Perching device for unmanned aerial vehicle, unmanned aerial vehicle

Abstract

The present application relates to a habitat device for an unmanned aerial vehicle and an unmanned aerial vehicle. The habitat device comprises an adhesion device directly or indirectly connected to the unmanned aerial vehicle, a voltage booster configured to provide an electric field to the adhesion device, and an electrical isolator configured to electrically isolate the voltage booster from the unmanned aerial vehicle. The adhesion device comprises a first encapsulation layer; a second encapsulation layer connected to the first encapsulation layer and forming a fluid seal with the first encapsulation layer, the second encapsulation layer forming a chamber adapted to contain a material selected from one of an electrorheological fluid, an electrorheological gel, or an electrorheological elastomer; a first conductive layer covering at least a portion of the first encapsulation layer; a second conductive layer covering at least a portion of the second encapsulation layer; a first adhesion layer covering the first conductive layer. The material for the first adhesion layer is an insulating material with low tensile modulus and low surface energy. The habitat device of the present application enables the habitat of the unmanned aerial vehicle on a variety of surfaces.

Description

Technical Field

[0001] This application relates to the field of unmanned aerial vehicle technology, and more particularly to a habitat for an unmanned aerial vehicle and an unmanned aerial vehicle. Background Technology

[0002] As an emerging unmanned system platform, micro or small unmanned aerial vehicles (UAVs) have shown significant potential in various application scenarios, such as reconnaissance, due to their advantages such as small size. However, limited by their miniaturized design, these systems cannot carry energy storage devices with sufficient capacity, which severely limits their operating endurance and has become a major technical bottleneck hindering their widespread application.

[0003] Currently, habitat technology is mainly used to enable aircraft to temporarily attach to specific locations in the environment during mission execution, thereby reducing energy consumption and extending operational time. Current habitat technologies mainly include mechanical gripping for stable grasping of thin rod-shaped targets, spike or thorn-based habitats for reliable fixation on specific material surfaces, microstructure adhesion for effective attachment to smooth surfaces, and other habitat solutions based on magnetic attraction, mechanical suspension, vacuum adsorption, and propulsion balancing.

[0004] However, current habitat solutions still have many shortcomings for unmanned aerial vehicles such as micro drones. For example, the low payload capacity of micro drones limits the integration of structures used in existing habitat solutions with the surface of the micro drone; the high energy consumption of micro drones based on existing habitat solutions limits their flight time; and micro drones based on existing habitat solutions can only inhabit specific surface conditions, making it difficult to adapt to complex and ever-changing real-world application environments.

[0005] Therefore, there is a need for a habitat and unmanned aerial vehicle that can be adapted to a variety of environmental surfaces, has a fast response, and allows for controlled adhesion and detachment. Summary of the Invention

[0006] The following is an overview of the subject matter described in detail herein. This overview is not intended to limit the scope of the claims.

[0007] In one aspect, this application provides a habitat for an unmanned aerial vehicle, comprising:

[0008] An adhesion device, which is directly or indirectly connected to the unmanned aerial vehicle, and includes:

[0009] First encapsulation layer;

[0010] A second encapsulation layer is connected to the first encapsulation layer and forms a fluid-tight chamber with the first encapsulation layer, the chamber being adapted to contain a material selected from one of electrorheological liquids, electrorheological gels, or electrorheological elastomers;

[0011] A first conductive layer covers at least a portion of the first encapsulation layer;

[0012] A second conductive layer covers at least a portion of the second encapsulation layer;

[0013] A first adhesive layer covers the first conductive layer;

[0014] A voltage booster is configured to provide an electric field to the adhesion device;

[0015] An electrical isolator configured to electrically isolate the voltage booster from the unmanned aerial vehicle;

[0016] The material used for the first adhesive layer has a tensile modulus in the range of 70-90 kPa and a tensile strength of 0.1-0.3 J / m. 2 Insulating materials with surface energy within a certain range.

[0017] In this application, the term "unmanned aerial vehicle" may be simply referred to as a drone. The unmanned aerial vehicle or drone used in this application may be a multi-rotor aircraft, such as a quadcopter, a hexacopter, etc.

[0018] In one embodiment, the input voltage of the voltage booster is amplified by a factor greater than or equal to 500.

[0019] In one embodiment, the electrical isolator is selected from one of the following: optocoupler, air-isolated relay, giant magnetoresistive isolator, and capacitive isolator.

[0020] In one embodiment, the material used for the first adhesive layer is silicone; preferably, the material used for the first adhesive layer is Ecoflex. TM .

[0021] In one embodiment, the first encapsulation layer and the second encapsulation layer are integral.

[0022] In one embodiment, the material used for the first encapsulation layer is a polymer film.

[0023] In one embodiment, the material used for the second encapsulation layer is a polymer film.

[0024] In one embodiment, the polymer film is a polyurethane film.

[0025] In one embodiment, the first encapsulation layer is in the shape of a frustum with one end closed and the other end open, and the second encapsulation layer is in the shape of a flat plate, and the second encapsulation layer seals the open end of the first encapsulation layer.

[0026] In one embodiment, the first encapsulation layer and the second encapsulation layer are sealed together by an adhesive.

[0027] In one embodiment, the first encapsulation layer and the second encapsulation layer are arranged coaxially.

[0028] In one embodiment, both the first encapsulation layer and the second encapsulation layer are shaped like caps, and the cap edge of the first encapsulation layer is bonded and fixed to the cap edge of the second encapsulation layer.

[0029] In one embodiment, the material used for the first conductive layer is a carbon nanotube electrode or a liquid metal electrode.

[0030] In one embodiment, the material used for the second conductive layer is a carbon nanotube electrode or a metal electrode.

[0031] In one embodiment, a second adhesion layer is also included, which covers the second conductive layer.

[0032] In one embodiment, the material used for the second adhesion layer is an insulating material.

[0033] In one embodiment, the material used for the second adhesion layer is silicone or a polymer film.

[0034] On the other hand, this application provides an aircraft including the above-described habitat, wherein the electrical isolator of the habitat is connected to the I / O interface of the aircraft; the aircraft applies an electric field to the adhesion device via a voltage booster of the habitat.

[0035] In one embodiment, the aircraft is connected to the second electrode layer or second adhesive layer of the habitat via multiple struts.

[0036] The aircraft in this application, which includes a habitat, is capable of reliably and stably perching on a variety of surfaces with different characteristics in urban and wilderness environments. These surfaces include rocks with diverse materials, surface roughness, and geometric features, such as tree bark, glass, overhead cables, building facades, and metal structures.

[0037] By installing the territorial device of this application in aircraft such as drones, the flight time can be significantly extended, such as significantly increasing the flight time of the commercially available Feather 120 drone from 5 minutes to 19 minutes, achieving a 3.8-fold increase in flight time.

[0038] The aircraft in this application, which includes a habitat, enables applications in multiple scenarios and with long endurance, and has broad application prospects in fields such as environmental monitoring, military reconnaissance, and disaster search and rescue.

[0039] Other features and advantages of this application will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the application. Other advantages of this application can be realized and obtained by means of the embodiments described in the description and drawings. Attached Figure Description

[0040] The accompanying drawings are used to provide an understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0041] Figure 1 This is a photograph showing the adhesion device included in a habitat device according to an embodiment of this application;

[0042] Figure 2 This is a schematic partial perspective view of the adhesion device included in a habitat device according to an embodiment of this application;

[0043] Figure 3 This is a schematic cross-sectional view showing the adhesion device included in a habitat device according to an embodiment of this application;

[0044] Figure 4 This is a schematic flowchart of a method for preparing an adhesive device according to an embodiment of this application;

[0045] Figure 5A This shows a photograph of a drone including a roosting device according to an embodiment of this application;

[0046] Figure 5B This shows a photograph of a drone including a roosting device according to another embodiment of this application;

[0047] Figures 6A-6I The photograph shows a drone, including a perching device, perching on an acrylic ceiling according to an embodiment of this application; and

[0048] Figures 7A-7I The images show photographs of a drone, including a roosting device, perched on different surfaces, according to an embodiment of this application. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application are described in detail below. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be arbitrarily combined with each other.

[0050] This application provides a habitat device including an adhesion device directly or indirectly connected to an unmanned aerial vehicle (UAV), a voltage booster configured to provide an electric field to the adhesion device, and an electrical isolator configured to electrically isolate the voltage booster from the UAV. The adhesion device also includes a first encapsulation layer; a second encapsulation layer connected to and forming a fluid-tight chamber with the first encapsulation layer, the chamber being adapted to contain a material selected from electrorheological liquids, electrorheological gels, or electrorheological elastomers; a first conductive layer covering at least a portion of the first encapsulation layer; a second conductive layer covering at least a portion of the second encapsulation layer; and a first adhesion layer covering the first conductive layer.

[0051] In this application, the material used for the first adhesive layer has a tensile modulus in the range of 70-90 kPa and a tensile strength of 0.1-0.3 J / m. 2 Insulating materials with surface energy within the specified range, including but not limited to silicone. In this application, the first adhesive layer covers the entire first conductive layer and is used to adhere to and detach from the target surface.

[0052] In one embodiment, the adhesion device may further include a second adhesion layer covering all or part of the second conductive layer. The material used for the second adhesion layer is an insulating material, and this application does not limit the tensile modulus and surface energy of the material of the second adhesion layer. In this application, the second adhesion layer is used to connect with the surface of the unmanned aerial vehicle (UAV). However, when the surface of the UAV to be in contact with the habitat is made of a material that meets the requirements of the second adhesion layer material, the habitat of this application may not require a second adhesion layer; instead, the second conductive layer may directly contact the surface of the UAV, i.e., the surface of the UAV directly acts as the second adhesion layer.

[0053] The following is for reference. Figures 1-3 This describes the adhesion device included in a habitat device provided according to an embodiment of the present application. For example... Figures 1-3 As shown, the adhesion device of this application may include a first encapsulation layer 11; a second encapsulation layer 12 connected to the first encapsulation layer 11 and forming a fluid-tight chamber 13 with the first encapsulation layer 11, the chamber 13 being adapted to contain a material such as an electrorheological liquid, an electrorheological gel, or an electrorheological elastomer; a first conductive layer 21 covering a portion of the first encapsulation layer 11, the first conductive layer 21 being electrically connected to a first wire (first pin) 31; a second conductive layer 22 covering a portion of the second encapsulation layer 12, the second conductive layer 22 being electrically connected to a second wire 32; a first adhesion layer 41 covering the first conductive layer 21 and exposing the first wire (first pin) 31; and a second adhesion layer 42 covering the second conductive layer 22 and exposing the second wire (second pin) 32.

[0054] refer to Figures 1-3 It can be seen that the first encapsulation layer 11 can be a frustum shape with one end closed and the other end open, and the second encapsulation layer 12 is a flat plate shape. The second encapsulation layer 12 seals the other end of the first encapsulation layer 11, thereby enabling the first encapsulation layer 11 and the second encapsulation layer 12 to be disposed opposite to each other and sealed together. This ensures that sufficient space can be formed between the first encapsulation layer 11 and the second encapsulation layer 12 to fill electrorheological fluids, etc., which facilitates the filling of electrorheological fluids, etc., and also facilitates the sealing connection operation between the first encapsulation layer 11 and the second encapsulation layer 12. However, in other exemplary embodiments, the first encapsulation layer 11 and the second encapsulation layer 12 can also be in other shapes. For example, both the first encapsulation layer 11 and the second encapsulation layer 12 can be in the shape of a cap, with the cap edge (edge) of the first encapsulation layer 11 and the cap edge (edge) of the second encapsulation layer 12 bonded and fixed together.

[0055] The materials used for the first encapsulation layer 11 and the second encapsulation layer 12 can be flexible and have good conformal capability. The first encapsulation layer 11 and the second encapsulation layer 12 are made of materials with low modulus, stretchability, bendability, good sealing performance, and physical and chemical inertness to the electrorheological fluid. This allows the flexible encapsulation structure formed by the first encapsulation layer 11 and the second encapsulation layer 12 to deform relatively easily under external force, and the internal electrorheological fluid is not easy to leak out, nor will it affect the chemical properties and deformability of the electrorheological fluid.

[0056] In some embodiments, both the first encapsulation layer 11 and the second encapsulation layer 12 are low-modulus polymer films. It is understood that a low-modulus polymer film refers to a polymer film with good flexibility, capable of being easily bent and stretched, and exhibiting good conformal ability to the object it contacts under relatively small external forces. This gives the first encapsulation layer 11 and the second encapsulation layer 12 good flexibility and stretchability. Furthermore, this low-modulus polymer film also possesses properties such as good sealing performance against electrorheological fluids and physicochemical inertness to the electrorheological fluids, thus meeting application requirements. Specifically, the low-modulus polymer film can be a polyurethane film, etc.

[0057] In some embodiments, the polymer film is a polyurethane film. It is understood that polyurethane films possess good flexibility, stretchability, and sealing properties, and are physicochemically inert to electrorheological fluids, resulting in good performance. Preferably, the polyurethane used to prepare the polyurethane film is VytaFlex 10.

[0058] In this application, the area dimensions of the first and second encapsulation layers can be adjusted as needed. Two flexible films of different area sizes will form chambers of different volumes to accommodate materials with variable stiffness properties (i.e., electrorheological fluids, electrorheological gels, or electrorheological elastomers). The weight of the adhesion device in this application is primarily determined by the weight of the material contained within the chambers. In this application, the weight of the adhesion device ranges from a few grams to tens of grams (e.g., 20g), preferably 4-5g.

[0059] in addition, Figures 1-3 The illustration shows a chamber formed using a first encapsulation layer and a second encapsulation layer. However, in other embodiments, the first and second encapsulation layers may also be a single flexible film, i.e., the first and second encapsulation layers are an integral structure.

[0060] The first conductive layer 21 and the second conductive layer 22 respectively cover the first encapsulation layer 11 and the second encapsulation layer 12, and are thus arranged at intervals relative to each other to form a sandwich configuration.

[0061] The materials used for the first conductive layer 21 and the second conductive layer 22 both possess excellent flexibility. Both the first conductive layer 21 and the second conductive layer 22 are made of low-modulus, stretchable, and highly conductive materials, allowing them to deform in response to the deformation of the first encapsulation layer 11 and the second encapsulation layer 12, and also providing electrical conductivity. It is understood that the first conductive layer 21 and the second conductive layer 22 are used to apply an electric field to materials such as electrorheological liquids. The first conductive layer 2 and the second conductive layer 3 are disposed at intervals relative to each other on the outer surfaces of the first encapsulation layer 11 and the second encapsulation layer 12 that do not contact the electrorheological liquid or other materials. This allows the electrorheological liquid or other materials to be positioned as close as possible to the center of the electric field, undergoing a transition from a liquid to a solid state under the influence of the electric field. In one embodiment, the electrorheological liquid can be a suspension composed of silicone oil and barium titanium oxalate particles.

[0062] In this application, the first conductive layer and the second conductive layer of the adhesion device are further provided with electrical connection structures, such as wires and pins. For example, the first conductive layer 21 is electrically connected to a first wire (first pin) 31, and the second conductive layer 22 is electrically connected to a second wire (second pin) 32. It is understood that the first conductive layer 21 and the second conductive layer 22 are respectively connected to an external power source through the first wire (first pin) 31 and the second wire (second pin) 32, thereby generating an electric field between the first conductive layer 21 and the second conductive layer 22. Optionally, the first wire 31 and the second wire 32 can be copper wires wrapped with an insulating layer.

[0063] In some embodiments, the materials used for the first conductive layer 21 and the second conductive layer 22 may be carbon nanotube electrodes. It is understood that carbon nanotube electrodes have the characteristics of low modulus, stretchability, and good conductivity, resulting in good performance and ease of processing as they can be transferred onto polymer films.

[0064] In some embodiments, the first wire (first pin) 31 and the first conductive layer 21, and the second wire (second pin) 32 and the second conductive layer 22 are electrically connected by conductive adhesive. This ensures good conductivity between the first wire (first pin) 31 and the first conductive layer 21, and between the second wire (second pin) 32 and the second conductive layer 22, thereby ensuring reliable conductivity during the operation of the adhesive device of this application.

[0065] The first adhesive layer 41 covers the entire first conductive layer 21, leaving only the first wire (first pin) 31 exposed. The second adhesive layer 42 covers the entire second conductive layer 22, leaving only the second wire (second pin) 32 exposed.

[0066] In one embodiment, both the first adhesive layer 41 and the second adhesive layer 42 can be made of a material with low elastic modulus and low surface energy, such as silicone Ecoflex. TM A range of products, such as Ecoflex 00-10, Ecoflex 00-20, Ecoflex 00-20FAST, Ecoflex 00-30, Ecoflex 00-31, Ecoflex 00-33AF, Ecoflex 00-35FAST, Ecoflex 00-45, and Ecoflex 00-50, are available. Liquid low surface energy silicone can be uniformly coated onto the surface of carbon nanotube (CNT) electrodes via spin coating. This process not only ensures the integrity and functionality of the carbon nanotube electrodes but also effectively controls the intermolecular forces between the device surface and the attached surface due to the use of low surface energy materials. Considering the lightweight nature of the devices, this low surface energy characteristic allows for both electrically attached devices and naturally desorbed devices by gravity when power is cut off.

[0067] Figure 4 This is a flowchart illustrating a method for manufacturing an adhesion device included in a habitat device provided according to an exemplary embodiment of this application. Figure 4 As shown, the method for manufacturing the adhesion device may include the following steps:

[0068] S100: Form the first encapsulation layer and the second encapsulation layer.

[0069] S200: A first conductive layer is formed on the first encapsulation layer and a second conductive layer is formed on the second encapsulation layer.

[0070] S300: A first adhesion layer is formed by coating on a first conductive layer; optionally, a second adhesion layer is formed by coating on a second conductive layer.

[0071] S400: The first encapsulation layer and the second encapsulation layer are sealed together to form a cavity between the first encapsulation layer and the second encapsulation layer.

[0072] S500: Fill the cavity with a material that has variable stiffness properties.

[0073] The manufacturing method of this application can produce adhesive devices that can generate significant stiffness change effects. The manufacturing method is simple and easy to operate.

[0074] In some embodiments, step S100 may specifically include the following steps:

[0075] S110: Polymer is made into a polymer film using a die-casting mold.

[0076] Specific steps may include: pouring liquid polymer onto a first glass plate, then covering it with a second glass plate, and then using a load to pressurize the polymer between the first and second glass plates so that the liquid polymer can form a uniform film.

[0077] In some embodiments, the polymer can be selected as liquid polyurethane vytaflex 10, which has good performance.

[0078] In some embodiments, the die-casting mold may include a rigid planar substrate layer, a first glass plate layer, a second glass plate layer, and a load-bearing weight layer arranged sequentially from bottom to top. Using a die-casting mold to die-cast the polymer film effectively avoids the problem of uneven polymer film thickness caused by the easy aggregation of liquid polymers. Unevenly thick polymer films are prone to breakdown in thinner areas, thus reducing the variable stiffness range of the adhesion device in this embodiment; conversely, the electric field strength decreases in thicker areas, affecting the variable stiffness efficiency of the adhesion device. Experimental verification shows that the polymer film prepared using the die-casting mold has a uniform thickness, and the adhesion device prepared using this polymer film is less prone to breakdown, has a more uniform internal electric field strength, and exhibits better performance.

[0079] In some embodiments, polymer films with a thickness of 180-280 μm can be prepared using die casting technology, resulting in good performance.

[0080] In some embodiments, a layer of silicone can be spin-coated onto the surface of the die-casting mold cavity, specifically on the side of the first and second glass plates that contacts the polymer. It should be noted that due to the strong adhesion between the die-cast polymer film and the die-casting mold cavity, the die-cast polymer film is prone to uneven pre-stretching or even cracking during demolding, thus reducing the quality of the polymer film. By spin-coating a layer of silicone onto the surface of the die-casting mold cavity, the adhesion between the die-cast polymer film and the die-casting mold cavity can be greatly reduced, facilitating smooth demolding of the die-cast polymer film and allowing it to be demolded with minimal pre-stretching, reducing the occurrence of unevenness or cracking of the polymer film. Preferably, the silicone can be Dragon Skin 30.

[0081] S120: Solidify the polymer film to complete the die-casting process.

[0082] The specific steps may include allowing the polymer film in the die-casting mold to solidify naturally at room temperature for 20-24 hours, and then placing it in an oven at 50-70℃ for 4-6 hours to solidify, thereby obtaining a polymer film with excellent mechanical properties. It should be noted that when placing the polymer film in the die-casting mold in the oven, the load can be either retained or removed.

[0083] S130: Cut the solidified polymer film to obtain the first encapsulation layer and the second encapsulation layer.

[0084] Specific steps may include using laser cutting to cut polymer films into specific shapes and sizes to meet different application requirements.

[0085] In other embodiments, the first encapsulation layer and the second encapsulation layer may also be made of different materials.

[0086] In some embodiments, step S200 may specifically include the following steps:

[0087] S210: Nanotube electrodes are fabricated using a vacuum filtration method.

[0088] The specific steps may include: first, mixing the nanotube stock solution with water to form a nanotube suspension; then, laying a filter screen and a filter membrane in sequence in a filtration container; then, evenly pouring the nanotube suspension onto the filter membrane; and finally, evacuating the filtration container to separate the water and nanotubes, allowing the nanotubes to deposit on the filter membrane, thereby obtaining a nanotube electrode.

[0089] In some embodiments, the nanotube electrode can be a carbon nanotube electrode with good conductivity.

[0090] S220: Transferring nanotube electrodes onto a thin film.

[0091] The specific steps may include: covering one side of the first encapsulation layer with a first mask, transferring a portion of the nanotube electrode onto one side of the first encapsulation layer, and then peeling off the first mask to fabricate a first conductive layer on the first encapsulation layer; covering one side of the second encapsulation layer with a second mask, transferring the other portion of the deposited nanotube electrode onto one side of the second encapsulation layer, and then peeling off the second mask to fabricate a second conductive layer on the second encapsulation layer. It is understood that the first and second masks serve to shield certain areas on one side of the first and second encapsulation layers, allowing the nanotube electrode to be transferred to specific areas. It should be noted that a single nanotube electrode can be transferred to only one film, for example, only to the first encapsulation layer or only to the second encapsulation layer, with good results. However, a single nanotube electrode can also be transferred to multiple films, for example, transferred to the first encapsulation layer and then to the second encapsulation layer. Using the transfer method to fabricate the first and second conductive layers provides a convenient way to obtain low-modulus, stretchable electrodes with good results and simple fabrication methods.

[0092] It is understandable that fabricating the first conductive layer on the first encapsulation layer and the second conductive layer on the second encapsulation layer can improve the adhesion between the first conductive layer and the first encapsulation layer, and between the second conductive layer and the second encapsulation layer, thus ensuring the effectiveness of the first and second conductive layers.

[0093] S230: An electrical connection structure is formed on the electrode.

[0094] In some embodiments, the electrical connection structure may be a wire, pin, or other mechanical or electronic structure capable of conducting electricity.

[0095] In some embodiments, forming an electrical connection structure on the electrodes may include forming a first wire on a first conductive layer and a second wire on a second conductive layer. Specific steps may include bonding and solidifying conductive adhesive at the junction of one end of the first wire and the first conductive layer, and at the junction of one end of the second wire and the second conductive layer, respectively. Using conductive adhesive ensures that one end of the first wire is fixed to the first conductive layer and one end of the second wire is fixed to the second conductive layer, preventing separation. It also ensures good electrical conduction between the first wire and the first conductive layer, and between the second wire and the second conductive layer.

[0096] In some embodiments, the conductive adhesive can be silver epoxy resin, which has good performance.

[0097] In some embodiments, the bonding at the conductive adhesive bonding points can be reinforced, thereby increasing the connection strength between one end of the first wire and the first conductive layer, and between one end of the second wire and the second conductive layer. Specifically, the reinforcing bonding can be achieved by applying a polyurethane-based adhesive (URE-BONDII). By using the polyurethane-based adhesive (URE-BONDII), the silver epoxy resin can be firmly bonded to the polyurethane film, and it exhibits good flexibility after curing.

[0098] In some embodiments, when the first and second adhesive layers are prepared using the same materials, step S300 may specifically include the following steps: stirring and evacuating a silicone solution (such as Ecoflex 00-30), then pouring it onto the first and second conductive layers; coating the silicone solution to cover the entire surface of the first conductive layer, exposing only the electrical connection structure such as the first wire, thus forming the first adhesive layer; and coating the silicone solution to cover the entire surface of the second conductive layer, exposing only the electrical connection structure such as the second wire. The coating method may include, but is not limited to, spin coating.

[0099] In other embodiments, the first adhesive layer and the second adhesive layer may also be made of different materials. For example, the first adhesive layer may be made of silicone, while the second adhesive layer may not need to be made of silicone but can be made of an insulating material, as long as the formed second adhesive layer can protect the second conductive layer and ensure that the second conductive layer can only be electrically connected to other structures through its electrical connection structure (such as a second wire).

[0100] In some embodiments, step S400 may include the following sub-steps:

[0101] S410: Fabrication of auxiliary support.

[0102] The specific steps may include: the auxiliary support can be a flexible structure of thin PET, which can be obtained by laser cutting PET material into a specific shape, and then the PET material is bent as required; after bending, the PET material can maintain its bent shape, thereby obtaining a flexible thin PET structure, i.e., a frustum-shaped auxiliary support. It should be noted that the auxiliary support serves to support the first encapsulation layer with the first conductive layer, so that a sufficiently large cavity can be formed between the first encapsulation layer and the second encapsulation layer to facilitate the filling of a material with variable stiffness properties.

[0103] In addition, a release agent can be applied to the inner surface of the auxiliary support; this facilitates the separation of the first encapsulation layer from the auxiliary support and avoids or reduces the possibility of local stretching or damage to the first encapsulation layer.

[0104] S420: The first encapsulation layer and the second encapsulation layer are sealed together with the aid of an auxiliary bracket.

[0105] The specific steps may include: attaching the first encapsulation layer to the inner surface of the auxiliary support coated with a release agent, bringing the boundary of the first encapsulation layer into contact with the second encapsulation layer, and sealing the connection with an adhesive, thereby creating a cavity between the first encapsulation layer and the second encapsulation layer.

[0106] The sealing connection may include applying a polyurethane-based adhesive (URE-BONDII) between the interfaces where the first and second encapsulation layers contact each other, and allowing it to cure for 4-6 hours. It is understood that after the material with variable stiffness properties is filled, the cavity can be sealed at the filling port, and then the auxiliary support located on the outside can be directly removed. This operation is convenient and will not adversely affect the adhesion device of this application.

[0107] It is understandable that a cavity is formed between the side of the first encapsulation layer without the first electrode (i.e., the inner side) and the side of the second encapsulation layer without the second electrode (i.e., the inner side).

[0108] In some embodiments, when an electrorheological fluid is selected as the material with variable stiffness properties, the material can be injected into the cavity.

[0109] For example, step S500 may include forming an injection port on the first encapsulation layer to expel gas from the chamber, then injecting electrorheological fluid through the injection port using a syringe, and sealing the injection port of the chamber with adhesive to prevent the electrorheological fluid from flowing out of the injection port of the chamber.

[0110] Expelling gas from the chamber can help prevent air bubbles from causing the resulting adhered device to break down when the chamber is filled with electrorheological fluid.

[0111] In one embodiment, the adhesive may be a polyurethane-based adhesive (URE-BONDII) with a curing time of 4-6 hours.

[0112] It should be noted that before the electrorheological fluid is injected into the chamber, it needs to be shaken and evacuated to obtain a uniformly distributed electrorheological fluid containing a small number of air bubbles before injection. This avoids the problem that the presence of air bubbles can easily cause the adhesive device of this application to break down and fail.

[0113] In this application, the preparation of the encapsulation layer, conductive layer, first adhesive layer, second adhesive layer, etc., or the connection between them, can also be formed by other means (such as the content disclosed in Chinese Patent CN115811924A, etc.), which will not be elaborated here.

[0114] The voltage booster in the habitat device of this application can be used to provide an electric field to the adhesion device to achieve adhesion to the target surface. This electric field is applied by the power supply of the aircraft. The voltage booster can increase the voltage applied by the aircraft by at least 500 times, and can typically be an EMCO AP50-5 voltage booster (lightweight, about 5 grams; high voltage conversion ratio, about 1:1000; low power consumption, less than 1.5 watts). The voltage booster can be electrically connected to a first conductive layer via a first wire or a first pin and to a second conductive layer via a second wire or a second pin. The first conductive layer can act as a positive electrode and the second conductive layer can act as a negative electrode, and vice versa.

[0115] The electrical isolator in the habitat device of this application can be used to electrically isolate the voltage booster from the aircraft. For example, using an optocoupler as an electrical isolator, the control end and the drive end of the optocoupler form independent circuits. The control end is connected to the voltage booster, and the drive end is connected to the unmanned aerial vehicle. Control commands are transmitted between the two ends through optical signals without any physical electrical connection, thus achieving electrical isolation. Typically, the circuit voltage of a UAV is about 5V, while the voltage boosted by the voltage booster can reach up to about 5000V. The electric field strength applied by the UAV to the adhesion device can reach up to 2500V / mm. This application can protect the UAV's circuit from the voltage in the voltage booster circuit by setting an electrical isolator, preventing the latter's high voltage from damaging the UAV. Electrical isolators applicable to this application include, but are not limited to, optocouplers (AQY212EHAX).

[0116] The electrical isolator of this application is directly connected to the voltage booster and indirectly connected to the adhesion device via the voltage booster. Additionally, if necessary, the electrical isolator of this application can be connected to the aircraft's I / O interface via a current-limiting resistor (e.g., approximately 350 ohms, which can be used to regulate the voltage at the input terminal of the electrical isolator).

[0117] The habitat device of this application can be integrated with an aircraft such as a micro-drone, which can be a cable-free, lightweight adhesion system. Such micro-drone can be a multi-rotor aircraft, for example, a commercially available drone with a weight of less than or equal to 350 grams and a power of greater than or equal to 160 milliwatts. Figure 5A and Figure 5B Photographs of drones including roosting devices provided according to different embodiments of this application are shown. Figure 5A and Figure 5BThe drone shown is the commercially available Feather 120. This application allows the drone's power source (such as its own battery or an external power source) to apply approximately 5V to a voltage booster via an electrical isolator. The voltage booster then increases the 5V to approximately 5000V. A first conductive layer is then connected to the positive electrode (approximately 5000V), and a second conductive layer is connected to the negative electrode (0V), creating an electric field between the two layers. This electric field acts on materials such as electrorheological fluids, causing them to exhibit a stiffness-enhancing effect, thereby enabling the adhesion device to perform its adhesion function. Typically, the electric field strength provided to the adhesion device via the drone's power source is in the range of 500V / mm to 2500V / mm.

[0118] Support structures can be used to connect aircraft, such as drones, to the habitat. For example, Figure 5A The image shows a cage-like support structure with a bottom, consisting of three pillars. The top surfaces of the three pillars are in contact with the second electrode or second adhesive layer of the adhesion device in the perching device (e.g., connected by an adhesive). The voltage booster and electrical isolator in the perching device can be placed on the bottom of the cage-like structure. The support can be mechanically connected to the drone via a column or other attachment attached to the drone. Figure 5B A support structure consisting of two pillars is shown, the top surfaces of which are in contact with the second electrode or second adhesive layer of the adhesion device in the perching device (e.g., connected by an adhesive); while the voltage booster and electrical isolator in the perching device can be placed on and fixed to the top surface of the drone (e.g., fixed by an adhesive), or fixed to other surfaces of the drone, as long as they do not affect the flight of the drone and can ensure that the adhesion device can perform its adhesion function.

[0119] However, in other embodiments, the aircraft can also be connected to the habitat by other forms of mechanical or electrical structures, as long as it is ensured that the aircraft can apply an electric field to the adhesion device via the voltage booster of the habitat.

[0120] The habitat device provided in this application constructs a variable stiffness adhesion mechanism with self-generated pressure difference by using a specific material with low surface energy and low tensile modulus. This enables the aircraft system equipped with the habitat device to achieve controlled habitat and re-takeoff from the target surface on target surfaces with different materials, roughness, and geometry, as well as in different environmental media and temperatures such as air, oil, or water.

[0121] Figures 6A-6I An exemplary demonstration shows the process of a drone system, formed by mounting a commercially available Feather 120 drone with the adhesive device manufactured in this application, perching on an acrylic ceiling and taking off. The specific process may include, within 0-1 seconds, using a remote controller and the drone to adjust the frequency, such as... Figure 6A As shown; in 2-3 seconds, unlock the drone's electrodes, as... Figure 6B As shown; within 3-4 seconds, a command is given to the drone to take off from the ground, such as... Figure 6C As shown; within 4-7 seconds, the lift from the drone's rotor propels the first adhesive layer of the adhesive device in the perching device into close contact with the acrylic ceiling, as... Figure 6D As shown; within 7 seconds, an electric field is applied to the material in the adhesion device, such as an electrorheological fluid, via the drone's own battery and a voltage booster in the territorial device, causing the electrorheological fluid to stiffen, as... Figure 6E As shown; at 7-21 seconds, after stiffness enhancement, the drone rotor motor can be shut off. At this time, the adhesion device is subjected to the gravity of the drone. Gravity causes the adhesion device to be stretched, resulting in the expansion of the micro-cavity formed at its adhesion contact interface. This causes a decrease in pressure within the micro-cavity, forming a negative pressure cavity, which generates the normal adhesion force of the adhesion device (i.e., a force perpendicular to the ceiling surface). The high stiffness of the adhesion device ensures that the cavity edge maintains good sealing performance, preventing external air from seeping in. Stable adhesion is generated through a continuous pressure difference, and the drone's perch on the ceiling surface generates only low energy consumption, such as... Figure 6F As shown; at 21 seconds, the rotor motors are unlocked to prepare for the second flight, as... Figure 6G As shown; between 23 and 27 seconds, the drone stops applying an electric field to the adhesion device, causing a decrease in the stiffness of the adhesion device and a reduction in the volume of the micro-cavity. This reduces the negative pressure within the micro-cavity, resulting in a decrease in the normal adhesion force. Consequently, the first adhesion layer of the adhesion device detaches from the ceiling surface, meaning the drone stops resting on the ceiling surface and leaves. Figure 6H As shown, the drone completed its resting and landed back on the ground in 27 seconds. This demonstrates that by installing and equipping the resting device manufactured in this application, aircraft such as drones can achieve extended hovering and controlled resting on ceiling surfaces.

[0122] Furthermore, the aircraft in this application, including a habitat device, not only achieves controlled habitat but also possesses wind resistance. The testing process is similar to... Figures 6A-6I After shutting down the rotor motors of the UAV, an airflow interference of 5 m / s was applied to the UAV. The results showed that the aircraft equipped with the habitat device of this application exhibited excellent wind interference resistance characteristics.

[0123] The aircraft described in this application, including a habitat device, can also achieve controlled habitat in various scenarios, such as... Figures 7A-7I As shown. By Figures 7A-7IAs shown in the photographs, in indoor environments, the drone with a perch, as described in this application, successfully adhered and attached to various surfaces of indoor facilities or devices, including under incandescent lamps (as shown in 7A), under fire sprinkler heads (as shown in 7B), under plaster ceilings (as shown in 7C), under monitoring equipment (as shown in 7D), under smoke detectors (as shown in 7E), and under emergency lights (as shown in 7F). In outdoor environments, the drone with a perch, as described in this application, also achieved stable adhesion and attachment to various outdoor facilities and devices, including under tree branches (as shown in 7G), under scaffolding (as shown in 7H), and under road signs (as shown in 7I). This fully demonstrates the practicality and reliability of the aircraft with a perch, as described in this application, for perching in diverse environments.

[0124] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0125] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A habitat device for an unmanned aerial vehicle, characterized in that, include: An adhesion device, which is directly or indirectly connected to the unmanned aerial vehicle, and includes: First encapsulation layer; A second encapsulation layer is connected to the first encapsulation layer and forms a fluid-tight chamber with the first encapsulation layer, the chamber being adapted to contain a material selected from one of electrorheological liquids, electrorheological gels, or electrorheological elastomers; A first conductive layer covers at least a portion of the first encapsulation layer; A second conductive layer covers at least a portion of the second encapsulation layer; A first adhesive layer covers the first conductive layer; A voltage booster is configured to provide an electric field to the adhesion device; An electrical isolator configured to electrically isolate the voltage booster from the unmanned aerial vehicle; The material used for the first adhesive layer has a tensile modulus in the range of 70-90 kPa and a tensile strength of 0.1-0.3 J / m. 2 Insulating materials with surface energy within a certain range.

2. The habitat device according to claim 1, characterized in that, The input voltage of the voltage booster has an amplification factor greater than or equal to 500.

3. The habitat device according to claim 1, characterized in that, The electrical isolator is selected from one of the following: optocoupler, air-isolated relay, giant magnetoresistive isolator, and capacitive isolator.

4. The perching device according to any one of claims 1-3, characterized in that, The material used for the first adhesive layer is silicone.

5. The perching device according to claim 4, characterized in that, The material used for the first adhesive layer is Ecoflex™.

6. The perching device according to any one of claims 1-3, characterized in that, The first encapsulation layer and the second encapsulation layer are integrated.

7. The perching device according to any one of claims 1-3, characterized in that, The material used for the first encapsulation layer is a polymer film; the material used for the second encapsulation layer is a polymer film.

8. The perching device according to claim 7, characterized in that, The polymer film is a polyurethane film.

9. The perching device according to any one of claims 1-3, characterized in that, The first encapsulation layer is in the shape of a frustum with one end closed and the other end open, and the second encapsulation layer is in the shape of a flat plate, sealing the open end of the first encapsulation layer.

10. The perching device according to claim 9, characterized in that, The first encapsulation layer and the second encapsulation layer are sealed together by an adhesive.

11. The perching device according to any one of claims 1-3, characterized in that, The first encapsulation layer and the second encapsulation layer are arranged coaxially.

12. The perching device according to any one of claims 1-3, characterized in that, Both the first encapsulation layer and the second encapsulation layer are shaped like caps, and the cap edge of the first encapsulation layer is bonded and fixed to the cap edge of the second encapsulation layer.

13. The perching device according to any one of claims 1-3, characterized in that, The material used for the first conductive layer is a carbon nanotube electrode or a liquid metal electrode; the material used for the second conductive layer is a carbon nanotube electrode or a metal electrode.

14. The perching device according to any one of claims 1-3, characterized in that, It also includes a second adhesive layer that covers the second conductive layer.

15. The perching device according to claim 14, characterized in that, The material used for the second adhesive layer is an insulating material.

16. The perching device according to claim 14, characterized in that, The material used for the second adhesive layer is silicone or a polymer film.

17. An unmanned aerial vehicle, characterized in that, Including the habitat device according to any one of claims 1-16, The electrical isolator of the hull device is connected to the I / O interface of the unmanned aerial vehicle; The unmanned aerial vehicle applies an electric field to the adhesion device via the voltage booster of the habitat.

18. The unmanned aerial vehicle according to claim 17, characterized in that, The unmanned aerial vehicle is connected to the second electrode layer or second adhesive layer of the habitat via multiple support pillars.

Images