Detection device for Android machine mainboard production

Abstract

The invention relates to the technical field of mainboard production and detection, in particular to a detection device for android mainboard production, which comprises a detection workbench, detection equipment mounted on the detection workbench and a plurality of test connectors electrically connected with the detection equipment, a matched carrier is mounted on the detection workbench, a limiting groove is formed in the matched carrier, and the detection equipment is electrically connected with the detection connectors through the limiting groove. The android machine mainboard is placed on the limiting groove during detection; when the mainboard of the Android machine is detected, a plurality of test connectors can be sequentially and quickly inserted into a plurality of interfaces on the mainboard of the Android machine in cooperation with the detection mechanism, and the interfaces and the mainboard of the Android machine are stably fixed again while the test connectors are inserted, so that after detection is completed, the test connectors can be quickly and conveniently inserted into the interfaces of the mainboard of the Android machine. When the plurality of test connectors are separated from the plurality of interfaces, the interfaces can be pressed and protected, and the problem of looseness between the interfaces and the android machine mainboard is prevented.

Description

Technical Field

[0001] The present invention relates to the technical field of motherboard production detection, and in particular to a detection device for producing Android machine motherboards. Background Art

[0002] During the production process, Android motherboards need to be tested. The testing method is that the tester manually inserts multiple test connectors into different interfaces on the motherboard (such as USB, audio, RF interface, etc.) in turn, and observes the test results through the display screen of the test equipment.

[0003] At present, in the process of testing the existing Android motherboard, multiple test connectors are first inserted into the multiple interfaces on the Android motherboard in sequence, and the test results of the Android motherboard are displayed on the display screen of the testing equipment. After the test is completed, the staff still needs to unplug the test connectors from the interfaces in sequence. This process not only requires the staff to spend a long time to plug and unplug the test connectors and the interfaces, but also when the staff pulls out the test connectors with force, the interfaces will also be subjected to tension, resulting in instability in the connection between the interfaces and the Android motherboard. For this reason, we propose a testing device for Android motherboard production. Summary of the invention

[0004] The purpose of the present invention is to provide a detection device for producing Android motherboards to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned object, the present invention provides the following technical solutions: a detection device for production of an Android machine motherboard, comprising a detection workbench, a detection device installed on the detection workbench, and a plurality of test connectors electrically connected to the detection device, wherein a matching carrier is installed on the detection workbench, a limiting groove is provided on the matching carrier, and the Android machine motherboard is placed on the limiting groove during detection; The two ends of the limiting groove on the matching carrier are respectively slidably connected with support frames, and a connecting mechanism is provided on the matching carrier, and the connecting mechanism is used to connect and adjust the positions of the two support frames; The support frame is provided with a matching detection mechanism, and the matching detection mechanism performs plug-and-unplug connection between the connector on the support frame and the interface on the Android machine mainboard.

[0006] Furthermore, the connecting mechanism includes a rotating shaft, a rotating motor, a rotating gear, a first connecting rack and a second connecting rack. A receiving groove is provided at the bottom of the mating carrier, and the rotating motor is located inside the receiving groove. The output end of the rotating motor is fixedly connected to the rotating shaft, and the rotating shaft is rotatably connected to the upper surface of the mating carrier. The rotating gear is sleeved on the outside of the rotating shaft, and the first connecting rack and the second connecting rack are respectively located on the outside of the rotating gear. The first connecting rack and the second connecting rack are meshed and connected with the rotating gear, and the ends of the first connecting rack and the second connecting rack that are away from each other are respectively fixedly connected to two support frames.

[0007] Further, the matching detection mechanism includes a mobile frame, a mobile plate, a linkage mechanism, a guide rod, a guide mechanism and a locking mechanism, the mobile frame and the mobile plate are both slidably connected to the support frame, and the mobile plate is close to the Android machine motherboard, the mobile plate is provided with a mounting port, and the test connector is fixed through the mounting port, the linkage mechanism is installed on the support frame, and the linkage mechanism is used to synchronously drive the mobile plate and the mobile frame; The support frame is provided with movable openings on both sides, and the two ends of the movable frame extend to one end of the two movable openings respectively, and the movable frame is slidably connected to the movable openings. Two guide rods are provided, and the two guide rods slide through one end of the two movable openings respectively, one end of the guide rod is fixedly connected to the movable frame, and the other end of the guide rod is connected to the guide mechanism, and the two guide mechanisms are both connected to the support frame. The locking mechanism is arranged between the two guide mechanisms, and the locking mechanism is used to lock the interface on the Android machine motherboard, and through the matching detection mechanism, it assists multiple test connectors to perform connection tests with multiple interfaces.

[0008] Furthermore, guide grooves are provided at the top of the matching carrier and at the positions corresponding to the two support frames, and two guide plates are provided at the bottom of the support frame, and the two guide plates are slidably connected to the guide grooves, so that the support frame can be limited and guided by the provided guide grooves.

[0009] Further, the linkage mechanism includes a support shaft, a rotating member, a driving rod, a pushing support rod and a connecting seat, the support shaft passes through the bottom of the support frame, and the bottom of the support shaft extends to the inside of the guide groove, the support shaft is rotatably connected to the support frame, the rotating member is located at the bottom of the support frame, and the rotating member is used to drive the support shaft; The middle part of the driving rod is fixedly sleeved on the outside of the supporting shaft, and both ends of the driving rod are rotatably connected with the pushing support rod through a pin shaft, and the ends of the two pushing support rods away from the driving rod are rotatably connected with the connecting seat through a pin shaft, and the two connecting seats are respectively fixedly connected to the moving frame and the moving plate, and the moving plate and the moving frame are synchronously driven by the linkage mechanism.

[0010] Furthermore, the rotating part includes an electric push rod, a pushing rack and a positioning gear. The electric push rod is fixedly installed at the bottom of the support frame, and the output end of the electric push rod is fixedly connected to the pushing rack. The pushing rack is meshed with the positioning gear, and the positioning gear is fixedly installed at the bottom of the support shaft. The driving function of the support shaft is realized through the rotating part.

[0011] Further, the guide mechanism includes a synchronization plate, a synchronization rod, a limit plate and a guide frame, the synchronization plate is fixedly mounted on one end of the guide rod close to the Android machine mainboard, and the synchronization rod is fixedly connected to the synchronization plate, the other end of the synchronization rod is fixedly connected to the limit plate, the limit plate is slidably connected to the top of one end of the support frame, the guide frame is fixedly mounted on the support frame, and the limit plate is slidably connected to the guide frame; The guide frame is provided with a vertical guide opening, and the limit plate is provided with an L-shaped limit opening, a connecting piece is provided between the guide opening and the limit opening, and the connecting piece is connected to the locking mechanism, and the guide mechanism is provided to realize the function of connecting the guide rod, and at the same time realize the function of connecting and limiting the locking mechanism.

[0012] Furthermore, the connecting member includes a connecting rod, a first connecting plate and a second connecting plate, the connecting rod slides through the guide opening and the limit opening respectively, and one end of the connecting rod is connected to the locking mechanism, the first connecting plate is slidably connected to one side of the limit plate, and the second connecting plate is slidably connected to one side of the guide frame, the first connecting plate and the second connecting plate are both fixedly sleeved on the outside of the connecting rod, and the locking mechanism is connected through the connecting member.

[0013] Furthermore, the locking mechanism includes a connecting frame, a support rod, a locking plate, a locking piece and an auxiliary pushing piece, the two ends of the connecting frame are respectively fixedly connected to the two connecting rods, the support rod passes through the connecting frame, and the bottom of the support rod is fixedly connected to the locking plate, the locking plate is U-shaped, and the locking plate is located outside the interface on the Android machine motherboard, the locking piece is installed on the locking plate, and the auxiliary pushing piece is installed on the side of the locking plate close to the test connector, and the locking mechanism is provided to achieve the function of locking the interface and the Android machine motherboard.

[0014] Furthermore, the locking member includes three clamping plates respectively arranged on the inner sides of the locking plates, and two locking rods are fixedly connected to the sides of the three clamping plates away from each other, the locking rods slide through the locking plates, and one end of the locking rods located on the outer side of the locking plate is fixedly connected to the limiting block, a buffer spring is sleeved on the outer side of the locking rod, and the two ends of the buffer spring are respectively fixedly connected to the limiting block and the locking plate, so that the function of locking the interface is realized through the provided locking member.

[0015] The present invention has at least the following beneficial effects: 1. When the Android mainboard is tested, the present invention can fix and limit the Android mainboard through the matching carrier. At the same time, the two support frames provided on the matching carrier and the matching detection mechanism provided on the support frame can not only insert multiple test connectors into multiple interfaces on the Android mainboard in sequence and quickly when testing the Android mainboard, but also realize the function of re-stabilizing the interfaces and the Android mainboard during the insertion. After the test is completed, the multiple test connectors are separated from the multiple interfaces, and the interfaces can be pressed to protect them, so as to prevent the interfaces from becoming loose with the Android mainboard. 2. When the present invention is in use, the locking mechanism is provided, which can not only lock and fix multiple interfaces, but also assist in the detachment of the test connectors when multiple test connectors are detached from the interfaces, thereby further improving the production and inspection efficiency of Android motherboards. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a front view of the overall structure of the present invention; Figure 3 A top view of the carrier of the present invention; Figure 4 This is a schematic diagram of the bottom structure of the carrier according to the present invention; Figure 5 This is a schematic diagram of the structure of the mobile rack of the present invention; Figure 6 For the present invention Figure 5 A schematic diagram of the enlarged structure of the middle A area; Figure 7 It is a schematic diagram of the structure of the sliding sleeve and the sliding plate of the present invention; Figure 8 It is a top view of the linkage mechanism structure of the present invention; Fig. 9 It is a schematic diagram of the structure of the rotating part of the present invention; Fig.10 This is a schematic diagram of the locking plate structure of the present invention; Fig.11 This is a schematic diagram of the push plate structure of the present invention; Fig.12 It is a schematic diagram of the structure of the clamping plate of the present invention.

[0017] In the figure: 1-testing workbench; 11-testing equipment; 12-test connector; 2-matching carrier; 21-limiting groove; 22-guide groove; 3-support frame; 31-moving port; 32-guide plate; 4-connecting mechanism; 41-rotating shaft; 42-rotating motor; 43-rotating gear; 44-first connecting rack; 45-second connecting rack; 5-matching testing mechanism; 51-moving frame; 52-moving plate; 53-linkage mechanism; 531-supporting shaft; 532-rotating member; 5321-electric push rod; 5322-pushing rack; 5323-positioning gear; 533-driving rod; 534-pushing Support rod; 535-connecting seat; 54-guide rod; 55-sliding sleeve; 56-slide plate; 6-interface; 7-guide mechanism; 71-synchronizing plate; 72-synchronizing rod; 73-limiting plate; 731-limiting opening; 74-guide frame; 741-guide opening; 8-locking mechanism; 81-connecting frame; 82-support rod; 83-locking plate; 84-locking member; 841-clamping plate; 842-locking rod; 843-limiting block; 844-buffer spring; 85-auxiliary pushing member; 851-pushing spring; 852-pushing plate; 9-connecting member; 91-connecting rod; 92-first connecting plate; 93-second connecting plate. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] Embodiment 1 See also Figure 1 to Figure 2 A testing device for producing an Android motherboard, comprising a testing workbench 1, a testing device 11 installed on the testing workbench 1, and a plurality of test connectors 12 electrically connected to the testing device 11, a matching carrier 2 is installed on the testing workbench 1, a limiting groove 21 is provided on the matching carrier 2, and the Android motherboard is placed on the limiting groove 21 during testing; See also Figures 3 to 5 , the supporting frames 3 are slidably connected to the two ends of the limiting groove 21 on the matching carrier 2, and a connecting mechanism 4 is provided on the matching carrier 2. In this embodiment, the supporting frame 3 is U-shaped, and the connecting mechanism 4 is used to connect and adjust the positions of the two supporting frames 3; The connecting mechanism 4 includes a rotating shaft 41, a rotating motor 42, a rotating gear 43, a first connecting rack 44 and a second connecting rack 45. A receiving groove is provided at the bottom of the matching carrier 2, and the rotating motor 42 is located inside the receiving groove. The output end of the rotating motor 42 is fixedly connected to the rotating shaft 41, and the rotating shaft 41 is rotatably connected to the upper surface of the matching carrier 2. The rotating gear 43 is sleeved on the outside of the rotating shaft 41, and the first connecting rack 44 and the second connecting rack 45 are respectively located on the outside of the rotating gear 43. The first connecting rack 44 and the second connecting rack 45 are meshed and connected with the rotating gear 43, and the ends of the first connecting rack 44 and the second connecting rack 45 that are away from each other are respectively fixedly connected to the two support frames 3; See also Figures 5 and 6 , a guide groove 22 is provided at the top of the matching carrier 2 and at the positions corresponding to the two support frames 3, two guide plates 32 are provided at the bottom of the support frame 3, and the two guide plates 32 are slidably connected to the guide groove 22, and the two guide plates 32 are both L-shaped, and by providing the guide plates 32 at the bottom of the support frame 3, when the support frame 3 moves along the matching carrier 2, the guide plates 32 can play a role in limiting and guiding the support frame 3; Specific implementation process: when the Android mainboard in the limit slot 21 is taken out or before the Android mainboard is put into the limit slot 21, the rotating motor 42 is operated, so that the rotating gear 43 rotates relative to the matching carrier 2, and when the rotating gear 43 rotates, the first connecting rack 44 and the second connecting rack 45 are driven respectively. At this time, the first connecting rack 44 and the second connecting rack 45 are respectively under the guiding and limiting action of the support frame 3, and the first connecting rack 44 and the second connecting rack 45 are further moved in the direction away from each other, and the two support frames 3 are further moved in the direction away from each other until the matching detection mechanisms 5 on the support frames 3 are respectively separated from the limit slots 21. At this time, it is convenient to take out or place the Android mainboard.

[0020] See also Figure 3 , Figure 5 and Figures 7 to 12, a matching detection mechanism 5 is provided on the support frame 3, and the matching detection mechanism 5 is used to plug and unplug the connector on it and the interface 6 on the Android machine motherboard. The matching detection mechanism 5 includes a moving frame 51, a moving plate 52, a linkage mechanism 53, a guide rod 54, a guide mechanism 7 and a locking mechanism 8. The moving frame 51 and the moving plate 52 are both slidably connected to the support frame 3, and the moving plate 52 is close to the Android machine motherboard. A mounting port is provided on the moving plate 52, and the test connector 12 is fixed through the mounting port. Preferably, the number of mounting ports is set according to the actual number of test connectors 12, that is, a plurality of mounting ports can be provided, and a plurality of test connectors 12 are respectively fixed through a plurality of mounting ports. The linkage mechanism 53 is installed on the support frame 3, and the linkage mechanism 53 is used to synchronously drive the moving plate 52 and the moving frame 51; There are movable openings 31 on both sides of the support frame 3, and both ends of the movable frame 51 extend to one end of the two movable openings 31 respectively, and the movable frame 51 is slidably connected to the movable openings 31, and there are two guide rods 54, which slide through one end of the two movable openings 31 respectively, one end of the guide rod 54 is fixedly connected to the movable frame 51, and the other end of the guide rod 54 is connected to the guide mechanism 7. As a supplementary explanation, in this embodiment, through holes are provided at both ends of the movable plate 52, that is, the movable plate 52 is slidably sleeved on the outer side of the guide rod 54 through the through holes, and the two guide mechanisms 7 are connected to the support frame 3, and the locking mechanism 8 is arranged between the two guide mechanisms 7, and the locking mechanism 8 is used to lock the interface 6 on the Android machine motherboard.

[0021] See also Figures 8 to 9 The linkage mechanism 53 includes a support shaft 531, a rotating member 532, a driving rod 533, a pushing support rod 534 and a connecting seat 535. The support shaft 531 passes through the bottom of the support frame 3, and the bottom of the support shaft 531 extends to the inside of the guide groove 22. The support shaft 531 is rotatably connected to the support frame 3. The rotating member 532 is located at the bottom of the support frame 3, and the rotating member 532 is used to drive the support shaft 531. The middle part of the driving rod 533 is fixedly sleeved on the outer side of the supporting shaft 531, and both ends of the driving rod 533 are rotatably connected with the pushing support rod 534 through a pin shaft, and the ends of the two pushing support rods 534 away from the driving rod 533 are rotatably connected with the connecting seat 535 through a pin shaft, and the two connecting seats 535 are fixedly connected with the moving frame 51 and the moving plate 52 respectively, that is, when the rotating member 532 is driven, the driving rod 533 is rotated, and when the driving rod 533 is rotated, the driving rod 533 is synchronously rotated, and when the driving rod 533 is synchronously rotated, the pushing support rod 534 is respectively driven to rotate, and at this time, the two pushing support rods 534 are respectively limited by the connecting seats 535 on the moving frame 51 and the moving plate 52, so that the moving plate 52 and the moving frame 51 are further moved in the direction toward or away from each other; The rotating member 532 includes an electric push rod 5321, a pushing rack 5322 and a positioning gear 5323. The electric push rod 5321 is fixedly installed at the bottom of the support frame 3, and the output end of the electric push rod 5321 is fixedly connected to the pushing rack 5322, the pushing rack 5322 is meshed and connected with the positioning gear 5323, and the positioning gear 5323 is fixedly installed at the bottom of the support shaft 531. In this embodiment, the rotating member 532 is located inside the guide groove 22 and is also located between the two guide plates 32, so as to ensure that the rotating member 532 can stably drive the support shaft 531; The guide mechanism 7 includes a synchronization plate 71, a synchronization rod 72, a limit plate 73 and a guide frame 74. The synchronization plate 71 is fixedly mounted on one end of the guide rod 54 close to the Android machine mainboard, and the synchronization rod 72 is fixedly connected to the synchronization plate 71, and the other end of the synchronization rod 72 is fixedly connected to the limit plate 73, and the limit plate 73 is slidably connected to the top of one end of the support frame 3. The guide frame 74 is fixedly mounted on the support frame 3, and the limit plate 73 is slidably connected to the guide frame 74; A vertical guide opening 741 is provided on the guide frame 74, and an L-shaped limit opening 731 is provided on the limit plate 73. A connecting member 9 is provided between the guide opening 741 and the limit opening 731, and the connecting member 9 is connected to the locking mechanism 8. The connecting member 9 includes a connecting rod 91, a first connecting plate 92 and a second connecting plate 93. The connecting rod 91 slides through the guide opening 741 and the limit opening 731 respectively, and one end of the connecting rod 91 is connected to the locking mechanism 8. The first connecting plate 92 is slidably connected to one side of the limit plate 73, and the second connecting plate 93 is slidably connected to one side of the guide frame 74. The first connecting plate 92 and the second connecting plate 93 are both fixedly sleeved on the outside of the connecting rod 91. Specific implementation process: In this embodiment, after the Android mainboard is placed inside the limit groove 21, at this time, the multiple interfaces 6 on both sides of the Android mainboard are respectively facing the two support frames 3, and the connecting mechanism 4 is operated, so that the two support frames 3 are moved toward the direction of the Android mainboard, until the two support frames 3 move toward each other to the set position, and then, the electric push rod 5321 located on the support frame 3 is operated, so that the pushing rack 5322 drives the positioning gear 5323 to rotate, and when the positioning gear 5323 rotates, the support shaft 531 rotates synchronously, and when the support shaft 531 rotates, the driving rod 533 rotates, and the driving rod 533 drives the moving plate 52 and the moving frame 51 to move through the pushing support rods 534 at both ends. When the movable plate 52 moves, the movable plate 52 drives the connector thereon to move toward the interface 6, and the movable frame 51 moves in the direction away from the movable plate 52. When the movable frame 51 moves, the two guide rods 54 respectively drive the limit plates 73 to move toward the guide frame 74. Due to the limiting effect of the guide opening 741 on the guide frame 74 and the limiting effect of the limit opening 731 on the limit plate 73, the connecting rod 91 drives the locking mechanism 8 to move downward toward the interface 6 shell, until the multiple test connectors 12 on the movable plate 52 move to the interface 6 and are about to be inserted into the interface 6. At this time, the locking mechanism 8 moves down to the bottom, and at the same time realizes the function of locking and fixing the interface 6 shell and the Android machine motherboard; As the moving plate 52 continues to move, multiple test connectors 12 are inserted into the interface 6. During this process, the locking mechanism 8 does not move. Subsequently, in cooperation with the detection device 11, a rapid detection of the Android mainboard is achieved. When the test is completed, the moving plate 52 drives the multiple test connectors 12 thereon to be pulled out from the insertion interface 6. During this process, the locking mechanism 8 remains stationary, thereby ensuring the locking protection of the interface 6, preventing the interface 6 from becoming loose due to the mutual pulling force between the interface 6 and the Android machine motherboard, and further ensuring the quality of the Android machine motherboard production; As the moving plate 52 continues to move, the locking mechanism 8 slowly disengages from the interface 6, and then, through the operation of the connecting mechanism 4, the two support frames 3 are further disengaged from the outside of the Android mainboard. At this time, the Android mainboard can be quickly taken out.

[0022] See also Figures 10 to 12The locking mechanism 8 includes a connecting frame 81, a support rod 82, a locking plate 83, a locking piece 84 and an auxiliary pushing piece 85. The two ends of the connecting frame 81 are fixedly connected to the two connecting rods 91 respectively, the support rod 82 passes through the connecting frame 81, and the bottom of the support rod 82 is fixedly connected to the locking plate 83. In this embodiment, the support rod 82 is slidably connected to the connecting frame 81, and a locking sleeve is provided on the connecting frame 81, and a locking bolt is threadedly connected to the locking sleeve. When the support rod 82 is adjusted, the locking bolt is turned to disengage the locking bolt from the support rod 82, so that the support rod 82 can be adjusted. Subsequently, the locking bolt is turned again to fix the support rod 82 and the locking sleeve to each other. The locking plate 83 is U-shaped, and the locking plate 83 is located outside the interface 6 on the Android mainboard. The locking piece 84 is installed on the locking plate 83, and the auxiliary pushing piece 85 is installed on the side of the locking plate 83 close to the test connector 12.

[0023] The locking member 84 includes three clamping plates 841 respectively arranged on the inner side of the locking plate 83, and two locking rods 842 are fixedly connected to the sides of the three clamping plates 841 away from each other. The locking rods 842 slide through the locking plate 83, and one end of the locking rods 842 located on the outer side of the locking plate 83 is fixedly connected to the limit block 843. A buffer spring 844 is sleeved on the outer side of the locking rod 842, and the two ends of the buffer spring 844 are fixedly connected to the limit block 843 and the locking plate 83 respectively. The auxiliary push member 85 includes a push spring 851 and a push plate 852. A plurality of push springs 851 are provided. One end of each of the plurality of push springs 851 is fixedly connected to the locking plate 83, and the other end of each of the plurality of push springs 851 is fixedly connected to the push plate 852. Specific implementation process: when the locking plate 83 moves downward along the interface 6 shell, the three clamping plates 841 on the locking plate 83 are further clamped to the interface 6 shell with each other under the elastic action of the buffer spring 844. At the same time, the clamping plate 841 at the top of the locking plate 83 provides downward pressure on the interface 6 shell, so that the interface 6 shell can be stably connected to the Android machine motherboard, preventing the interface 6 from becoming loose due to the influence of plugging and unplugging, and at the same time, when the test connector 12 is inserted into the interface 6, the locking plate 83 contacts the test connector 12, which plays a role in buffering and protecting the test connector 12. At the same time, when the test connector 12 is separated from the interface 6, the pushing plate 852 synchronously pushes the test connector 12 to separate from the interface 6, thereby realizing the role of assisting the separation of the test connector 12 from the interface 6.

[0024] Embodiment 2 Embodiment 2 is a further supplementary description of Embodiment 1, specifically: a sliding sleeve 55 is provided on one side of the moving plate 52 close to the moving frame 51, and a sliding plate 56 is slidably penetrated through the sliding sleeve 55, and one end of the sliding plate 56 is fixedly connected to the moving frame 51; The setting of the sliding sleeve 55 and the sliding plate 56 can play the role of reconnecting the mobile frame 51 and the mobile plate 52 to ensure the stability of the connection between the mobile frame 51 and the mobile plate 52, and at the same time realize the function of supporting and protecting the connecting wires at the test connector 12 to prevent the connecting wires at the test connector 12 from entering the space between the mobile frame 51 and the mobile plate 52.

[0025] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A testing device for producing an Android motherboard, comprising a testing workbench (1), a testing device (11) mounted on the testing workbench (1), and a plurality of test connectors (12) electrically connected to the testing device (11), characterized in that: A matching carrier (2) is installed on the detection workbench (1), a limiting groove (21) is provided on the matching carrier (2), and the Android machine motherboard is placed on the limiting groove (21) during detection; Support frames (3) are slidably connected to the two ends of the matching carrier (2) and located at the limiting groove (21), and a connecting mechanism (4) is provided on the matching carrier (2), wherein the connecting mechanism (4) is used to connect and adjust the positions of the two support frames (3); The support frame (3) is provided with a matching detection mechanism (5), and the matching detection mechanism (5) is used to connect the connector on the support frame (3) to the interface (6) on the mainboard of the Android device by plugging and unplugging.

2. The detection device for producing an Android motherboard according to claim 1, characterized in that: The connecting mechanism (4) comprises a rotating shaft (41), a rotating motor (42), a rotating gear (43), a first connecting rack (44) and a second connecting rack (45); a receiving groove is provided at the bottom of the matching carrier (2), and the rotating motor (42) is located inside the receiving groove; an output end of the rotating motor (42) is fixedly connected to the rotating shaft (41), and the rotating shaft (41) is rotatably connected to the upper surface of the matching carrier (2); the rotating gear (43) is sleeved on the outside of the rotating shaft (41), and the first connecting rack (44) and the second connecting rack (45) are respectively located on the outside of the rotating gear (43); the first connecting rack (44) and the second connecting rack (45) are meshedly connected to the rotating gear (43); and ends of the first connecting rack (44) and the second connecting rack (45) that are away from each other are respectively fixedly connected to two support frames (3).

3. The detection device for producing an Android motherboard according to claim 1, characterized in that: The matching detection mechanism (5) comprises a moving frame (51), a moving plate (52), a linkage mechanism (53), a guide rod (54), a guide mechanism (7) and a locking mechanism (8); the moving frame (51) and the moving plate (52) are both slidably connected to the support frame (3); the moving plate (52) is close to the mainboard of the Android device; a mounting opening is provided on the moving plate (52); a test connector (12) is fixedly inserted through the mounting opening; the linkage mechanism (53) is mounted on the support frame (3); and the linkage mechanism (53) is used to synchronously drive the moving plate (52) and the moving frame (51); The support frame (3) is provided with a moving opening (31) on both sides, and both ends of the moving frame (51) extend to one end of the two moving openings (31) respectively, and the moving frame (51) is slidably connected to the moving openings (31), two guide rods (54) are provided, and the two guide rods (54) respectively slide through one end of the two moving openings (31), one end of the guide rod (54) is fixedly connected to the moving frame (51), and the other end of the guide rod (54) is connected to a guide mechanism (7), and the two guide mechanisms (7) are connected to the support frame (3), and the locking mechanism (8) is arranged between the two guide mechanisms (7), and the locking mechanism (8) is used to lock the interface (6) on the mainboard of the Android machine.

4. The detection device for producing an Android motherboard according to claim 2, characterized in that: A guide groove (22) is provided at the top of the matching carrier (2) and at positions corresponding to the two support frames (3); two guide plates (32) are provided at the bottom of the support frame (3), and the two guide plates (32) are slidably connected to the guide groove (22).

5. The detection device for producing an Android motherboard according to claim 3, characterized in that: The linkage mechanism (53) comprises a support shaft (531), a rotating member (532), a driving rod (533), a pushing support rod (534) and a connecting seat (535); the support shaft (531) passes through the bottom of the support frame (3), and the bottom of the support shaft (531) extends to the inside of the guide groove (22); the support shaft (531) is rotatably connected to the support frame (3); the rotating member (532) is located at the bottom of the support frame (3), and the rotating member (532) is used to drive the support shaft (531); The middle portion of the driving rod (533) is fixedly sleeved on the outside of the supporting shaft (531), and both ends of the driving rod (533) are rotatably connected to the pushing support rod (534) via a pin shaft, and one end of the two pushing support rods (534) away from the driving rod (533) is rotatably connected to the connecting seat (535) via a pin shaft, and the two connecting seats (535) are respectively fixedly connected to the moving frame (51) and the moving plate (52).

6. The detection device for producing an Android motherboard according to claim 5, characterized in that: The rotating member (532) comprises an electric push rod (5321), a pushing rack (5322) and a positioning gear (5323); the electric push rod (5321) is fixedly mounted on the bottom of the support frame (3); the output end of the electric push rod (5321) is fixedly connected to the pushing rack (5322); the pushing rack (5322) is meshedly connected to the positioning gear (5323); and the positioning gear (5323) is fixedly mounted on the bottom of the support shaft (531).

7. The detection device for producing an Android motherboard according to claim 3, characterized in that: The guide mechanism (7) comprises a synchronization plate (71), a synchronization rod (72), a limit plate (73) and a guide frame (74); the synchronization plate (71) is fixedly mounted on one end of the guide rod (54) close to the Android machine mainboard, and the synchronization rod (72) is fixedly connected to the synchronization plate (71); the other end of the synchronization rod (72) is fixedly connected to the limit plate (73); the limit plate (73) is slidably connected to the top of one end of the support frame (3); the guide frame (74) is fixedly mounted on the support frame (3), and the limit plate (73) is slidably connected to the guide frame (74); The guide frame (74) is provided with a vertical guide opening (741), and the limiting plate (73) is provided with an L-shaped limiting opening (731), a connecting piece (9) is provided between the guide opening (741) and the limiting opening (731), and the connecting piece (9) is connected to the locking mechanism (8).

8. The detection device for producing an Android motherboard according to claim 7, characterized in that: The connecting member (9) comprises a connecting rod (91), a first connecting plate (92) and a second connecting plate (93); the connecting rod (91) slides through the guide opening (741) and the limit opening (731) respectively, and one end of the connecting rod (91) is connected to the locking mechanism (8); the first connecting plate (92) is slidably connected to one side of the limit plate (73), and the second connecting plate (93) is slidably connected to one side of the guide frame (74); the first connecting plate (92) and the second connecting plate (93) are both fixedly sleeved on the outside of the connecting rod (91).

9. The detection device for producing an Android phone motherboard according to claim 7, characterized in that: The locking mechanism (8) comprises a connecting frame (81), a support rod (82), a locking plate (83), a locking piece (84) and an auxiliary pushing piece (85); the two ends of the connecting frame (81) are respectively fixedly connected to two connecting rods (91); the support rod (82) passes through the connecting frame (81); and the bottom of the support rod (82) is fixedly connected to the locking plate (83); the locking plate (83) is U-shaped and is located outside an interface (6) on an Android machine mainboard; the locking piece (84) is mounted on the locking plate (83); and the auxiliary pushing piece (85) is mounted on a side of the locking plate (83) close to the test connector (12).

10. The detection device for producing an Android phone motherboard according to claim 9, characterized in that: The locking member (84) comprises three clamping plates (841) respectively arranged on the inner side of the locking plate (83); two locking rods (842) are fixedly connected to the sides of the three clamping plates (841) away from each other; the locking rods (842) slide through the locking plate (83); one end of the locking rods (842) located on the outer side of the locking plate (83) is fixedly connected to the limit block (843); a buffer spring (844) is sleeved on the outer side of the locking rod (842); and the two ends of the buffer spring (844) are respectively fixedly connected to the limit block (843) and the locking plate (83).

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