repeatedly controlled.

6. The chip testing method based on program package according to claim 5, characterized in that: The functional interface is also provided with an interval setting functional component; Before controlling the execution of the plurality of target program packages based on the target execution process, the method further includes: In response to a second configuration operation instruction for the interval setting functional component, determining a fixed interval duration corresponding to each of the target program packages based on the second configuration operation instruction; The step of controlling the execution of a plurality of target program packages based on the target execution process includes: In response to receiving a test start instruction, starting to run the first target program package in the target execution flow; After the first target program package is finished running, generating a first execution end instruction; In response to detecting the i-1th execution end instruction, starting to run the i-th target program package in the target execution process after the i-th interval duration; wherein i is a positive integer, and 2≤i≤N, N is the number of the target program packages in the target execution process.

7. The chip testing method based on program package according to claim 1, characterized in that: The plurality of optional identifiers include at least a first optional identifier and a second optional identifier; the program package calling system is provided with a configured interface; The step of determining the selected order of the target identifiers based on the selection operation instruction to obtain the target execution process of the target program package includes: In response to a click operation on the first selectable identifier and a click operation on the second selectable identifier, recording a first click time when the first selectable identifier is clicked, and recording a second click time when the second selectable identifier is clicked; In the case where it is detected that the first click time is earlier than the second click time, constructing a mapping connection from the first optional identifier to the second optional identifier in the configured interface, obtaining the selected order based on the mapping connection, and obtaining the target execution process based on the selected order; When it is detected that the first click time is later than the second click time, a mapping connection is constructed in the configured interface from the second optional identifier to the first optional identifier, the selected order is obtained based on the mapping connection, and the target execution process is obtained based on the selected order.

8. A chip testing device based on a program package, characterized in that: Applied to a host computer, the host computer is deployed with a program package calling system, and the device includes: A display module, configured to display a plurality of optional identifiers on a program package configuration interface of the program package calling system, each of the optional identifiers corresponding to a program package, and the program package is used to test the chip to be tested connected to the host computer; a determination module configured to respond to a selection operation instruction for the program package configuration interface, determine a plurality of selected target identifiers based on the selection operation instruction, and determine a target program package based on the target identifier; A process obtaining module is configured to determine the selection order of the target identifiers based on the selection operation instruction, and obtain the target execution process of the target program package; The running module is configured to control the running of the plurality of target program packages based on the target execution process.

9. An electronic device, characterized in that: The electronic device comprises a memory and a processor, the memory stores a computer program, and the processor implements the program package-based chip testing method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the chip testing method based on a program package according to any one of claims 1 to 7 is implemented.

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