Mold processing control method and device and electronic equipment

Abstract

The invention relates to the technical field of mold machining, and provides a mold machining control method and device and electronic equipment. The method comprises the following steps: setting a target number of temperature control areas; acquiring a target temperature of the temperature control area; and based on the actual temperature and the target temperature of the temperature control area, controlling the moving assembly to drive the cooling pipeline to move so as to adjust the density of the cooling pipeline at each temperature control area. According to the mold machining control method, the mold can be divided into the target number of temperature control areas according to the temperature requirements of different positions of the workpiece, and the temperature of each temperature control area can be independently controlled, so that the temperature of each temperature control area can be better matched with the corresponding workpiece position, the forming quality of the workpiece is improved, and the machining efficiency of the workpiece is improved. And the intelligence degree of the mold machining method is improved.

Description

Technical Field

[0001] The present application relates to the field of mold processing technology, and in particular to a mold processing control method, device and electronic equipment. Background Art

[0002] A mold is a tool used to manufacture workpieces, usually used to form materials (such as metal, plastic, rubber, etc.) into a specific shape by heating, pressurizing, etc. Molds are widely used in industrial production, especially in the manufacture of parts, electronic products, automobiles, home appliances, medical devices, etc.

[0003] The temperature of the mold has a great relationship with the molding speed and molding quality of the workpiece. The mold in the related art can basically only maintain one temperature, but the shapes of the workpieces are different, and not all workpieces are regular shapes. When encountering workpieces with different thicknesses at different positions, if the entire mold is kept at the same temperature, the molding quality of some positions of the workpiece will be insufficient. Therefore, the current mold processing method needs to be improved. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the related art. To this end, the present application proposes a mold processing control method, device and electronic equipment.

[0005] The mold processing control method according to the first embodiment of the present application is applied to a lithium mold, wherein the mold includes a body, a moving component and a plurality of cooling pipelines, wherein the plurality of cooling pipelines are arranged on the body, the cooling pipelines are connected to the moving component, and the moving component is used to drive each cooling pipeline to move relative to the body; The method comprises:

[0006] Set a target number of temperature control zones;

[0007] Obtaining a target temperature of the temperature control zone;

[0008] Based on the actual temperature of the temperature control zone and the target temperature, the moving component is controlled to drive the cooling pipeline to move, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0009] According to one embodiment of the present application, the mold is used to process a workpiece; the step of setting a target number of temperature control zones includes:

[0010] According to the parameters of the workpiece, the workpiece is divided into a target number of sub-partitions;

[0011] According to the sub-divisions, the main body is divided into a target number of temperature control zones.

[0012] According to one embodiment of the present application, the step of obtaining the target temperature of the temperature control zone includes:

[0013] The target temperatures of the different temperature control zones of the workpiece are determined according to the required temperatures of the sub-zones.

[0014] According to the second aspect of the present application, the mold includes a control component, and the control component is used to execute the above-mentioned mold processing control method.

[0015] According to one embodiment of the present application, the mold includes a main body, a moving component and a plurality of cooling pipes, the plurality of cooling pipes are arranged on the main body, the cooling pipes are connected to the moving component, and the moving component is used to drive each cooling pipe to move relative to the main body.

[0016] According to the third aspect of the present application, a mold processing control device includes:

[0017] A setting module, used to set a target number of temperature control zones;

[0018] An acquisition module, used for acquiring the target temperature of the temperature control zone;

[0019] The control module is used to control the moving component to drive the cooling pipeline to move based on the actual temperature of the temperature control zone and the target temperature, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0020] According to the electronic device of the fourth aspect of the present application, the electronic device includes a memory, a processor, and a computer program stored in the memory and executable on the processor, and the processor implements the above-mentioned mold processing control method when executing the computer program.

[0021] According to the non-transitory computer-readable storage medium of the fifth aspect embodiment of the present application, the non-transitory computer-readable storage medium includes a computer program, and when the computer program is executed by the processor, the above-mentioned mold processing control method is implemented.

[0022] According to the computer program product of the sixth aspect of the present application, the computer program product includes a computer program, and when the computer program is executed by the processor, the above-mentioned mold processing control method is implemented.

[0023] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 It is a schematic flow chart of the mold processing control method of the present invention;

[0026] Figure 2 It is one of the structural schematic diagrams of the mold provided by the present invention;

[0027] Figure 3 This is the second structural schematic diagram of the mold provided by the present invention;

[0028] Figure 4 It is a structural schematic diagram of the mold processing control device provided by the present invention;

[0029] Figure 5 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in this application will be clearly and completely described below in conjunction with the drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] The embodiments of the present application provide embodiments of a mold processing control method. It should be noted that, although a logical order is shown in the flow chart, under certain data, the steps shown or described may be completed in an order different from that shown here.

[0032] Before introducing the mold processing control method of the embodiment of the present application, the application scenario of the mold processing control method is first explained. The mold processing control method of the present application can be applied to smart phones, tablets, computers and other smart terminals, and can also be applied to servers. The present application does not make any special limitations here, as long as it can carry and implement the mold processing control method of the present application.

[0033] The following description will be given by applying the mold processing control method to the server side, but it should be understood that the mold processing control method is not limited to being applied only to the server side.

[0034] Combine the following Figures 1 to 5The mold processing control method, device and electronic equipment of the present application are described.

[0035] According to the embodiment of the first aspect of the present application, Figure 1 As shown, a mold processing control method is used for a mold, the mold includes a body 1, a moving component 2 and a plurality of cooling pipelines 3, the plurality of cooling pipelines 3 are arranged on the body 1, the cooling pipelines 3 are connected to the moving component 2, and the moving component 2 is used to drive each cooling pipeline 3 to move relative to the body 1; the mold processing control method includes:

[0036] Step 101, setting a target number of temperature control zones;

[0037] It can be understood that the mold is divided into a target number of temperature control zones, and different temperature control zones correspond to different positions in the cavity of the mold.

[0038] It is understandable that as casting geometry becomes more complex, mold cavities become deeper, and process conditions become more complex, the temperature requirements for the mold surface are also getting higher and higher. In the process of controlling the temperature difference in the mold cavity to achieve thermal equilibrium, the temperature requirements of different mold surfaces are also different. Only relying on a set of fixed temperature judgment rules and corresponding temperature control strategies to adjust the mold surface temperature cannot achieve accurate adjustment of the local temperature of the mold surface. Therefore, in order to make the mold temperature closer to its actual needs, the mold surface temperature needs to be controlled in different zones.

[0039] Specifically, it can also be understood that the temperature control zones of the target number group can be set in advance, and each subsequent module can be reused. The target number group is determined according to the actual load and processing capacity of the system, and the present disclosure does not limit this.

[0040] Step 102, obtaining the target temperature of the temperature control zone;

[0041] It is understandable that the target temperatures of different temperature control zones are obtained so that the actual temperatures of the temperature control zones can be adjusted according to the target temperatures later.

[0042] It is understandable that the temperatures in different temperature control zones may be different or the same.

[0043] It is understandable that the temperatures of different temperature control zones can be preset in advance. The temperatures of different temperature control zones can also be determined based on the thickness data of the workpiece, that is, the target temperatures of different temperature control zones are determined based on the thickness of the workpiece corresponding to the different temperature control zones.

[0044] Step 103: Based on the actual temperature of the temperature control zone and the target temperature, control the moving component 2 to drive the cooling pipeline 3 to move, so as to adjust the density of the cooling pipeline 3 at each temperature control zone.

[0045] It can be understood that the actual temperature of different temperature control zones is obtained, and the actual temperature of the temperature control zone is compared with the target temperature. When the difference between the actual temperature of the temperature control zone and the target temperature is greater than the preset value, it means that the temperature of the temperature control zone needs to be adjusted at this time. Therefore, the moving component 2 is controlled to drive the cooling pipeline 3 to move, and the density of the cooling pipeline 3 at the temperature control zone is changed, thereby changing the cooling effect of the temperature control zone, and then realizing the temperature adjustment of the temperature control zone.

[0046] In some examples, the plurality of cooling pipelines 3 include a plurality of first cooling pipelines 3 , and the mold further includes a second cooling pipeline 3 , and the second cooling pipeline 3 is disposed between two adjacent first cooling pipelines 3 .

[0047] The mold also includes a connecting valve, a first end of the connecting valve is connected to the outlet of one of the two adjacent first cooling pipelines 3, a second end of the connecting valve is connected to the outlet of the other of the two adjacent first cooling pipelines 3, a third end of the connecting valve is connected to the inlet of the second cooling pipeline 3, and a fourth end of the connecting valve is connected to the outlet of the second cooling pipeline 3.

[0048] In step 103, the on-off between different ends of the connecting valve can also be controlled based on the actual temperature and target temperature of the temperature control zone. It is understandable that when the temperature of the temperature control zone needs to be lowered, the first end and the third end of the connecting valve can be controlled to be connected, and the second end and the fourth end of the connecting valve can be controlled to be connected, so that the coolant will flow through one of the first cooling pipelines 3, the second cooling pipeline 3 and the other cooling pipeline 3 in sequence, increasing the flow path of the coolant, which is beneficial to improving the cooling effect and thus reducing the temperature of the temperature control zone. When the temperature of the temperature control zone needs to be increased, the first end and the second end of the connecting valve can be controlled to be connected, so that the coolant flows through one of the first cooling pipelines 3 and the other first cooling pipeline 3 in sequence. At this time, the second cooling pipeline 3 is not connected to the cooling flow path, thereby shortening the flow path of the coolant, which is beneficial to increasing the temperature of the temperature control zone.

[0049] In some examples, a plurality of cooling pipelines 3 are connected in sequence, and two adjacent cooling pipelines 3 are connected via telescopic pipes, so that when one cooling pipeline 3 moves, it will not affect the other cooling pipeline 3 .

[0050] In some examples, the moving assembly 2 includes a plurality of moving parts, and the plurality of moving parts correspond to a plurality of cooling pipelines 3 one by one, that is, one moving part can drive the movement of one cooling pipeline 3 accordingly.

[0051] According to the mold processing control method of the present application, by setting a target number of temperature control zones in the mold, each temperature control zone corresponds to a different position of the workpiece, and the temperature of different temperature control zones can affect different positions of the workpiece. Then, the target temperature of the temperature control zone is obtained, and based on the actual temperature of the temperature control zone and the target temperature, it is determined whether the actual temperature of the temperature control zone reaches the target temperature, that is, whether the difference between the actual temperature and the target temperature is greater than the preset value. When the actual temperature reaches the target temperature, the mobile component 2 is controlled not to drive the cooling pipeline 3 corresponding to the temperature control zone to move, so that the number of cooling pipelines 3 corresponding to the temperature control zone remains unchanged; when the actual temperature does not reach the target temperature, the mobile component 2 is controlled to drive the cooling pipeline 3 to move to adjust the density of the cooling pipeline 3 at the temperature control zone. When the density of the cooling pipeline 3 changes, the cooling effect on the temperature control zone will also change, and the temperature of the temperature control zone can be adjusted. That is to say, the present application can divide the mold into a target number of temperature control zones according to the temperature requirements of different positions of the workpiece, and the temperature of each temperature control zone can be controlled individually, so that the temperature of each temperature control zone can be more adapted to the corresponding workpiece position, which is beneficial to improving the molding quality of the workpiece and improving the intelligence level of the mold processing method.

[0052] In some examples, the mold has an extension portion, the extension portion protrudes from the body 1, part of the cooling pipeline 3 is located at the extension portion, and the cooling pipeline 3 can move between the body 1 and the extension portion. It is understandable that the cooling pipeline 3 located at the extension portion will not affect the temperature of the body 1. When the number of cooling pipelines 3 at the body 1 cannot meet the cooling requirements of the temperature control zone, the cooling pipeline 3 at the body 1 can be moved to the extension portion or the cooling pipeline 3 at the extension portion can be moved to the body 1 to meet the temperature regulation requirements of the temperature control zone at the body 1.

[0053] In one embodiment of the present application, the mold is used to process a workpiece; the step of setting a target number of temperature control zones includes:

[0054] Dividing the workpiece into a target number of sub-divisions according to parameters of the workpiece, wherein the parameters of the workpiece include thickness data of the workpiece and / or volume data of the workpiece;

[0055] According to the sub-divisions, the main body 1 is divided into a target number of temperature control zones.

[0056] It can be understood that, according to the parameters of the workpiece, the required temperature of different positions of the workpiece can be determined, and the positions with different required temperatures can be divided into different sub-partitions to achieve the division of the workpiece. Then, according to the positions of the sub-partitions, the body 1 is divided into a target number of temperature control zones, so that the temperature control zones and sub-partitions correspond one to one, and then by controlling the temperature of different temperature control zones, the temperature control of different sub-partitions can be achieved, which can meet the requirements of different required temperatures at different positions of the workpiece.

[0057] It can be understood that the required temperatures corresponding to positions with different thicknesses and / or different volumes will be different. Therefore, according to the thickness of the workpiece at different positions and / or the volume of the workpiece at different positions, the workpiece can be divided into a target number of sub-partitions. The required temperatures of the same sub-partition are basically the same, and the required temperatures of different sub-partitions are different.

[0058] In one embodiment of the present application, the step of obtaining the target temperature of the temperature control zone includes:

[0059] The target temperatures of the different temperature control zones of the workpiece are determined according to the required temperatures of the sub-zones.

[0060] It can be understood that the target temperature of the temperature control zone is determined according to the required temperature of the sub-partition, so that the temperature control zone at the target temperature can make the temperature of the corresponding sub-partition its required temperature, and then the temperature of the temperature control zone is adjusted and controlled according to the target temperature, which can ensure that the temperature of the sub-partition is maintained at the required temperature, thereby ensuring the molding quality of the workpiece.

[0061] It can be understood that the required temperature of the sub-zone can be determined according to the parameters of the workpiece.

[0062] In some embodiments, the number of the sub-regions is two, the number of the temperature control zones is two, and the two sub-regions correspond to the two temperature control zones one by one;

[0063] After the step of dividing the workpiece into a target number of sub-partitions according to the parameters of the workpiece, the method further includes:

[0064] Obtain target forming time of different sub-partitions;

[0065] According to the target molding time, the temperatures of the different temperature control zones are controlled.

[0066] It is understandable that different sub-partitions have different parameters such as thickness and volume, so the target molding time of different sub-partitions will also be different, that is, the time for different sub-partitions to maintain the required temperature will be different.

[0067] After dividing the workpiece into a target number of sub-partitions, the target molding time of different sub-partitions is obtained. According to the target molding time, if the time for which the temperature of the temperature control zone corresponding to some sub-partitions is maintained at the target temperature does not reach the target molding time, the temperature of the temperature control zone corresponding to these sub-partitions is controlled to continue to be maintained at the target temperature. When it is determined that the temperature of the temperature control zone corresponding to some sub-partitions is already at the target temperature for the target molding time, it means that the workpiece corresponding to these sub-partitions has been formed. Then, the temperature of the temperature control zone corresponding to these sub-partitions can be controlled to decrease, so as to avoid continuing to bake the workpiece after it is formed, thereby avoiding affecting the molding quality of the workpiece.

[0068] In one embodiment of the present application, the number of the sub-partitions is two, the number of the temperature control zones is two, the two sub-partitions and the two temperature control zones correspond one to one, the two sub-partitions include a first sub-partition and a second sub-partition, the two temperature control zones include a first temperature control zone and a second temperature control zone, the target molding time of the first sub-partition is a first target molding time, the target molding time of the second sub-partition is a second target molding time, and the first target molding time is less than the second target molding time;

[0069] The step of controlling the operation of the mold according to the target molding time comprises:

[0070] Control the temperature of the first temperature control zone to maintain at a target temperature for a first target molding time;

[0071] After the step of controlling the temperature of the first temperature control zone to maintain at the target temperature for the first target molding time, the following steps are included:

[0072] The operation of the moving component 2 is controlled so that the temperature of the first temperature control zone is lower than a threshold value.

[0073] It can be understood that the first target forming time is shorter than the second target forming time, so the first sub-partition will be formed earlier than the second sub-partition.

[0074] It can be understood that the first sub-partition corresponds to the first temperature control zone, and the temperature of the first temperature control zone is controlled to be maintained at the target temperature and the first target molding time, so that the temperature of the first sub-partition is maintained at the required temperature and the first target molding time is maintained, so that the workpiece corresponding to the first sub-partition is formed.

[0075] Then, the moving component 2 is controlled to drive the cooling pipeline 3 to move, thereby increasing the temperature of the first temperature control zone and lowering the temperature of the first temperature control zone, so that the temperature of the first temperature control zone is lower than the threshold value, thereby lowering the temperature of the first sub-division zone, thereby preventing the first sub-division zone from being subjected to high-temperature baking after molding, and effectively avoiding problems such as aging of the workpiece, thereby improving the molding quality of the workpiece.

[0076] In some embodiments, the mold includes a body 1, a winding assembly 4 and a plurality of cooling pipelines 3, the plurality of cooling pipelines 3 are arranged on the body 1, the winding assembly 4 includes a plurality of winding members 41, the plurality of winding members 41 correspond to the plurality of cooling pipelines 3 one by one, the cooling pipelines 3 are connected to the winding members 41, and the moving member is used to wind or release the cooling pipelines 3 to adjust the length of the cooling pipelines 3 at the body 1;

[0077] After the step of obtaining the target temperature of the temperature control zone, the method further includes:

[0078] Based on the target temperature and actual temperature of different temperature control zones, the operation of different winding members 41 is controlled, and each temperature control zone corresponds to at least one cooling pipeline 3 .

[0079] It can be understood that the actual temperature of different temperature control zones is obtained, and the actual temperature of the temperature control zone is compared with the target temperature. When the difference between the actual temperature of the temperature control zone and the target temperature is greater than the preset value, it means that the temperature of the temperature control zone needs to be adjusted at this time. Therefore, the winding member 41 is controlled to wind or release the cooling pipeline 3, and the length of the cooling pipeline 3 at the temperature control zone is changed, thereby changing the cooling effect of the temperature control zone, and then realizing the temperature adjustment of the temperature control zone.

[0080] In some examples, the plurality of cooling pipelines 3 include a plurality of first cooling pipelines 3 , and the mold further includes a second cooling pipeline 3 , and the second cooling pipeline 3 is disposed between two adjacent first cooling pipelines 3 .

[0081] The mold also includes a connecting valve, a first end of the connecting valve is connected to the outlet of one of the two adjacent first cooling pipelines 3, a second end of the connecting valve is connected to the outlet of the other of the two adjacent first cooling pipelines 3, a third end of the connecting valve is connected to the inlet of the second cooling pipeline 3, and a fourth end of the connecting valve is connected to the outlet of the second cooling pipeline 3.

[0082] In step 103, the on-off between different ends of the connecting valve can also be controlled based on the actual temperature and target temperature of the temperature control zone. It is understandable that when the temperature of the temperature control zone needs to be lowered, the first end and the third end of the connecting valve can be controlled to be connected, and the second end and the fourth end of the connecting valve can be controlled to be connected, so that the coolant will flow through one of the first cooling pipelines 3, the second cooling pipeline 3 and the other cooling pipeline 3 in sequence, increasing the flow path of the coolant, which is beneficial to improving the cooling effect and thus reducing the temperature of the temperature control zone. When the temperature of the temperature control zone needs to be increased, the first end and the second end of the connecting valve can be controlled to be connected, so that the coolant flows through one of the first cooling pipelines 3 and the other first cooling pipeline 3 in sequence. At this time, the second cooling pipeline 3 is not connected to the cooling flow path, thereby shortening the flow path of the coolant, which is beneficial to increasing the temperature of the temperature control zone.

[0083] In some examples, a plurality of cooling pipelines 3 are connected in sequence, and two adjacent cooling pipelines 3 are connected via telescopic pipes, so that when one cooling pipeline 3 moves, it will not affect the other cooling pipeline 3 .

[0084] By setting a target number of temperature control zones in the mold, each temperature control zone corresponds to a different position of the workpiece, and the temperature of different temperature control zones can affect different positions of the workpiece. Then, the target temperature of the temperature control zone is obtained, and based on the actual temperature of the temperature control zone and the target temperature, it is determined whether the actual temperature of the temperature control zone reaches the target temperature, that is, whether the difference between the actual temperature and the target temperature is greater than the preset value. When the actual temperature reaches the target temperature, the winding member 41 is controlled not to drive the cooling pipeline 3 corresponding to the temperature control zone to move, so that the length of the cooling pipeline 3 corresponding to the temperature control zone remains unchanged; when the actual temperature does not reach the target temperature, the winding member 41 is controlled to wind or release the cooling pipeline 3 to adjust the length of the cooling pipeline 3 at the temperature control zone, that is, the length of the cooling pipeline 3 acting on the temperature control zone is changed, and then the cooling effect of the cooling pipeline 3 on the temperature control zone will also change, and then the temperature of the temperature control zone can be adjusted. That is to say, the present application can divide the mold into a target number of temperature control zones according to the temperature requirements of different positions of the workpiece, and the temperature of each temperature control zone can be controlled individually, so that the temperature of each temperature control zone can be more adapted to the corresponding workpiece position, which is beneficial to improving the molding quality of the workpiece and improving the intelligence level of the mold processing method.

[0085] In one embodiment of the present application, the mold is used to process a workpiece; the step of obtaining the target temperatures of the different temperature control zones includes:

[0086] Determining the temperature change rates of the plurality of temperature control zones according to the thickness change rate of the workpiece;

[0087] Based on the temperature change rate, target temperatures of different temperature control zones are determined.

[0088] It is understandable that the required temperature will be different for different thicknesses of workpieces. The present application first obtains the thickness change rate of the workpiece, which can be determined along the length direction of the workpiece, and then determines the temperature change rates of multiple temperature control zones based on the thickness change rate, and then determines the target temperatures of different temperature control zones, so that the target temperature change rates of multiple temperature control zones match the thickness change rate of the workpiece, thereby ensuring the forming effect of the workpiece.

[0089] It is understandable that the thickness variation rate of the workpiece can be set in advance.

[0090] For example, after obtaining the thickness change rate of the workpiece, the operation of the plurality of winding members 41 can be controlled so that the change rate of the effective action length of the cooling pipeline 3 corresponding to the different temperature control zones corresponds to the thickness change rate of the workpiece. It should be noted that the effective action length of the cooling pipeline 3 refers to the length of the cooling pipeline 3 located in the temperature control zone, that is, the length of the portion of the cooling pipeline 3 that can cool the temperature control zone.

[0091] In one embodiment of the present application, a rigid member is fixedly connected to each of the temperature control zones;

[0092] The step of controlling the operation of different winding members 41 based on the target temperature and the actual temperature of different temperature control zones includes:

[0093] Obtaining a shift of a resonance peak of the rigid member;

[0094] Based on the shift of the resonance peak of the rigid member, the actual temperature of the temperature control zone is determined.

[0095] It is understandable that when the temperature control zone is at different temperatures, the expansion force of the temperature control zone is different, that is, the force applied by the temperature control zone to the rigid part is different. When the force applied to the rigid part is different, the offset of the resonance peak of the rigid part will also be different. Therefore, by detecting the offset of the resonance peak of the rigid part, the actual temperature of the temperature control zone can be determined, thereby realizing the detection of the actual temperature of the temperature control zone.

[0096] In some examples, a resonator is installed on a side of the rigid member facing away from the temperature control zone, and the resonator is used to detect the shift of the resonance peak of the rigid member.

[0097] In one embodiment of the present application, the step of obtaining the target temperature of the temperature control zone includes: obtaining a front thermal image of the mold, and matching the front thermal image with a CAD image of the mold to obtain a CAD thermal image of the temperature control zone.

[0098] Specifically, it is understandable that as the geometric shape of the casting becomes more and more complex, the mold cavity becomes deeper and deeper. If the thermal image of the surface of the mold is obtained simply from the periphery of the mold, on the one hand, due to the long distance, the temperature data obtained cannot accurately reflect the temperature of the mold cavity surface. On the other hand, the temperature data obtained at an oblique angle has a large inclination angle, which will cause serious data distortion. Therefore, in order to improve the accuracy of the obtained temperature data, the present disclosure sets the thermal image acquisition device in the protective device of the spraying robot so that the thermal image acquisition device can obtain the temperature data of the mold cavity surface from the center of the mold cavity.

[0099] Specifically, a front thermal image of the mold is obtained.

[0100] More specifically, the front thermal image of the mold refers to the front thermal image of the mold obtained at the center of the mold cavity before spraying, and the front thermal image of the mold includes the front thermal image of the fixed mold and the front thermal image of the movable mold. The front thermal image of the mold is obtained, including:

[0101] Step a1, connecting a thermal image acquisition device, wherein the thermal image acquisition device includes a first acquisition device and a second acquisition device, which are installed on both sides of the spraying robot;

[0102] The thermal image acquisition device is a simplified infrared camera without control software, which saves cumbersome hardware configuration and reduces costs compared to using a mature infrared camera. In addition, the present invention also independently develops and sets up an acquisition unit based on the SDK (Software Development Kit) provided by the thermal image acquisition device, realizes the reading and storage of the thermal image acquired by the thermal image acquisition device, and meets the automation requirements of mold temperature control.

[0103] In some embodiments, the first collection device and the second collection device are respectively arranged in the first protection device and the second protection device, and the first protection device and the second protection device are installed on both sides of the spraying robot. The first protection device and the second protection device can enable the first collection device and the second collection device to operate in a harsh environment of high temperature, humidity and water mist.

[0104] Step a2, moving the spraying robot to the center of the mold cavity, controlling the first acquisition device to obtain the front thermal image of the fixed mold, and controlling the second acquisition device to obtain the front thermal image of the movable mold.

[0105] The center of the mold cavity refers to the middle position between the fixed mold and the movable mold after the mold is opened and the part is taken out. This position is opposite to the center of the fixed mold cavity surface and the center of the movable mold cavity surface.

[0106] The CAD image of the mold refers to a CAD image obtained after filtering, simplifying and making transparent the original CAD drawing of the mold, and the original CAD drawing of the mold includes the geometric structure of the mold, the geometric elements corresponding to the temperature control pipe and the valve, and coordinate information, etc. The filtering process refers to removing a large number of splines generated in the original CAD drawing; the simplification process refers to removing the annotation information and description information in the original CAD drawing, and only retaining feature information such as circles and lines, such as the feature information of the temperature control pipe; the transparency process refers to making the background of the original CAD drawing transparent to highlight the geometric features of the CAD image. The CAD image of the mold is generally saved as a file in dxf format, and can also be saved as a file in other formats, which is not limited in this disclosure.

[0107] More specifically, the front thermal image and the CAD image of the mold are displayed on the interactive interface of the acquisition unit, such as the image registration interface, and the image registration tool is used to match the front thermal image with the CAD image of the mold to obtain the CAD thermal image of the mold.

[0108] In some embodiments, the step of obtaining the target temperature of the temperature control zone includes:

[0109] Acquire infrared images of the mold during the die-casting production process;

[0110] Here, the infrared image is an image taken using infrared imaging technology.

[0111] The above-mentioned “infrared image taken of the mold during the die-casting production process” specifically refers to the infrared image taken during the process of obtaining the casting through the mold during the die-casting production process. Optionally, the infrared image can be obtained by taking an infrared camera device.

[0112] Optionally, during the die-casting production process, a plurality of infrared sub-images may be captured from different angles and at different time points, and the plurality of infrared sub-images may be used as the infrared image in this step.

[0113] The three-dimensional temperature field of the mold is obtained according to the infrared image as the real temperature field of the mold;

[0114] Specifically, this embodiment can analyze the infrared image, extract the temperature information of each region of interest (ROI) contained in the infrared image and perform certain processing to obtain the three-dimensional temperature field of the mold, and the three-dimensional temperature field is the real temperature field of the mold.

[0115] In an optional embodiment, the process of the step of "obtaining the three-dimensional temperature field of the mold according to the infrared image" may specifically include: registering and mapping the infrared image to the surface of the three-dimensional mold model to obtain the three-dimensional temperature field.

[0116] More specifically, this step is to align and register multiple infrared sub-images contained in the infrared image to obtain a registered target infrared image, extract temperature information of each preset area of ​​interest contained in the target infrared image, map the extracted temperature information to the three-dimensional mold model surface of the mold, and obtain a three-dimensional temperature field.

[0117] The above alignment is to align multiple infrared sub-images at different viewing angles and time points for subsequent analysis and comparison. Mapping is to map the temperature information of each area extracted to the surface of the three-dimensional mold model after alignment, thereby forming a three-dimensional temperature field. By viewing the mapped three-dimensional temperature field on the monitoring interface, you can intuitively understand the temperature distribution of the mold, thereby evaluating the performance and status of the mold.

[0118] Optionally, the above registration and mapping process can be implemented by a pre-trained segmentation model, which can perform image processing and feature extraction on multiple infrared sub-images contained in the infrared image respectively, and perform registration and mapping based on the extracted features to obtain a three-dimensional temperature field.

[0119] Determine whether there is abnormal mold temperature in the die-casting production process based on the actual temperature field;

[0120] It should be understood that the structure of the mold is relatively complex. As described in the background technology, a large mold often has hundreds of water and oil circuits. Once the temperature of at least one pipeline of the mold is abnormal, it is easy to cause casting defects and deformation of the casting due to the mold temperature imbalance, which seriously affects the service life of the casting and product quality. To this end, this embodiment can determine whether there is an abnormal mold temperature in the die casting production process based on the real temperature field.

[0121] In this embodiment, the process of die-casting a casting from a mold is regarded as a cycle, and the actual temperature field is the temperature field obtained under one cycle. Considering that some emergencies may occur during the die-casting production process, which may cause the temperature field of only one cycle to be abnormal, the judgment conclusion based on the temperature field of one cycle may be wrong.

[0122] In order to ensure that the judgment conclusion of this step is accurate, optionally, this embodiment can also judge whether there is abnormal mold temperature in the die-casting production process based on the real temperature field and the historical temperature field under the historical cycle. Based on this, the process of this step "judging whether there is abnormal mold temperature in the die-casting production process based on the real temperature field" can also include: obtaining multiple historical temperature fields of the mold, the historical temperature field is obtained based on the historical infrared images taken of the mold during the die-casting production process; judging whether there is abnormal mold temperature in the die-casting production process based on the real temperature field and multiple historical temperature fields.

[0123] Optionally, the process of "determining whether there is abnormal mold temperature in the die-casting production process based on the actual temperature field and multiple historical temperature fields" may further include: obtaining a temperature field change trend curve of the mold based on the actual temperature field and multiple historical temperature fields; if the temperature change trend under the temperature field change trend curve exceeds a preset threshold limit, then determining that there is abnormal mold temperature in the die-casting production process; and / or determining whether the temperatures of the monitoring points respectively included in the actual temperature field and multiple historical temperature fields are both greater than a preset threshold; if so, then determining that there is abnormal mold temperature in the die-casting production process.

[0124] For example, if the temperatures of the monitoring points included in the real temperature field and the five historical temperature fields are all greater than the preset thresholds, it is determined that there is abnormal mold temperature in the die-casting production process; otherwise, it is determined that there is no abnormal mold temperature in the die-casting production process.

[0125] According to the embodiment of the second aspect of the present application, the mold processing control device and the mold processing control method correspond to each other. Figure 4 As shown, the mold processing control device includes:

[0126] A setting module 201 is used to set a target number of temperature control zones;

[0127] An acquisition module 202 is used to acquire the target temperature of the temperature control zone;

[0128] The control module 203 is used to control the moving component to drive the cooling pipeline to move based on the actual temperature of the temperature control zone and the target temperature, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0129] According to an embodiment of the third aspect of the present application, the mold includes a control component, and the control component is used to execute the above method.

[0130] In some embodiments, Figure 2 As shown, the mold includes a main body 1, a moving component 2 and a plurality of cooling pipes 3, wherein the plurality of cooling pipes 3 are arranged on the main body 1, the cooling pipes 3 are connected to the moving component 2, and the moving component 2 is used to drive each cooling pipe 3 to move relative to the main body 1.

[0131] It is understandable that by moving the cooling pipe 3 through the moving component 2, the density of the cooling pipe 3 at different positions of the main body 1 can be changed, thereby changing the temperature at different positions of the main body 1, so that the temperature at different positions of the main body 1 can be more adapted to the workpiece.

[0132] In some embodiments, Figure 3 As shown, the mold includes a main body 1, a winding assembly 4 and a plurality of cooling pipes 3, the plurality of cooling pipes 3 are arranged on the main body 1, the winding assembly 4 includes a plurality of winding members 41, the plurality of winding members 41 correspond to the plurality of cooling pipes 3 one by one, the cooling pipes 3 are connected to the winding members 41, and the movable member is used to wind or release the cooling pipes 3 to adjust the length of the cooling pipes 3 at the main body 1.

[0133] It is understandable that by winding or releasing the cooling pipeline 3 by the winding member 41, the length of the cooling pipeline 3 in the body 1 can be changed, so that the length of the cooling pipeline 3 acting on the body 1 changes, and the cooling effect on the body 1 also changes. The present application is provided with a plurality of cooling pipelines 3, and the effective length of each cooling pipeline 3 can be adjusted, thereby realizing independent adjustment of the temperature at different positions of the body 1, so that the temperature at different positions of the body 1 can be more adapted to the workpiece.

[0134] In one embodiment of the present application, the main body 1 includes an upper mold, a lower mold and an adsorption component. The upper mold and the lower mold are surrounded by a cavity. The adsorption component is arranged on the upper mold. The upper mold is formed with a mounting hole. The adsorption component is arranged in the mounting hole. The adsorption component can move relative to the upper mold. The adsorption component is used to adsorb the workpiece after molding.

[0135] It is understandable that when the workpiece needs to be taken out after being formed, the driving member can drive the adsorption member to move toward the cavity relative to the upper mold so that the adsorption member can absorb the workpiece, and then move the upper mold so that the adsorption member drives the workpiece to move, thereby taking out the workpiece. Compared with the related art in which an ejector is provided in the lower mold to eject the workpiece, since the adsorption member is provided in the upper mold, the sealing requirements are reduced, which is conducive to reducing the cost of the mold.

[0136] According to an embodiment of the fourth aspect of the present application, Figure 5 As shown, the electronic device may include: a processor 310, a communications interface 320, a memory 330 and a communication bus 340, wherein the processor 310, the communications interface 320 and the memory 330 communicate with each other through the communication bus 340. The processor 310 may call the logic instructions in the memory 330 to execute the mold processing control method, which includes:

[0137] Set a target number of temperature control zones;

[0138] Obtaining a target temperature of the temperature control zone;

[0139] Based on the actual temperature of the temperature control zone and the target temperature, the moving component is controlled to drive the cooling pipeline to move, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0140] In addition, the logic instructions in the above-mentioned memory 330 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present application can be essentially or partly embodied in the form of a software product that contributes to the prior art. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods of each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk, etc. Various media that can store program codes.

[0141] On the other hand, the present application also provides a computer program product, the computer program product includes a computer program stored on a non-transitory computer-readable storage medium, the computer program includes program instructions, when the program instructions are executed by a computer, the computer can execute the mold processing control method provided by the above methods, the method includes:

[0142] Set a target number of temperature control zones;

[0143] Obtaining a target temperature of the temperature control zone;

[0144] Based on the actual temperature of the temperature control zone and the target temperature, the moving component is controlled to drive the cooling pipeline to move, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0145] According to an embodiment of the fifth aspect of the present application, the present application also includes a non-transitory computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned mold processing control method is implemented, and the method includes:

[0146] Set a target number of temperature control zones;

[0147] Obtaining a target temperature of the temperature control zone;

[0148] Based on the actual temperature of the temperature control zone and the target temperature, the moving component is controlled to drive the cooling pipeline to move, so as to adjust the density of the cooling pipeline at each temperature control zone.

[0149] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, i.e., they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Those of ordinary skill in the art may understand and implement it without creative effort.

[0150] Through the description of the above implementation modes, those skilled in the art can clearly understand that each implementation mode can be implemented by means of software plus a necessary general hardware platform, or of course by hardware. Based on such an understanding, the above technical solution can essentially or in other words be embodied in the form of a software product that contributes to the prior art. The computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a magnetic disk, an optical disk, etc., and includes a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods of each embodiment or some parts of the embodiment.

[0151] Finally, it should be noted that the above implementation modes are only used to illustrate the present application, rather than to limit the present application. Although the present application is described in detail with reference to the embodiments, a person skilled in the art should understand that various combinations, modifications or equivalent substitutions of the technical solutions of the present application do not depart from the spirit and scope of the technical solutions of the present application, and should be included in the scope of the claims of the present application.

Claims

1. A mold processing control method, applied to a mold, characterized in that: The mold comprises a body, a moving component and a plurality of cooling pipelines, wherein the plurality of cooling pipelines are arranged on the body, the cooling pipelines are connected to the moving component, and the moving component is used to drive each cooling pipeline to move relative to the body; The method comprises: Set a target number of temperature control zones; Obtaining a target temperature of the temperature control zone; Based on the actual temperature of the temperature control zone and the target temperature, the moving component is controlled to drive the cooling pipeline to move, so as to adjust the density of the cooling pipeline at each temperature control zone.

2. The mold processing control method according to claim 1, characterized in that: The mold is used to process a workpiece; the step of setting a target number of temperature control zones includes: According to the parameters of the workpiece, the workpiece is divided into a target number of sub-partitions; According to the sub-divisions, the main body is divided into a target number of temperature control zones.

3. The mold processing control method according to claim 1, characterized in that: The step of obtaining the target temperature of the temperature control zone comprises: The target temperatures of the different temperature control zones of the workpiece are determined according to the required temperatures of the sub-zones.

4. A mold, characterized in that: It comprises a control component, and the control component is used to execute the mold processing control method according to any one of claims 1 to 3.

5. The mold according to claim 4, characterized in that: The mold includes a body, a moving component and a plurality of cooling pipelines. The plurality of cooling pipelines are arranged on the body. The cooling pipelines are connected to the moving component. The moving component is used to drive each cooling pipeline to move relative to the body.

6. A mold processing control device, characterized in that: include: A setting module, used to set a target number of temperature control zones; An acquisition module, used for acquiring the target temperature of the temperature control zone; The control module is used to control the moving component to drive the cooling pipeline to move based on the actual temperature of the temperature control zone and the target temperature, so as to adjust the density of the cooling pipeline at each temperature control zone.

7. An electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the mold processing control method according to any one of claims 1 to 3 is implemented.

8. A non-transitory computer-readable storage medium, the non-transitory computer-readable storage medium comprising a computer program, characterized in that: When the computer program is executed by a processor, the mold processing control method according to any one of claims 1 to 3 is implemented.

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