Chip testing device and method for temperature and humidity control

Abstract

The invention discloses a temperature and humidity control chip testing device and a testing method. The chip testing device comprises a bottom plate; the driving module is arranged on the bottom plate; the carrier plate module is arranged on the bottom plate and used for placing a to-be-tested piece, and the lower portion of the carrier plate module is arranged in a sealed mode; the pressing plate module is arranged above the carrier plate module, and the driving module is used for driving the pressing plate module to move up and down; the temperature control module is arranged on the pressing plate module and is used for cooling the to-be-tested piece; the vacuum module is arranged on the pressing plate module and is used for being matched with the carrier plate module to meet a vacuum environment required by testing; and the drying module is arranged on the pressing plate module, wraps the outer side of the vacuum module and is used for forming a dry environment on the periphery of the vacuum module. Accurate humidity control is carried out through the vacuum module and the drying module, and cooling control is carried out on the to-be-tested piece on the carrier plate module through the temperature control module, so that a secondary guarantee capability of controlling humidity in an extremely low temperature test is achieved, and the reliability of the whole system is enhanced.

Description

Technical Field

[0001] The present invention relates to the technical field of testing equipment, and in particular to a chip testing device and method for controlling temperature and humidity. Background Art

[0002] With the rapid development of electronic product technology and the increasing requirements for process efficiency and yield, the electronics industry has gradually begun to strengthen the development and optimization of product function test equipment while improving the process efficiency of electronic products. Among them, the temperature and humidity control of the high-performance SOC (system-on-chip) test environment has always been a technical difficulty in the industry.

[0003] To test high-performance SOC, two states need to be achieved: one is to run the SOC in an extremely low temperature environment, and the other is to run the SOC in a full power state. Both states require an extremely low temperature environment, and in an extremely low temperature environment, condensation water is easily generated on the SOC, causing damage to the SOC.

[0004] At present, the common solutions to prevent condensation in extremely low temperature environments are: one is manual observation and regular maintenance and cleaning of equipment; the other is to control the humidity in the workshop. However, the effects of these two methods are not very good. Summary of the invention

[0005] The present invention provides a chip testing device with temperature and humidity control, aiming to solve at least one of the technical problems existing in the prior art.

[0006] The technical solution of the first aspect of the present invention relates to a chip testing device with temperature and humidity control, comprising:

[0007] Base plate;

[0008] A driving module, arranged on the bottom plate;

[0009] A carrier module is arranged on the bottom plate, the carrier module is used to place the test piece, and the bottom of the carrier module is sealed;

[0010] A pressing plate module is arranged above the carrier plate module, and a driving module is used to drive the pressing plate module to move up and down;

[0011] A temperature control module, arranged on the pressing plate module, for cooling the test piece;

[0012] The vacuum module is arranged on the pressure plate module and is used for cooperating with the carrier plate module to meet the vacuum environment required for testing.

[0013] According to some embodiments of the present invention, the carrier module includes:

[0014] A support rod, arranged on the bottom plate;

[0015] A middle frame plate is arranged on the support rod, and a yielding portion is provided on the middle frame plate;

[0016] A needle plate, arranged on the middle frame plate;

[0017] A mounting plate, arranged on the needle plate, the mounting plate being provided with a mounting portion for placing the piece to be tested;

[0018] The sealing cover is arranged below the needle plate and located in the yielding portion.

[0019] According to some embodiments of the present invention, a plurality of sealing strips are further provided between the needle plate and the mounting plate.

[0020] According to some embodiments of the present invention, the pressing plate module comprises:

[0021] A first pressing plate, arranged above the mounting plate, wherein a first clearance hole is provided on the first pressing plate, and the first clearance hole is located above the mounting portion;

[0022] The second pressing plate is arranged above the first pressing plate. The second pressing plate is provided with a second clearance hole. The vacuum module is arranged in the second clearance hole.

[0023] According to some embodiments of the present invention, a guide pin is provided below the first pressing plate, and a guide sleeve is correspondingly provided on the mounting plate.

[0024] According to some embodiments of the present invention, the temperature control module includes:

[0025] A water cooling component, arranged on one side of the bottom plate and located in the first clearance hole;

[0026] A support block, disposed on the first pressing plate, for fixing a water cooling head of the water cooling component;

[0027] A refrigeration component is arranged below the water cooling head;

[0028] The boss is connected below the cooling element and is used for contacting the test piece.

[0029] According to some embodiments of the present invention, a temperature sensor and a humidity sensor are further disposed in the boss, for respectively detecting the temperature and humidity of the test piece.

[0030] According to some embodiments of the present invention, the vacuum module comprises:

[0031] A vacuum cover is arranged on the pressing plate module, and a plurality of mounting holes are arranged on the vacuum cover. The mounting holes are provided with adapters, which are respectively used to connect the temperature control module, the negative pressure device and the electric control device;

[0032] A first cover plate is disposed above the vacuum cover and is used to seal the upper portion of the vacuum cover, wherein a sealing strip is disposed between the first cover plate and the vacuum cover;

[0033] The pressure sensor is arranged in the vacuum cover and is used to detect the pressure value in the vacuum cover.

[0034] According to some embodiments of the present invention, a drying module is further included. The drying module is arranged on the pressing plate module and covers the outside of the vacuum cover, so as to form a drying environment around the vacuum cover.

[0035] According to some embodiments of the present invention, the drying module comprises:

[0036] A drying hood, arranged on the pressing plate module and covering the outer side of the vacuum hood, the drying hood is provided with an air inlet joint and an air outlet joint, the air inlet joint is used to connect to an air pump, and the air outlet joint is connected to a one-way valve;

[0037] a second cover plate, arranged on the drying cover and used to seal the upper part of the drying cover, wherein the sealing strip is arranged between the second cover plate and the drying cover;

[0038] A pressure sensor is arranged in the drying hood and is used to detect the pressure value in the drying hood;

[0039] A plurality of humidity sensors are respectively arranged inside and outside the drying hood, and the plurality of humidity sensors are respectively used to detect the humidity values ​​inside and outside the drying hood.

[0040] According to some embodiments of the present invention, the driving module includes:

[0041] A driving member, disposed on the bottom plate along the up-down direction;

[0042] The support plate is connected to the output end of the driving member, and the pressure plate module is arranged on the support plate.

[0043] According to some embodiments of the present invention, a plurality of guide rods are further included. The guide rods are arranged on the base plate along the up-down direction, and the support plate is provided with linear bearings connected to the guide rods.

[0044] A temperature and humidity controlled chip testing method according to the technical solution of the second aspect of the present invention is applied to any of the temperature and humidity controlled chip testing devices described above, comprising the following steps:

[0045] S100. Set the humidity abnormal value A0 and the target temperature value B0;

[0046] S200. The temperature is adjusted to drop gradually until B0, and the humidity value A1 of the test piece is detected in real time. If A1 ≥ A0 during the process, the vacuuming device is started to vacuum the vacuum module until A1 < A0.

[0047] According to some embodiments of the present invention, step S200 also includes:

[0048] S300. Detect the pressure value in the vacuum module in real time. If the pressure value reaches an upper limit, stop the negative pressure device and start the drying device to input dry air into the drying module until A1<A0.

[0049] According to some embodiments of the present invention, step S300 also includes:

[0050] S400. The external environment humidity value is set to A3. If the humidity value in the drying module is A2>A3, the input amount of the drying device is increased until A2<A3.

[0051] According to some embodiments of the present invention, in step S400, the pressure value in the drying module is detected in real time, and if the pressure value in the drying module is greater than the atmospheric pressure, the test is stopped for maintenance.

[0052] The beneficial effects of the present invention are as follows.

[0053] 1. The driving module drives the pressure plate module to fit on the carrier module for testing. A sealing structure is formed between the vacuum module and the carrier module. The temperature control module controls the temperature of the test piece and the vacuum module to perform low-temperature testing. The vacuum module is used to meet the vacuum environment required for testing. At the same time, the vacuum environment can also reduce humidity, enhance the reliability of the entire test device, and can accurately control humidity locally to avoid humidity adjustment in the entire space and reduce energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 is an overall schematic diagram of a chip testing device according to an embodiment of the present invention;

[0055] Figure 2 is a schematic structural diagram of a carrier module and a drive module according to an embodiment of the present invention;

[0056] Figure 3 yes Figure 2 An exploded view of the carrier module shown;

[0057] Figure 4 is a structural schematic diagram of a pressing plate module according to an embodiment of the present invention;

[0058] Figure 5 is a schematic structural diagram of a vacuum module according to an embodiment of the present invention;

[0059] Figure 6 yes Figure 5 An exploded view of the vacuum module shown;

[0060] Figure 7 is a schematic structural diagram of a drying module according to an embodiment of the present invention;

[0061] Figure 8 is a schematic structural diagram of a temperature control module according to an embodiment of the present invention;

[0062] Fig. 9 yes Figure 8 An exploded view of the temperature control module is shown (with the water cooling unit hidden).

[0063] Figure Number:

[0064] Base plate 100, guide rod 110;

[0065] Driving module 200, driving member 210, supporting plate 220, linear bearing 221;

[0066] Carrier board module 300, support rod 310, middle frame board 320, yielding portion 321, needle board 330, mounting plate 340, mounting portion 341, guide sleeve 342, sealing cover 350;

[0067] A pressing plate module 400, a first pressing plate 410, a guide pin 411, and a second pressing plate 420;

[0068] Temperature control module 500, water cooling element 510, water cooling head 511, support block 520, refrigeration element 530, boss 540;

[0069] Vacuum module 600, vacuum cover 610, adapter 611, first cover plate 620;

[0070] Drying module 700, drying cover 710, air inlet connector 711, air outlet connector 712, second cover plate 720;

[0071] Sealing strip 800. DETAILED DESCRIPTION

[0072] The following content will describe several embodiments of the present invention, including embodiments corresponding to the drawings. It can be understood that the drawings are used to assist in understanding the technical features and technical solutions of the present invention, and should not be understood as limiting the scope of protection of the present invention.

[0073] The following will be combined with the embodiments and drawings to clearly and completely describe the concept, specific structure and technical effects of the present invention, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0074] It should be noted that, unless otherwise clearly defined, when a feature is referred to as "fixed", "connected", "installed" or "set on" another feature, it can be directly "fixed", "connected", "installed" or "set on" another feature, or it can be indirectly "fixed", "connected", "installed" or "set on" another feature. The words "fixed", "connected", "installed" or "set on" should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.

[0075] It should be noted that the description of the orientation or position relationship indicated by up, down, left, right, top, bottom, front, back, inside, outside, etc. used in the present invention is based on the orientation or position relationship of the drawings or embodiments, and is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0076] It should be noted that the term "and / or" used in the present invention includes any combination of one or more related listed items, "above", "below", "within", etc. are understood to include the number itself.

[0077] It should be noted that, in the present invention, the description of first and second is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0078] It should be noted that, unless otherwise clearly defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art. The terms used in this specification are only for describing specific embodiments and are not intended to limit the present invention.

[0079] Reference Figures 1 to 9The technical solution of the present invention relates to a temperature and humidity controlled chip testing device, comprising: a base plate 100; a driving module 200, which is arranged on the base plate 100; a carrier module 300, which is arranged on the base plate 100, and the carrier module 300 is used to place the test piece, and the lower part of the carrier module 300 is sealed; a pressing plate module 400, which is arranged above the carrier module 300, and the driving module 200 is used to drive the pressing plate module 400 to move up and down; a temperature control module 500, which is arranged on the pressing plate module 400, and is used to cool the test piece; a vacuum module 600, which is arranged on the pressing plate module 400, and is used to cooperate with the carrier module 300 to meet the vacuum environment required for testing, and also includes a drying module 700, which is arranged on the pressing plate module 400 and is covered on the outer side of the vacuum module 600, and is used to form a dry environment around the vacuum module 600.

[0080] It can be understood that, in the above embodiment, the bottom of the carrier module 300 is sealed, and the top is sealed by the vacuum module 600. The vacuum module 600 can form a simulated vacuum environment effect on the environment inside the carrier module 300, so that the test piece can be kept dry during the temperature reduction test. The drying module 700 is used to seal the vacuum module 600. When the vacuum module 600 reaches the maximum pressure value and cannot be adjusted further, dry air is introduced into the drying module 700 to discharge the moist air in the drying module 700, so that the vacuum module 600 is in a dry environment, which provides a secondary guarantee for keeping the test piece dry.

[0081] Application of the above-mentioned chip testing device has at least the following beneficial effects: the driving module 200 drives the pressure plate module 400 to fit on the carrier module 300 for testing, a sealing structure is formed between the vacuum module 600 and the carrier module 300, and the temperature control module 500 controls the temperature of the test piece and the temperature inside the vacuum module 600 to perform low-temperature testing. The vacuum module 600 is used to meet the vacuum environment required for testing and at the same time plays a role in reducing humidity. The drying module 700 is used to ensure a dry environment outside the vacuum module 600, which plays a secondary guarantee for controlling humidity and enhances the reliability of the entire testing device. At the same time, it can achieve local precise humidity control to avoid humidity adjustment for the entire space and reduce energy consumption.

[0082] According to some embodiments of the present invention, the carrier module 300 includes: a support rod 310, which is arranged on the bottom plate 100; a middle frame plate 320, which is arranged on the support rod 310, and a yielding portion 321 is provided on the middle frame plate 320, referring to Figure 2 and Figure 3In this embodiment, the middle frame plate 320 is a U-shaped plate with two openings arranged opposite to each other, and the opening between the two U-shaped plates forms a yielding portion 321; the needle plate 330 is arranged on the middle frame plate 320, and a plurality of probes are arranged on the needle plate 330 for contacting and testing the test piece; the mounting plate 340 is arranged on the needle plate 330, and the mounting plate 340 is provided with a mounting portion 341 for placing the test piece; the sealing cover 350 is arranged below the needle plate 330 and is located in the yielding portion 321, and a sealing strip 800 is arranged between the sealing cover 350 and the needle plate 330. In some other embodiments, sealing can also be performed by a sealant.

[0083] According to some embodiments of the present invention, a plurality of sealing strips 800 are further provided between the needle plate 330 and the mounting plate 340 .

[0084] According to some embodiments of the present invention, the pressure plate module 400 includes: a first pressure plate 410, which is arranged above the mounting plate 340, and a first clearance hole is provided on the first pressure plate 410, and the first clearance hole is located above the mounting portion 341; a second pressure plate 420, which is arranged above the first pressure plate 410, and a second clearance hole is provided on the second pressure plate 420, and the vacuum module 600 and the drying module 700 are arranged in the second clearance hole, and the second pressure plate 420 is used to connect the driving module 200, the first pressure plate 410 is connected to the second pressure plate 420, and the vacuum module 600 and the drying module 700 are connected to the first pressure plate 410.

[0085] According to some embodiments of the present invention, a guide pin 411 is provided under the first pressure plate 410, and a guide sleeve 342 is correspondingly provided on the mounting plate 340. The guide pin 411 cooperates with the guide sleeve 342 to ensure that the first pressure plate 410 can be correctly pressed on the mounting plate 340.

[0086] According to some embodiments of the present invention, the temperature control module 500 includes: a water-cooling component 510, which is arranged on one side of the base plate 100 and is located in the first clearance hole; a support block 520, which is arranged on the first pressing plate 410 and is used to fix the water-cooling head 511 of the water-cooling component 510; a refrigeration component 530, which is arranged below the water-cooling head 511; a boss 540, which is connected to the bottom of the refrigeration component 530 and is used to contact the test piece. In this embodiment, the temperature control module 500 includes the water-cooling component 510, and the water-cooling component 510 is used to cool the refrigeration component 530. In some other embodiments, other heat sinks may be used. In this embodiment, the cooling element 530 is configured as a semiconductor cooling element. In some other embodiments, other cooling devices may be used for cooling. The boss 540 is made of copper. The boss 540 is attached to the surface of the test piece. The temperature is lowered by the cooling element 530. The boss 540 conducts temperature to cool the test piece. The water cooling head 511 of the water cooling element 510 is attached to the surface of the cooling element 530 to dissipate heat from the cooling element 530.

[0087] According to some embodiments of the present invention, a temperature sensor and a humidity sensor are further provided in the boss 540, which are used to detect the temperature and humidity of the test piece, respectively, and detect the temperature value and humidity value of the test piece in real time to determine whether the set target temperature is reached and whether the humidity value meets the standard, so as to determine whether it is necessary to start the vacuum module 600 and the drying module 700.

[0088] According to some embodiments of the present invention, the vacuum module 600 includes: a vacuum cover 610, which is arranged on the pressure plate module 400. The vacuum cover 610 is provided with a plurality of mounting holes, and adapters 611 are provided in the mounting holes, which are respectively used to connect the temperature control module 500, the negative pressure device and the electronic control device. It can be understood that the adapter 611 mentioned here includes multiple adapters 611 such as aviation connectors, air pipe connectors and water-cooled water pipe connectors, which can be used to connect the electronic control device, the negative pressure device and the water-cooling component 510 respectively; a first cover plate 620, which is arranged above the vacuum cover 610 and is used to seal the upper part of the vacuum cover 610. A sealing strip 800 is provided between the first cover plate 620 and the vacuum cover 610; a pressure sensor, which is arranged in the vacuum cover 610 and is used to detect the pressure value in the vacuum cover 610. By real-time detection of the pressure value in the vacuum cover 610, it is ensured that the pressure value of the vacuum cover 610 can always be within the limit range to avoid exceeding the pressure limit and causing damage to the vacuum cover 610.

[0089] According to some embodiments of the present invention, the drying module 700 includes: a drying hood 710, which is arranged on the pressing plate module 400 and covered on the outer side of the vacuum hood 610, and the drying hood 710 is provided with an air inlet connector 711 and an exhaust connector 712, the air inlet connector 711 is used to connect the air pump, and the exhaust connector 712 is connected to a one-way valve. In some other embodiments, the exhaust connector 712 can also be connected to a negative pressure device to evacuate air, which is synchronized with the input of dry air to ensure that the drying hood 710 is filled with dry air and the moist air is discharged. It can be understood that when the air inlet connector 711 and the exhaust connector 712 are both sealed, the drying hood 710 can be regarded as a closed space; a second cover plate 720, which is arranged on the drying hood 7 10, used to seal the upper part of the drying hood 710, a sealing strip 800 is provided between the second cover plate 720 and the drying hood 710; a pressure sensor is arranged in the drying hood 710, and is used to detect the pressure value in the drying hood 710. When it is detected that the pressure value of the drying hood 710 becomes higher, it may be that the vacuum hood 610 is leaking, and it is necessary to shut down for maintenance at this time; multiple humidity sensors are respectively arranged in the drying hood 710 and outside the drying hood 710. The multiple humidity sensors are respectively used to detect the humidity values ​​in the drying hood 710 and outside the drying hood 710. When the humidity value in the drying hood 710 is higher than the humidity value outside, dry air is introduced into the drying hood 710 to ensure that a dry environment is maintained in the drying hood 710.

[0090] According to some embodiments of the present invention, the driving module 200 includes: a driving member 210, which is arranged on the base plate 100 along the up and down directions; a support plate 220, which is connected to the output end of the driving member 210, and the pressure plate module 400 is arranged on the support plate 220; a plurality of guide rods 110, the guide rods 110 are arranged on the base plate 100 along the up and down directions, and a linear bearing 221 connected to the guide rods 110 is provided on the support plate 220. In this embodiment, the driving member 210 is configured as a cylinder, and in some other embodiments, the driving member 210 can also use a motor.

[0091] A temperature and humidity controlled chip testing method according to the technical solution of the second aspect of the present invention is applied to any of the above chip testing devices, comprising the following steps:

[0092] S100. Set the humidity abnormal value A0 and the target temperature value B0;

[0093] S200. The temperature is gradually adjusted down to B0 by the refrigeration element 530 in the temperature control module 500, and the humidity value A1 of the test piece is detected in real time by the humidity sensor. If A1≥A0 during the process, the vacuuming device is started to vacuum the vacuum module 600 until A1<A0.

[0094] In step S200, the gradient value of the temperature adjustment may be 0.1°C, 0.5°C or 1°C, etc., which is set according to actual test requirements.

[0095] According to some embodiments of the present invention, step S200 also includes:

[0096] S300. The pressure value in the vacuum module 600 is detected in real time through the pressure sensor. If the pressure value reaches the upper limit, the negative pressure device is stopped, and the drying device is started to input dry air into the drying module 700 until A1<A0. It can be understood that when the pressure value reaches the upper limit, continuing to reduce the pressure of the vacuum module 600 may cause the vacuum cover 610 to be crushed. At this time, it is impossible to continue to reduce the humidity value by forming a vacuum environment. In this case, dry air is input into the drying module 700 to ensure that the vacuum module 600 is in a dry environment, thereby reducing the humidity value.

[0097] According to some embodiments of the present invention, step S300 also includes:

[0098] S400. The external environment humidity value is set to A3. If the humidity value A2>A3 in the drying module 700, the input amount of the drying equipment is increased until A2<A3.

[0099] According to some embodiments of the present invention, in step S400, the pressure value in the drying module 700 is detected in real time, and if the pressure value in the drying module 700 is greater than the atmospheric pressure, the test is stopped for maintenance.

[0100] It should be noted that in this specification, terms such as "one embodiment", "some embodiments", "basic embodiment", "extended embodiment" etc. may be used to describe several embodiments of the present invention. The specific features, structures, materials or characteristics of the several embodiments may be combined in accordance with the principles and purposes of the present invention.

[0101] Although some embodiments of the present invention have been shown and described in this specification, the present invention should not be limited to the above-mentioned embodiments. As long as the technical effects of the present invention are achieved by the same or equivalent means, any changes, modifications, equivalent substitutions and equivalent variations to these embodiments that are within the spirit and principles of the present disclosure and do not depart from the principles and purpose of the present invention should be included in the scope of protection of the present disclosure and should be deemed to be within the scope of protection of the present invention.

Claims

1. A chip testing device with temperature and humidity control, characterized in that: include: Base plate; A driving module, arranged on the bottom plate; A carrier module is arranged on the bottom plate, the carrier module is used to place the test piece, and the bottom of the carrier module is sealed; A pressing plate module is arranged above the carrier plate module, and a driving module is used to drive the pressing plate module to move up and down; A temperature control module, arranged on the pressing plate module, for cooling the test piece; The vacuum module is arranged on the pressure plate module and is used for cooperating with the carrier plate module to meet the vacuum environment required for testing.

2. The temperature and humidity controlled chip testing device according to claim 1, characterized in that: The carrier module comprises: A support rod, arranged on the bottom plate; A middle frame plate is arranged on the support rod, and a yielding portion is provided on the middle frame plate; A needle plate, arranged on the middle frame plate; A mounting plate, arranged on the needle plate, the mounting plate being provided with a mounting portion for placing the piece to be tested; The sealing cover is arranged below the needle plate and located in the yielding portion.

3. The temperature and humidity controlled chip testing device according to claim 2, characterized in that: A plurality of sealing strips are also arranged between the needle plate and the mounting plate.

4. The temperature and humidity controlled chip testing device according to claim 2 or 3, characterized in that: The pressing plate module comprises: A first pressing plate, arranged above the mounting plate, wherein a first clearance hole is provided on the first pressing plate, and the first clearance hole is located above the mounting portion; The second pressing plate is arranged above the first pressing plate. The second pressing plate is provided with a second clearance hole. The vacuum module is arranged in the second clearance hole.

5. The temperature and humidity controlled chip testing device according to claim 4, characterized in that: A guide pin is provided below the first pressing plate, and a guide sleeve is correspondingly provided on the mounting plate.

6. The temperature and humidity controlled chip testing device according to claim 4, characterized in that: The temperature control module comprises: A water cooling component, arranged on one side of the bottom plate and located in the first clearance hole; A support block, disposed on the first pressing plate, for fixing a water cooling head of the water cooling component; A refrigeration component, arranged below the water cooling head; The boss is connected below the cooling element and is used for contacting the test piece.

7. The temperature and humidity controlled chip testing device according to claim 6, characterized in that: The boss is also provided with a temperature sensor and a humidity sensor, which are used to detect the temperature and humidity of the test piece respectively.

8. The temperature and humidity controlled chip testing device according to claim 1, characterized in that: The vacuum module comprises: A vacuum cover is arranged on the pressing plate module, and a plurality of mounting holes are arranged on the vacuum cover. The mounting holes are provided with adapters, which are respectively used to connect the temperature control module, the negative pressure device and the electric control device; A first cover plate is disposed above the vacuum cover and is used to seal the upper portion of the vacuum cover, wherein a sealing strip is disposed between the first cover plate and the vacuum cover; The pressure sensor is arranged in the vacuum cover and is used to detect the pressure value in the vacuum cover.

9. The chip testing device with temperature and humidity control according to claim 8, characterized in that: It also includes a drying module, which is arranged on the pressing plate module and covers the outside of the vacuum cover, and is used to form a drying environment outside the vacuum cover.

10. The chip testing device with temperature and humidity control according to claim 9, characterized in that: The drying module comprises: A drying hood, arranged on the pressing plate module and covering the outside of the vacuum hood, the drying hood is provided with an air inlet joint and an air outlet joint, the air inlet joint is used to connect to an air pump, and the air outlet joint is connected to a one-way valve; a second cover plate, arranged on the drying cover and used to seal the upper part of the drying cover, wherein the sealing strip is arranged between the second cover plate and the drying cover; A pressure sensor is arranged in the drying hood and is used to detect the pressure value in the drying hood; A plurality of humidity sensors are respectively arranged inside and outside the drying hood, and the plurality of humidity sensors are respectively used to detect the humidity values ​​inside and outside the drying hood.

11. The chip testing device with temperature and humidity control according to claim 1, characterized in that: The driving module comprises: A driving member, disposed on the bottom plate along the up-down direction; The support plate is connected to the output end of the driving member, and the pressure plate module is arranged on the support plate.

12. The chip testing device with temperature and humidity control according to claim 11, characterized in that: It also includes a plurality of guide rods, which are arranged on the base plate along the up-down direction, and the support plate is provided with linear bearings connected to the guide rods.

13. A temperature and humidity controlled chip testing method, applied to the temperature and humidity controlled chip testing device according to any one of claims 1 to 12, characterized in that: The steps include: S100. Set the humidity abnormal value A0 and the target temperature value B0; S200. The temperature is adjusted to drop gradually until B0, and the humidity value A1 of the test piece is detected in real time. If A1 ≥ A0 during the process, the vacuuming device is started to vacuum the vacuum module until A1 < A0.

14. The chip testing method with temperature and humidity control according to claim 12, characterized in that: The step S200 also includes: S300. Detect the pressure value in the vacuum module in real time. If the pressure value reaches an upper limit, stop the negative pressure device and start the drying device to input dry air into the drying module until A1<A0.

15. The chip testing method with temperature and humidity control according to claim 13, characterized in that: The step S300 also includes: S400. The external environment humidity value is set to A3. If the humidity value in the drying module is A2>A3, the input amount of the drying device is increased until A2<A3.

16. The chip testing method with temperature and humidity control according to claim 13, characterized in that: In the step S400, the pressure value in the drying module is detected in real time. If the pressure value in the drying module is greater than the atmospheric pressure, the test is stopped for maintenance.

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