Probe card, test device and test method
By embedding the optical fiber interface in the probe card and using the adjuster for precise adjustment, the problem of long set-up time and difficulty in testing equipment caused by split design of the optical fiber interface and needle tester or probe card in the prior art is solved, and efficient multi-group testing design and manufacturing are achieved.
Patent Information
- Application Number
- CN202411908511.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-05-09
AI Technical Summary
In the prior art, the optical fiber interface and needle tester or probe card are designed in a split type, which makes it difficult to set the machine on the test equipment for a long time, adjust the test, and it is difficult to implement multiple array testing.
A probe card is designed with an optical fiber interface embedded in it. The optical fiber interface corresponds to the optical gate of the device to be tested, and the position, height and angle of the optical fiber interface are adjusted through the adjuster to achieve accurate docking.
Through the embedding of the optical fiber interface and the use of the adjuster, the testing design and manufacturing of the devices to be tested is realized, which reduces the setting time of the on-machine and ensures the precise docking of the optical fiber interface and the optical gate.
Smart Images
Figure CN119959576A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of probe card testing technology, and in particular to a probe card, a testing device and a testing method. Background Art
[0002] A vertical probe card is a probe card used for multi-die testing, especially for testing logic-type products, including CPU, GPU, MCU, MPU, and a large number of SoC products. Because its probe is perpendicular to the substrate, it is called a "vertical" probe card. A cantilever probe card is a type of probe card used for semiconductor wafer testing. Its main feature is that the probe extends toward the wafer in a cantilever shape and contacts the wafer surface. Cantilever probe cards are usually used for chips with larger pads or bumps, such as traditional analog chips, logic chips, etc., because of their larger probe diameter.
[0003] The existing optical fiber transmitter or receiver or transceiver interface and the probe card are each one-piece. After the probe card is fixed on the probe station, the optical fiber interface is fixed to the probe station and the position, height, angle (X / Y / X / theta) and the position of the device to be tested (DUT) are adjusted. It is not easy to reduce the overall setup time and adjustment, and it is not easy to implement multi-site testing. Or because the optical fiber transmitter or receiver or transceiver interface and the probe card are each one-piece, when the probe card is made, the optical fiber interface is fixed to the probe, and then the probe card is fixed to the probe station and the position, height, angle (X / Y / X / theta) and the position of the device to be tested (DUT) are adjusted. It is not easy to reduce the overall setup time and adjustment, and it is not easy to implement multi-site testing. Summary of the invention
[0004] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a probe card, a test device and a test method for solving the problem in the prior art that the optical fiber interface and the probe station or the probe card adopt a split design, which makes it difficult to reduce the setup time and adjustment of the entire test equipment and difficult to implement multi-site testing.
[0005] To achieve the above objectives and other related objectives, the present invention provides a probe card having an embedded optical fiber interface, which corresponds to an optical gate of a device under test, so that a functional test can be performed by connecting the optical fiber interface to the optical gate.
[0006] In one embodiment of the present invention, the optical fiber interface includes a silicon photonic transducer optical fiber interface, a silicon photonic receiver optical fiber interface and a silicon photonic transceiver optical fiber interface.
[0007] In one embodiment of the present invention, the probe card includes: a fixing component, and the optical fiber interface is disposed on the fixing component.
[0008] In one embodiment of the present invention, the probe card further comprises an adjuster, and an adjusting end of the adjuster is connected to the fixing member to adjust the position, height and angle of the optical fiber interface.
[0009] In one embodiment of the present invention, the probe card is a multi-site probe card composed of a plurality of groups of optical fiber interfaces.
[0010] In one embodiment of the present invention, the optical fiber interfaces in the multi-site probe card are arranged in a manner of jumping one or more devices under test.
[0011] In one embodiment of the present invention, the optical fiber interfaces in the multi-site probe card are arranged in an oblique manner to jump one or more devices under test.
[0012] To achieve the above-mentioned purpose and other related purposes, the present invention also provides a testing device, including the aforementioned probe card, and also including: a probe tester, the probe card is arranged on the probe tester; and a device to be tested, the device to be tested is provided with an optical gate.
[0013] To achieve the above object and other related objects, the present invention further provides a testing method, comprising the following steps:
[0014] Provide a device under test, wherein the device under test is provided with an optical gate;
[0015] Provide a probe card, wherein the probe card is embedded with an optical fiber interface, and the optical fiber interface corresponds to the optical gate of the device to be tested;
[0016] Providing a probe test machine, wherein the probe card is arranged on the probe test machine;
[0017] A functional test is performed by connecting the optical fiber interface to the optical gate.
[0018] In one embodiment of the present invention, before performing a functional test by connecting the optical fiber interface with the optical gate port, the method includes: finely adjusting the position, height and angle of the optical fiber interface by means of an adjuster disposed on the probe card so that the optical fiber interface and the optical gate port are aligned and connected, and further processing the adjuster after the adjustment is completed so as to perform a functional test by aligning the optical fiber interface and the optical gate port in a connected state, wherein further processing the adjuster after the adjustment is completed includes one of continuing to install the adjuster on the structure of the probe card and removing the adjuster after the adjustment is completed.
[0019] As described above, a probe card, a test device and a test method of the present invention have the following beneficial effects: by embedding the probe card with the optical fiber interface, it is easy to directly align the optical gate of the device under test with the optical fiber interface embedded on the probe card when the device under test is connected, so as to ensure that the test work is easy to implement multi-site design and manufacturing and reduce the machine setting (setup) time. It is also possible to adjust the optical fiber interface corresponding to the optical fiber transmission / receiver (X / Y / Z / theta) to the optical gate position and height of the silicon photonic device under test through the adjuster to ensure the precise docking of the optical fiber interface and the optical gate. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 Shown is a communication connection framework diagram of the probe card of the present invention.
[0021] Figure 2 It is a schematic diagram showing a case where an optical interface is fixedly installed on a probe card according to an embodiment of the present invention.
[0022] Figure 3 It is a schematic diagram showing an embodiment of the present invention in which an optical interface is adjustably installed on a probe card.
[0023] Figure 4 Shown is a schematic structural diagram of an adjuster provided by an embodiment of the present invention.
[0024] Component number description
[0025] The device under test 10 , the probe card 20 , the optical gate 101 , the optical fiber interface 201 , the probe 202 , the fixing mechanism 30 , and the adjuster 40 . DETAILED DESCRIPTION
[0026] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the features in the following embodiments and the embodiments can be combined with each other without conflict. It should also be understood that the terms used in the embodiments of the present invention are intended to describe specific embodiments, rather than to limit the scope of protection of the present invention. The test methods for which specific conditions are not specified in the following examples are usually carried out under conventional conditions or according to the conditions recommended by the manufacturers.
[0027] See also Figure 1 to Figure 4 . It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "upper", "lower", "left", "right", "middle" and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.
[0028] Silicon photonics technology uses laser beams instead of electronic signals to transmit data. It is a low-cost, high-speed optical communication technology based on silicon photonics. Intel Labs has achieved the first data connection based on silicon photonics through an integrated laser that hybridizes silicon laser technology.
[0029] The optical fiber interface 201 is a physical interface for connecting optical fiber cables. The principle is to use the total reflection of light from a dense medium to a sparse medium. There are usually several types such as SC, ST, and FC. FC is the abbreviation of Ferrule Connector, and its external reinforcement method is to use a metal sleeve and the fastening method is a screw buckle. The ST interface is usually used for 10Base-F, and the SC interface is usually used for 100Base-FX.
[0030] Optical fibers can be divided into two types, namely single-mode (conducting long-wavelength lasers) and multi-mode (conducting short-wavelength lasers), depending on the light waves they can transmit.
[0031] The probe card 20 is mainly used to establish electrical connections between the test equipment and the numerous chips on the wafer, ensuring that the test points on each chip can be accurately contacted, so as to perform effective testing. The probe card is usually used in the IC manufacturing process, especially for functional testing before chip packaging to screen out defective products.
[0032] The probe card 20 is a test interface composed of probe pins, electronic components, wires and printed circuit boards (PCB). Depending on different situations, there will also be a demand for electronic components, stiffeners, etc. It mainly tests bare cores, i.e. wafer level testing. During wafer testing, the object to be tested is placed on the probe station, and then the probes on the probe card are directly in contact with the pads or bumps on the chip, and the chip signals generated by the tester (Atomic Test Equipment, ATE) are applied to the device under test, and the feedback signals in the device under test are transmitted back to the ATE, thereby completing the entire test.
[0033] See also Figure 1 In one embodiment of the present invention, the present invention provides a probe card 20, wherein the probe card 20 is embedded with a fiber optic interface 201, and the fiber optic interface 201 corresponds to the optical gate 101 of the device under test 10, so as to perform a functional test by connecting the fiber optic interface 201 with the optical gate 101.
[0034] In the present embodiment, in the probe card 20 of the present invention, in order to realize multi-site testing of the device under test 10 (DUT) and reduce the setup time, by embedding the optical fiber interface 201 in the probe card 20, it can be achieved that when the device under test 10 is tested, when the device under test 10 is installed on the probe card 20, the optical gate 101 on the device under test 10 can directly correspond to the optical fiber interface 201 embedded and fixed on the probe card 20, so that the optical gate 101 and the probe card 20 remain in a connected state, so as to test the device under test 10.
[0035] In one embodiment of the present invention, the optical fiber interface 201 includes a silicon photonic transducer optical fiber interface 201, a silicon photonic receiver optical fiber interface 201, and a silicon photonic transceiver optical fiber interface 201. In this embodiment, the optical fiber interface 201 may also be other interfaces capable of realizing silicon photonic (SiPh) transmission.
[0036] It is worth noting that a silicon photonic transducer is a transducer made of silicon material, which is a device that realizes the conversion between electrical energy and silicon photonic energy. A silicon photonic receiver is an optoelectronic integrated device based on a silicon chip, which is mainly used to convert optical signals into electrical signals; its working principle is to control the transmission and coupling of light through the optical waveguide on the silicon chip to realize the conversion between optical signals and electrical signals. A silicon photonic transceiver is an optoelectronic integrated device based on a silicon chip, which is mainly used to realize the conversion between optical signals and electrical signals. Its core principle is to control the transmission and coupling of light through the optical waveguide on the silicon chip. A silicon photonic transceiver consists of two main components: a photodetector and a laser. Among them, the photodetector converts the optical signal into an electrical signal, while the laser converts the electrical signal into an optical signal.
[0037] like Figure 2 As shown, in one embodiment of the present invention, the probe card 20 may be a probe card PCB board, and the probe card 20 includes: a fixing mechanism 30, and the optical fiber interface 201 is arranged on the fixing mechanism 30. In this embodiment, the fixing mechanism 30 for fixing the optical fiber interface 201 and the test machine 2 may form an integrated structure, thereby realizing the embedded installation of the optical fiber interface 201 on the test machine 2. Specifically, the fixing mechanism 30 may be installed on the probe 202 on the probe card 20.
[0038] like Figure 3 As shown, in one embodiment of the present invention, the probe card 20 may be a probe card PCB board, and the probe card 20 further includes an adjuster 40, and the adjusting end of the adjuster 40 is connected to the fixing member 30 to adjust the position, height and angle of the optical fiber interface 201. In this embodiment, when the fixing member 30 and the tester 2 form an integrated structure, the fixing member 30 may be movably connected to the tester 2, so as to adjust the position of the fixing member 30 through the adjuster 40. After the adjustment is completed, the adjuster 40 may be disassembled, and only the structure of the fixing member 30 and the optical fiber interface 201 may be retained. Of course, after the adjustment is completed, the adjuster 40 may not be disassembled and may continue to remain on the probe card 20.
[0039] See also Figure 4 , Figure 4 In the illustrated embodiment, the adjuster 40 is an X / Y / Z / Theta position height angle adjuster, which can adjust the position, height and angle of the optical fiber interface 201 by adjusting the fixing member 30 .
[0040] In one embodiment of the present invention, the probe card 20 is a multi-site probe card composed of a plurality of groups of optical fiber interfaces 201 .
[0041] 1D matrix arrangement table of probe card + optical fiber transmission / receiver:
[0042] Be samples Be samples Be samples Be samples Be samples …… be Head be Head be Head be Head be Head ……
[0043] As can be seen from the table above, whether the optical fiber interface 201 is fixed or adjustable, the optical fiber interface 201 can be applied in array form. Specifically, the optical fiber interface 201 can be a single-site array (single site) or a multi-site array (multi-site) to form a multi-site probe card.
[0044] In one embodiment of the present invention, the optical fiber interfaces 201 in the multi-site probe card 20 are arranged in a manner of jumping one or more DUTs 10 .
[0045] 2D matrix arrangement table of probe card + optical fiber transmission / receiver:
[0046] Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples Be samples
[0047] It can be seen from the above table that no matter it is a 1D matrix arrangement or a 2D matrix arrangement, the optical fiber interfaces 201 in the multi-site probe card 20 can be arranged and configured in a continuous or skipping manner for one or more DUTs.
[0048] In one embodiment of the present invention, the optical fiber interfaces 201 in the multi-site probe card 20 are arranged in an oblique manner so as to jump one or more devices under test 10 .
[0049] Diagonal arrangement table 1:
[0050]
[0051]
[0052] Diagonal arrangement table 2:
[0053] Be samples Be samples Be samples Be samples Be samples ……
[0054] It can be seen from the above table that the optical fiber interface 201 in the multi-site probe card 20 can also be configured using an oblique arrangement or an oblique arrangement with one or more DUTs.
[0055] In one embodiment of the present invention, the present invention further provides a testing device, including the aforementioned probe card 20 , and also including: a probe tester, the probe card 20 is arranged on the probe tester; and a device under test 10 , the device under test 10 is provided with an optical gate 101 .
[0056] In this embodiment, when using the testing device of the present invention for testing, the probe card 20 can be first fixed on the probe tester, and then the optical fiber interface 201 of the probe card 20 is adjusted to be correspondingly connected with the optical gate 101 of the device under test 10 to implement the test of the device under test 10.
[0057] The present invention further provides an assembly method of a testing device, which includes a fixed assembly method of the optical fiber interface 201 and an adjustable assembly method of the optical fiber interface 201 .
[0058] The fixed assembly method of the optical fiber interface 201 includes:
[0059] Step S10a: first design and manufacture the probe card 20, and complete all flatness and position adjustments;
[0060] Step S20a: According to the relative position of the probe and the optical gate 101 of the device under test (DUT), the position of the optical fiber interface 201 is adjusted (including height and angle) to the position of the optical gate 101 of the DUT. After adjusting to the correct position, the optical fiber interface 201 is fixed and embedded into the probe card 20, and then fixed.
[0061] The adjustable assembly method of the optical fiber interface 201 includes:
[0062] Step S10b: first design and manufacture the probe card 20, and complete all flatness and position adjustments;
[0063] Step S20b: According to the relative position of the probe and the (DUT) optical gate 101, the optical fiber interface 201 is first fixed to the X / Y / Z / Theta fine adjustment mechanism, and then the integrated mechanism (adjuster 40 + optical fiber interface 201) is fixed and embedded into the probe card 20, and then fixed;
[0064] Step S30b: fix the probe card 20 to the probe tester, insert the device under test 10 again, start the test program of the tester (ATE), and fine-tune the position, height, and angle (theta) of the optical fiber interface 201 through the X / Y / Z / Theta fine-tuning mechanism;
[0065] Step S40b: After the X / Y / Z / Theta fine adjuster has adjusted the position, height, and angle (theta) of the fiber interface and the DUT, the fine adjuster is fixed to the probe card, or the X / Y / Z / Theta fine adjuster is removed to keep only the fiber interface.
[0066] In one embodiment of the present invention, the present invention further provides a testing method, comprising the following steps:
[0067] A device under test 10 is provided, wherein the device under test 10 is provided with an optical gate 101;
[0068] A probe card 20 is provided, wherein the probe card 20 is embedded with an optical fiber interface 201, and the optical fiber interface 201 corresponds to the optical gate 101 of the device under test 10;
[0069] A probe test machine is provided, and the probe card 20 is arranged on the probe test machine;
[0070] A functional test is performed by connecting the optical fiber interface 201 to the optical gate 101 .
[0071] In this embodiment, in the testing method of the present invention, on a probe test machine for testing the device under test 10, by installing the probe card 20 on the probe test machine and embedding the optical fiber interface 201 on the probe card 20, when testing the device under test 10, the corresponding position of the optical fiber interface 201 on the probe card 20 is pre-adjusted according to the position of the optical gate 101 of the device under test 10, so that when performing functional testing, when the device under test 10 is installed, the optical fiber interface 201 can be directly connected to the optical gate 101 of the device under test 10, which makes it easy to realize multi-site design and manufacturing in the testing process and reduce the setup time.
[0072] In one embodiment of the present invention, before performing a functional test by connecting the optical fiber interface 201 to the optical gate port 101, the following steps are included: fine-tuning the position, height and angle of the optical fiber interface 201 by means of an adjuster 40 disposed on the probe card 20, so that the optical fiber interface 201 is aligned and connected with the optical gate port 101, and further processing the adjuster 40 after the adjustment is completed, so as to perform a functional test by aligning the optical fiber interface 201 with the optical gate port 101 in a connected state, wherein further processing the adjuster 40 after the adjustment is completed includes one of continuing to install the adjuster 40 on the structure of the probe card 20 and removing the adjuster 40 after the adjustment is completed.
[0073] In this embodiment, before the functional test is performed by connecting the optical fiber interface 201 to the optical gate 101, the position of the optical fiber interface 201 needs to be adjusted. Specifically, the optical fiber interface 201 is adjusted to the alignment position with the optical gate 101 according to the position of the optical gate 101 of the device under test 10 by using the adjuster 40, and then after alignment, the optical fiber interface 201 and the optical gate 101 can be aligned and connected by removing the adjuster 40, and the functional test can be performed after the connection. Of course, the adjuster 40 can also be not removed after adjusting the position of the optical fiber interface 201, and the functional test after alignment and connection can be performed directly.
[0074] In summary, the probe card, test device and test method disclosed in the present invention can be easily realized by embedding the optical fiber interface 201 in the probe card 20 when the device under test 10 is directly aligned with the optical fiber interface 201 embedded on the probe card 20, so as to ensure that the test work is easy to implement multi-site design and manufacturing and reduce the machine setting (setup) time. It is also possible to adjust the optical fiber interface 201 corresponding to the optical fiber transmission / receiver (X / Y / Z / theta) to correspond to the position and height of the optical gate 101 of the silicon photonic device under test 10 through the adjuster 40 to ensure the precise docking of the optical fiber interface 201 and the optical gate 101. Therefore, the present invention effectively overcomes the various shortcomings of the prior art and has a high industrial utilization value.
[0075] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.
Claims
1. A probe card, characterized in that: The probe card is embedded with an optical fiber interface, which corresponds to the optical gate of the device to be tested, so that a functional test can be performed by connecting the optical fiber interface with the optical gate.
2. The probe card according to claim 1, wherein: The optical fiber interface includes a silicon photon transducer optical fiber interface, a silicon photon receiver optical fiber interface and a silicon photon transceiver optical fiber interface.
3. The probe card according to claim 1, wherein: The probe card comprises a fixing component, and the optical fiber interface is arranged on the fixing component.
4. The probe card according to claim 3, wherein: The probe card also includes an adjuster, and an adjusting end of the adjuster is connected to the fixing member to adjust the position, height and angle of the optical fiber interface.
5. The probe card according to claim 1, wherein: The probe card is a multi-site probe card composed of several groups of optical fiber interfaces.
6. The probe card according to claim 5, characterized in that: The optical fiber interfaces in the multi-site probe card are arranged in a manner of jumping one or more devices under test.
7. The probe card according to claim 5, wherein: The optical fiber interfaces in the multi-site probe card are arranged obliquely in a manner of jumping one or more devices under test.
8. A testing device, characterized in that: The probe card according to any one of claims 1 to 7 further comprises: A probe test machine, wherein the probe card is arranged on the probe test machine; The device under test is provided with an optical gate.
9. A testing method, characterized in that: The steps include: Provide a device under test, wherein the device under test is provided with an optical gate; Provide a probe card, wherein the probe card is embedded with an optical fiber interface, and the optical fiber interface corresponds to the optical gate of the device to be tested; Providing a probe test machine, wherein the probe card is arranged on the probe test machine; A functional test is performed by connecting the optical fiber interface to the optical gate.
10. The testing method according to claim 9, characterized in that: Before the functional test is performed by connecting the optical fiber interface to the optical gate, the method includes: The position, height and angle of the optical fiber interface are finely adjusted by an adjuster disposed on the probe card so that the optical fiber interface and the optical gate port are aligned and connected, and the adjuster is further processed after the adjustment is completed to perform a functional test on the optical fiber interface and the optical gate port in an aligned and connected state, wherein the further processing of the adjuster after the adjustment is completed includes one of continuing to install the adjuster on the structure of the probe card and removing the adjuster after the adjustment is completed.