Laser processing method and device for optical device

Abstract

The invention relates to the technical field of laser system control, and discloses a laser processing method and device for an optical device, and the method comprises the steps: obtaining manufacturing target information and basic feature information of a manufacturing object, carrying out the digital simulation, obtaining a laser processing simulation model, and extracting laser processing demand features; the method comprises the following steps: carrying out synchronous processing scheme analysis on a laser device array to obtain a synchronous processing scheme, driving each laser device group of the laser device array to carry out laser processing treatment according to the synchronous processing scheme, monitoring and feeding back a laser processing effect in real time, and continuously adjusting until a required manufacturing object is obtained. By means of digital simulation and synchronous machining scheme analysis, high efficiency and accuracy of the machining process are guaranteed, errors can be effectively reduced through a real-time feedback and adjustment mechanism, cooperative work of a multi-laser device array is optimized, machining efficiency is improved, and the problem that in the prior art, precision is insufficient when a plurality of laser devices are synchronously machined is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser system control, and in particular to a laser processing method and device for an optical device. Background Art

[0002] Laser processing technology is widely used in the field of precision manufacturing. As a high-energy, short-time, precisely controllable processing tool, laser has the advantages of non-contact, high precision, and adjustable control. It can achieve local precision processing and structural modification of materials during the manufacturing process. However, the accuracy, efficiency, and stability of the final processing effect of the laser processing process depend on multiple factors, such as the performance of the laser source, the configuration of the laser device array, the characteristics of the processing object, and the selection of processing parameters.

[0003] In the traditional laser processing process, adjustments are usually made based on manual experience or a single processing parameter setting, resulting in poor stability of processing accuracy, long processing time and difficult to control processing results. The limitations of this traditional method make it difficult for laser processing to meet the requirements of some high-end manufacturing fields under the requirements of high-precision and high-efficiency processing. Summary of the invention

[0004] The object of the present invention is to provide a laser processing method and device for an optical device, aiming to solve the problem of insufficient precision in synchronous processing of multiple laser devices in the prior art.

[0005] The present invention is implemented in this way. In a first aspect, the present invention provides a laser processing method for an optical device, comprising: Acquiring manufacturing target information of a manufacturing object, acquiring basic feature information of a laser-processed object to be processed by laser to obtain the manufacturing object, and digitally simulating the manufacturing object and the laser-processed object according to the manufacturing target information and the basic feature information to obtain a laser processing simulation model; Based on the laser processing simulation model, the laser processing requirements of the laser processing object are analyzed to obtain laser processing requirement characteristics, and according to the laser processing requirement characteristics, a synchronous processing scheme of a laser device array is analyzed for the laser processing object to obtain a synchronous processing scheme of the laser device array for the laser processing object; According to the synchronous processing scheme, each laser device group of the laser device array is driven to perform laser processing on the laser processing object, and the laser processing effect of the laser device array is monitored in real time and operation feedback is provided until the manufacturing object is obtained.

[0006] In a second aspect, the present invention provides a laser processing apparatus for an optical device, which is used to implement a laser processing method for an optical device as described in any one of the first aspects.

[0007] The present invention provides a laser processing method for an optical device, which has the following beneficial effects: The present invention obtains manufacturing target information and basic feature information of a manufacturing object for digital simulation, obtains a laser processing simulation model and extracts laser processing requirement features, so as to analyze the synchronous processing scheme of a laser device array, obtain a synchronous processing scheme, drive each laser device group of the laser device array to perform laser processing according to the synchronous processing scheme, monitor and feedback the laser processing effect in real time, and continuously adjust until the desired manufacturing object is obtained. Through digital simulation and synchronous processing scheme analysis, the efficiency and accuracy of the processing process are ensured, and the real-time feedback and adjustment mechanism can effectively reduce errors, optimize the collaborative work of multiple laser device arrays, improve processing efficiency, and solve the problem of insufficient accuracy during synchronous processing of multiple laser devices in the prior art. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the steps of a laser processing method for an optical device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0009] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0010] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0011] Reference Figure 1 As shown, a preferred embodiment of the present invention is provided.

[0012] In a first aspect, the present invention provides a laser processing method for an optical device, comprising: S1: Acquire manufacturing target information of a manufacturing object, acquire basic feature information of a laser-processed object to be processed by laser to obtain the manufacturing object, and digitally simulate the manufacturing object and the laser-processed object according to the manufacturing target information and the basic feature information to obtain a laser processing simulation model; S2: analyzing the laser processing requirements of the laser processing object based on the laser processing simulation model to obtain laser processing requirement characteristics, and analyzing the synchronous processing scheme of the laser device array for the laser processing object according to the laser processing requirement characteristics to obtain a synchronous processing scheme of the laser device array for the laser processing object; S3: driving each laser device group of the laser device array to perform laser processing on the laser processing object according to the synchronous processing scheme, and performing real-time monitoring and operation feedback on the laser processing effect of the laser device array until the manufacturing object is obtained.

[0013] Specifically, in step S1 of the embodiment provided by the present invention, a complete three-dimensional model of the manufacturing object is obtained through design software (such as CAD, SolidWorks, etc.), and this model includes the size, shape, surface characteristics, material type, etc. of the object. Combined with the design data, the manufacturing goal is clarified, for example, whether fine surface quality, specific dimensional tolerances, certain specific material properties, etc. are required. Specific requirements are input as needed, including processing accuracy, surface quality requirements, processing area (such as local cutting or overall processing), processing depth, etc. By obtaining detailed manufacturing target information, it is ensured that each step in the processing process can be executed according to the predetermined design requirements, reducing deviations in the processing process. The precise input of manufacturing target information provides an accurate benchmark for subsequent digital simulation and optimization, effectively avoiding information loss or error transmission.

[0014] More specifically, basic feature information of the laser processed object to be processed by laser to obtain the manufactured object is obtained, and preliminary physical information of the laser processed object is obtained through sensors, laser scanners, three-dimensional scanning equipment, etc. This information includes its geometric shape, surface roughness, existing cracks or defects, thermal properties of materials, etc. High-precision sensors (such as laser interferometers, optical scanners) are used to measure the surface of the processed object in detail to obtain data such as surface structure and roughness before processing, such as laser absorptivity, thermal conductivity, specific heat capacity, etc., to ensure that thermal effects and material changes in the processing process are fully considered, and the basic data in the simulation process is ensured to be authentic by accurately collecting the initial features of the laser processed object. This data collection method helps capture the details of the laser processed object, reflects the thermal effects and physical deformation it may suffer, and provides the necessary basis for subsequent processing simulation.

[0015] More specifically, the manufacturing object and the laser processing object are digitally simulated according to the manufacturing target information and the basic feature information, and a digital model is established through computer-aided engineering (CAE) software (such as ANSYS, COMSOL, etc.) based on the manufacturing target information and the basic feature information of the laser processing object. The model includes the geometric structure, material properties, heat conduction model, etc. of the laser processing object, and the physical phenomena when the laser acts on the surface of the processing object, such as thermal effects, stress distribution, material melting or evaporation, etc., are simulated through finite element analysis (FEA) or other numerical simulation methods. For example, when the laser is irradiated on the surface of the material, how to cause a local temperature rise, the formation of a heat-affected zone, and changes in processing depth, etc.

[0016] More specifically, based on the simulation results, the stress concentration, material deformation, surface quality and other problems that may occur during the laser processing are analyzed, and the degree of compliance of these influences with the final manufacturing goals is evaluated. The various parameters in the laser processing process (such as laser power, focal position, scanning speed, etc.) are adjusted through the simulation results to make them meet the requirements of the manufacturing goals as much as possible. Digital simulation can predict the thermal effects and material removal processes in the laser processing process by simulating physical phenomena before actual processing, thereby effectively avoiding uncertainties in processing. Through simulation analysis, potential problems in the processing process (such as excessive heat effects, material ablation, etc.) can be discovered in advance, and the processing parameters can be adjusted according to the results to avoid unnecessary waste or errors. Using digital simulation technology, different processes and laser parameters can be tested before actual processing to ensure that the risks in the processing process are minimized, thereby improving the stability and controllability of the processing. The simulation model provides accurate data support for subsequent processing decisions and can help engineers develop the best laser processing plan.

[0017] Specifically, in step S2 of the embodiment provided by the present invention, according to the manufacturing target and the basic characteristic information of the laser processing object, the specific requirements of laser processing are clarified, such as the processing accuracy requirements, cutting depth, processing area, material removal amount, surface quality, etc., and the processing problems that need to be optimized (such as high heat-affected zone, incomplete processing caused by too low laser power, etc.) are identified through analysis of the simulation model. These problems are usually related to factors such as the absorption characteristics of the material, processing speed, focal length, and laser energy distribution.

[0018] More specifically, the laser processing requirements are quantitatively analyzed according to the processing objectives, and the key features required for processing are extracted, such as: energy density: the energy distribution of the laser beam on the material surface, which affects the cutting depth and surface quality; heat input: the heat generated during the processing, which may affect the deformation and damage of the material; processing path: the required laser beam scanning path, processing sequence, etc.; processing accuracy: the required cutting dimensional accuracy, surface roughness, etc.

[0019] More specifically, the above requirements are converted into actionable parameters, such as laser power, scanning speed, laser focus position, etc., to form the demand characteristic data for laser processing. By clearly defining and analyzing the processing requirements, it is ensured that all processing parameters and goals are quantified to avoid unnecessary errors or mistakes in the processing process. The analyzed demand characteristics provide a clear direction for the subsequent optimization plan to ensure that the final processing process meets the design requirements. By analyzing the processing problems in the simulation model, it is possible to foresee and adjust the problems in advance before actual processing, reducing the subsequent adjustments and corrections.

[0020] More specifically, according to the characteristics of the processing requirements, a suitable laser device array is selected. The configuration of the laser device array depends on the processing area that needs to be covered, the laser power distribution requirements, and the processing accuracy requirements. For example, multiple low-power lasers can be selected to work together to improve the flexibility and accuracy of the processing. Considering that the multiple laser sources of the laser device array need to work in coordination, a synchronous processing strategy is designed. This strategy needs to determine the output power, scanning speed, focal length of each laser, and the relative position between lasers to ensure that all lasers work synchronously at the same time or through a specific time delay. Through the reasonable allocation of laser power, overheating or damage caused by excessive heat concentration is avoided. At the same time, the processing efficiency is ensured, and the scanning path between the laser arrays is designed so that the processing areas of each laser do not overlap to avoid redundant processing.

[0021] More specifically, based on the characteristics of the processing requirements, the working path, focus setting, scanning rate, etc. of each laser are optimized to ensure efficient and precise processing, reduce energy waste and time delays in processing, and digitally simulate the synchronous processing plan to verify the effect of the laser array in the processing process. While ensuring the processing quality and efficiency, overheating, incomplete local processing and other problems are avoided. Digital simulation tools are used to analyze the synchronous working effect of the laser array, such as energy distribution, heating effect, deformation, etc., to ensure that all lasers achieve the expected processing effect when working together.

[0022] It is understandable that through the synchronous processing scheme of the laser array, multiple areas can be processed at the same time, thereby greatly improving the processing efficiency. It is especially suitable for large-area, high-precision laser processing tasks. The synchronous operation of the laser array can ensure the consistency of the processing path and heating distribution, thereby improving the processing accuracy and surface quality of the product, avoiding local overheating or uneven cutting problems. By optimizing the configuration and synchronous operation of the laser array, the processing time can be reduced, the material utilization rate can be improved, and the production cost can be reduced. The synchronous processing scheme can reasonably distribute the load of each laser, avoid overloading of a certain laser, and extend the service life of the equipment. The synchronous operation of the laser array can be flexibly adjusted according to different processing requirements, so that the processing scheme can adapt to changing production needs, such as cutting workpieces of different shapes and depths.

[0023] More specifically, the process parameters and equipment selection are integrated, and the characteristics of laser processing requirements and synchronous processing schemes are combined to select the most suitable laser array equipment and processing technology. According to the synchronous processing scheme, a specific processing plan is generated and optimized. The optimization content includes laser arrangement, power distribution, scanning path arrangement, etc. to ensure the best processing effect. In the actual processing process, the parameters of the processing process are monitored through the feedback control system, and the synchronous working state of the laser array is adjusted in real time to cope with possible errors or changes in the external environment.

[0024] It can be understood that according to the aforementioned synchronous processing scheme, the laser array can perform processing tasks efficiently and accurately, thereby ensuring that the quality of the final workpiece meets expectations. The synchronous processing scheme can cope with different processing objects, different materials, and different processing requirements, and has strong adaptability. Synchronous processing enables various parameters in the processing process to be precisely controlled, ensuring the consistency, stability and high production efficiency of the processing.

[0025] Specifically, in step S3 of the embodiment provided by the present invention, according to the synchronous processing scheme, each laser device group of the laser device array is started to ensure that each laser is ready according to predetermined working parameters (such as power, frequency, scanning speed, focal position, etc.). When each laser device group is started, the excitation mode, power distribution and scanning path of the laser are determined according to the specific processing requirements and the designed synchronous processing scheme to ensure that the laser beam of each laser is focused on the target processing area, and the energy density is adjusted according to the requirements to achieve the best processing effect.

[0026] More specifically, according to the path and sequence designed in the synchronous processing plan, each laser of the laser device array is driven to perform laser processing on the processing object along the specified path. The multiple lasers in the laser device array work in coordination according to the synchronous processing plan to ensure that each part of the processing area can be processed simultaneously or in sequence. According to the shape and requirements of the processing object, the laser may adopt a layer-by-layer processing method. Especially when performing precision cutting on metal or high-hardness materials, it is usually necessary to gradually remove the material layer. Synchronously driving multiple lasers for joint processing can simultaneously or quickly switch processing in multiple areas, significantly improving processing efficiency. It is especially suitable for processing tasks of large areas or complex shapes. Each laser works according to a predetermined path and sequence to ensure the precise execution of the processing path, avoid excessive heating or uneven cutting of the material, and by controlling the laser beam intensity, focal length and other parameters of different lasers, it can flexibly respond to the processing needs of different materials and different depths, thereby improving the adaptability of processing.

[0027] More specifically, by integrating sensors and monitoring equipment, the working status of each laser during laser processing and the response of the processing object are monitored in real time. Common monitoring methods include: monitoring the temperature of the processing area through infrared sensors to avoid material damage or deformation due to overheating, using high-precision optical equipment (such as CCD cameras or laser reflection detection) to monitor the laser beam spot, focus and optical signals generated during the processing process in real time to ensure processing accuracy, monitoring surface quality, such as surface roughness, cutting edge flatness, etc., to ensure that the processing accuracy meets the predetermined requirements.

[0028] More specifically, the processing is dynamically adjusted based on real-time monitoring data. For example, the output power of the laser is automatically adjusted based on the monitored temperature and processing progress to prevent overheating or incomplete processing. If inaccurate processing or deviations are detected (such as focal length changes or spot position errors), the laser scanning path can be adjusted to ensure processing accuracy. According to the working status and feedback of each laser, the start and pause time of each laser is automatically adjusted to ensure synchronous working status. Based on the monitoring results, the system adjusts the process in real time through the operation interface, optimizes the working parameters of the laser, and can even pause processing, re-plan the path or change the processing mode.

[0029] More specifically, modern laser processing systems are usually equipped with closed-loop control systems, which can automatically adjust laser parameters according to real-time data during the processing to achieve the best processing effect. Through real-time monitoring and feedback control, it can ensure that errors in the processing process are detected and corrected in time, thereby achieving high-precision laser processing and avoiding the occurrence of defective products. The real-time monitoring and feedback mechanism makes the processing process completely transparent, and the operator can make timely adjustments according to the actual situation, thereby avoiding problems in the processing process. Real-time monitoring of factors such as temperature, focus, and spot ensures that there will be no defects such as overheating, focus drift, and incomplete cutting during the processing process, thereby ensuring the quality of the final workpiece. Automatic adjustment of laser parameters through a closed-loop control system can not only avoid processing defects, but also ensure maximum processing efficiency and reduce unnecessary human intervention.

[0030] More specifically, when the laser processing object is processed in full accordance with the design requirements, the system will automatically perform the final processing effect verification. This step includes: size and shape inspection to ensure that the size and shape of the processing object meet the design standards, surface quality confirmation, check the surface quality after processing, confirm the surface smoothness, the flatness of the cutting edge, etc., final product extraction and inspection. After the processing is completed, the processing object is extracted from the processing platform by a robotic arm or other equipment, and a final inspection and quality verification are carried out. The final manufacturing object is fully verified for quality, including testing the physical properties of the material (such as hardness, heat resistance, etc.) and surface defects to ensure product compliance.

[0031] More specifically, through real-time monitoring and feedback adjustment, the quality of the processing process can be effectively guaranteed, thereby ensuring that the final manufactured object meets the predetermined quality standards. The real-time feedback mechanism ensures that problems arising during processing can be corrected in a timely manner, thereby significantly reducing the scrap rate and improving production efficiency. Since each step is finely controlled and adjusted in real time, the final workpiece can be delivered on time and the production cycle can be shortened.

[0032] The present invention provides a laser processing method for an optical device, which has the following beneficial effects: The present invention obtains manufacturing target information and basic feature information of a manufacturing object for digital simulation, obtains a laser processing simulation model and extracts laser processing requirement features, so as to analyze the synchronous processing scheme of a laser device array, obtain a synchronous processing scheme, drive each laser device group of the laser device array to perform laser processing according to the synchronous processing scheme, monitor and feedback the laser processing effect in real time, and continuously adjust until the desired manufacturing object is obtained. Through digital simulation and synchronous processing scheme analysis, the efficiency and accuracy of the processing process are ensured, and the real-time feedback and adjustment mechanism can effectively reduce errors, optimize the collaborative work of multiple laser device arrays, improve processing efficiency, and solve the problem of insufficient accuracy during synchronous processing of multiple laser devices in the prior art.

[0033] Preferably, the steps of obtaining manufacturing target information of a manufacturing object, obtaining basic feature information of a laser-processed object to be processed by laser to obtain the manufacturing object, and digitally simulating the manufacturing object and the laser-processed object according to the manufacturing target information and the basic feature information to obtain a laser processing simulation model include: S11: Acquire a processing unit that has undergone basic topography processing in a previous processing stage, and mark the processing unit as a laser processing object to be laser processed; S12: obtaining theoretical characteristic information of the basic morphology of the laser processed object after the previous processing stage, and collecting characteristic information of the laser processed object through a sensor group to verify the deviation of the theoretical characteristic information, so as to obtain basic characteristic information of the laser processed object; S13: Acquiring manufacturing target information of a manufacturing object to be obtained by laser processing the laser processing object; S14: performing digital simulation on the manufacturing object according to the manufacturing target information to obtain a manufacturing object simulation model; S15: digitally simulating the laser processing object according to the basic feature information to obtain a laser processing object simulation model; S16: performing correlation positioning analysis on the laser processing object simulation model and the manufacturing object simulation model to obtain a correlation positioning node set between the laser processing object simulation model and the manufacturing object simulation model; S17: performing model overlap processing on the laser processing object simulation model and the manufacturing object simulation model based on the associated positioning node set to obtain the laser processing simulation model.

[0034] Specifically, before laser processing, basic morphology processing is first performed, usually by performing preliminary processing on the workpiece through mechanical processing, milling, cutting and other means. These processing units that have undergone basic morphology processing are marked as laser processing objects. These processing units will serve as the basis for subsequent laser processing and have relatively stable shape and size information. Accurate processing object identification can clearly define and distinguish which processing units will undergo laser processing, which provides an accurate basis for subsequent processing planning and control. The preceding processing provides a stable basic morphology for subsequent laser processing, avoids the accumulation of shape errors, and improves the accuracy of subsequent laser processing.

[0035] More specifically, after the workpiece is processed according to the basic morphology, its theoretical geometric feature information (such as size, shape, surface roughness, etc.) is obtained. This information usually comes from the CAD model or previous calculation data. The laser processing object is measured using a sensor group (such as a laser scanner, a three-dimensional measuring instrument, an optical sensor, etc.), and its actual feature information is collected in real time. It is compared with the theoretical data, the deviation is calculated, the theoretical feature information and the actual measurement information are compared, the processing error is identified, and corresponding adjustments or corrections are made according to the deviation. Through a precise sensor system, the feature information of the processing object can be collected and verified in real time and accurately to ensure that the geometric shape of the processing object meets the expected requirements. Through the verification and analysis of the deviation, the difference between theory and practice can be corrected in time, thereby improving the accuracy of subsequent laser processing.

[0036] More specifically, according to the product design requirements and manufacturing process requirements, the manufacturing target information is obtained. This information includes the geometric size, shape, surface accuracy and other requirements of the target. The manufacturing target information usually comes from the engineering design documents, product CAD models or process roadmaps to ensure that each step of the laser processing is moving towards the established manufacturing goal and avoid the processing process from deviating from the final goal. The manufacturing target information is one of the key parameters in the digital simulation process, which provides an accurate target reference for subsequent simulation and analysis.

[0037] More specifically, according to the manufacturing target information, CAD or CAM software is used to digitally simulate the manufacturing object to generate a simulation model of the manufacturing object. This step may include simulating all geometric shapes and dimensional changes required in the manufacturing process. According to the basic feature information (verified actual data), the laser processing object is digitally simulated to generate a simulation model of the laser processing object. This step mainly focuses on the deformation, processing accuracy and surface quality that may occur during the laser processing process. Through digital simulation technology, accurate models of the manufacturing object and the laser processing object can be generated to provide clear visual representation for subsequent processing and analysis. Through digital simulation, the relationship between the manufacturing object and the laser processing object can be evaluated in advance, the processing results can be predicted, and the uncertainty in the actual processing process can be reduced.

[0038] More specifically, the manufacturing object simulation model and the laser processing object simulation model are compared to perform correlation positioning analysis, analyze the positional relationship and shape deviation between the two, and identify important positioning nodes (such as corner points, center points, edge points, etc.) between the two through model comparison. These positioning nodes are used for subsequent model overlap and adjustment. Through precise positioning analysis, the relative position between the two models can be accurately identified, laying the foundation for subsequent model overlap processing. Through accurate positioning nodes, the precise docking between the laser processing object and the manufacturing object is ensured, improving processing accuracy and quality.

[0039] More specifically, based on the associated positioning node set, the simulation model of the laser processing object and the simulation model of the manufacturing object are overlapped and aligned. This process can be completed through the docking algorithm in the CAD software or the optimization docking algorithm in the CNC system. During the overlapping process, fine-tuning is usually required to ensure that the models are completely matched in terms of size, shape, etc., so that the simulation effect of the laser processing object can be consistent with the actual manufacturing target. After the overlapping process, the generated laser processing simulation model will contain processing paths, cutting methods, laser power, scanning modes and other information that are consistent with the expected effects of the manufacturing target. This model is used to guide actual laser processing operations.

[0040] More specifically, through model overlap processing, a high degree of consistency between the simulation model of the laser processing object and the simulation model of the manufacturing object can be ensured, and the actual processing process can be accurately simulated in the digital space. The overlapping model can accurately predict the processing path and problems that may be encountered during the processing, help optimize the laser processing path and parameter settings, and ensure efficient and accurate processing. The laser processing simulation model after model overlap can predict the processing effect in advance, evaluate the material removal amount, surface quality, etc., thereby providing a basis for the actual processing process and reducing errors or deviations in the processing process.

[0041] Preferably, the step of analyzing the laser processing requirements of the laser processing object based on the laser processing simulation model to obtain the laser processing requirement characteristics includes: S21: performing digital analysis and feature annotation of model differences based on the laser processing object simulation model and the manufacturing object simulation model in an overlapping state in the laser processing simulation model to obtain a distribution of features to be processed of the laser processing simulation model; S22: Acquire performance information of a laser device array to be prepared to perform a laser processing operation, and perform adaptability analysis of the laser processing mode on the distribution of features to be processed of the laser processing simulation model according to the performance information, so as to obtain adaptability evaluation characteristics of the distribution of features to be processed of the laser processing simulation model corresponding to various laser processing modes of the laser device array; S23: Based on the adaptability evaluation characteristics of the distribution of the to-be-processed features of the laser processing simulation model corresponding to various laser processing modes of the laser device array, the distribution of the to-be-processed features of the laser processing simulation model is subjected to time-space correlation feature mapping to obtain a laser processing vector matrix of the laser processing simulation model; wherein the laser processing vector matrix includes a plurality of laser processing vectors with time-space correlation, and the laser processing vectors are used to describe the requirement characteristics of preparing the laser device array to perform laser processing operations at various specific locations on the laser processing simulation model; S24: Performing a vector clustering analysis on the laser processing vector matrix at an overall level to obtain vector clusters of the laser processing simulation model and an overall feedback list corresponding to the vector clusters, wherein the vector clusters and the overall feedback list together serve as the laser processing demand characteristics of the laser processing object; wherein the vector clusters include a plurality of vector clusters, and the vector clusters are generated by a plurality of laser processing vector clusters whose spatiotemporal correlations meet preset clustering criteria.

[0042] Specifically, the overlapping state of the laser processing simulation model is confirmed to ensure that the laser processing object simulation model and the manufacturing object simulation model are in an overlapping state, ensuring their spatial docking and mutual adaptation. Through digital analysis, the differences in geometric morphology between the two models are compared, the differences are identified and feature annotation is performed. Common differences may include shape changes, dimensional errors, surface roughness differences, etc.

[0043] More specifically, after marking the differences, a distribution map of features to be processed is obtained. This is a distribution map showing the processing requirements of each part of the model (such as removal amount, accuracy requirements, etc.). Through difference analysis, it can be clear which areas of the laser processing object need to be processed intensively and which areas may need further correction or optimization. The generation of the distribution of features to be processed provides an accurate basis for the selection and adjustment of subsequent laser processing modes.

[0044] More specifically, performance data of the laser device array that is prepared to perform laser processing operations is obtained, mainly including laser power, wavelength, focus control, scanning speed, etc. According to the performance of the laser device array, the processing modes required for different areas of the distribution of features to be processed are analyzed. For example, high-power lasers are suitable for thicker material removal, low-power lasers are suitable for fine cutting, etc. According to the distribution of features to be processed and the performance information of the laser device array, the adaptability of various processing modes is evaluated to determine which areas are suitable for a specific laser processing mode (such as high-power pulsed laser, low-power continuous laser, etc.).

[0045] More specifically, through adaptability analysis, the most suitable laser processing mode can be selected for different processing areas to avoid waste of resources and poor processing. The processing mode can be reasonably selected according to actual needs, the processing efficiency and quality can be improved, and high-precision control can be ensured during the processing.

[0046] More specifically, a spatiotemporal correlation analysis is performed on the distribution of processing features, taking into account the changes in the processing area in time and space. Through spatiotemporal correlation feature mapping, the information of the features to be processed is combined with the results of the processing mode adaptability evaluation to form a laser processing vector matrix. Each vector in the matrix represents the required characteristics of laser processing at a specific position (in space) and time (in the processing process). These vectors reflect the power, speed, path and other information required by different areas during the laser processing process. Through spatiotemporal correlation feature mapping and vector matrix, the requirements of the entire laser processing process can be described in detail, helping engineers better understand the dynamic requirements in the processing process. The laser processing vector matrix provides comprehensive data support for subsequent processing path planning, laser power adjustment and parameter optimization.

[0047] More specifically, a cluster analysis is performed on the laser processing vector matrix, and a clustering algorithm (such as K-means, DBSCAN, etc.) is used to cluster the vectors whose spatiotemporal correlation meets the preset standards. Each vector cluster represents an area or time period under the same characteristics, representing a collection of certain laser processing modes. Through clustering, similar processing requirements are classified into a cluster. These clusters reflect areas or time periods with similar processing requirements.

[0048] More specifically, after cluster analysis, a feedback list is generated for each vector cluster, which contains the processing mode, laser parameters, expected effects and other information corresponding to the cluster. Through the feedback list, optimization suggestions for the laser processing process can be obtained. Through vector cluster analysis, complex laser processing demand information can be reasonably classified to help processing personnel quickly find suitable processing solutions. Each vector cluster represents an optimized processing demand model. The feedback list provides a basis for adjusting laser processing parameters, making the processing process more accurate and efficient. Through refined vector clusters and feedback lists, precise control of laser processing can be achieved, processing errors and defective rates can be reduced, and product consistency can be improved.

[0049] More specifically, through the above analysis, we finally get the complete demand characteristics of the laser processing object, covering the laser power, processing path, time control, cutting accuracy and other information of all processing areas. The demand characteristics can not only provide guidance for subsequent laser processing operations, but also provide data support for the scheduling and control of equipment. Through the analysis and modeling of the laser processing demand characteristics, the specific requirements of each processing area can be accurately described to ensure that the laser processing can be completed efficiently and accurately. The generation of demand characteristics helps processing personnel plan the entire processing process in advance, avoid resource waste, process mismatch and other problems, and improve production efficiency.

[0050] Preferably, the step of analyzing the synchronous processing scheme of the laser device array for the laser processing object according to the laser processing requirement characteristics to obtain the synchronous processing scheme of the laser device array for the laser processing object includes: S25: performing synchronous calibration operation analysis on the laser device array according to each vector cluster in the laser processing requirement feature and the overall feedback list to obtain a synchronous calibration plan of the laser device array corresponding to the laser processing requirement feature; wherein the synchronous calibration plan is used for the laser device array to calibrate the relative position corresponding to the laser processing object; S26: analyzing the most suitable laser processing mode for each vector cluster in the laser processing requirement feature according to the performance information of the laser device array, so as to obtain the most suitable laser processing mode for each laser device group in the laser device array corresponding to each specific position on the laser processing object; S27: performing a synchronous processing feasibility analysis on the overall feedback list in the laser processing requirement characteristics according to the performance information of the laser device array and the most suitable laser processing modes of each laser device group corresponding to each specific position on the laser processing object, so as to allocate each specific position on the laser processing object and the corresponding most suitable laser processing mode into a plurality of synchronous processing gradient plans; S28: Cross-combining the synchronous calibration plan with each of the synchronous processing gradient plans to obtain a synchronous processing plan for the laser device array for the laser processing object.

[0051] Specifically, each vector cluster in the laser processing demand characteristics is associated with the overall feedback list. Each vector cluster represents a processing area with similar demand characteristics, and the feedback list contains information on the detailed processing requirements and applicable processing modes of the processing area. Based on the above vector clusters and feedback lists, the synchronous calibration operation analysis of the laser device array is performed. By calculating the relative position relationship between different laser devices in the laser device array, the relative positions of these laser devices in space are calibrated to ensure that they can accurately and coordinately complete their corresponding processing tasks.

[0052] More specifically, a synchronous calibration plan is generated, which includes how to adjust the relative positions of each laser device in the laser device array so that it can accurately match the laser processing requirements, ensure that multiple laser devices in the laser device array can work in coordination during the processing, avoid processing errors or processing failures due to position deviations, and improve the accuracy of laser processing through precise calibration, ensuring that the laser device array can perform tasks according to the expected demand characteristics.

[0053] More specifically, based on the performance information of the laser device array (such as power, wavelength, focusing capability, etc.), each vector cluster in the laser processing demand characteristics is analyzed. For each vector cluster, the most suitable laser processing mode is selected according to its corresponding processing requirements. Different processing requirements may require different laser modes, such as high-speed cutting, fine engraving, deep drilling, etc. According to these requirements, the most suitable laser power, wavelength, scanning speed and other parameters are selected, and the laser device groups in each laser device array are assigned to different processing modes to ensure that the processing method of each laser device group best matches the needs of the target area.

[0054] More specifically, choosing the most suitable laser processing mode helps to improve processing quality, efficiency and precision, avoid over-processing or under-processing problems, and maximize the performance of the laser device array by properly selecting the laser mode, avoiding unnecessary energy waste.

[0055] More specifically, the performance of the laser device array is matched with the most suitable mode. The performance information of the laser device array and the most suitable processing mode assigned to each laser device group are integrated to perform a feasibility analysis of synchronous processing on the overall feedback list in the laser processing demand characteristics. It is evaluated whether all laser device groups can perform tasks in the same time and according to the established processing mode. This includes considering factors such as laser power limitations, scanning speed coordination, and overlap of processing paths to ensure coordination between multiple laser devices.

[0056] More specifically, based on the results of the feasibility analysis, the most suitable processing mode for each position on the laser processing object is assigned to multiple synchronous processing gradient plans. These gradient plans describe the working status of each laser device in the laser device array at different times and positions. Through feasibility analysis, it is ensured that the working status of each laser device is feasible, avoiding the inability to complete the processing task due to equipment limitations or resource conflicts. Through reasonable gradient plan allocation, multiple laser devices can work synchronously, maximize processing efficiency, and shorten processing time.

[0057] More specifically, the synchronous calibration plan is cross-combined and analyzed with each synchronous processing gradient plan. The calibration plan ensures the relative position and coordination of the laser device array, while the synchronous processing gradient plan ensures that the laser devices work efficiently in a predetermined mode during the processing. Through cross-analysis, the optimal synchronous processing plan is generated, which includes ensuring that each laser device can work step by step according to the gradient in a coordinated manner during the processing, and timely adjusting the synchronous calibration plan to avoid a decrease in processing accuracy due to position deviation or time mismatch. Through the optimal combination of the synchronous calibration plan and the gradient plan, an efficient and accurate synchronous processing plan is generated. This plan can ensure that each laser device performs tasks in the optimal order and time node, maximize the efficiency and quality of processing, ensure the coordination between different laser devices, and enable each processing area to be seamlessly connected, reducing the ineffective waiting time during the processing process.

[0058] Preferably, the step of performing synchronous calibration operation analysis on the laser device array according to each vector cluster in the laser processing requirement feature and the overall feedback list to obtain a synchronous calibration plan for the laser device array corresponding to the laser processing requirement feature includes: S251: Retrieving a synchronous calibration scheme template prepared for synchronous calibration of the laser device array, and analyzing the specific execution mode of the performance information of the laser device array according to the synchronous calibration scheme template to obtain a synchronous calibration mode of the laser device array; wherein the synchronous calibration scheme template includes driving each laser device group of the laser device array to perform edge processing on a plurality of designated positions on the laser processing object, so that the processing laser of each laser device group passes through the edge of each designated position to process each designated position, and then detecting the landing effect of the processing laser, and obtaining the morphological deviation of the laser processing object by detecting the loss of the processing laser; S252: performing a value reference analysis of each vector cluster as a synchronous calibration position on the vector clusters of the laser processing requirement characteristics according to the synchronous calibration mode of the laser device array, so as to obtain calibration value parameters corresponding to the synchronous calibration operation of each vector cluster on the laser processing object, and performing an associated value analysis of jointly performing the synchronous calibration operation on each vector cluster on the laser processing object based on the overall feedback list of the laser processing requirement characteristics, so as to obtain associated value parameters of jointly performing the synchronous calibration operation on each vector cluster on the laser processing object; S253: Select the synchronous calibration position of the laser processing object according to the calibration value parameters and associated value parameters of the vector clusters at various locations on the laser processing object, and perform a specific execution analysis of the synchronous calibration mode on the laser device array according to the selected synchronous calibration position to obtain a synchronous calibration plan for the laser device array corresponding to the synchronous calibration position.

[0059] Specifically, a template suitable for the current laser processing needs is selected from the prepared synchronous calibration scheme templates. This template contains the basic framework of how to operate the laser device array to complete the synchronous calibration. The template design takes into account the geometric structure, power parameters and working mode of the laser device array. After selecting the synchronous calibration scheme template, the performance information of the laser device array (such as laser power, wavelength, focusing ability, scanning speed, etc.) is analyzed. Based on this performance information, it is determined how the laser device array can accurately perform the processing task during the synchronous calibration operation, and the specific implementation method of the synchronous calibration is analyzed in detail. By retrieving a suitable synchronous calibration scheme template based on the performance information of the laser device array, it can be ensured that each laser device group can perform the calibration operation in the most suitable state, thereby improving the overall processing accuracy and efficiency. By analyzing the performance information, it is ensured that the synchronous calibration operation can be carried out efficiently and accurately to avoid errors due to differences in equipment performance.

[0060] More specifically, according to the synchronous calibration scheme template, each laser device group in the laser device array is driven to perform edge processing on several designated positions of the laser processing object. This process is to focus the laser beam on the edges of these designated positions to ensure that the processing laser can pass through the edges of these positions for processing, so as to accurately determine the beam deviation of each laser device. After completing the edge processing, the landing effect of the processing laser is detected, and the traces left after the laser processing are monitored by high-precision sensors. The accuracy and deviation of the laser beam in the target area are analyzed, and the loss of the laser during the processing is monitored to determine whether there is a problem of excessive loss or energy loss during the laser processing. This can help identify the actual working state of the laser device array, thereby analyzing the morphological deviation of the laser processing object.

[0061] More specifically, edge processing and landing effect detection can accurately evaluate whether there are errors in the laser device array during the processing process, thereby providing data support for further calibration. By detecting the loss of processing laser, deviations can be discovered and adjusted in a timely manner, thereby improving processing quality and ensuring the morphological accuracy of the laser processing object.

[0062] More specifically, based on the various vector clusters in the laser processing demand characteristics, the distribution of each vector cluster on the laser processing object is analyzed. Each cluster represents a small range within the processing area. The vectors in the cluster usually represent processing requirements at different positions. According to the distribution of each vector cluster, it is analyzed which areas are the priority positions for synchronous calibration operations. By performing weight analysis on the processing demand characteristics of each cluster, its value reference in the synchronous calibration process is determined. The purpose of this process is to ensure that the calibration operation is concentrated in the area that has the greatest impact on the overall processing accuracy.

[0063] More specifically, by analyzing the vector clusters, we can accurately select the key areas that need to be calibrated, improve the effectiveness of calibration, and avoid wasting resources. Through value reference analysis, we can ensure that the calibration work is concentrated on the areas that need correction most, thereby improving the overall processing accuracy.

[0064] More specifically, based on the characteristics of the synchronous calibration mode and vector clusters, the calibration value parameters of each cluster when performing synchronous calibration operations are calculated. The calibration value parameters usually include factors such as the time required for calibration, expected results, and the degree of error correction. Based on the overall feedback list of laser processing requirement characteristics, an association value analysis is performed between vector clusters. This analysis helps determine the mutual influence between different clusters, especially whether clusters in different positions need to be calibrated at the same time. By comprehensively evaluating the calibration value and correlation of each cluster, the association value parameters of each cluster are generated to guide the priority of synchronous calibration operations.

[0065] More specifically, by calculating the calibration value parameters, we can quantitatively analyze which areas are critical to synchronous calibration, thereby optimizing the calibration priority and resource allocation. By comprehensively considering the correlation between clusters, we can rationally plan the order of synchronous calibration operations, avoid repeated and invalid calibration steps, and save time and resources.

[0066] More specifically, based on the calibration value parameters and associated value parameters of each vector cluster, the specific positions on the laser processing object that most need synchronous calibration are selected. These positions will serve as the target areas for the synchronous calibration operation. After the synchronous calibration positions are selected, the specific synchronous calibration execution plan of the laser device array at these positions is analyzed. This analysis includes how to adjust each laser device group in the laser device array so that it can effectively perform accurate synchronous calibration to ensure the morphological accuracy of the processing object at each calibration position.

[0067] More specifically, by selecting the most critical synchronous calibration position, it is ensured that the laser device array can focus on optimizing the most challenging processing area during the processing process, thereby improving the overall processing accuracy. According to the selected position, the execution plan of the synchronous calibration mode can be optimized in a targeted manner to ensure that each laser device group can complete the calibration operation efficiently and accurately at a specific position.

[0068] Preferably, the steps of driving each laser device group of the laser device array to perform laser processing on the laser processing object according to the synchronous processing scheme, and performing real-time monitoring and operation feedback on the laser processing effect of the laser device array until the manufacturing object is obtained include: S31: driving the laser device array to perform a synchronous calibration operation on the laser processing object according to the synchronous calibration plan in the synchronous processing scheme, so that the laser device array is in a calibration state relative to the laser processing object; S32: driving the laser device array in a calibrated state to perform synchronous laser processing of multiple laser device groups on the laser processing object according to the synchronous processing gradient plan in the synchronous processing scheme, monitoring the morphological changes of the laser processing object in real time during the synchronous laser processing, and feeding back the real-time monitoring results to the laser processing simulation model for analysis to obtain the laser processing effect of the laser device array, and adjusting the processing laser of the laser device array in real time according to the laser processing effect; S33: After each synchronous processing gradient plan is executed, the synchronous calibration plan is repeatedly executed to correct the calibration state of the laser device array.

[0069] Specifically, according to the synchronous calibration plan in the synchronous processing plan, each laser device group in the laser device array is driven to perform preliminary synchronous calibration. This step ensures that the laser device array is in a correct calibration state relative to the laser processing object, and the output position, power and focus of the laser device are aligned with the processing object. By monitoring the working state of the laser device array, it is ensured that it has reached the predetermined calibration target and is ready for subsequent processing steps. It is ensured that the relative position between the laser device array and the processing object is accurate to avoid affecting the subsequent processing quality due to preliminary calibration errors. Through the calibration operation, the beam deviation and energy loss of the laser device array are reduced to ensure the stability of the laser during the entire processing process.

[0070] More specifically, after the laser device array is in the calibration state, each laser device group is driven to perform synchronous laser processing according to the synchronous processing gradient plan in the synchronous processing scheme. Each laser device group performs laser processing tasks within a designated processing area, and multiple laser device groups work together to ensure the efficiency and consistency of the entire processing process. During the synchronous laser processing, the morphological changes of the laser processing object are monitored in real time through sensors and imaging systems. Specifically, the changes in factors such as processing depth, width, and spot distribution during the processing are monitored to ensure that they meet the expected goals.

[0071] More specifically, through a real-time feedback mechanism, the monitored morphological change results are input into the laser processing simulation model for analysis. The simulation model will adjust the expected processing parameters according to the actual processing effect to ensure that the processing is always carried out under ideal conditions. According to the results of real-time monitoring during the processing, the laser parameters (such as power, focal length, scanning speed, etc.) of the laser device array are adjusted in real time to ensure processing accuracy and effect.

[0072] More specifically, through real-time monitoring and feedback mechanisms, deviations in the processing process can be quickly discovered and the laser device array can be adjusted to optimize the processing effect. Synchronous laser processing operations can reduce processing errors caused by asynchrony between laser device groups and ensure consistent processing effects in all areas. The combination of real-time feedback and simulation models enables laser processing errors to be corrected in the first place, greatly improving processing accuracy.

[0073] More specifically, after completing each synchronous processing gradient plan, a synchronous calibration is performed. After completing the execution of a synchronous processing gradient plan, the synchronous calibration plan is restarted to correct the calibration status of the laser device array. This step is mainly to ensure that deviations or equipment changes that may be introduced during the processing process can be corrected in time.

[0074] More specifically, re-execute the synchronous calibration operation to ensure that the laser device array is still in the optimal working state to adapt to subsequent processing steps. Through regular synchronous calibration, any deviations that may affect the processing accuracy can be corrected in time to ensure the consistency and high precision of the processing process. As the processing progresses, the laser device array may undergo slight performance changes due to thermal effects, wear and other factors. Regular calibration can ensure the long-term stability of the system and avoid the gradual accumulation of processing errors. As the laser processing progresses, the working state of the laser device array may undergo slight changes. Regular calibration operations can help adapt to these changes, thereby continuing to maintain high-precision processing effects.

[0075] More specifically, during the entire synchronous processing process, the real-time morphological change data of the laser processing object will be continuously fed back to the system, the laser processing simulation model will be continuously updated, and the processing parameters (such as laser power, focusing position, etc.) will be optimized to ensure that the final processing effect meets expectations. All real-time feedback data and model analysis results will provide a basis for the control of the laser device array and realize adaptive processing optimization. Through the feedback mechanism and continuous updating of the simulation model, the system can automatically adapt to complex processing requirements, intelligently optimize the processing process, and improve the final processing quality. As the processing progresses, the system can make precise adjustments based on real-time data, continuously optimize the processing process, and improve production efficiency.

[0076] Preferably, the step of driving the laser device array to perform a synchronous calibration operation on the laser processing object according to the synchronous calibration plan in the synchronous processing scheme so that the laser device array is in a calibration state relative to the laser processing object includes: S311: driving the limiting structure to perform a limiting operation on the laser processing object so that the laser processing object is in a limited state; S312: driving each laser device group in the laser device array to perform displacement deployment and orientation adjustment according to the synchronous calibration plan in the synchronous processing plan, so that each laser device group and each designated position on the laser processing object in a limited state are in a preparatory test state; S313: each of the laser device groups in the preparatory test state is instructed to emit a processing laser toward each designated position on the laser processing object, so that the processing laser performs edge processing on the laser processing object, and at the same time, the landing effect of the processing laser is detected to obtain edge processing laser landing effect detection data of each laser device group; S314: performing deviation analysis between the actual shape and the theoretical shape of the laser processing object in a limited state according to the edge processing laser landing effect detection data of each laser device group, so as to obtain the shape deviation of the laser processing object; S315: Based on the morphological deviation, synchronously adjust the limiting structure and the laser device array so that the laser device array is in a calibration state relative to the laser processing object.

[0077] Specifically, the driving limiting structure performs limiting operations on the laser processing object. Through the limiting structure (such as a positioning fixture or a bracket, etc.), the laser processing object is ensured to be in a fixed and controlled position during the processing process, avoiding position displacement of the object during the processing process, and putting the laser processing object in a limited state. The limiting structure ensures that the processing object does not move during the entire calibration process, thereby improving the accuracy of the calibration.

[0078] More specifically, through the limit operation, the displacement of the laser processing object due to external interference or equipment error is avoided, thereby ensuring the processing accuracy of the laser device array. The fixed processing object ensures that the laser emission position of the laser device array is the same each time, thereby reducing the error caused by the change of the object position.

[0079] More specifically, each laser device group in the laser device array is driven to perform displacement deployment and orientation adjustment: According to the synchronous calibration plan, each laser device group in the laser device array is adjusted according to the predetermined target position. These adjustments ensure that the laser output direction of each laser device group is precisely aligned with the designated position on the processing object, so that the laser device group enters a preparatory test state: After the adjustment is completed, the laser device group is in a preparatory test state, ready for test laser emission.

[0080] More specifically, through precise displacement and orientation adjustment, it is ensured that the laser beam of each laser device group can accurately irradiate the specified position of the processing object, avoiding the impact of deviation on the processing quality. The precise deployment of each laser device group ensures the coordination and cooperation of the entire laser array in synchronous processing, ensuring that multiple laser beams can act on the surface of the object at the same time.

[0081] More specifically, in the preparatory test state, each laser device group emits a processing laser toward a designated position on the laser processing object to perform edge processing tasks. At this time, the main task of the laser device group is to perform edge processing and process the edge area of ​​the target object. Through sensors or visual detection systems, the landing point of the laser beam emitted by each laser device group on the processing object is detected to evaluate the accuracy of its edge processing. Through real-time detection of the laser landing point, the actual laser effect of the laser device group on the processing object can be accurately evaluated to ensure the clarity and accuracy of the processing edge. Real-time laser landing point detection provides important feedback information for subsequent calibration, timely discovers deviations and provides a basis for adjustment.

[0082] It should be noted that edge processing is laser processing of the edge part of the specified position. By emitting the processing laser to the edge part of the specified position, if the relative position relationship between the laser processing object and the laser device group is as expected, the processing laser will pass through the edge of the specified position and receive a certain loss. If the position relationship is not as expected, the processing laser will be completely blocked or transmitted. Therefore, by collecting the landing effect of the processing laser, it can be determined whether the relative position relationship between the laser processing object and the laser device group is as expected.

[0083] More specifically, based on the data obtained from the edge processing laser landing effect of each laser device group, an analysis of the deviation between the actual and theoretical forms of the laser processing object is performed. By comparing the deviation between the actual processed edge and the expected edge, the morphological deviation of the laser processing object is obtained. This deviation analysis is mainly aimed at the relative position and orientation errors of the laser device group. These errors may lead to inconsistent edge processing effects. Through precise analysis of the laser landing effect, the source of errors in the processing process can be accurately identified, and then the calibration process can be targetedly corrected. By analyzing the morphological deviation in advance, poor processing caused by system errors in the laser processing process can be effectively prevented, thereby improving the overall processing quality.

[0084] More specifically, based on the results of the morphological deviation analysis, the limiting structure and the laser device array are adjusted synchronously. Specifically, the fine-tuning of the limiting structure may affect the position accuracy of the processing object, and the laser device array needs to adjust the orientation and position of each laser device group according to the deviation in order to perform precise processing again. By continuously adjusting the limiting structure and the laser device array, the calibration state of the laser device array relative to the laser processing object is ensured. The calibration adjustment process will be optimized with the results of each processing, thereby gradually realizing high-precision control of the processing process.

[0085] More specifically, by synchronously adjusting the limit structure and the laser device array, it is ensured that the laser device array is always in the optimal relative position with the processing object, and that the output direction of each laser device group is perfectly aligned with the processing object. This step is not only a one-time adjustment, but also continuously optimized according to subsequent processing data feedback, gradually correcting system errors, thereby achieving long-term stable processing effects.

[0086] It can be understood that through the limit operation and the precise deployment of the laser device array, the relative position between the laser device array and the processing object is ensured to be accurate, thereby achieving high-precision laser processing. The real-time detection and deviation analysis of the laser landing effect ensure that any inconsistency or error in the processing process can be discovered and corrected in time, reducing the accumulation of errors in the processing process. The synchronous adjustment of the limit structure and the laser device array ensures the coordination and accuracy of each part in the processing process, avoiding the processing inaccuracy caused by equipment position error. Through multiple adjustments and feedback, the entire system gradually reaches the optimal processing state, which not only improves the processing quality, but also enhances the long-term stability of the system. The scheme can make adaptive adjustments according to the processing conditions through a data-driven feedback mechanism to achieve an intelligent and efficient processing process. This synchronous calibration plan process not only improves the accuracy of laser processing, but also ensures the stability and efficiency of the processing process through continuous optimization, greatly promoting the development of high-precision laser processing technology.

[0087] In a second aspect, the present invention provides a laser processing apparatus for an optical device, which is used to implement a laser processing method for an optical device as described in any one of the first aspects.

[0088] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser processing method for an optical device, characterized in that: include: Acquiring manufacturing target information of a manufacturing object, acquiring basic feature information of a laser-processed object to be processed by laser to obtain the manufacturing object, and digitally simulating the manufacturing object and the laser-processed object according to the manufacturing target information and the basic feature information to obtain a laser processing simulation model; Based on the laser processing simulation model, the laser processing requirements of the laser processing object are analyzed to obtain laser processing requirement characteristics, and according to the laser processing requirement characteristics, a synchronous processing scheme of a laser device array is analyzed for the laser processing object to obtain a synchronous processing scheme of the laser device array for the laser processing object; According to the synchronous processing scheme, each laser device group of the laser device array is driven to perform laser processing on the laser processing object, and the laser processing effect of the laser device array is monitored in real time and operation feedback is provided until the manufacturing object is obtained.

2. A laser processing method for an optical device as claimed in claim 1, characterized in that: The steps of obtaining manufacturing target information of a manufacturing object, obtaining basic feature information of a laser-processed object to be processed by laser to obtain the manufacturing object, and digitally simulating the manufacturing object and the laser-processed object according to the manufacturing target information and the basic feature information to obtain a laser processing simulation model include: Acquire a processing unit that has undergone basic topography processing in a previous processing stage, and mark the processing unit as a laser processing object to be laser processed; Acquire theoretical characteristic information of the basic topography of the laser processed object after the previous processing stage, and collect characteristic information of the laser processed object through a sensor group to verify the deviation of the theoretical characteristic information, so as to obtain basic characteristic information of the laser processed object; Acquiring manufacturing target information of a manufacturing object to be obtained by laser processing the laser processing object; Digitally simulating the manufacturing object according to the manufacturing target information to obtain a manufacturing object simulation model; Digitally simulating the laser processing object according to the basic feature information to obtain a laser processing object simulation model; Performing correlation positioning analysis on the laser processing object simulation model and the manufacturing object simulation model to obtain a correlation positioning node set between the laser processing object simulation model and the manufacturing object simulation model; Model overlap processing is performed on the laser processing object simulation model and the manufacturing object simulation model based on the associated positioning node set to obtain the laser processing simulation model.

3. The laser processing method of an optical device according to claim 2, characterized in that: The step of analyzing the laser processing requirements of the laser processing object based on the laser processing simulation model to obtain the laser processing requirement characteristics includes: Digital analysis and feature annotation of model differences are performed based on the laser processing object simulation model and the manufacturing object simulation model in an overlapping state in the laser processing simulation model to obtain the distribution of features to be processed of the laser processing simulation model; Acquiring performance information of a laser device array to be prepared to perform a laser processing operation, and performing an adaptability analysis of a laser processing mode on the distribution of features to be processed of the laser processing simulation model according to the performance information, so as to obtain adaptability evaluation characteristics of the distribution of features to be processed of the laser processing simulation model corresponding to various laser processing modes of the laser device array; Based on the adaptive evaluation characteristics of the distribution of the to-be-processed features of the laser processing simulation model corresponding to various laser processing modes of the laser device array, the distribution of the to-be-processed features of the laser processing simulation model is subjected to time-space correlation feature mapping to obtain a laser processing vector matrix of the laser processing simulation model; wherein the laser processing vector matrix includes a plurality of laser processing vectors with time-space correlation, and the laser processing vectors are used to describe the requirement characteristics of preparing the laser device array to perform laser processing operations at various specific locations on the laser processing simulation model; A vector clustering analysis is performed on the laser processing vector matrix at an overall level to obtain vector clusters of the laser processing simulation model and an overall feedback list corresponding to the vector clusters, wherein the vector clusters and the overall feedback list together serve as the laser processing demand characteristics of the laser processing object; wherein the vector clusters include a plurality of vector clusters, and the vector clusters are generated by a plurality of laser processing vector clusters whose spatiotemporal correlations meet preset clustering criteria.

4. The laser processing method of an optical device according to claim 3, characterized in that: The steps of analyzing the synchronous processing scheme of the laser device array for the laser processing object according to the laser processing requirement characteristics to obtain the synchronous processing scheme of the laser device array for the laser processing object include: Performing synchronous calibration operation analysis on the laser device array according to each vector cluster in the laser processing requirement feature and the overall feedback list to obtain a synchronous calibration plan of the laser device array corresponding to the laser processing requirement feature; wherein the synchronous calibration plan is used for the laser device array to calibrate the relative position corresponding to the laser processing object; Analyzing the most suitable laser processing mode for each vector cluster in the laser processing requirement feature according to the performance information of the laser device array, so as to obtain the most suitable laser processing mode for each laser device group in the laser device array corresponding to each specific position on the laser processing object; According to the performance information of the laser device array and the most suitable laser processing mode of each laser device group corresponding to each specific position on the laser processing object, the overall feedback list in the laser processing requirement characteristics is analyzed for the feasibility of synchronous processing, so as to allocate each specific position on the laser processing object and the corresponding most suitable laser processing mode into a plurality of synchronous processing gradient plans; The synchronous calibration plan is combined with each of the synchronous processing gradient plans in a cross-form to obtain a synchronous processing plan for the laser device array for the laser processing object.

5. The laser processing method of an optical device according to claim 4, characterized in that: The steps of performing synchronous calibration operation analysis on the laser device array according to each vector cluster in the laser processing requirement feature and the overall feedback list to obtain a synchronous calibration plan for the laser device array corresponding to the laser processing requirement feature include: Retrieving a synchronous calibration scheme template prepared for synchronous calibration of the laser device array, and analyzing the specific execution mode of the performance information of the laser device array according to the synchronous calibration scheme template to obtain a synchronous calibration mode of the laser device array; wherein the synchronous calibration scheme template includes driving each laser device group of the laser device array to perform edge processing on a plurality of designated positions on the laser processing object, so that the processing laser of each laser device group passes through the edge of each designated position to process each designated position, and then detecting the landing effect of the processing laser, and obtaining the morphological deviation of the laser processing object by detecting the loss of the processing laser; According to the synchronous calibration mode of the laser device array, the vector clusters of the laser processing requirement characteristics are analyzed for value references of each vector cluster as a synchronous calibration position, so as to obtain calibration value parameters corresponding to the synchronous calibration operation of each vector cluster on the laser processing object, and based on the overall feedback list of the laser processing requirement characteristics, the vector clusters on the laser processing object are analyzed for associated value of jointly performing the synchronous calibration operation, so as to obtain associated value parameters of jointly performing the synchronous calibration operation of each vector cluster on the laser processing object; The synchronous calibration position of the laser processing object is selected according to the calibration value parameters and associated value parameters of the vector clusters at various locations on the laser processing object, and the specific execution analysis of the synchronous calibration mode of the laser device array is performed according to the selected synchronous calibration position to obtain a synchronous calibration plan for the laser device array corresponding to the synchronous calibration position.

6. The laser processing method of an optical device according to claim 4, characterized in that: The steps of driving each laser device group of the laser device array to perform laser processing on the laser processing object according to the synchronous processing scheme, and performing real-time monitoring and operation feedback on the laser processing effect of the laser device array until the manufacturing object is obtained include: driving the laser device array to perform a synchronous calibration operation on the laser processing object according to a synchronous calibration plan in the synchronous processing scheme, so that the laser device array is in a calibration state relative to the laser processing object; According to the synchronous processing gradient plan in the synchronous processing scheme, the laser device array in the calibration state is driven to perform synchronous laser processing of multiple laser device groups on the laser processing object; during the synchronous laser processing, the morphological changes of the laser processing object are monitored in real time, and the real-time monitoring results are fed back to the laser processing simulation model for analysis to obtain the laser processing effect of the laser device array, and the processing laser of the laser device array is adjusted in real time according to the laser processing effect; After each synchronous processing gradient plan is executed, the synchronous calibration plan is repeatedly executed to correct the calibration state of the laser device array.

7. The laser processing method of an optical device according to claim 6, characterized in that: The step of driving the laser device array to perform a synchronous calibration operation on the laser processing object according to the synchronous calibration plan in the synchronous processing scheme so that the laser device array is in a calibration state relative to the laser processing object comprises: Driving the limiting structure to perform a limiting operation on the laser processing object so that the laser processing object is in a limited state; According to the synchronous calibration plan in the synchronous processing scheme, each laser device group in the laser device array is driven to perform displacement deployment and orientation adjustment, so that each laser device group and each designated position on the laser processing object in a limited state are in a preparatory test state; Each of the laser device groups in the preparatory test state is instructed to emit processing lasers toward each designated position on the laser processing object, so that the processing lasers perform edge processing on the laser processing object, and at the same time, the landing effect of the processing lasers is detected to obtain edge processing laser landing effect detection data of each laser device group; According to the edge processing laser landing effect detection data of each laser device group, a deviation analysis is performed on the actual shape and theoretical shape of the laser processing object in a limit state to obtain the shape deviation of the laser processing object; The limiting structure and the laser device array are synchronously adjusted based on the morphological deviation, so that the laser device array is in a calibration state relative to the laser processing object.

8. A laser processing device for an optical device, characterized in that: A laser processing method for realizing an optical device as described in any one of claims 1-7.

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