Ultrahigh-strength memory card and manufacturing method thereof

Abstract

The invention provides an ultrahigh-strength memory card and a manufacturing method thereof. The ultrahigh-strength memory card comprises a metal shell, a substrate and a metal upper cover. The metal shell is provided with a groove. The substrate is bonded in the groove and comprises a control part and an electric connection part. And the metal upper cover is bonded on the control part, so that the electric connection part is exposed outside. Therefore, as the structures of the metal shell and the metal upper cover have the characteristics of high strength, high hardness, high temperature resistance, good heat dissipation performance and the like, the metal shell and the metal upper cover cannot be cracked and deformed even if a user accidentally falls the memory card onto the ground or bends the memory card forcibly. Therefore, the metal shell and the metal upper cover can provide a good protection effect for the control part, and the control part cannot be broken, so that the control part can be prevented from being damaged to lose functions.

Description

Technical Field

[0001] The present invention relates to a memory card and a manufacturing method thereof, and particularly to an ultra-high strength memory card whose outer shell will not break and can protect the control part or the electrical connection part of the substrate, and a manufacturing method thereof. Background Art

[0002] A Secure Digital Memory Card (SD) is a type of memory card that is widely used in portable electronic devices such as digital cameras, digital video cameras, multimedia players, or aerial drones. The technology of the memory card is based on the format of the MultiMedia card. The memory card has a relatively high data transfer speed and the standard is constantly updated. Most memory cards are provided with a write protection control on the side to prevent some data from being accidentally written, and a small number of memory cards even support digital rights management technology.

[0003] However, the outer shell of the existing memory card is made by ultrasonic pressing two pieces of plastic, and the plastic outer shell is prone to breakage. When the user accidentally drops the memory card on the ground, or bends it forcefully, or the aerial drone drops on the ground, it will cause the plastic outer shell to break, resulting in damage to the control part or the electrical connection part of the substrate and loss of function. Summary of the Invention

[0004] The main purpose of the present invention is to provide an ultra-high strength memory card and a manufacturing method thereof, whose outer shell and upper cover will not break and can protect the control part of the substrate.

[0005] Another purpose of the present invention is to provide an ultra-high strength memory card and a manufacturing method thereof, whose outer frame will not break and can protect the electrical connection part of the substrate.

[0006] To achieve the foregoing purposes, the present invention provides an ultra-high strength memory card, including a metal outer shell, a substrate, and a metal upper cover. The metal outer shell has a groove. The substrate is bonded in the groove of the metal outer shell and includes a control part and an electrical connection part. The metal upper cover is bonded on the control part of the substrate, so that the electrical connection part of the substrate is exposed.

[0007] In some embodiments, the ultra-high strength memory card further includes a plastic outer frame, and the plastic outer frame is fixed around the electrical connection part of the substrate.

[0008] In some embodiments, the ultra-high strength memory card further includes a metal outer frame, and the metal outer frame is fixed around the electrical connection part of the substrate and is integrally formed with the metal upper cover.

[0009] In some embodiments, the material of the metal outer frame is stainless steel.

[0010] In some embodiments, the materials of the metal housing and the metal upper cover are both stainless steel.

[0011] To achieve the foregoing objectives, the present invention provides a method for manufacturing an ultra-high-strength memory card, including the following steps: coating an adhesive layer on the surface of a groove of a metal housing; placing a substrate in the groove of the metal housing; coating an adhesive layer on the surface of a control portion of the substrate; covering a metal upper cover on the control portion of the substrate so that an electrical connection portion of the substrate is exposed; and placing the combination of the metal housing, the substrate, and the metal upper cover in an oven for baking so that the substrate is bonded in the groove of the metal housing, and the metal upper cover is bonded to the control portion of the substrate.

[0012] In some embodiments, after the step of placing in the oven for baking, the following steps are further included: placing the combination of the metal housing, the substrate, and the metal upper cover in a mold and performing insert injection molding to fix a plastic outer frame around the electrical connection portion of the substrate.

[0013] In some embodiments, the step of covering the metal upper cover on the control portion of the substrate further includes: fixing a metal outer frame around the electrical connection portion of the substrate, and the metal outer frame and the metal upper cover are integrally formed; wherein, the step of placing in the oven for baking further includes: placing the combination of the metal housing, the substrate, the metal upper cover, and the metal outer frame in the oven for baking.

[0014] In some embodiments, the material of the metal outer frame is stainless steel.

[0015] In some embodiments, the materials of the metal housing and the metal upper cover are both stainless steel.

[0016] The efficacy of the present invention is that, because the structures of the metal housing and the metal upper cover have characteristics such as high strength, high hardness, high temperature resistance, and good heat dissipation, even if the user accidentally drops the ultra-high-strength memory card of the present invention on the ground or bends it forcefully, the metal housing and the metal upper cover will not crack or deform. Therefore, the metal housing and the metal upper cover can provide good protection for the control portion of the substrate, and the control portion of the substrate will not have a cracking problem, thereby avoiding damage to the control portion of the substrate and loss of function.

[0017] Furthermore, stainless steel has good corrosion resistance, good structural strength, and hard hardness and will not crack, making it suitable as the material of the metal housing and the metal upper cover, so that the metal housing and the metal upper cover can provide better protection for the control portion of the substrate, solving the shortcoming that existing memory cards are easily damaged. Description of the Drawings

[0018] Figure 1Stereogram of the first embodiment of the ultra-high strength memory card according to the embodiments of the present invention;

[0019] Figure 2 Exploded view of the first embodiment of the ultra-high strength memory card according to the embodiments of the present invention;

[0020] Figure 3 Flow chart of the first embodiment of the manufacturing method according to the embodiments of the present invention;

[0021] Figure 4 Schematic diagram of steps S10 to S30 of the first embodiment of the manufacturing method according to the embodiments of the present invention;

[0022] Figure 5 Schematic diagram of steps S40 and S50 of the first embodiment of the manufacturing method according to the embodiments of the present invention;

[0023] Figure 6 Schematic diagram of step S60 of the first embodiment of the manufacturing method according to the embodiments of the present invention;

[0024] Figure 7 Stereogram of the second embodiment of the ultra-high strength memory card according to the embodiments of the present invention;

[0025] Figure 8 Exploded view of the second embodiment of the ultra-high strength memory card according to the embodiments of the present invention;

[0026] Figure 9 Flow chart of the second embodiment of the manufacturing method according to the embodiments of the present invention;

[0027] Figure 10 Schematic diagram of steps S10 to S30 of the second embodiment of the manufacturing method according to the embodiments of the present invention;

[0028] Figure 11 Schematic diagram of steps S40 and S50 of the second embodiment of the manufacturing method according to the embodiments of the present invention.

[0029] Explanation of reference signs in the drawings:

[0030] 1, 1A: Ultra-high strength memory card; 10: Metal housing; 11: Groove; 12: Adhesive layer; 20: Substrate; 21: Control unit; 22: Electrical connection part; 23: Adhesive layer; 30: Metal upper cover; 40: Plastic outer frame; 41: Metal outer frame; 50: Oven; S10 to S60: Steps. Detailed description of the invention

[0031] To make the technical problems, technical solutions, and advantages to be solved by the present invention clearer, the following will be described in detail with reference to the accompanying drawings and specific embodiments. In the following description, providing specific details such as specific configurations and components is only to help comprehensively understand the embodiments of the present invention. Therefore, those skilled in the art should clearly understand that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. Additionally, descriptions of known functions and configurations are omitted for clarity and conciseness.

[0032] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures, or characteristics related to the embodiment are included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics can be combined in one or more embodiments in any suitable manner.

[0033] Figure 1 is a perspective view of the first embodiment of the ultra-high-strength memory card 1 of the present invention. Figure 2 is an exploded view of the first embodiment of the ultra-high-strength memory card 1 of the present invention. As Figure 1 and Figure 2 shown, the present invention provides an ultra-high-strength memory card 1 (Secure Digital Memory Card, SD), which includes a metal housing 10, a substrate 20, a metal upper cover 30, and a plastic outer frame 40. The metal housing 10 has a groove 11. The substrate 20 is bonded in the groove 11 of the metal housing 10 and includes a control portion 21 and an electrical connection portion 22. The metal upper cover 30 is bonded on the control portion 21 of the substrate 20, so that the electrical connection portion 22 of the substrate 20 is exposed. The plastic outer frame 40 is fixed around the electrical connection portion 22 of the substrate 20.

[0034] Specifically, the internal structure of the control portion 21 of the substrate 20 includes a card controller, a memory controller, and a memory chip, and its functions are those of the prior art. The electrical connection portion 22 of the substrate 20 can be electrically connected to the electrical connection portion of a portable electronic device (for example, a digital camera, a digital video camera, a multimedia player, or an aerial drone) and is used for transmitting data, and its functions are also those in the prior art.

[0035] Preferably, the materials of the metal housing 10 and the metal upper cover 30 are stainless steel.

[0036] Figure 3 is a flowchart of the first embodiment of the manufacturing method of the present invention. Figure 4It is a schematic diagram of steps S10 to S30 of the first embodiment of the method of the present invention. Figure 5 It is a schematic diagram of steps S40 and S50 of the first embodiment of the method of the present invention. Figure 6 It is a schematic diagram of step S60 of the first embodiment of the method of the present invention. The present invention provides a method for manufacturing an ultra-high-strength memory card, including the following steps:

[0037] Step S10, as Figure 3 and Figure 4 shown, coat an adhesive layer 12 on the surface of the groove 11 of the metal housing 10.

[0038] Step S20, as Figure 3 and Figure 4 shown, place the substrate 20 in the groove 11 of the metal housing 10.

[0039] Step S30, as Figure 3 and Figure 4 shown, coat an adhesive layer 23 on the surface of the control part 21 of the substrate 20.

[0040] Step S40, as Figure 3 and Figure 5 shown, cover the control part 21 of the substrate 20 with the metal upper cover 30, so that the electrical connection part 22 of the substrate 20 is exposed.

[0041] Step S50, as Figure 3 and Figure 5 shown, place the combination of the metal housing 10, the substrate 20 and the metal upper cover 30 into an oven 50 for baking, so that the substrate 20 is bonded in the groove 11 of the metal housing 10, and the metal upper cover 30 is bonded on the control part 21.

[0042] Step S60, as Figure 3 and Figure 6 shown, place the combination of the metal housing 10, the substrate 20 and the metal upper cover 30 into a mold (not shown in the figure), and through in-mold injection molding, so that the plastic outer frame 40 is fixed around the electrical connection part 22 of the substrate 20, thereby achieving the front-end insulation requirement.

[0043] Thus, because the structures of the metal housing 10 and the metal upper cover 30 have characteristics such as high strength, high hardness, high temperature resistance and good heat dissipation, even if the user accidentally drops the ultra-high-strength memory card 1 of the present invention to the ground or bends it forcefully, the metal housing 10 and the metal upper cover 30 will not crack or deform. Therefore, the metal housing 10 and the metal upper cover 30 can provide good protection for the control part 21 of the substrate 20, and the control part 21 of the substrate 20 will not have the problem of cracking, thereby avoiding damage to the control part 21 of the substrate 20 and loss of function.

[0044] Furthermore, stainless steel has good corrosion resistance, excellent structural strength and high hardness, and will not break, making it suitable as the material for the metal housing 10 and the metal upper cover 30, so that the metal housing 10 and the metal upper cover 30 provide better protection for the control part 21 of the substrate 20, solving the disadvantage of easy damage of the memory card in the prior art.

[0045] In addition, the metal housing 10 and the metal upper cover 30 can provide good dust and water protection effects.

[0046] Figure 7 It is a perspective view of the second embodiment of the ultra-high strength memory card 1A of the present invention. Figure 8 It is an exploded view of the second embodiment of the ultra-high strength memory card 1A of the present invention. As Figure 7 and Figure 8 shown, in terms of structure, the difference between the second embodiment and the first embodiment is that: the ultra-high strength memory card 1A of the present invention further includes a metal outer frame 41 and no plastic outer frame 40, and the metal outer frame 41 is fixed around the electrical connection part 22 of the substrate 20 and integrally formed with the metal upper cover 30.

[0047] Preferably, the material of the metal outer frame 41 is stainless steel.

[0048] Figure 9 It is a flowchart of the second embodiment of the manufacturing method of the present invention. Figure 10 It is a schematic diagram of steps S10 to S30 of the second embodiment of the manufacturing method of the present invention. Figure 11 It is a schematic diagram of steps S40 and S50 of the second embodiment of the manufacturing method of the present invention. In terms of method, the difference between the second embodiment and the first embodiment is that: firstly, as Figure 9 , Figure 10 and Figure 11 shown, in step S40, the metal outer frame 41 is fixed around the electrical connection part 22 of the substrate 20, and the metal outer frame 41 is integrally formed with the metal upper cover 30; secondly, in step S50, the combination of the metal housing 10, the substrate 20, the metal upper cover 30 and the metal outer frame 41 is placed in an oven 50 for baking; thirdly, there is no step S60.

[0049] Thereby, because the structure of the metal outer frame 41 has characteristics such as high strength, high hardness, high temperature resistance and good heat dissipation, even if the user accidentally drops the ultra-high strength memory card 1A of the present invention on the ground or bends it forcefully, the metal outer frame 41 will not break or deform. Therefore, the metal outer frame 41 can provide good protection for the electrical connection part 22 of the substrate 20, and the electrical connection part 22 of the substrate 20 will not have the problem of breaking, thereby avoiding the damage of the electrical connection part 22 of the substrate 20 and losing its function.

[0050] Furthermore, stainless steel has good corrosion resistance, excellent structural strength and high hardness, and will not break, making it suitable as the material of the metal outer frame 41, so that the metal outer frame 41 provides better protection for the electrical connection part 22 of the substrate 20, solving the disadvantage that the memory card in the prior art is easily damaged.

[0051] The above are the preferred embodiments of the present invention. It should be noted that for those of ordinary skill in the art, several improvements and refinements can be made without departing from the principle described in the present invention, and these improvements and refinements are also within the protection scope of the present invention.

Claims

1. An ultra-high strength memory card, characterized in that: include: A metal housing having a groove; a substrate, bonded in the groove of the metal housing, and comprising a control portion and an electrical connection portion; and, A metal cover is bonded to the control part of the substrate so that the electrical connection part of the substrate is exposed.

2. The ultra-high strength memory card according to claim 1, characterized in that: Also includes: A plastic outer frame is fixed around the electrical connection portion of the substrate.

3. The ultra-high strength memory card according to claim 1, characterized in that: Also includes: A metal outer frame is fixed around the electrical connection portion of the substrate and is integrally formed with the metal upper cover.

4. The ultra-high strength memory card according to claim 3, characterized in that: The material of the metal outer frame is stainless steel.

5. The ultra-high strength memory card according to claim 1 or 4, characterized in that: The metal shell and the metal cover are both made of stainless steel.

6. A method for manufacturing an ultra-high strength memory card, characterized in that: include: Applying an adhesive layer on a surface of a groove of a metal housing; placing a substrate in the groove of the metal housing; Coating an adhesive layer on a surface of a control portion of the substrate; Covering the control portion of the substrate with a metal cover so that an electrical connection portion of the substrate is exposed; as well as, The combination of the metal shell, the substrate and the metal cover is placed in an oven for baking, so that the substrate is bonded in the groove of the metal shell, and the metal cover is bonded on the control part of the substrate.

7. The method for manufacturing an ultra-high strength memory card according to claim 6, characterized in that: After the step of placing in the oven for baking, it includes: The combination of the metal shell, the substrate and the metal cover is placed in a mold and subjected to insert injection molding so that a plastic outer frame is fixed around the electrical connection portion of the substrate.

8. The method for manufacturing an ultra-high strength memory card according to claim 6, characterized in that: The metal cover covers the control part of the substrate, including: A metal outer frame is fixed around the electrical connection portion of the substrate, and the metal outer frame is integrally formed with the metal upper cover; wherein, placing in the oven for baking comprises: placing the combination of the metal shell, the substrate, the metal upper cover and the metal outer frame in the oven for baking.

9. The method for manufacturing an ultra-high strength memory card according to claim 8, characterized in that: The material of the metal outer frame is stainless steel.

10. The method for manufacturing an ultra-high strength memory card according to claim 6 or 9, characterized in that: The metal shell and the metal cover are both made of stainless steel.

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