Chip test equipment based on aging test

Abstract

The invention discloses chip testing equipment based on an aging test, and relates to the technical field of chip manufacturing. The device comprises two variable-temperature chambers, the same constant-temperature chamber is fixedly installed between the two variable-temperature chambers, placing trays are arranged in the variable-temperature chambers, the two placing trays are arranged in a staggered mode from top to bottom, and the top and the bottom of each placing tray are each provided with a plurality of circuit board grooves which are evenly distributed. The circuit board groove is used for placing a circuit board loaded with a chip to be tested, and one side of the temperature changing chamber is fixedly provided with a temperature changing gas tank. According to the invention, by arranging the exchange assembly, the two groups of circuit boards and the chip are respectively cooled and heated, and the exchange assembly drives the two placement trays to enter the temperature changing chamber at the other side for a second round of temperature test, so that the chip is rapidly switched between high and low temperatures, and the working state of the chip at an extreme temperature, a high-pressure state or a humid environment is tested; and the chip is quickly aged in extreme temperature change, so that batch aging test is realized.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to a chip testing device based on aging test. Background Art

[0002] With the rapid development of semiconductor technology and the increasing complexity of chips year by year, chip testing runs through the entire design, development and production process, and is becoming more and more challenging. Among them, chip aging test is an important test used to eliminate early faulty products before delivery to customers. Chip aging test is an electrical stress test method that uses voltage and high temperature to accelerate the electrical failure of devices. The aging process basically simulates the operation of the entire life of the chip. The electrical excitation applied during the aging process reflects the worst case of chip operation. The ultimate goal of the chip aging test is to predict the service life of the product and evaluate or predict the durability of the products produced by the manufacturer.

[0003] When using existing chip aging test equipment, workers are required to place chips into the test equipment for accelerated aging, and then regularly take out the aged chips for power-on testing. This test method not only fails to monitor the state changes of the chip during the aging process in real time, but also requires regular removal for special power-on testing, which hinders the progress of chip aging testing and results in the inability to carry out chip aging testing in batches. Therefore, a chip testing device based on aging testing is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem that the existing testing equipment and testing methods are not only unable to monitor the state changes of the chip during the aging process in real time, but also need to be taken out regularly for special power-on testing, which blocks the progress of the chip aging test and causes the chip aging test to be unable to be carried out in batches. The present invention provides a chip testing device based on aging testing.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions: A chip testing device based on aging test comprises two variable temperature chambers, a constant temperature chamber is fixedly installed between the two variable temperature chambers, a placement tray is arranged inside each of the variable temperature chambers, the two placement trays are staggered from top to bottom, a plurality of evenly distributed circuit board slots are opened on the top and bottom of each of the placement trays, the circuit board slots are used to place circuit boards loaded with chips to be tested, a variable temperature gas tank is fixedly installed on one side of each of the variable temperature chambers, a gas delivery pipe is fixedly installed on the top of each of the variable temperature gas tanks, one end of each of the two gas delivery pipes extends to the inside of each of the two variable temperature chambers and corresponds to the positions of the two placement trays, and a same exchange component is arranged inside each of the two variable temperature chambers; The exchange component is used to exchange the two placement trays back and forth in the two temperature-changing chambers with different temperatures, so that the circuit boards and chips on the two placement trays are subjected to extreme temperature changes alternately; The top of the placement tray is provided with a fastening assembly, and the fastening assembly is used to intercept and fix the top of each circuit board after the circuit board is placed in each circuit board slot.

[0006] Furthermore, the exchange component includes four drive frames, which are respectively fixedly mounted on the sides of the two temperature-controlled chambers away from each other, and exchange electric push rods are fixedly mounted inside the drive frames, and the positions of the two exchange electric push rods on the same side correspond to the positions of the two placement disks, respectively. The telescopic ends of the exchange electric push rods are fixedly mounted on a frame, and a plurality of electric-driven clamps are fixedly mounted on one side of the frame, and a plurality of first clamping rods matched with the electric-driven clamps are fixedly mounted on both sides of the placement disk. A plurality of plug-in terminals for matching with circuit boards loaded with chips to be tested are arranged on the top of the placement disk, and the plurality of plug-in terminals are respectively located on one side of the plurality of circuit board slots, and two electric-driven valves are arranged on the inner walls on both sides of the constant-temperature chamber, and the two electric-driven valves located on the same side are arranged in sequence from top to bottom and correspond to the positions of the two placement disks, respectively.

[0007] Furthermore, the fastening assembly includes a plurality of evenly distributed rotating holes respectively opened at the top and bottom of the placing plate, a plurality of the rotating holes are rotatably installed with a fastening shaft inside, a fastening shaft is fixedly sleeved on one end of the fastening shaft located outside the placing plate, a plurality of the fastening shafts respectively correspond to the positions of a plurality of the circuit board slots, a same linkage rod is rotatably installed between any two adjacent fastening rods, the linkage rods located on the same side are arranged on the ends of the two fastening rods away from the fastening shaft, any adjacent linkage rods are staggered with each other, a driven shaft is fixedly installed on one end of the plurality of fastening shafts located on the same side and in the same vertical column, the driven shafts are all located inside the placing plate, a driven gear is fixedly sleeved on the driven shaft, two slide rails are fixedly installed inside the placing plate, the two slide rails are symmetrically arranged, and the two A control rack is slidably installed inside each of the slide rails, and the control rack is perpendicular to the linkage rod, and multiple driven gears located on the same side are meshed with the control rack, and one end of the control rack close to the electric drive clamp is fixedly installed with a pitch adjusting screw, one end of the pitch adjusting screw is threaded with a pitch adjusting screw barrel, and one end of the pitch adjusting screw barrel is fixedly installed with a control rod, two control holes are provided on the side of the placement plate close to the electric drive clamp, and the two control rods are rotatably installed in the two control holes respectively, and a positioning groove is provided on the side of the control rod close to the electric drive clamp, wherein two fastening electric push rods are fixedly installed inside the two drive frames respectively close to the two control rods, and the telescopic ends of the fastening electric push rods are fixedly installed with second steering arms, and the output ends of the second steering arms are drivingly installed with positioning plugs matching the positioning holes.

[0008] Furthermore, an exhaust pump connected to the interior of the constant temperature chamber is fixedly installed on the top and bottom of the constant temperature chamber, an exhaust pipe is fixedly installed on the output end of the exhaust pump, a recovery tank is fixedly installed on one side of the constant temperature chamber, one end of the two exhaust pipes is connected to the interior of the recovery tank, an airtight partition is fixedly installed inside the constant temperature chamber, the two exhaust pumps are respectively located at the top and bottom of the airtight partition, and the four electric-driven valves are respectively located at the top and bottom of the airtight partition.

[0009] Furthermore, four guide brackets are fixedly installed inside the constant temperature chamber, two guide brackets at the same height are symmetrically arranged to each other and correspond to the position of the placement plate, and the airtight partition is located between the four guide brackets.

[0010] Furthermore, two symmetrically distributed cleaning trays are provided on the top and bottom of the airtight partition, and a plurality of cleaning pipes are fixedly installed on the sides of the two cleaning trays on the same side that are close to each other, and the same ventilation pipe is fixedly installed between the two cleaning trays on the same side. Inert gas washers are fixedly installed on the top and bottom of the constant temperature chamber, two of which are respectively connected to the two inert gas washers, and the other two cleaning trays are respectively fixedly installed on the top and bottom of the airtight partition.

[0011] Furthermore, two airtight valves are provided on one side of the constant temperature chamber, the two airtight valves respectively correspond to the positions of the four guide brackets, and a plurality of second clamping rods are fixedly installed on one side of the placement plate close to the airtight valves.

[0012] Furthermore, a foldable telescopic tube is fixedly installed at one end of the gas supply pipe inside the variable temperature chamber, a jet disk is fixedly installed at the bottom end of the foldable telescopic tube, and a height-adjusting electric push rod is fixedly installed on the top of the variable temperature chamber, and the telescopic end of the height-adjusting electric push rod extends to the interior of the variable temperature chamber and is fixedly installed on the top of the jet disk.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention sets a switching component so that the variable temperature gas tank blows high and low temperature gas or moisture into the two variable temperature chambers to perform pressurization, cooling and heating treatments respectively, so that the two groups of circuit boards and chips are subjected to cooling and heating treatments. After that, the switching component is used to drive the two placement plates into the constant temperature chamber to restore the temperature, or directly send them to the variable temperature chamber on the other side for a second round of temperature testing, so that the chips can be quickly switched between high and low temperatures, and the working state of the chips under extreme temperature, high pressure or humid environment can be tested. At the same time, the chips can be quickly aged in extreme temperature changes, thereby realizing batch aging testing; 2. The present invention provides plug-in terminals so that when loading circuit boards, each circuit board is sequentially placed in the circuit board slot on the top of the placement tray, and the terminals on the circuit board are sequentially plugged into the plug-in terminals, so that the chip, the circuit board and the internal control circuit of the placement tray are connected, and the temperature aging test of the chip on the placement tray can be performed, and the working status of each chip can be monitored in real time. In the process, the two temperature-changing chambers are isolated from each other, which can effectively prevent two groups of different chips from interfering with each other during the test process; 3. The present invention sets a fastening assembly so that after placing the circuit board in each circuit board slot, the two placement plates can be placed in the constant temperature room in turn, and the fastening electric push rods on both sides drive the driven gears to rotate through the second steering arm, so that the driven shaft of the longitudinal column drives the fastening rods to rotate together and clamp on the top of the circuit board, so as to realize batch and automatic fixation of the circuit board, and effectively prevent the circuit board from vibrating during the switching process and loosening the contact with the plug-in terminal, which affects the real-time monitoring of the test data; 4. The present invention provides a fastening assembly. When the placement tray carrying the circuit board is already in the temperature-changing room and fixed, the staff can control the fastening electric push rod to drive the positioning rod to snap into the positioning groove, and then drive each fastening rod to rotate to one side of the circuit board groove, so that the fastening rod is no longer on the top of the circuit board, preventing the fastening rod from blocking the high and low temperature gas or humid gas transported by the gas pipeline, so that the circuit board and the chip can directly withstand the scouring of the high and low temperature gas or humid gas, thereby ensuring the progress of the test; 5. The present invention provides an air pump so that when the placement plate is sent into the constant temperature chamber, the high and low temperature gases, humid gases, etc. in the two variable temperature chambers will leak into the constant temperature chamber due to the previous opening of the electric drive valve. Therefore, the air pump will extract the above gases remaining in the constant temperature chamber and send them to the recovery tank through the air extraction pipe for recycling, and ventilate the constant temperature chamber to keep the interior of the constant temperature chamber at a constant temperature, so as to avoid the high and low temperature gases from flowing into each other when the electric drive valve is opened next time, which will affect the test work. 6. The present invention provides an airtight partition so that the airtight partition can separate the space in the constant temperature chamber into two parts, so that the two placement plates are not always in the same space during the entire exchange process, preventing the high and low temperature gases remaining on the two placement plates from mixing with each other and preventing the high and low temperature gases from entering the variable temperature chamber on the other side; 7. The present invention is provided with an inert gas washer, so that after the placement tray loaded with circuit boards is sent from the outside into the constant temperature chamber of the cleaning chamber, the inert gas washer can spray inert gas to the top and bottom of the placement tray through the ventilation pipe, the cleaning tray and the cleaning pipe array to wash, so that the placement tray and the surfaces of each circuit board can meet the cleanliness standard of the test in cooperation with the vacuum pump, reducing the influence of external factors. At the same time, after the two placement trays are sent back to the constant temperature chamber from their respective variable temperature chambers, the inert gas washer will quickly dry the humid gas on each circuit board and restore the temperature of the circuit board, so that the circuit board can work in a normal environment of constant temperature after being subjected to a period of high and low temperature, pressure and humidity treatment; 8. The present invention sets a height-adjusting electric push rod so that the high and low temperature gases output by the two variable temperature gas tanks are respectively sprayed evenly on the inside of the variable temperature chamber, that is, the top of the two placement plates, through two sets of gas transmission pipes, folding and telescopic tubes and jet disks. At the same time, before the placement plates are exchanged, the height-adjusting electric push rod can drive the two folding and telescopic tubes to shrink and stretch respectively, so that the two jet disks rise and fall respectively, to avoid collision between the jet disk and the placement plate due to position conflict after the placement plate is exchanged, or the gas is too far away from the placement plate due to different heights, thereby affecting the test effect, so that the jet disk can automatically adapt to the height of the current placement plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention from a first viewing angle; Figure 2 is a schematic diagram of a three-dimensional structure from a second viewing angle of the present invention; Figure 3 It is a schematic diagram of the internal three-dimensional structure of the variable temperature chamber and the constant temperature chamber of the present invention; Figure 4 It is a schematic diagram of the three-dimensional structure of the placement tray of the present invention from a first viewing angle; Figure 5 is a schematic diagram of the three-dimensional structure of the placement tray of the present invention from a second viewing angle; Figure 6 It is a schematic diagram of the three-dimensional structure of the exchange electric push rod and the electric drive clamping claw of the present invention; Figure 7 It is a schematic diagram of the internal three-dimensional structure of the placement tray of the present invention; Figure 8 The present invention Figure 7 Schematic diagram of the structure at A in the middle; Fig. 9 It is a schematic diagram of the three-dimensional structure of the fastening rod and the linkage rod of the present invention; Fig.10 It is a schematic diagram of the internal three-dimensional structure of the constant temperature chamber of the present invention; Figure numerals: 1, variable temperature chamber; 2, constant temperature chamber; 3, placement plate; 4, circuit board slot; 5, variable temperature gas tank; 6, gas pipe; 7, drive frame; 8, exchange electric push rod; 9, electric drive clamping claw; 10, plug-in terminal; 11, first clamping rod; 12, electric drive valve; 13, folding telescopic tube; 14, jet disc; 15, height adjustment electric push rod; 16, fastening shaft; 17, fastening rod; 18, driven shaft; 19, driven gear; 20, slide rail; 21. Control rack; 22. Pitch-adjusting screw; 23. Pitch-adjusting screw barrel; 24. Control lever; 25. Linkage lever; 26. Vacuum pump; 27. Vacuum pipe; 28. Airtight partition; 29. ​​Inert gas washer; 30. Cleaning plate; 31. Cleaning pipe; 32. Ventilation pipe; 33. Guide bracket; 34. Second clamping rod; 35. Airtight valve; 36. Fastening electric push rod; 37. Second steering arm; 38. Positioning plug rod; 39. Recovery tank. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0018] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0019] like Figures 1 to 10 As shown, a chip testing device based on aging test includes two variable temperature chambers 1, and a constant temperature chamber 2 is fixedly installed between the two variable temperature chambers 1. Figure 3 As shown, a placement tray 3 is provided inside the variable temperature chamber 1, and the two placement trays 3 are staggered from top to bottom. A plurality of evenly distributed circuit board slots 4 are provided on the top and bottom of the placement trays 3. The circuit board slots 4 are used to place circuit boards loaded with chips to be tested. A variable temperature gas tank 5 is fixedly installed on one side of the variable temperature chamber 1. In this embodiment, a pumping device is provided on the top of the variable temperature gas tank 5. A gas delivery pipe 6 connected to the pumping device is fixedly installed on the top of the variable temperature gas tank 5. One end of the two gas delivery pipes 6 respectively extends to the inside of the two variable temperature chambers 1 and respectively corresponds to the positions of the two placement trays 3. The same exchange component is provided inside the two variable temperature chambers 1. The exchange component is used to exchange the two placement trays 3 back and forth in two temperature-changing chambers 1 with different temperatures, so that the circuit boards and chips on the two placement trays 3 are subjected to extreme temperature changes alternately; The top of the placement tray 3 is provided with a fastening assembly, which is used to intercept and fix the top of each circuit board after the circuit board is placed in each circuit board slot 4; specifically, when the chip testing equipment based on the aging test is in use, the circuit boards loaded with the chips to be tested can be placed in batches on each circuit board slot 4 on the top of the placement tray 3, and then the circuit boards are fixed by the fastening assembly, and then the two placement trays 3 are respectively sent to the variable temperature chambers 1 on both sides, and the variable temperature gas tanks 5 loaded with gases of different temperatures are respectively blown into the two variable temperature chambers 1 through the gas pipes 6, so as to respectively perform pressurization, cooling and heating treatment, so that the two placement trays 3 and the circuit boards and chips loaded on the top thereof are subjected to cooling and heating treatment. After that, the exchange component is used to drive the two placement trays 3 filled with circuit boards to leave the current variable temperature chamber 1 and enter the constant temperature chamber 2 to restore the temperature, or the two placement trays 3 are directly sent to the variable temperature chamber 1 on the other side for a second round of temperature testing, so that the circuit board originally in high temperature is immediately placed in the variable temperature chamber 1 in a low temperature state, and the circuit board originally in high temperature is immediately placed in the variable temperature chamber 1 in a high temperature state, so that the chips on the two placement trays 3 are alternately switched between the two variable temperature chambers 1, so that the chip can quickly switch between high and low temperatures, test the working status of the chip under extreme temperature, high pressure or humid environment, and make the chip age quickly in extreme temperature changes, so as to speed up the aging test process.

[0020] like Figure 1 , Figure 3 As shown, the exchange assembly includes four drive racks 7, which are respectively fixedly mounted on the sides of the two variable temperature chambers 1 away from each other, and the drive racks 7 are each fixedly mounted with exchange electric push rods 8 inside. Figure 6As shown, the positions of the two exchange electric push rods 8 located on the same side correspond to the positions of the two placement trays 3 respectively, the telescopic ends of the exchange electric push rods 8 are fixedly mounted on a frame, and a plurality of electric drive clamps 9 are fixedly mounted on one side of the frame, and a plurality of first clamping rods 11 adapted to the electric drive clamps 9 are fixedly mounted on both sides of the placement tray 3, and a plurality of plug-in terminals 10 for adapting to the circuit board loaded with the chip to be tested are arranged on the top of the placement tray 3, and the plurality of plug-in terminals 10 are respectively located on one side of the plurality of circuit board slots 4, and two electric drive valves 12 are arranged on the inner walls of both sides of the constant temperature chamber 2, and the two electric drive valves 12 located on the same side are arranged in sequence from top to bottom and correspond to the positions of the two placement trays 3 respectively; specifically, by setting the exchange component, when loading the circuit board, each circuit board is placed in the circuit board slot 4 at the top of the placement tray 3 in sequence, and the terminals on the circuit board are plugged into each other in sequence with the plug-in terminals 10 in sequence, so that the chip, the circuit board and the internal control circuit of the placement tray 3 are connected, and when the placement tray 3 is sent into the constant temperature chamber 2, the plurality of The electric-driven clamping claw 9 will be driven by the exchange electric push rod 8 to pass through the opened electric-driven valve 12 and enter the constant temperature chamber 2, and then the electric-driven clamping claws 9 on both sides respectively clamp and fix the first clamping rods 11 on the two placement trays 3, so that the two placement trays 3 are respectively docked with the exchange electric push rods 8 on both sides, so that the two placement trays 3 can be pulled by the exchange electric push rods 8 and move to the two variable temperature chambers 1 respectively, and then the electric-driven valves 12 on both sides are closed, so that the two variable temperature chambers 1 are closed respectively, and the circuit boards and chips on the two placement trays 3 are respectively tested at high and low temperatures. After that, the electric-driven valve 12 is reopened, and then driven by the exchange electric push rods 8 on both sides, the two placement trays 3 are sent back to the constant temperature chamber 2, and then pulled by the exchange electric push rod 8 on the other side to be sent to the opposite variable temperature chamber 1 to be subjected to the opposite temperature test, and the above operation can be repeated to perform temperature aging test on the chips on the placement tray 3, and the working status of each chip can be monitored in real time, and during the processing, the two variable temperature chambers 1 are isolated from each other, which can effectively prevent two groups of different chips from interfering with each other during the test process.

[0021] like Figure 4 As shown, the fastening assembly includes a plurality of evenly distributed rotating holes respectively opened at the top and bottom of the placement plate 3, wherein a fastening shaft 16 is rotatably mounted inside the plurality of rotating holes, and a fastening rod 17 is fixedly sleeved on one end of the fastening shaft 16 located outside the placement plate 3, and the plurality of fastening rods 17 respectively correspond to the positions of the plurality of circuit board slots 4, as shown in FIG. Fig. 9 As shown, the same linkage rod 25 is rotatably installed between any two adjacent fastening rods 17. The linkage rods 25 located on the same side are arranged on the ends of the two fastening rods 17 away from the fastening shaft 16. Any adjacent linkage rods 25 are staggered with each other. Figure 7As shown, a driven shaft 18 is fixedly installed at one end of a plurality of fastening shafts 16 located on the same side and in the same vertical column. The driven shaft 18 is located inside the placement disk 3. A driven gear 19 is fixedly sleeved on the driven shaft 18. Two slide rails 20 are fixedly installed inside the placement disk 3. The two slide rails 20 are symmetrically arranged. A control rack 21 is slidably installed inside the two slide rails 20. The control rack 21 is perpendicular to the linkage rod 25. A plurality of driven gears 19 located on the same side are meshed with the control rack 21. In this embodiment, a plurality of fastening rods 17 and the linkage rod 25 located on the same side form a horizontal "linkage structure". Only the bottom end of the fastening shaft 16 located at one end of the "linkage structure" is fixedly installed with the driven shaft 18. The horizontal "linkage structure" is consistent with the longitudinal arrangement. The control racks 21 are arranged perpendicular to each other, and one end of the control rack 21 close to the electric drive clamping jaw 9 is fixedly installed with a pitch adjusting screw 22, one end of the pitch adjusting screw 22 is threaded with a pitch adjusting screw barrel 23, and one end of the pitch adjusting screw barrel 23 is fixedly installed with a control rod 24, and two control holes are provided on the side of the placement plate 3 close to the electric drive clamping jaw 9, and the two control rods 24 are rotatably installed in the inside of the two control holes, and the side of the control rod 24 close to the electric drive clamping jaw 9 is provided with a positioning groove, wherein two driving frames 7 close to the two control rods 24 are fixedly installed with two fastening electric push rods 36, and the telescopic ends of the fastening electric push rods 36 are fixedly installed with second steering arms 37, and the output ends of the second steering arms 37 are driven to be installed with positioning plugs 38 adapted to the positioning holes. In this embodiment, as shown in FIG. Figure 1 , Figure 3 As shown, there are four drive frames 7 and four exchange electric push rods 8, and only two of the exchange electric push rods 8 are provided with fastening electric push rods 36 and second steering arms 37 on both sides. Figure 6As shown, there are two fastening electric push rods 36 and two second steering arms 37 respectively distributed on both sides of two of the exchange electric push rods 8; specifically, by setting a fastening component, after the circuit boards are placed in each circuit board slot 4, the two placement trays 3 can be placed in the constant temperature chamber 2 in turn, and the electric drive valves 12 on both sides are opened, and the fastening electric push rods 36 on both sides drive the second steering arms 37 to pass through the electric drive valves 12 and move to one side of the placement trays 3 at their respective heights, and then each positioning rod 38 is inserted into the corresponding positioning groove, and then the second steering arm 37 drives the control rod 24 to rotate through the positioning rod 38, and then the control rack 21 slides along the slide rail 20 with the help of the meshing action of the pitch adjusting screw barrel 23 and the pitch adjusting screw 22, thereby driving each driven gear 19 to rotate, so that the driven shaft 18 of the longitudinal column drives The fastening shaft 16 rotates, thereby driving the fastening rods 17 to rotate together with the help of the linkage rods 25 and clamped on the top of the circuit board, thereby realizing batch and automatic fixing of the circuit board, and effectively preventing the circuit board from vibrating and loosening the contact with the plug-in terminal 10 during the back-and-forth switching process, affecting the real-time monitoring of the test data. When the placement tray 3 carrying the circuit board is already in the variable temperature room 1 and fixed, the staff can control the fastening electric push rod 36 to drive the positioning rod 38 to clamp into the positioning groove, and then drive each fastening rod 17 to rotate to one side of the circuit board groove 4, so that the fastening rod 17 is no longer on the top of the circuit board, preventing the fastening rod 17 from blocking the high and low temperature gas or humid gas transported by the gas pipe 6, so that the circuit board and the chip can directly withstand the erosion of the high and low temperature gas or humid gas, thereby ensuring the progress of the test.

[0022] like Fig.10As shown, the top and bottom of the constant temperature chamber 2 are fixedly installed with an exhaust pump 26 connected to the inside of the constant temperature chamber 2, and the output end of the exhaust pump 26 is fixedly installed with an exhaust pipe 27. A recovery tank 39 is fixedly installed on one side of the constant temperature chamber 2, and one end of the two exhaust pipes 27 is connected to the inside of the recovery tank 39. An airtight partition 28 is fixedly installed inside the constant temperature chamber 2, and two exhaust pumps 26 are respectively located at the top and bottom of the airtight partition 28, and four electric drive valves 12 are respectively located at the top and bottom of the airtight partition 28; specifically, by arranging the exhaust pump 26, when the placement plate 3 is sent into the constant temperature chamber 2, the electric drive valve 12 is opened before, resulting in the high and low temperature gases inside the two constant temperature chambers 1 being , humid gases, etc. will leak into the constant temperature chamber 2, so the vacuum pump 26 will extract the above-mentioned gases remaining in the constant temperature chamber 2 and send them to the recovery tank 39 through the vacuum pipe 27 for recovery, and ventilate the constant temperature chamber 2 to keep the interior of the constant temperature chamber 2 at a constant temperature, so as to avoid the high and low temperature gases from flowing into each other when the electric drive valve 12 is opened next time, thereby affecting the test work. By setting the airtight partition 28, the airtight partition 28 can separate the space in the constant temperature chamber 2 into two parts, so that the two placement plates 3 are not in the same space throughout the entire exchange process, so as to prevent the high and low temperature gases remaining on the two placement plates 3 from flowing into each other and mixing, and prevent the high and low temperature gases from entering the variable temperature chamber 1 on the other side.

[0023] like Fig.10 As shown, four guide brackets 33 are fixedly installed inside the constant temperature chamber 2, and two guide brackets 33 located at the same height are symmetrically arranged and correspond to the position of the placement plate 3, and the airtight partition 28 is located between the four guide brackets 33; specifically, by setting the guide brackets 33, after the placement plate 3 is sent into the constant temperature chamber 2 from the outside or the variable temperature chamber 1, the placement plate 3 can be placed on the guide brackets 33, and under the guiding action of the guide brackets 33, it is pulled and moved by the electric drive clamps 9 and the plug-in terminals 10 on both sides, thereby making the movement of the placement plate 3 more stable and controllable.

[0024] like Fig.10As shown, two symmetrically distributed cleaning trays 30 are provided at the top and bottom of the airtight partition 28, a plurality of cleaning pipes 31 are fixedly installed on the side close to each other of the two cleaning trays 30 on the same side, and a same ventilation pipe 32 is fixedly installed between the two cleaning trays 30 on the same side, and an inert gas washer 29 is fixedly installed at the top and bottom of the constant temperature chamber 2, wherein two cleaning trays 30 are respectively connected to the two inert gas washers 29, and the other two cleaning trays 30 are respectively fixedly installed at the top and bottom of the airtight partition 28; specifically, by providing the inert gas washer 29, the placement tray 3 loaded with circuit boards is fed into the chamber from the outside. After being placed in the constant temperature room 2 of the cleaning chamber, the inert gas washer 29 can spray inert gas to flush the top and bottom of the placement tray 3 through the vent pipe 32, the cleaning tray 30 and the cleaning tube 31 array, so as to cooperate with the vacuum pump 26 to make the placement tray 3 and the surface of each circuit board meet the cleanliness standard of the test and reduce the influence of external factors. At the same time, after the two placement trays 3 are sent back to the constant temperature room 2 from their respective variable temperature rooms 1, the inert gas washer 29 will quickly dry the humid gas on each circuit board and restore the temperature of the circuit board, so that the circuit board can work in a normal constant temperature environment after being subjected to a period of high and low temperature, pressurization and humidity treatment.

[0025] like Figure 1 As shown, two airtight valves 35 are provided on one side of the constant temperature chamber 2, and the two airtight valves 35 correspond to the positions of the four guide brackets 33 respectively, and a plurality of second clamping rods 34 are fixedly installed on one side of the placement tray 3 close to the airtight valves 35; specifically, by providing the second clamping rods 34 and the airtight valves 35, the second clamping rods 34 on the two placement trays 3 can be clamped with the aid of an external mechanical clamping device, and the placement trays 3 loaded with circuit boards are placed in the constant temperature chamber 2 through the two airtight valves 35 for aging testing, and when the test is completed, the processed circuit boards and the placement trays 3 are taken out together.

[0026] like Figure 3As shown, one end of the gas pipe 6 located inside the variable temperature chamber 1 is fixedly installed with a foldable telescopic tube 13, the bottom end of the foldable telescopic tube 13 is fixedly installed with an air jet disk 14, and the top of the variable temperature chamber 1 is fixedly installed with a height-adjusting electric push rod 15, and the telescopic end of the height-adjusting electric push rod 15 extends to the inside of the variable temperature chamber 1 and is fixedly installed on the top of the air jet disk 14; specifically, by arranging the height-adjusting electric push rod 15, the high and low temperature gases output by the two variable temperature gas tanks 5 will be evenly sprayed on the inside of the variable temperature chamber 1, that is, the top of the two placement trays 3, through the two groups of gas pipes 6, the foldable telescopic tube 13 and the air jet disk 14 respectively. At the same time, before the placement trays 3 are exchanged, the height-adjusting electric push rod 15 can drive the two foldable telescopic tubes 13 to shrink and stretch respectively, so that the two air jet disks 14 rise and fall respectively, so as to avoid collision between the air jet disk 14 and the placement tray 3 due to the position conflict after the placement tray 3 is exchanged, or the gas is too far away from the placement tray 3 due to the height difference, thereby affecting the test effect, so that the air jet disk 14 can automatically adapt to the height of the current placement tray 3.

[0027] In summary: Before the test: When loading the circuit boards, place each circuit board in turn into the circuit board slot 4 on the top of the placement tray 3, and make the terminals on the circuit board plug into the plug terminals 10 in turn, so that the chip, the circuit board and the internal control circuit of the placement tray 3 are connected, and then use the external mechanical clamping equipment to clamp the second clamping rods 34 on the two placement trays 3, and put the placement trays 3 loaded with circuit boards into the constant temperature chamber 2 through the two airtight valves 35 respectively, open the electric drive valves 12 on both sides, and the fastening electric push rods 36 on both sides drive the second steering arm 37 to pass through the electric drive valve 12 and move To one side of the placement tray 3 of each height, and then each positioning rod 38 is inserted into the corresponding positioning groove, and then the second steering arm 37 drives the control rod 24 to rotate through the positioning rod 38, and then the control rack 21 slides along the slide rail 20 by means of the meshing action of the pitch adjusting screw barrel 23 and the pitch adjusting screw 22, and then drives each driven gear 19 to rotate, so that the driven shaft 18 of the longitudinal column drives the fastening shaft 16 to rotate, and then drives each fastening rod 17 to rotate together with the help of each linkage rod 25 and clamped on the top of the circuit board, so as to realize batch and automatic fixation of the circuit board; High and low temperature test: multiple electric drive clamps 9 will be driven by the exchange electric push rod 8 to pass through the opened electric drive valve 12 and enter the constant temperature chamber 2, and then the electric drive clamps 9 on both sides respectively clamp and fix the first clamping rods 11 on the two placement trays 3, so that the two placement trays 3 are respectively docked with the exchange electric push rods 8 on both sides, so that the two placement trays 3 can be pulled by the exchange electric push rods 8 and move to the two variable temperature chambers 1 respectively, and then the electric drive valves 12 on both sides are closed, so that the two variable temperature chambers 1 are respectively closed, and the circuit boards and chips on the two placement trays 3 are respectively tested for high and low temperatures. The variable temperature gas tank 5 loaded with gases of different temperatures blows high and low temperature gases or moisture into the two variable temperature chambers 1 through two sets of gas pipes 6, folding telescopic tubes 13 and jet discs 14, so as to pressurize, cool down and heat them respectively, so that the two placement trays 3 and the circuit boards and chips loaded on the top thereof are cooled and heated; High and low temperature exchange: before exchanging the placement plate 3, the electric push rod 15 is raised to drive the two folding telescopic tubes 13 to contract and stretch respectively, so that the two jet disks 14 rise and fall respectively, to avoid the collision between the jet disk 14 and the placement plate 3 due to the position conflict after the placement plate 3 is exchanged, or the gas is too far away from the placement plate 3 due to the height difference, which affects the test effect, so that the jet disk 14 can automatically adapt to the height of the current placement plate 3, and then the electric drive valve 12 is reopened, and then the exchange electric push rods 8 on both sides are driven respectively to send the two placement plates 3 back to the constant temperature room 2 to restore the temperature , or directly continue to send the two placement trays 3 to the temperature-changing chamber 1 on the other side to receive opposite temperature tests, so that the circuit board originally in high temperature is immediately placed in the temperature-changing chamber 1 in the low temperature state, and the circuit board originally in high temperature is immediately placed in the temperature-changing chamber 1 in the high temperature state, so that the chips on the two placement trays 3 are alternately switched between the two temperature-changing chambers 1, so that the chips can be quickly switched between high and low temperatures, and the working state of the chips under extreme temperature, high pressure or humid environment can be tested, and the chips can be quickly aged in extreme temperature changes, and the working state of each chip can be monitored in real time; Constant temperature test: When the placement plate 3 is sent to the constant temperature chamber 2, the high and low temperature gases, humid gases, etc. in the two variable temperature chambers 1 will leak into the constant temperature chamber 2 due to the previous opening of the electric drive valve 12. Therefore, the vacuum pump 26 will extract the above gases remaining in the constant temperature chamber 2 and send them to the recovery tank 39 through the vacuum pipe 27 for recovery, and ventilate the constant temperature chamber 2 to keep the interior of the constant temperature chamber 2 at a constant temperature, so as to avoid the high and low temperature gases from flowing into each other when the electric drive valve 12 is opened next time, which will affect the test work. The inert gas washer 29 can be used through the ventilation pipe 32, The cleaning tray 30 and the cleaning pipe 31 array spray inert gas to the top and bottom of the placement tray 3 for flushing, so that the placement tray 3 and the surface of each circuit board can reach the cleanliness standard of the test in cooperation with the vacuum pump 26, reducing the influence of external factors. At the same time, after the two placement trays 3 are sent back to the constant temperature room 2 from their respective variable temperature room 1, the inert gas washer 29 will quickly dry the humid gas on each circuit board and restore the temperature of the circuit board, so that the circuit board can work in a normal environment of constant temperature after being subjected to high and low temperature, pressure and humidity treatment for a period of time; After the test: After the test is finished, the processed circuit board and the placement tray 3 are taken out together.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A chip testing device based on aging test, characterized in that: The invention comprises two temperature-changing chambers (1), wherein a constant-temperature chamber (2) is fixedly installed between the two temperature-changing chambers (1), a placement plate (3) is arranged inside each of the temperature-changing chambers (1), the two placement plates (3) are arranged alternately from top to bottom, a plurality of evenly distributed circuit board slots (4) are opened on the top and bottom of each of the placement plates (3), the circuit board slots (4) are used to place circuit boards loaded with chips to be tested, a temperature-changing gas tank (5) is fixedly installed on one side of each of the temperature-changing chambers (1), a gas delivery pipe (6) is fixedly installed on the top of each of the temperature-changing gas tanks (5), one end of each of the two gas delivery pipes (6) respectively extends to the inside of the two temperature-changing chambers (1) and respectively corresponds to the positions of the two placement plates (3), and a same exchange component is arranged inside the two temperature-changing chambers (1); The exchange component is used to exchange the two placement trays (3) back and forth between two temperature-changing chambers (1) with different temperatures, so that the circuit boards and chips on the two placement trays (3) are subjected to extreme temperature changes alternately; The top of each placement plate (3) is provided with a fastening assembly, and the fastening assembly is used to intercept and fix the top of each circuit board after the circuit board is placed inside each circuit board slot (4).

2. A chip testing device based on aging test according to claim 1, characterized in that: The exchange assembly comprises four drive racks (7), the four drive racks (7) being respectively fixedly mounted on the sides of the two temperature-controlled chambers (1) away from each other, exchange electric push rods (8) being fixedly mounted inside the drive racks (7), the positions of the two exchange electric push rods (8) located on the same side corresponding to the positions of the two placement plates (3), the telescopic ends of the exchange electric push rods (8) being fixedly mounted on a rack, a plurality of electric drive clamps (9) being fixedly mounted on one side of the rack, a plurality of first clamps (11) matching the electric drive clamps (9) being fixedly mounted on both sides of the placement plate (3), a plurality of plug-in terminals (10) for matching with a circuit board loaded with a chip to be tested being arranged on the top of the placement plate (3), the plurality of plug-in terminals (10) being respectively located on one side of the plurality of circuit board slots (4), two electric drive valves (12) being arranged on the inner walls on both sides of the constant temperature chamber (2), the two electric drive valves (12) located on the same side being arranged in sequence from top to bottom and corresponding to the positions of the two placement plates (3) respectively.

3. A chip testing device based on aging test according to claim 2, characterized in that: The fastening assembly comprises a plurality of evenly distributed rotating holes respectively opened at the top and bottom of the placement plate (3); a fastening shaft (16) is rotatably mounted inside the plurality of rotating holes; a fastening rod (17) is fixedly sleeved on one end of the fastening shaft (16) located outside the placement plate (3); the plurality of fastening rods (17) respectively correspond to the positions of the plurality of circuit board slots (4); a same linkage rod (25) is rotatably mounted between any two adjacent fastening rods (17); the linkage rod (25) located on the same side is arranged between the two On one end of the fastening rod (17) away from the fastening shaft (16), any adjacent linkage rods (25) are arranged in a staggered manner, and one end of the plurality of fastening shafts (16) located on the same side and in the same vertical row are fixedly mounted with a driven shaft (18), and the driven shaft (18) is located inside the placement plate (3), and a driven gear (19) is fixedly sleeved on the driven shaft (18), and two slide rails (20) are fixedly mounted inside the placement plate (3), and the two slide rails (20) are symmetrically arranged with each other. ) are slidably mounted with a control rack (21) inside, the control rack (21) being perpendicular to the linkage rod (25), a plurality of driven gears (19) located on the same side being meshed with the control rack (21), a pitch-adjusting screw rod (22) being fixedly mounted on one end of the control rack (21) close to the electric drive clamp (9), a pitch-adjusting screw barrel (23) being screwed on one end of the pitch-adjusting screw rod (22), a control rod (24) being fixedly mounted on one end of the pitch-adjusting screw barrel (23), the placement plate (3) being close to the electric drive clamp (9) Two control holes are provided on one side, and the two control rods (24) are rotatably mounted inside the two control holes respectively. A positioning groove is provided on the side of the control rod (24) close to the electric drive clamp (9), and two fastening electric push rods (36) are fixedly mounted inside the driving frame (7) close to the two control rods (24). The telescopic ends of the fastening electric push rods (36) are fixedly mounted with second steering arms (37), and the output ends of the second steering arms (37) are drivenly mounted with positioning plugs (38) adapted to the positioning holes.

4. The chip testing device based on aging test according to claim 2, characterized in that: An air pump (26) connected to the interior of the constant temperature chamber (2) is fixedly installed at the top and bottom of the constant temperature chamber (2), and an air extraction pipe (27) is fixedly installed at the output end of the air extraction pump (26). A recovery tank (39) is fixedly installed on one side of the constant temperature chamber (2), and one end of the two air extraction pipes (27) is connected to the interior of the recovery tank (39). An airtight partition (28) is fixedly installed inside the constant temperature chamber (2), and the two air extraction pumps (26) are respectively located at the top and bottom of the airtight partition (28), and the four electric drive valves (12) are respectively located at the top and bottom of the airtight partition (28).

5. The chip testing device based on aging test according to claim 4, characterized in that: Four guide brackets (33) are fixedly installed inside the constant temperature chamber (2); two guide brackets (33) located at the same height are symmetrically arranged with respect to each other and correspond to the position of the placement plate (3); and the airtight partition (28) is located between the four guide brackets (33).

6. The chip testing device based on aging test according to claim 5, characterized in that: Two symmetrically distributed cleaning trays (30) are provided at the top and bottom of the airtight partition (28); a plurality of cleaning pipes (31) are fixedly installed on the sides of the two cleaning trays (30) located on the same side close to each other; a common ventilation pipe (32) is fixedly installed between the two cleaning trays (30) located on the same side; an inert gas washer (29) is fixedly installed at the top and bottom of the constant temperature room (2); two of the cleaning trays (30) are respectively connected to the two inert gas washer (29); and another two of the cleaning trays (30) are respectively fixedly installed at the top and bottom of the airtight partition (28).

7. The chip testing device based on aging test according to claim 5, characterized in that: Two airtight valves (35) are provided on one side of the constant temperature chamber (2), the two airtight valves (35) respectively corresponding to the positions of the four guide brackets (33), and a plurality of second clamping rods (34) are fixedly mounted on one side of the placement plate (3) close to the airtight valves (35).

8. The chip testing device based on aging test according to claim 1, characterized in that: A foldable telescopic tube (13) is fixedly mounted on one end of the gas delivery pipe (6) located inside the temperature-changing chamber (1), an air jet disk (14) is fixedly mounted on the bottom end of the foldable telescopic tube (13), and a height-adjusting electric push rod (15) is fixedly mounted on the top of the temperature-changing chamber (1), and the telescopic end of the height-adjusting electric push rod (15) extends into the interior of the temperature-changing chamber (1) and is fixedly mounted on the top of the air jet disk (14).

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